DOCSLIB.ORG

Psoc® 4 Is Here!

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Psoc® 4 Is Here! CYPRESS TOUCH-SENSING SOLUTIONS: A SUPERIOR USER EXPERIENCE Consumers are demanding elegant, sophisticated user interfaces for their home appliances, automobiles, smartphones, tablets and consumer electronics. Cypress is the No. 1 provider of capacitive touch sensing products, including our TrueTouch® and CapSense® solutions. We have shipped more than one billion capacitive touch units. Our sensing technology can be found in automobiles from Tesla to Toyota, nine of the Top 10 mobile phone suppliers, and a wide range of consumer electronics. Our newest product, the Gen5 TrueTouch controller, features patented analog sensing technology that delivers awless touch perfor- mance in the face of electronic “noise” from chargers and displays. This allows customers to create thinner mobile devices that work with any charger. Gen5 also delivers the industry’s best waterproong, along with user-friendly functionality such as activating by 2012 ANNUAL REPO R T Cypress Cypress Cypress sensing an approaching nger and tracking touches when the user is wearing a glove. ® CYPRESS AUTOMOTIVE TOUCH SOLUTIONS HIGH-PERFORMANCE SOLUTIONS 30 YEARS OF INNOVATION PSoC 4 Is Here! Semiconductor Semiconductor Semiconductor Cypress celebrated its 30th birthday on CPU SubsystemSubsystem SWD/TCSWD/TC SPCIFSPCIF December 1, 2012 with the launch of its Cortex FLASH SRAM ROM DataWire/ M0 48 MHzMHz 128 kBkB 32 kBkB 4 kBkB DMA FASTFAST MULMUL most important chip ever. ReadRead AcceleratorAccelerator SRAMSRAM ControllerController ROMROM ControllerController Initiator/MMIOInitiator/MMIO NVIC, IRQMXIRQMX SystemSystem ResourcesResources PowerPower System InterconnectInterconnect (Multi(Multi LayerLayer AHB)AHB) SleepSleep ControlControl WIC Peripherals PORPOR LVDLVD REFREF BODBOD Peripheral InterconnectInterconnect (MMIO)(MMIO) PCLKPCLK PWRSYSPWRSYS Corp. Corp. Corp. NVLatches BoostBoost ClockClock Clock ControlControl Programmable Programmable WDT Analog Digital 512B IMOIMO ILOILO ECOECO WCO PLLPLL CLKD x1 x4 UDB UDB ports) ports) ports) 2012 2012 2012 CAN CAN CAN I2C/SPI/UART I2C/SPI/UART I2C/SPI/UART LCD LCD LCD 9x 9x 9x ResetReset TCPWM TCPWM TCPWM 2x 2x 2x SARSAR UAB Comparator Comparator Comparator ( ( ( ResetReset ControlControl CapsenseCapsense Capsense (12-bit)(12-bit) x16x16 4x4x 4x XRESXRES LP LP LP SCB-SCB- SCB- 2x 2x 2x TestTest 2x2x 2x GPIO GPIO GPIO DFT LogicLogic UDB UDB USB-FS/FSH USB-FS/FSH USB-FS/FSH DFT AnalogAnalog Analog RoutingRouting IOSS IOSS IOSS Annual Annual Annual SMX CTB Tesla’s design team wanted to differentiate the interior of the revolutionary Active/Sleep 2x OpAmpOpAmp x4 PortPort InterfaceInterface && DigitalDigital SystemSystem InterconnectInterconnect (DSI)(DSI) Model S—the world’s rst premium-class electrically powered sedan… Deep SleepSleep Cypress capacitive touch solutions offer industry-leading noise Hibernate FS-PHYFS-PHY FS-PHY immunityimmunity for awless nger tracking in consumer electronic High SpeedSpeed I/OI/O MatrixMatrix CHG-DET CHG-DET CHG-DET products such as the Kindle Fire HD and security keypads such as thethe one on this Samsung EZON digital door lock. Report Report Report 64x GPIOs,GPIOs, 4x4x SIOsSIOs IOIO SubsystemSubsystem SRAM PSoC 4 and and and REVOLUTION 2013 2013 2013 1988 1994 1995 1996 1998 2000 2013 TESLA $6.00 $4.50 $3.00 $2.50 $2.00 $1.50 $1.00 256Kb 256Kb 256Kb 256Kb 256Kb 256Kb 32-bit ARMARM CPUCPU So it selected Cypress’s TrueTouch solution to drive the 17-inch touchscreen in the 3232 KbKb SRAMSRAM Proxy Proxy Proxy dashboard’s center stack—the largest in any vehicle to date and the rst to integrate 256256 KbKb FlashFlash all functional controls. Tesla describes the display as the “gem” of its interior design. 