The Case of the Microcomputer Hardware Industry in Ireland and Scotland
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INTEL CORPORATION (Exact Name of Registrant As Specified in Its Charter) Delaware 94-1672743 State Or Other Jurisdiction of (I.R.S
UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 FORM 10-K (Mark One) x ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the fiscal year ended December 31, 2016. or ¨ TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the transition period from to . Commission File Number 000-06217 INTEL CORPORATION (Exact name of registrant as specified in its charter) Delaware 94-1672743 State or other jurisdiction of (I.R.S. Employer incorporation or organization Identification No.) 2200 Mission College Boulevard, Santa Clara, California 95054-1549 (Address of principal executive offices) (Zip Code) Registrant’s telephone number, including area code (408) 765-8080 Securities registered pursuant to Section 12(b) of the Act: Title of each class Name of each exchange on which registered Common stock, $0.001 par value The NASDAQ Global Select Market* Securities registered pursuant to Section 12(g) of the Act: None Indicate by check mark if the registrant is a well-known seasoned issuer, as defined in Rule 405 of the Securities Act. Yes x No ¨ Indicate by check mark if the registrant is not required to file reports pursuant to Section 13 or Section 15(d) of the Act. Yes ¨ No x Indicate by check mark whether the registrant (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past 90 days. -
The Politics of Global Production: Apple, Foxconn and Chinas New
New Technology, Work and Employment 28:2 ISSN 0268-1072 The politics of global production: Apple, Foxconn and China’s new working class Jenny Chan, Ngai Pun and Mark Selden Apple’s commercial triumph rests in part on the outsourcing of its consumer electronics production to Asia. Drawing on exten- sive fieldwork at China’s leading exporter—the Taiwanese- owned Foxconn—the power dynamics of the buyer-driven supply chain are analysed in the context of the national ter- rains that mediate or even accentuate global pressures. Power asymmetries assure the dominance of Apple in price setting and the timing of product delivery, resulting in intense pressures and illegal overtime for workers. Responding to the high- pressure production regime, the young generation of Chinese rural migrant workers engages in a crescendo of individual and collective struggles to define their rights and defend their dignity in the face of combined corporate and state power. Keywords: Foxconn, Apple, global supply chains, labour, China, outsourcing, consumer electronics manufacturing, collective actions. Introduction The magnitude of Apple’s commercial success is paralleled by, and based upon, the scale of production in its supply chain factories, the most important of them located in Asia (Apple, 2012a: 7). As the principal manufacturer of products and components for Apple, Taiwanese company Foxconn1 currently employs 1.4 million workers in China alone. Arguably, then, just as Apple has achieved a globally dominant position, described as ‘the world’s most valuable brand’ (Brand Finance Global 500, 2013), so too have the fortunes of Foxconn been entwined with Apple’s success, facilitating Foxconn’s rise to become the world’s largest electronics contractor (Dinges, 2010). -
Value Chain Assignment
Value Chain Assignment 2008 MBA/ENG 290G International Competition in Technology Team 1 • Team 1: Cloud 1 Project: Software cloud • Franck Formis - franck_formis[at]mba.berkeley.edu • Vincent Wai-Shan Ng - vincentng[at]berkeley.edu • Jameson Slattery - jameson_slattery[at]mba.berkeley.edu • Robert Ka Chun Kong - rkong[at]berkeley.edu • Chuohao Yeo - zuohao[at]eecs.berkeley.edu 2 PC Value Chain Analysis MBA 290G.1 9/24/2008 Team 1: Franck Formis, Robert Kong, Vincent Ng, Jameson Slattery & Chuohao Yeo Acer value chain and its dependencies Distribution & R&D Components Manufacturer Marketing •Apacer •Toshiba •Wistron •Channel Business •AQR •Fujitsu •BenQ Model – indirect •Kingdom Corp. •Sony •AMBIT •Resellers •Animeta System •Hitachi •ALi partnership •Mitsubishi •Aegis •Global •Lite-On Semiconductor distributor •IBM •Yam Digital Tech. •Acer Computer •Ambit •Legend Tech. •Logistron Service •Sumida •RDC Semiconductor •Broadwalk Capital •Sanyo •Feiya Tech. Red – heavy presence by Acer 4 Blue – no or light presence by Acer Example 5 Source: http://somo.nl/html/paginas/pdf/Acer_Incorporated_Company_Prof_2005_EN.pdf Asus value chain and its dependencies •R&D center •Chips •Motherboard •Eee PC •Sales, •Sales, •Core •Logic IC •LED display •Ultra marketing marketing technology •PCB •Sound blaster Mobile PC and PM and PM center •Connectors •Eee PC •phone groups groups •DRAM •Intel, nVIDIA etc •Procurement and material management center Red – heavy presence by Asus 6 Blue – no or light presence by Asus Dell Value Chain Marketing & R&D Components Design -
