Intel/AMD CPU Release Dates, 2018
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H242-Z10 Edge Server - AMD up 2U 4 Nodes
H242-Z10 Edge Server - AMD UP 2U 4 Nodes Features • Supports 5G network infrastructure • 2U - 4 nodes rear access server system for Edge Computing • Single AMD EPYC™ 7002 series processor family • 4 x LGA 4094 sockets • 8-Channel RDIMM/LRDIMM DDR4, 32 x DIMMs • 8 x 1Gb/s LAN ports (Intel® I350-AM2) • 4 x 2.5" NVMe hot-swappable SSD bays • 8 x M.2 with PCIe Gen3 x4 interface • 8 x Low profile PCIe x16 expansion slots • 4 x OCP 2.0 Gen3 x16 mezzanine slots • Aspeed® AST2500 remote management controller • 2+0 1200W 80 PLUS Platinum power supply AMD EPYC™ 7002 Series Processor (Rome) The next generation of AMD EPYC has arrived, providing incredible compute, IO and bandwidth capability – designed to meet the huge demand for more compute in big data analytics, HPC and cloud computing. Built on 7nm advanced process technology, allowing for denser compute capabilities with lower power consumption Up to 64 core per CPU, built using Zen 2 high performance cores and AMD’s innovative chiplet architecture Supporting PCIe Gen 4.0 with a bandwidth of up to 64GB/s, twice of PCIe Gen 3.0 Embedded security protection to help defend your CPU, applications, and data Optional CMC / Ring Topology Module GIGABYTE’s H242-Series servers include support for an optional CMC / Ring Topology Module, featuring an Aspeed CMC (Central Management Controller), LAN hub and dual MLAN ports for multi-node management (including iKVM support) by connecting internally to Aspeed BMCs integrated on each node. This results only in one MLAN connection required to perform manage- ment of all four nodes, resulting in less ToR (Top of Rack) cabling and switch connections. -
Evaluation of AMD EPYC
Evaluation of AMD EPYC Chris Hollowell <[email protected]> HEPiX Fall 2018, PIC Spain What is EPYC? EPYC is a new line of x86_64 server CPUs from AMD based on their Zen microarchitecture Same microarchitecture used in their Ryzen desktop processors Released June 2017 First new high performance series of server CPUs offered by AMD since 2012 Last were Piledriver-based Opterons Steamroller Opteron products cancelled AMD had focused on low power server CPUs instead x86_64 Jaguar APUs ARM-based Opteron A CPUs Many vendors are now offering EPYC-based servers, including Dell, HP and Supermicro 2 How Does EPYC Differ From Skylake-SP? Intel’s Skylake-SP Xeon x86_64 server CPU line also released in 2017 Both Skylake-SP and EPYC CPU dies manufactured using 14 nm process Skylake-SP introduced AVX512 vector instruction support in Xeon AVX512 not available in EPYC HS06 official GCC compilation options exclude autovectorization Stock SL6/7 GCC doesn’t support AVX512 Support added in GCC 4.9+ Not heavily used (yet) in HEP/NP offline computing Both have models supporting 2666 MHz DDR4 memory Skylake-SP 6 memory channels per processor 3 TB (2-socket system, extended memory models) EPYC 8 memory channels per processor 4 TB (2-socket system) 3 How Does EPYC Differ From Skylake (Cont)? Some Skylake-SP processors include built in Omnipath networking, or FPGA coprocessors Not available in EPYC Both Skylake-SP and EPYC have SMT (HT) support 2 logical cores per physical core (absent in some Xeon Bronze models) Maximum core count (per socket) Skylake-SP – 28 physical / 56 logical (Xeon Platinum 8180M) EPYC – 32 physical / 64 logical (EPYC 7601) Maximum socket count Skylake-SP – 8 (Xeon Platinum) EPYC – 2 Processor Inteconnect Skylake-SP – UltraPath Interconnect (UPI) EYPC – Infinity Fabric (IF) PCIe lanes (2-socket system) Skylake-SP – 96 EPYC – 128 (some used by SoC functionality) Same number available in single socket configuration 4 EPYC: MCM/SoC Design EPYC utilizes an SoC design Many functions normally found in motherboard chipset on the CPU SATA controllers USB controllers etc. -