3232 KbKb ROMROM Cypress Transformation—From Chips to Solutions: As an SRAM company, Programmable IPIP 11 CapSenseCapSense BlockBlock (36(36 buttons)buttons) Statement Statement Statement founded in 1982, our objective was follow Moore’s Law to reduce chip size, 22 ProgrammableProgrammable IDACsIDACs lowerlower device cost and increase performance. The photos above show six 22 SerialSerial CommunicationsCommunications BlocksBlocks 44 Timer-CounterTimer-Counter Pulse-WidthPulse-Width ModulatorsModulators generations of our 256-Kilobit (Kb) SRAM chip—designed on increasingly 22 LowLow PowerPower AnalogAnalog ComparatorsComparators Programmable AnalogAnalog smaller geometries—alongside our new PSoC 4 programmable system-on-chip, 12-bit12-bit SARSAR ADCADC which contains 32 Kb of SRAM, and a lot more, as the list of circuit blocks Continuous-TimeContinuous-Time BlockBlock w/2w/2 OpAmpsOpAmps TOYOTA TrueTouch and CapSense controllers feature the world’s best Programmable DigitalDigital waterproong technology, bringing durability to touch controls in shows. PSoC 4 integrates our programmable analog technology; our exible, 4x4x UniversalUniversal DigitalDigital BlocksBlocks eacheach w/2w/2 PLDsPLDs ® Toyota and its system So they turned to Cypress’s TrueTouch and CapSense home appliances such as the Saeco Espresso Machine and programmable digital logic; SRAM and Flash memory; and an ARM andand 11 datapathdatapath smartphones such as the new Samsung Galaxy Grand DUOS. Programmable I/OI/O supplier DENSO demand controllers for the capacitive touchscreen, buttons and Cortex™-M0-M0 microcontroller core—all on a tiny chip. All for $1. quality and reliability… sliders in the 2013 Toyota Avalon. High-speedHigh-speed IOIO MatrixMatrix 3636 ProgrammableProgrammable GeneralGeneral PurposePurpose IOsIOs 22 Analog-MuxAnalog-Mux BusesBuses inin allall GPIOsGPIOs Cypress Semiconductor Corporation 198 Champion Court, San Jose, CA 95134-1709 (408)(408) 943-2600 www.cypress.com ©2013 CypressCypress SemiconductorSemiconductor Corporation.Corporation. AllAll RightsRights Reserved.Reserved. TrademarksTrademarks areare propertyproperty ofof theirtheir respectiverespective owners.owners. Printed inin thethe U.S.A.U.S.A. PSoC® 4, PSoC CREATOR™ AND PSoC COMPONENTS™: A POWERFUL, NEW DESIGN PLATFORM FX3: CYPRESS’S USB 3.0 SOLUTION FOR AMAZING SUPERSPEED APPLICATIONS ImagineImagine if you could get an entire mixed-signal embedded system chip with an ARM® 32-bit processor for $1. The 5-Gbps USB 3.0 standard has become the system interface of choice for high-denition video applications, including machine Cypress’s new PSoC 4 programmable system-on-chip architecture combines our programmable precision vision, and medical and industrial cameras, without image-degrading video compression. Cypress is the USB leader, having analog circuitry, programmable digital blocks, and fully-routable I/Os, with our CapSense® capacitive touch shipped more than 1.2 billion units to date. Our one-chip USB 3.0 solution, EZ-USB® FX3™—like the FX2™ and FX1™ before it—is technologytechnology and ARM’s power-efcient Cortex™-M0-M0 core. thethe industry's de facto peripheral controller. FX3 powers the world's most advanced HD video cameras. PSoC 4 enables design engineers to leverage ARM’s low-cost cores, which account for an increasing share of Leap Motion selected FX3 to drive its 3-D motion controller, which enables users to execute sophisticated 3-D gestures by taking thethe MCU market, along with a wealth of programmable elements, to enable complete system design—all for $1. stereo pictures of the hand. Leap Motion is able to track hand and nger movements to 1/100th of a millimeter—100 times more sensitive than the best existing motion control systems. Our PSoC Creator platform system design