Improved Quantification of CSF Bilirubin in the Presence of Hemoglobin Using Least Squares Curve-Fitting
2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2011) Boston, Massachusetts, USA 30 August – 3 September 2011 Pages 1-396 IEEE Catalog Number: CFP11EMB-PRT ISBN: 978-1-4244-4121-1 1/17 Program in Chronological Order * Author Name – Corresponding Author ● * Following Paper Title – Paper not Available Tuesday, 30 August 2011 TuP01: 15:15-16:45 America Ballroom Westin 3.1.13 Advances in Optical and Photonic Sensors and Systems (Poster Session) 15:15-16:45 TuP01.1 Improved Quantification of CSF Bilirubin in the Presence of Hemoglobin Using Least Squares Curve-Fitting ......... 1-4 Butler, Josh (Univ. of Cincinnati); Booher, Blaine (Xanthostat Diagnostics Inc.); Bowman, Peggy (Univ. of Cincinnati); Clark, Joseph F (Univ. of Cincinnati); Beyette, Fred R* (Univ. of Cincinnati) 15:15-16:45 TuP01.2 CMOS Direct Time Interval Measurement of Long-Lived Luminescence Lifetimes .................................................. 5-9 Yao, Lei (Inst. of Microelectronics, Singapore); Yung, Ka Yi (Univ. at Buffalo); Cheung, Maurice (McGill Univ.); Chodavarapu, Vamsy* (McGill Univ.); Bright, Frank (Univ. at Buffalo) 15:15-16:45 TuP01.3 CMOS Integrated Avalanche Photodiodes and Frequency-Mixing Optical Sensor Front End for Portable NIR Spectroscopy Instruments ........................................................................................... 10-13 Yun, Ruida (Tufts Univ.); Sthalekar, Chirag* (Tufts Univ.); Joyner, Valencia (Tufts Univ.) 15:15-16:45 TuP01.4 Inclusion Mechanical Property Estimation Using Tactile Images, Finite Element Method, and Artificial Neural Network ...................................................................................................................................... 14-17 Lee, Jong-Ha (Temple Univ.); Won, Chang-Hee* (Temple Univ.) 15:15-16:45 TuP01.5 Development of an Optoelectronic Sensor for the Investigation of Photoplethysmographic Signals from the Anterior Fontanel of the Newborn ................................................................................................ -
THE STORY of ELECTRONICS: Annotated Script
THE STORY OF ELECTRONICS: Annotated Script By Annie Leonard The other day, I couldn’t find my computer charger. My computer is my lifeline to my work, my friends, my music. So I looked everywhere, even in that drawer where this lives. I know you have one too, a tangle of old chargers, the sad remains of electronics past. How did I end up with so many of these things? It’s not like I’m always after the latest gadget. My old devices broke or became so obsolete I couldn’t use them anymore. And not one of these old chargers fits my computer. Augh. This isn’t just bad luck. It’s bad design.1 I call it “designed for the dump.” “Designed for the dump” sounds crazy, right? But when you’re trying to sell lots of stuff, it makes perfect sense. It’s a key strategy of the companies that make our electronics.2 In fact it’s a key part of our whole unsustainable materials economy. Designed for the dump means making stuff to be thrown away quickly. Today’s electronics are hard to upgrade, easy to break, and impractical to repair. My DVD player broke and I took it to a shop to get fixed. The repair guy wanted $50 just to look at it! A new one at Target costs $39.3 In the 1960s, Gordon Moore, the giant brain and semiconductor pioneer, predicted that electronics 1. It may seem crazy, but many of these products are actually designed where consumers access data on the Internet – or “the cloud” – to break after a certain amount of time. -
Everything Matters
Everything intel.com/go/responsibility Matters Global Citizenship Report 2003 Contents Executive Summary 3 Everything Adds Up Corporate Performance 4 Organizational Profile 6 Everywhere Matters 8 Stakeholder Relationships 10 Performance Summary 11 Goals & Targets 12 Ethics & Compliance 13 Economic Performance Environment, Health & Safety 14 Every Effort Contributes 16 Performance Indicators 18 Inspections & Compliance 19 Workplace Health & Safety 20 Environmental Footprint 22 Product Ecology 23 EHS Around the World Social Programs & Performance 24 Everyone Counts 26 Workplace Environment 31 Everyone Has a Say 32 Diversity 34 Education 36 Technology in the Community 37 Contributing to the Community 38 External Recognition 39 Intel: 35 Years of Innovation GRI Content Table