Motherboards, Processors, and Memory
220-1001 COPYRIGHTED MATERIAL c01.indd 03/23/2019 Page 1 Chapter Motherboards, Processors, and Memory THE FOLLOWING COMPTIA A+ 220-1001 OBJECTIVES ARE COVERED IN THIS CHAPTER: ✓ 3.3 Given a scenario, install RAM types. ■ RAM types ■ SODIMM ■ DDR2 ■ DDR3 ■ DDR4 ■ Single channel ■ Dual channel ■ Triple channel ■ Error correcting ■ Parity vs. non-parity ✓ 3.5 Given a scenario, install and configure motherboards, CPUs, and add-on cards. ■ Motherboard form factor ■ ATX ■ mATX ■ ITX ■ mITX ■ Motherboard connectors types ■ PCI ■ PCIe ■ Riser card ■ Socket types c01.indd 03/23/2019 Page 3 ■ SATA ■ IDE ■ Front panel connector ■ Internal USB connector ■ BIOS/UEFI settings ■ Boot options ■ Firmware upgrades ■ Security settings ■ Interface configurations ■ Security ■ Passwords ■ Drive encryption ■ TPM ■ LoJack ■ Secure boot ■ CMOS battery ■ CPU features ■ Single-core ■ Multicore ■ Virtual technology ■ Hyperthreading ■ Speeds ■ Overclocking ■ Integrated GPU ■ Compatibility ■ AMD ■ Intel ■ Cooling mechanism ■ Fans ■ Heat sink ■ Liquid ■ Thermal paste c01.indd 03/23/2019 Page 4 A personal computer (PC) is a computing device made up of many distinct electronic components that all function together in order to accomplish some useful task, such as adding up the numbers in a spreadsheet or helping you to write a letter. Note that this defi nition describes a computer as having many distinct parts that work together. Most PCs today are modular. That is, they have components that can be removed and replaced with another component of the same function but with different specifi cations in order to improve performance. Each component has a specifi c function. Much of the computing industry today is focused on smaller devices, such as laptops, tablets, and smartphones. -
2018 Annual Report on Form 10-K
2018 ANNUAL REPORT ON FORM 10-K MARCH 2019 DEAR SHAREHOLDERS: From the industry’s first 1GHz CPU to the world’s first GPU delivering a teraflop of computing power, AMD has always stood for pushing the boundaries of what is possible. A few years ago, we made several big bets to accelerate our pace of innovation, strengthen our execution, and enable AMD to deliver a leadership portfolio of computing and graphics processors capable of increasing our share of the $75 billion high-performance computing market. In 2018, we saw those bets begin to pay off as we delivered our second straight year of greater than 20% annual revenue growth and significantly improved our gross margin and profitability from the previous year. REVENUE GROSS MARGIN % R&D INVESTMENT EXPENSE/REVENUE % $ Billions $ Billions $6.5B 38% $1.43B 34% $5.3B 34% 33% $4.3B $1.20B 23% $1.01B 31% 2016 2017 2018 2016 2017 2018 2016 2017 2018 2016 2017 2018 Added $2.2B in revenue Significantly improved gross Increased R&D by more than Significant improvement over the last 2 years margin over last 2 years based 40% over the last 2 years in OPEX leverage on new product portfolio Our newest Ryzen™, EPYC™ and datacenter GPU products contributed more than $1.2 billion of revenue in 2018 and helped us gain share across our priority markets. In 2018, we added 3.9% points of desktop processor unit share, 5.3% points of notebook processor unit share and met our goal of exiting the year with mid-single digit server processor market share. -