software features pre-veried, production-ready PSoC Components, virtual chips within PSoC 4 that replace and integrate multiple competitor chips to create custom solutions. Our solution—PSoC 4, PSoC Components and PSoC Creator, our highly-rated development platform— USB 3.0 ENABLES PERFECT HD IMAGES AND ACCURATE 3-D MOTION CONTROL PSoC 4:4: TheThe world’sworld’s mostmost exible, lowest-powerlowest-power simplies and accelerates the design process, reduces BOM, and enables our customers to change their ARM Cortex-M0-basedCortex-M0-based hardware as easily and rapidly as they change their rmware. device forfor $1.$1. “Can life get simpler? PSoC and PSoC Creator greatly simplify the setup and conguration process in embedded designs. The drag-and-drop approach to system components enables engineers to connect functional hardware and software at the block-diagram level. Bravo, Cypress.” — JonJon Titus,Titus, leadingleading electronicselectronics journalist,journalist, designerdesigner ofof thethe Mark-8Mark-8 PCPC prototypeprototype inin thethe SmithsonianSmithsonian InstitutionInstitution With USB 2.0 With USB 3.0 FOUR DESIGN STEPS TO A RELIABLE, INTEGRATED PSoC SOLUTION Compressed USB 2.0 video Uncompressed USB 3.0 video degrades image quality. delivers the high-resolution image The 5.0 Gbps performance of USB 3.0 enables 3-D gestures in A COMPLEX CAPSENSE DESIGN IN CHALLENGING ISIS QUICKLY AND SIMPLY DESIGNED IN OUR quality today’s consumers demand. motion-control systems for PCs. 1 ENVIRONMENTS… 2 PSoC CREATOR DESIGN ENVIRONMENT WITH PRODUCTION-READY CAPSENSE COMPONENTS... CYPRESS NVRAM PRODUCTS: THE FASTEST, DENSEST, AND LOWEST-POWER What do you do when you are storing critical data in a memory and the power goes out? Nonvolatile RAMs (NVRAMs) retain CapSense data when power is lost without the need for battery backup. They also provide the functionality and speed of traditional SRAMs. Component Three key investments enabled Cypress to attain leadership in the NVRAM market. First, we have continued investing in our existing SONOS technology to improve
Load more

Recommended publications
  • Porting the Arduino Library to the Cypress Psoc in Psoc Creator
    Porting the Arduino Library to the Cypress PSoC in PSoC Creator Matt Durak November 11, 2011 Design Team 1 Abstract Arduino, the open-source electronic platform is a useful tool to hobbyists in building embedded systems. It provides an easy to use library which includes components to work with an Ethernet board, called the Ethernet shield. PSoC is a programmable system-on-chip made by Cypress Semiconductor. It is a very flexible platform which includes an ARM Cortex M3 processor. This application note includes the steps necessary to port parts of the Arduino library to the PSoC in order to use Arduino software and hardware, known as shields, with the PSoC. The note will cover many issues which must be overcome in porting this software. Keywords PSoC, Arduino, C++, C, Library, Software, Porting, PSoC Creator, Ethernet shield Introduction Arduino Library The Arduino is an open-source electronics hardware platform that is designed primarily for students and hobbyists (1). Arduino provides the schematics to build the hardware, as well as kits which can be pre- assembled or just include the parts. This application note will focus on the software for Arduino. Arduino has its own open-source development environment based on Wiring, a platform for programming electronics (2). The software library used by Arduino is written in C++ and is also open-source and freely available (3). This library is composed of a low layer which communicates directly with hardware registers and provides an abstraction for programmers to set whether a pin is an input or an output and to read and write to those pins.