Section # GRI Section Intel Report Reference Page # 1.1 Vision & Strategy Executive Summary 3 1.2 CEO Statement Executive Summary 3 2.1– 2.9 Organizational Profile Organizational Profile, Stakeholder Relationships 4–9 2.10– 2.16 Report Scope Report Scope & Profile 2 2.17– 2.22 Report Profile Report Scope & Profile 2 3.1– 3.8 Structure & Governance Ethics & Compliance 12 3.9– 3.12 Stakeholder Engagement Stakeholder Relationships 8–9 3.13– 3.20 Overarching Policies & Management Systems Ethics & Compliance, For More Information 12, 40 4.1 GRI Content Index GRI Content Table 2 Performance Summary 2003 Performance, 2004 Goals & Targets 10–11 5.0 Economic Performance Indicators Economic Performance 13 5.0 Environmental Performance Indicators Environment, Health & Safety 14– 23 5.0 Social Performance Indicators Social Programs & Performance 24–37 Report Scope and Profile: This report, addressing Intel’s worldwide operations, was published in May 2004. The report contains data from 2001 through 2003. -
Solectron Corporation
Table of Contents UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 FORM 10−K (MARK ONE) [X] ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the fiscal year ended August 30, 2002 OR [ ] TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 FOR THE TRANSITION PERIOD FROM ___________ TO _____________ Commission File Number 001−11098 SOLECTRON CORPORATION (Exact name of Registrant as Specified in its Charter) Delaware 94−2447045 (State or Other Jurisdiction of Incorporation or Organization) (I.R.S. Employer Identification Number) 777 Gibraltar Drive Milpitas, California 95035 (Address of Principal Executive Offices including Zip Code) (408) 957−8500 (Registrant’s Telephone Number, Including Area Code) Securities registered pursuant to Section 12(b) of the Act: 7.25% Adjustable Conversion−Rate Equity Security Units 3.25% Liquid Yield Option Notes due 2020 2.75% Liquid Yield Option Notes due 2020 Common Stock Securities registered pursuant to Section 12(g) of the Act: None Indicate by check mark whether the registrant (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past 90 days. Yes [X] No [ ] Indicate by check mark if disclosure of delinquent filers pursuant to Item 405 of Regulation S−K is not contained herein, and will not be contained, to the best of Registrant’s knowledge, in definitive proxy or information statements incorporated by reference in Part III of this Form 10−K, or any amendment to this Form 10−K. -
Wen-Mei William Hwu
Wen-mei William Hwu PERSONAL INFORMATION Office: Home: Coordinated Science Laboratory 2709 Bayhill Drive 1308 West Main Street, Champaign, Illinois, 61822-7988 Urbana, Illinois, 61801-2307 (217) 359-8984 (217) 244-8270 (217) 333-5579 (FAX) Email: [email protected] EDUCATION Ph.D., Computer Science,1987, University of California, Berkeley B.S., Electrical Engineering, 1983, National Taiwan University, Taiwan CURRENT POSITION Professor and Sanders III Advanced Micro Devices, Inc., Endowed Chair, Electrical and Computer Engineering; Research Professor of Coordinated Science Laboratory, University of Illinois, Urbana-Champaign (UIUC). Chief Technology Officer and Co-Founder, MulticoreWare, Sunnnyvale, California, St. Louis, Missouri, Champaign, Illinois, Chennai, India, Chang-Chun and Beijing, China. Chief Scientist, Parallel Computing Institute, University of Illinois at Urbana-Champaign Board Member, Personify, Inc., Champaign, IL PROFESSIONAL EXPERIENCE September 2016 to present Co-Director (with Jinjun Xiong of IBM) of the IBM-Illinois Center for Cognitive Computing Systems Research, funded by IBM at a total of $8M for five years. The center funds a total of 30+ researchers working on hardware, software, and algorithms for building cognitive computing systems for innovative AI applications. June 2010 to present Co-Director (with Mateo Valero) of the PUMPS Summer School in Barcelona jointly offered by UIUC and the Universitat Politècnica de Catalunya. The summer school has been attended by about 100 faculty and graduate students worldwide every year to study the advanced parallel algorithm techniques for manycore computing systems. June 2008 to present Principle Investigator of the UIUC CUDA Center of Excellence, funded by NVIDIA at over $2.0 M in cash and equipment. -
Apple Inc.: Managing a Global Supply Chain1