SMBIOS Specification
1 2 Document Identifier: DSP0134 3 Date: 2019-10-31 4 Version: 3.4.0a 5 System Management BIOS (SMBIOS) Reference 6 Specification Information for Work-in-Progress version: IMPORTANT: This document is not a standard. It does not necessarily reflect the views of the DMTF or its members. Because this document is a Work in Progress, this document may still change, perhaps profoundly and without notice. This document is available for public review and comment until superseded. Provide any comments through the DMTF Feedback Portal: http://www.dmtf.org/standards/feedback 7 Supersedes: 3.3.0 8 Document Class: Normative 9 Document Status: Work in Progress 10 Document Language: en-US 11 System Management BIOS (SMBIOS) Reference Specification DSP0134 12 Copyright Notice 13 Copyright © 2000, 2002, 2004–2019 DMTF. All rights reserved. 14 DMTF is a not-for-profit association of industry members dedicated to promoting enterprise and systems 15 management and interoperability. Members and non-members may reproduce DMTF specifications and 16 documents, provided that correct attribution is given. As DMTF specifications may be revised from time to 17 time, the particular version and release date should always be noted. 18 Implementation of certain elements of this standard or proposed standard may be subject to third party 19 patent rights, including provisional patent rights (herein "patent rights"). DMTF makes no representations 20 to users of the standard as to the existence of such rights, and is not responsible to recognize, disclose, 21 or identify any or all such third party patent right, owners or claimants, nor for any incomplete or 22 inaccurate identification or disclosure of such rights, owners or claimants. -
Lista Sockets.Xlsx
Data de Processadores Socket Número de pinos lançamento compatíveis Socket 0 168 1989 486 DX 486 DX 486 DX2 Socket 1 169 ND 486 SX 486 SX2 486 DX 486 DX2 486 SX Socket 2 238 ND 486 SX2 Pentium Overdrive 486 DX 486 DX2 486 DX4 486 SX Socket 3 237 ND 486 SX2 Pentium Overdrive 5x86 Socket 4 273 março de 1993 Pentium-60 e Pentium-66 Pentium-75 até o Pentium- Socket 5 320 março de 1994 120 486 DX 486 DX2 486 DX4 Socket 6 235 nunca lançado 486 SX 486 SX2 Pentium Overdrive 5x86 Socket 463 463 1994 Nx586 Pentium-75 até o Pentium- 200 Pentium MMX K5 Socket 7 321 junho de 1995 K6 6x86 6x86MX MII Slot 1 Pentium II SC242 Pentium III (Cartucho) 242 maio de 1997 Celeron SEPP (Cartucho) K6-2 Socket Super 7 321 maio de 1998 K6-III Celeron (Socket 370) Pentium III FC-PGA Socket 370 370 agosto de 1998 Cyrix III C3 Slot A 242 junho de 1999 Athlon (Cartucho) Socket 462 Athlon (Socket 462) Socket A Athlon XP 453 junho de 2000 Athlon MP Duron Sempron (Socket 462) Socket 423 423 novembro de 2000 Pentium 4 (Socket 423) PGA423 Socket 478 Pentium 4 (Socket 478) mPGA478B Celeron (Socket 478) 478 agosto de 2001 Celeron D (Socket 478) Pentium 4 Extreme Edition (Socket 478) Athlon 64 (Socket 754) Socket 754 754 setembro de 2003 Sempron (Socket 754) Socket 940 940 setembro de 2003 Athlon 64 FX (Socket 940) Athlon 64 (Socket 939) Athlon 64 FX (Socket 939) Socket 939 939 junho de 2004 Athlon 64 X2 (Socket 939) Sempron (Socket 939) LGA775 Pentium 4 (LGA775) Pentium 4 Extreme Edition Socket T (LGA775) Pentium D Pentium Extreme Edition Celeron D (LGA 775) 775 agosto de -