    [Show full text]
  • Schedule 14A Employee Slides Supertex Sunnyvale
    UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 SCHEDULE 14A Proxy Statement Pursuant to Section 14(a) of the Securities Exchange Act of 1934 Filed by the Registrant Filed by a Party other than the Registrant Check the appropriate box: Preliminary Proxy Statement Confidential, for Use of the Commission Only (as permitted by Rule 14a-6(e)(2)) Definitive Proxy Statement Definitive Additional Materials Soliciting Material Pursuant to §240.14a-12 Supertex, Inc. (Name of Registrant as Specified In Its Charter) Microchip Technology Incorporated (Name of Person(s) Filing Proxy Statement, if other than the Registrant) Payment of Filing Fee (Check the appropriate box): No fee required. Fee computed on table below per Exchange Act Rules 14a-6(i)(1) and 0-11. (1) Title of each class of securities to which transaction applies: (2) Aggregate number of securities to which transaction applies: (3) Per unit price or other underlying value of transaction computed pursuant to Exchange Act Rule 0-11 (set forth the amount on which the filing fee is calculated and state how it was determined): (4) Proposed maximum aggregate value of transaction: (5) Total fee paid: Fee paid previously with preliminary materials. Check box if any part of the fee is offset as provided by Exchange Act Rule 0-11(a)(2) and identify the filing for which the offsetting fee was paid previously. Identify the previous filing by registration statement number, or the Form or Schedule and the date of its filing. (1) Amount Previously Paid: (2) Form, Schedule or Registration Statement No.: (3) Filing Party: (4) Date Filed: Filed by Microchip Technology Incorporated Pursuant to Rule 14a-12 of the Securities Exchange Act of 1934 Subject Company: Supertex, Inc.
    [Show full text]
  • A Vhsic Hardware Description Language Compiler for Logic Cell Arrays
    A VHSIC HARDWARE DESCRIPTION LANGUAGE COMPILER FOR LOGIC CELL ARRAYS by Bing Liu A thesis presented to the university of Mânitoba in partial fulfillment of úe requirements of the degree of Maste¡ of Science in Elecrical and Computel Engineering Winnipeg, Manitoba, Canada @ Bing Liu, January 1990 Bibliothèque nat¡onale rE fr"3""i"i;tjo'",' du Canada Canadian Theses Serv¡ce Service des thèses canadiennes Otta'¿/ã. Can¿da Kl A ON¡ The author has granted an inevocable non' L'auteur a accordé une licence iffévocable et exclusive licence allowing the National Library non exclusive permettant à h Bibliothèque of Canada to reproduce, loan, distribute or sell nationale du Canada.de reproduire, prêter, copies of his/her thesis by any means and in distribuer ou vendre des copies de sa thèse any form or format, making this thesis avaihble de quelque manière et sous quelque forme to ¡nterested persons. que ce soit pour mettre des exemplaires de cette thèse à la disposition des personnes intéressées. The author retains ownership of the copyright L auteur conserve la propriété du droit d'auteur in his/her thesis. Neither the thesis nor qui protà?e sa thèse. Ni la thèse ni des extraits substantial extracts from it may be printed or substantiels de celle-ci ne doivent être otherw¡se reproduced without his/her per' imprimés ou autrement reproduits sans son mission. autorisation. ISBN ø-315-7 r7s t -3 Canadä A VHSIC HARDWARE DESCRIPTION I.ANGUAGE COMPILER FOR LOG]C CEI,L ARRAYS BY BING LIU A thesis subnrined lo thc Fact¡lty of Crâduate Studies of the University of M¿nitoba in partial fulfìllment of the requirenrents of the degree of MASTM O¡' SC]MICE o 1990 Permission has becn granted to the L¡BRÁRY OF THE UNIVER' SITY OF MANITOBA to lend o¡ sell copies of tlt¡s thesis.
    [Show full text]
  • Getting Started with Psoc 6 MCU (AN221774)
    AN221774 Getting Started with PSoC 6 MCU Authors: Srinivas Nudurupati, Vaisakh K V Associated Part Family: All PSoC® 6 MCU devices Software Version: ModusToolbox™ 1.0, PSoC Creator™ 4.2 Associated Application Notes and Code Examples: Click here. More code examples? We heard you. To access an ever-growing list of hundreds of PSoC code examples, please visit our code examples web page. You can also explore the PSoC video library here. AN221774 introduces the PSoC 6 MCU, a dual-CPU programmable system-on-chip with Arm® Cortex®-M4 and Cortex-M0+ processors. This application note helps you explore PSoC 6 MCU architecture and development tools, and shows you how to create your first project using ModusToolbox and PSoC Creator. This application note also guides you to more resources available online to accelerate your learning about PSoC 6 MCU. To get started with the PSoC 6 MCU with BLE Connectivity device family, refer to AN210781 – Getting Started with PSoC 6 MCU with BLE Connectivity. Contents 1 Introduction .................................................................. 2 5.6 Part 4: Build the Application .............................. 32 1.1 Prerequisites ....................................................... 3 5.7 Part 5: Program the Device ............................... 33 2 Development Ecosystem ............................................. 4 5.8 Part 6: Test Your Design ................................... 34 2.1 PSoC Resources ................................................ 4 6 My First PSoC 6 MCU Design 2.2 Firmware/Application Development .................... 5 Using PSoC Creator .................................................. 36 2.3 Support for Other IDEs ....................................... 9 6.1 Using These Instructions .................................. 36 2.4 RTOS Support .................................................... 9 6.2 About the Design .............................................. 37 2.5 Debugging......................................................... 11 6.3 Part 1: Create a New Project from Scratch ......
    [Show full text]
  • Going Vertical: a New Integration Era in the Semiconductor Industry Table of Contents
    Going vertical: A new integration era in the semiconductor industry Table of contents 01 Executive overview Integration in the 02 semiconductor industry Strategic options for 03 semiconductor companies Moving forward: what semiconductor 04 companies must consider today Going vertical: A new integration era in the semiconductor industry 2 Executive overview Like many industries, the semiconductor industry is not immune to waves of diversification and consolidation through inorganic and organic growth. While inflection points with large-scale systemic changes in the value chain are relatively rare, our perspective is that there is a systemic change currently trending in the industry. Since the inception of the industry, semiconductor companies have recognized the value of technology. Accordingly, the market has rewarded semiconductor companies for specializing in distinct parts of the value chain by developing technological advantages by investing in R&D and by scaling technology through horizontal integration. This way of working transformed an industry that was initially vertically integrated (semiconductor design, semiconductor manufacturing, and system integration) into an ecosystem focused on specific areas of design, manufacturing, and/or systems. In the past five years, business value in some segments has moved from underlying technology to specific use cases to better monetize end-customer data and experience. • 5G, automotive, AI, cloud, system integration and hardware-software integration System integrators and software and cloud platform companies are no longer just important customers for the semiconductor industry—they are directly expanding into multiple upstream areas. • Taking advantage of silicon and system design • Control more of the technology stack • Optimize system performance • Improve the customer experience This vertical integration trend is distinctly different from the vertical integration which occurred at the inception of the semiconductor and integrated device manufacturing industry more than 50 years ago.