Procesory AMD
Procesory AMD Mariusz Nowak 2019 Gniazdo PGA Socket AM2 • Liczba pinów: 940 • Rok wprowadzenia: 2006 • Magistrale: FSB 200 MHz, HyperTransport 2.0 • Obsługa kontrolera pamięci DDR2 zintegrowanego z procesorem • Athlon 64, Sempron, Opteron, Phenom Gniazdo PGA Socket AM2+ • Liczba pinów: 940 • Rok wprowadzenia: 2007 • Magistrale: FSB 200 MHz, HyperTransport 3.0 (2.6 GHz) • Obsługa procesorów 1-, 2-, 3-, 4-rdzeniowych • Athlon 64, Athlon II, Opteron, Phenom, Phenom II Gniazdo PGA Socket AM3 • Liczba pinów: 941 • Rok wprowadzenia: 2009 • Magistrale: FSB 200 MHz, HyperTransport 3.0 (2.6 GHz) • Obsługa DDR3 • Athlon II, Phenom II, Sempron, Opteron Gniazdo PGA Socket AM4 • Liczba pinów: 1331 • Rok wprowadzenia: 2016 • Obsługa DDR4, PCIe 3.0 i 4.0 • Wsparcie dla architektury ZEN (procesory Ryzen, Athlon) Gniazdo LGA Socket TR4 • Liczba pinów: 4094 • Rok wprowadzenia: 2017 • Obsługa DDR4 (8 modułów, 4 kanały), PCIe 3.0 i 4.0 • Wsparcie dla architektury ZEN (super wydajne procesory Ryzen Threadripper) Oznaczenia najnowszych procesorów AMD (Zen) Zapotrzebowanie na energię Nazwa • (brak) - komputer stacjonarny Ryzen 5 3 5 50 H • U - komputer przenośny handlowa • X - wysoka częstotliwość taktowania • WX - duża ilość rdzeni • G - z układem graficznym • E - obniżone zapotrzebowanie na energię (komputer stacjonarny) • M - obniżone zapotrzebowanie na Seria Generacja Wydajność Numer energię (komputer przenośny) • H - wysokowydajny komputer • 3 (mała wydajność) • 1 • 9 (ekstremalna) modelu przenośny • 5 (średnia wydajność) • 2 • 8 (najwyższa) procesora • -
Prezentacja Dotycząca Płyt Głównych
PŁYTA GŁÓWNA Podstawowe parametry płyt głównych Standard płyty (ATX, Micro-ATX, Mini-ITX, ITX) Gniazdo procesora Chipset płyty (H – do zastosowań uniwersalnych, B – dla biznesu, C – dla wydajnych komputerów gamingowych, Z – rekomendowane do komputerów, które będą podkręcane) Standard pamięci (obecnie stand to DDR4) Maksymalna obsługiwana pamięć Oferowane złącza (USB 3.0 i typu C, Thunderbolt, PCI Express i inne) Rodzaje płyt głownych opis ATX-w komputerach składakach wyższej klasy instaluje się zwykle płyty główne w formacie ATX. Mają one rozmiar 305 x 244 milimetry, mogą pomieścić nawet trzy karty graficzne lub cztery karty rozszerzeń - takie jak karta TV czy dźwiękowa. Duże radiatory na najważniejszych układach chronią je przed przegrzaniem. Dedykowane sa dla zestawów o dużej wydajności, które użytkownika planuje rozbudować w przyszłości. Micro-ATX - w większości komputerów domowych montuje się płyty w formacie Micro-ATX o maksymalnym rozmiarze 244 x 244 milimetry. Na takiej płycie można zwykle zamontować jedną kartę graficzną i dwie lub trzy inne karty rozszerzeń. Zaletą tego rozwiązania jest mniejszy format, co pozwala zredukować wielkość obudowy. Minusy? Ograniczone możliwości rozbudowy zestawu. Mini-ITX - dla minikomputerów (na przykład nettopów czy zestawów barebone) przeznaczone są płyty w formacie Mini-ITX (171 x 171 milimetrów). Możliwości rozbudowy komputera skonstruowanego na bazie takiej płyty są bardzo ograniczone (przeważnie jest na nich tylko jeden port rozszerzeń). Zaleta? Zwykle całkowiecie pasywne chłodzenie, a więc totalna cisza. Złącza rodzaje SATA II i SATA III – magistrale umożliwiające podłączenie dysków twardych (3 Gbit/s i 6 Gbit/s), eSATA (eSATAp, xSATA, mSATA) – zewnętrzny port umożliwiający podłączenie dysków zewnętrznych prędkość od 3 Gbit/s do 6 Gbit/s , M.2 – możliwość podłączenia dysków SSD prędkość 4 GB/s, PCI, AGP, PCI Express – służą do połączenia min. -
Purpose Power AMD Platform Solutions Performance Optimized, Power-Ef Cient and Perfect Density Mar
HPC. Big Data. Convergence. All Purpose Power AMD Platform Solutions Performance Optimized, Power-efcient and Perfect Density Mar. 2021 3rd Gen AMD Ryzen Threadripper Server Board TRX40D8-2N2T with Dual 10GbE and IPMI AMD Ryzen™ Threadripper Gen 3.0 TRX40D8-2N2T Form Factor ATX (12" x 9.6") Processor System CPU Socket sTRX4 (LGA4094P), supports 3rd Gen AMD Ryzen™ Threadripper™ Series Processors PCH AMD TRX40 Memory Capacity 8 DIMM slots (2DPC), supports DDR4 ECC and non-ECC UDIMM, up to 3200MHz 32GB per DIMM Expansion PCIe slot 3 PCIe 4.0 x16, 1 PCIe 4.0 x8 Others 1 OCulink (PCIe 4.0 x4) [BTO] Storage M.2 2 M-key (PCIe 4.0 x4 or SATA 6Gb/s); Form factor: 22110/2280/2260/2242 SATA port AMD TRX40: 4 SATA 6Gb/s (2 supports SATA DOM), ASM 1061: 2 SATA 6Gb/s Network RJ45 2 RJ45 (10GbE) by Intel® X710-AT2, 2 RJ45 (2.5 GbE) by Intel® i225 Management BMC ASPEED AST2500 : IPMI (Intelligent Platform Management Interface) 2.0 IPMI Dedicated LAN 1 x Realtek RTL8211E for Dedicated Management GLAN I/O USB USB 3.2 Gen 2 Port: 1 rear Type A, 1 rear Type C USB 3.2 Gen 1 Port: 2 rear Type A, 2 via header, 1 type A AMD X399-based Versatile and Multiple PCIe X399D8A-2T ATX Board with 10GbE Networking AMD Ryzen™ Threadripper Gen 1.0 X399D8A-2T Form Factor ATX (12" x 9.6") Processor Support Single Socket LGA SP3 4094P, Supports AMD TR4 Socket Ryzen Threadripper Series Processors Chipset AMD X399 Memory Capacity 8 DIMM Slots, Supports Dual Channel DDR4 3600+(OC)/3200(OC)/2933(OC)/2666/2400/2133 ECC and non-ECC U DIMM (Max 64GB(SR)/128GB(DR)) Storage SATA Controller -
Muntatge D'equips Microinformàtics Conjunt Placa Mare, Processador I
M1: Muntatge i manteniment d'equips microinformàtics UF3: Muntatge d'equips microinformàtics Conjunt placa mare, processador i memòria CFGM Sistemes Microinformàtics i Xarxes Professor: Joaquim Martínez Característiques Sòcol processador Connexió DIMM de memòria Tipus de memòria Velocitat del bus de memòria Velocitat interna del processador Xipset Evolució dels processadors Fins fa pocs anys els processadors només incorporaven els circuits lògics del processador, o processadors si és multinucli, i memòria caché. Fa poc han començat a incorporar el controlador de memòria, especialment des de l'aparició de les memòries DDR3, connectant-se la memòria directament al processador i simplificant el pont nord del xipset, que interconnecta el processador, el PCIe x16 per les gràfiques i el pont sud. Actualment alguns fins i tot integren un processador gràfic i el controlador PCIe x16 de connexió per les gràfiques, cas en que desapareix el pont nord del xipset i el processador es connecta directament al pont sud del xipset. Evolució dels processadors Controlador de memòria Depenen d'on es trobi el controlador de memòria la compatibilitat del tipus de memòria pot dependre només del processador o també del xipset. Trobem dos casos: Controlador de memòria al processador. Processador connectat directament amb la memòria. El processador ha de ser compatible amb el tipus de memòria. Controlador de memòria al pont nord. Processador connectat a la memòria a través del pont nord del xipset. El processador i el xipset han de ser compatible amb el tipus de memòria. Controlador de memòria Al final seran les connexions de la placa mare les que marcaran el tipus de processador i de memòria a fer servir, segons el xipset i les connexions de que disposa. -