    [Show full text]
  • Computer Organization and Architecture Designing for Performance Ninth Edition
    COMPUTER ORGANIZATION AND ARCHITECTURE DESIGNING FOR PERFORMANCE NINTH EDITION William Stallings Boston Columbus Indianapolis New York San Francisco Upper Saddle River Amsterdam Cape Town Dubai London Madrid Milan Munich Paris Montréal Toronto Delhi Mexico City São Paulo Sydney Hong Kong Seoul Singapore Taipei Tokyo Editorial Director: Marcia Horton Designer: Bruce Kenselaar Executive Editor: Tracy Dunkelberger Manager, Visual Research: Karen Sanatar Associate Editor: Carole Snyder Manager, Rights and Permissions: Mike Joyce Director of Marketing: Patrice Jones Text Permission Coordinator: Jen Roach Marketing Manager: Yez Alayan Cover Art: Charles Bowman/Robert Harding Marketing Coordinator: Kathryn Ferranti Lead Media Project Manager: Daniel Sandin Marketing Assistant: Emma Snider Full-Service Project Management: Shiny Rajesh/ Director of Production: Vince O’Brien Integra Software Services Pvt. Ltd. Managing Editor: Jeff Holcomb Composition: Integra Software Services Pvt. Ltd. Production Project Manager: Kayla Smith-Tarbox Printer/Binder: Edward Brothers Production Editor: Pat Brown Cover Printer: Lehigh-Phoenix Color/Hagerstown Manufacturing Buyer: Pat Brown Text Font: Times Ten-Roman Creative Director: Jayne Conte Credits: Figure 2.14: reprinted with permission from The Computer Language Company, Inc. Figure 17.10: Buyya, Rajkumar, High-Performance Cluster Computing: Architectures and Systems, Vol I, 1st edition, ©1999. Reprinted and Electronically reproduced by permission of Pearson Education, Inc. Upper Saddle River, New Jersey, Figure 17.11: Reprinted with permission from Ethernet Alliance. Credits and acknowledgments borrowed from other sources and reproduced, with permission, in this textbook appear on the appropriate page within text. Copyright © 2013, 2010, 2006 by Pearson Education, Inc., publishing as Prentice Hall. All rights reserved. Manufactured in the United States of America.
    [Show full text]
  • North American Company Profiles 8X8
    North American Company Profiles 8x8 8X8 8x8, Inc. 2445 Mission College Boulevard Santa Clara, California 95054 Telephone: (408) 727-1885 Fax: (408) 980-0432 Web Site: www.8x8.com Email: [email protected] Fabless IC Supplier Regional Headquarters/Representative Locations Europe: 8x8, Inc. • Bucks, England U.K. Telephone: (44) (1628) 402800 • Fax: (44) (1628) 402829 Financial History ($M), Fiscal Year Ends March 31 1992 1993 1994 1995 1996 1997 1998 Sales 36 31 34 20 29 19 50 Net Income 5 (1) (0.3) (6) (3) (14) 4 R&D Expenditures 7 7 7 8 8 11 12 Capital Expenditures — — — — 1 1 1 Employees 114 100 105 110 81 100 100 Ownership: Publicly held. NASDAQ: EGHT. Company Overview and Strategy 8x8, Inc. is a worldwide leader in the development, manufacture and deployment of an advanced Visual Information Architecture (VIA) encompassing A/V compression/decompression silicon, software, subsystems, and consumer appliances for video telephony, videoconferencing, and video multimedia applications. 8x8, Inc. was founded in 1987. The “8x8” refers to the company’s core technology, which is based upon Discrete Cosine Transform (DCT) image compression and decompression. In DCT, 8-pixel by 8-pixel blocks of image data form the fundamental processing unit. 2-1 8x8 North American Company Profiles Management Paul Voois Chairman and Chief Executive Officer Keith Barraclough President and Chief Operating Officer Bryan Martin Vice President, Engineering and Chief Technical Officer Sandra Abbott Vice President, Finance and Chief Financial Officer Chris McNiffe Vice President, Marketing and Sales Chris Peters Vice President, Sales Michael Noonen Vice President, Business Development Samuel Wang Vice President, Process Technology David Harper Vice President, European Operations Brett Byers Vice President, General Counsel and Investor Relations Products and Processes 8x8 has developed a Video Information Architecture (VIA) incorporating programmable integrated circuits (ICs) and compression/decompression algorithms (codecs) for audio/video communications.