SMBIOS) Reference 6 Specification
1 2 Document Identifier: DSP0134 3 Date: 2018-04-26 4 Version: 3.2.0 5 System Management BIOS (SMBIOS) Reference 6 Specification 7 Supersedes: 3.1.1 8 Document Class: Normative 9 Document Status: Published 10 Document Language: en-US 11 System Management BIOS (SMBIOS) Reference Specification DSP0134 12 Copyright Notice 13 Copyright © 2000, 2002, 2004–2016 Distributed Management Task Force, Inc. (DMTF). All rights 14 reserved. 15 DMTF is a not-for-profit association of industry members dedicated to promoting enterprise and systems 16 management and interoperability. Members and non-members may reproduce DMTF specifications and 17 documents, provided that correct attribution is given. As DMTF specifications may be revised from time to 18 time, the particular version and release date should always be noted. 19 Implementation of certain elements of this standard or proposed standard may be subject to third party 20 patent rights, including provisional patent rights (herein "patent rights"). DMTF makes no representations 21 to users of the standard as to the existence of such rights, and is not responsible to recognize, disclose, 22 or identify any or all such third party patent right, owners or claimants, nor for any incomplete or 23 inaccurate identification or disclosure of such rights, owners or claimants. DMTF shall have no liability to 24 any party, in any manner or circumstance, under any legal theory whatsoever, for failure to recognize, 25 disclose, or identify any such third party patent rights, or for such party’s reliance on the standard or 26 incorporation thereof in its product, protocols or testing procedures. -
MSI Z270 SLI PLUS Driver LAN Download Windows 8.1 DRIVER Z370 SLI PLUS for WINDOWS 7 64
MSI Z270 SLI PLUS driver LAN download windows 8.1 DRIVER Z370 SLI PLUS FOR WINDOWS 7 64. All images and descriptions are for illustrative purposes only. Products online at stock speed, B360, Dual M. NEXT GEN Z370 MOTHERBOARDS WITH 6-CORE SUPPORT. The MSI Z370 SLI PLUS Motherboard. Rear Type. Server Memory. Why is Asus Prime Z370-P better than MSI Z370 SLI Plus? Here's how Z390, Z370, H370, B360, and H310 motherboards compare. 12-02- 2018 MSI Z370 SLI Plus review, Performance The Z370 SLI Plus fared well at stock speed, matching the rest of the field with a system score of 186,504, and never straying far from the best Z370 results we ve seen. There's been a new and descriptions are flashing. Ti Graphics. 101 461 55 AMD Socket AM2+, GIGABYTE. 12-02-2018 MSI Z370 SLI Plus review, Conclusion The MSI Z370 SLI Plus offers excellent value for money for a Z370 motherboard already, but it offers many high-end features and solid performance in our benchmarks that mean it s still competitive with considerably more expensive boards. Support For Z370 SLI & AMD 3-Way Crossfire Member Center. Hello, Performance The SLI Plus? DRIVER EPSON 620F FOR WINDOWS 8.1 DOWNLOAD. The Pro series consists of two motherboards, the Z370 PC Pro and Z370-A Pro. Product specification, functions and appearance may vary by models and differ from country to country. World class performance in the product. This Ryzen based mobo has some impressive features. 2 ssd samsung 960 EVO NVMe 250GB M.