    [Show full text]
  • Embos CPU & Compiler Specifics for Cortex-M Using Cypress Psoc
    embOS Real-Time Operating System CPU & Compiler specifics for Cortex- M using Cypress PSoC Creator Document: UM01041 Software Version: 5.00 Revision: 0 Date: June 13, 2018 A product of SEGGER Microcontroller GmbH www.segger.com 2 Disclaimer Specifications written in this document are believed to be accurate, but are not guaranteed to be entirely free of error. The information in this manual is subject to change for functional or performance improvements without notice. Please make sure your manual is the latest edition. While the information herein is assumed to be accurate, SEGGER Microcontroller GmbH (SEG- GER) assumes no responsibility for any errors or omissions. SEGGER makes and you receive no warranties or conditions, express, implied, statutory or in any communication with you. SEGGER specifically disclaims any implied warranty of merchantability or fitness for a particular purpose. Copyright notice You may not extract portions of this manual or modify the PDF file in any way without the prior written permission of SEGGER. The software described in this document is furnished under a license and may only be used or copied in accordance with the terms of such a license. © 2010-2018 SEGGER Microcontroller GmbH, Hilden / Germany Trademarks Names mentioned in this manual may be trademarks of their respective companies. Brand and product names are trademarks or registered trademarks of their respective holders. Contact address SEGGER Microcontroller GmbH In den Weiden 11 D-40721 Hilden Germany Tel. +49 2103-2878-0 Fax. +49 2103-2878-28 E-mail: [email protected] Internet: www.segger.com embOS for Cortex-M and PSoC Creator © 2010-2018 SEGGER Microcontroller GmbH 3 Manual versions This manual describes the current software version.
    [Show full text]
  • Modustoolbox IDE User Guide
    ModusToolbox™ IDE User Guide Document # 002-24375 Rev ** Cypress Semiconductor 198 Champion Court San Jose, CA 95134-1709 http://www.cypress.com Copyrights © Cypress Semiconductor Corporation, 2018. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC (“Cypress”). This document, including any software or firmware included or referenced in this document (“Software”), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users (either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress’s patents that are infringed by the Software (as provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation of the Software is prohibited.
    [Show full text]
  • Embedded Market Study, 2013
    2013 EMBEDDED MARKET STUDY Essential to Engineers DATASHEETS.COM | DESIGNCON | DESIGN EAST & DESIGN WEST | EBN | EDN | EE TIMES | EMBEDDED | PLANET ANALOG | TECHONLINE | TEST & MEASUREMENT WORLD 2013 Embedded Market Study 2 UBM Tech Electronics’ Brands Unparalleled Reach & Experience UBM Tech Electronics is the media and marketing services solution for the design engineering and electronics industry. Our audience of over 2,358,928 (as of March 5, 2013) are the executives and engineers worldwide who design, develop, and commercialize technology. We provide them with the essentials they need to succeed: news and analysis, design and technology, product data, education, and fun. Copyright © 2013 by UBM. All rights reserved. 2013 Embedded Market Study 5 Purpose and Methodology • Purpose: To profile the findings of the 2013 results of EE Times Group annual comprehensive survey of the embedded systems markets worldwide. Findings include types of technology used, all aspects of the embedded development process, tools used, work environment, applications, methods and processes, operating systems used, reasons for using and not using chips and technology, and brands and chips currently used by or being considered by embedded developers. Many questions in this survey have been trended over two to five years. • Methodology: A web-based online survey instrument based on the previous year’s survey was developed and implemented by independent research company Wilson Research Group from January 18, 2013 to February 13, 2013 by email invitation • Sample: E-mail invitations were sent to subscribers to UBM/EE Times Group Embedded Brands with one reminder invitation. Each invitation included a link to the survey. • Returns: 2,098 valid respondents for an overall confidence of 95% +/- 2.13%.
    [Show full text]
  • A Vhdl-Based Digital Slot Machine Implementation Using A
    A VHDL-BASED DIGITAL SLOT MACHINE IMPLEMENTATION USING A COMPLEX PROGRAMMABLE LOGIC DEVICE by Lucas C. Pascute Submitted in Partial Fulfillment ofthe Requirements for the Degree of Master ofScience ofEngineering in the Electrical Engineering Program YOUNGSTOWN STATE UNIVERSITY December, 2002 A VHDL-BASED DIGITAL SLOT MACHINE IMPLEMENTATION USING A COMPLEX PROGRAMMABLE LOGIC DEVICE Lucas C. Pascute I hereby release this thesis to the public. I understand that this thesis will be made available from the OhioLINK ETD Center and the Maag Library Circulation Desk for public access. I also authorize the University or other individuals to make copies ofthis thesis as needed for scholarly research. Signature: ;/ (' , p ~-~_.._--- c:;.--_. ~ ~b IZ-3-Cl7., Lucas C. Pascute, Student Date Approvals: r. Faramarz Mossayebi, Thesis Advisor 12-:}--02- Date S~?c~ /"L/ 0:5 /u C Dr. Salvatore Pansino, Committee Member Date Dr. Peter J. K: vinsky, Dean ofGradua 111 ABSTRACT The intent ofthis project is to provide an educational resource from which future students can learn the basics ofprogrammable logic and the design process involved. More specifically, the area ofinterest involves very large scale integration (VLSI) design and the advantages associated with it such as reduced chip count and development time. The methodology used within is to first implement a design; using small and medium scale integration (SSI/MSI) packages in order to have a baseline for comparison. The design is then translated for use with the very high speed integrated circuit hardware description language (VHDL) and implemented onto a complex programmable logic device (CPLD). A discussion ofthis implementation process as well as VHDL lessons is provided to serve as a tutorial for the interested reader.
    [Show full text]
  • Serial EEPROM Cross Reference Guide
    SERIAL EEPROM Serial EEPROM Cross Reference Guide The purpose of this document is to provide a quick way interested in a part that is not listed in this book, please to determine the closest Microchip equivalent to Serial refer to the Microchip data book, or contact your local EEPROMs produced by other manufacturers. The distributor or sales representative for assistance. cross reference section is broken down by manufac- The manufacturers* included in this document are as turer and lists all parts from that manufacturer, and the follows: comparable Microchip part number. There is also a list- ing of manufacturer’s part numbering schemes to AKM Oki assist in determining the specifications of a particular Atmel Philips part. Catalyst Samsung There are subtle differences from manufacturer to Exel SGS-Thomson manufacturer and device to device, so Microchip rec- ommends consulting the respective manufacturer’s ISSI Siemens gadabout for specific details. Microchip Xicor Microchip provides a wide selection of Serial EEPROM Mitsubishi devices, both from a density and a packaging stand- National point, as well as several different protocols. If you are FIGURE 1: MICROCHIP SERIAL EEPROM PART NUMBER GUIDE XX XX XX XX X / XX Package W = Die in wafer form S = Die in waffle pack P = PDIP SM = Small outline .207 mil SN = Small outline .150 mil SL = 14-lead small outline .150 mil Process Temperature Blank = 0°C to +70°C I = -40°C to +125°C E = -40°C to +125°C Special Options Memory 01 1K 128 x 8 02 2K 256 x 8 04 4K 512 x 8 08 8K 1K x 8 16 16K 2K x 8 32 32K 4K x 8 65 64K 8K x 8 11 1K 128K x 8 or 64 x 16 72 1K 128 x 8 82 2K 256 x 8 92 4K 512 x 8 06 256 Bit 16 x 16 46 1K 64 x 16/128 x 8 56 2K 256 x 8/128 x 16 66 4K 512 x 8/256 x 16 Process Technology C – CMOS LC – Low Voltage (2.5V) CMOS AA – 1.8 Volt Part Number Designator 24 – 2-wire 59 – 4-wire 85 – 2-wire 93 – 3-wire *The above trademarks are property of their respective companies.
    [Show full text]