For the exclusive use of T. Ausby, 2015. W14161 APPLE INC.: MANAGING A GLOBAL SUPPLY CHAIN1 Ken Mark wrote this case under the supervision of Professor P. Fraser Johnson solely to provide material for class discussion. The authors do not intend to illustrate either effective or ineffective handling of a managerial situation. The authors may have disguised certain names and other identifying information to protect confidentiality. This publication may not be transmitted, photocopied, digitized or otherwise reproduced in any form or by any means without the permission of the copyright holder. Reproduction of this material is not covered under authorization by any reproduction rights organization. To order copies or request permission to reproduce materials, contact Ivey Publishing, Ivey Business School, Western University, London, Ontario, Canada, N6G 0N1; (t) 519.661.3208; (e) [email protected]; www.iveycases.com. Copyright © 2014, Richard Ivey School of Business Foundation Version: 2014-06-12 INTRODUCTION Jessica Grant was an analyst with BXE Capital (BXE), a money management firm based in Toronto.2 It was February 28, 2014, and Grant was discussing her U.S. equity mandate with BXE’s vice president, Phillip Duchene. Both Grant and Duchene were trying to identify what changes, if any, they should make to BXE’s portfolio. “Apple is investing in its next generation of products, potentially the first new major product lines since Tim Cook took over from Steve Jobs,” she said. Apple Inc., the world’s largest company by market capitalization, had introduced a series of consumer products during the past dozen years that had transformed it into the industry leader in consumer devices. -
Abbott Laboratories Advanced Micro Devices, Inc
FORTUNE 1000 CUSTOMERS equipped with the power to save lives 3M (3 Com Corporation) Gannett Co, Inc. Pittston Co 3M (3M Company) General Electric Pratt & Whitney Abbott Laboratories Gencorp Praxair Advanced Micro Devices, Inc. General Dynamics Corporation Procter & Gamble Agilent Technologies, Inc. General Mills Progressive Insurance AK Steel General Motors Purolator Alcoa Gillette Quantum Corporation Allstate Gold Kist, Inc. Raytheon Amazon Goldman Sachs Group, Inc. Readers Digest Amerada Hess Corporation Goodyear Reebok American Express Great Lakes Chemical Corp Revlon, Inc. Anadarko Petroleum Corporation Guidant Corporation Rockwell International AON Corporation Halliburton Company Rohm and Haas Company Apache Corporation Harley-Davidson Safeco Corporation Applied Materials Harris Corporation Sentry Insurance Ashland, Inc. Heinz Sherwin-Williams AT&T Hercules Incorporated Sierra Pacific Resources Ball Corporation Hewlett Packard Sisco Bank of America Corporation Hilton Spartan Stores Bank of New York Company, Inc. Hon Industries, Inc. Sprint Bear Stearns Companies, Inc. Honeywell Solectron Corporation Bethlehem Steel Hubbell Corporation Solutia, Inc. Blockbuster IBM Southern Company Boeing Intel Southern Union Company, Inc. Bristol-Myers Squibb International Paper Standard Register Company Cabot ITT Industries, Inc. State Farm Calpine Corporation Jabil Circuit, Inc. Steelcase, Inc. Carrier Corporation John Deere Textron, Inc. Caterpillar Johnson & Johnson The Gap Charter Communications, Inc. Johnson Controls Timberland Company Chevron -
The List of Oral and Poster Presentations with 4-Page Paper
The list of oral and poster presentations with 4-page paper at 35th Annual International Conference of IEEE Engineering in Medicine and Biology Society in Conjunction with 52nd Annual Conference of Japanese Society for Medical and Biological Engineering The articles listed below can be accessed via IEEE Xplore® as “Engineering in Medicine and Biolo- gy Society (EMBC), Annual International Conference of the IEEE”. Thursday, 4 July 2013 ThA01: 08:00-09:30 Conference Hall (12F) 1.1.1 Nonstationary Processing of Biomedical Signals I (Oral Session) Chair: Yoshida, Hisashi (Kinki Univ.) 08:00-08:15 ThA01.1 Estimation of Dynamic Neural Activity Including Informative Priors into a Kalman Filter Based Ap- proach: A simulation study Martinez-Vargas, Juan David Universidad Nacional de Colombia; Castano-Candamil, Juan Sebastian Universidad Nacional de Colombia; Castellanos-Dominguez, German Universidad Nacional de Colombia 08:15-08:30 ThA01.2 Reconstruction and Analysis of the Pupil Dilation Signal: Application to a Psychophysiological Af- fective Protocol Onorati, Francesco Politecnico di Milano; Barbieri, Riccardo MGH-Harvard Medical School-MIT; Mauri, Maurizio IULM University of Milan; Russo, Vincenzo IULM University of Milan; Mainardi, Luca Politecnico di Milano 08:30-08:45 ThA01.3 Adaptive Sensing of ECG Signals Using R-R Interval Prediction Nakaya, Shogo NEC Corporation; Nakamura, Yuichi NEC Corp. 08:45-09:00 ThA01.4 Real Time Eye Blink Noise Removal from EEG Signals Using Morphological Component Analysis Matiko, Joseph Wambura University of -
2008 Corporate Responsibility Report
2008 Corporate Responsibility Report What can we make possible? A world of possibilities. LETTER FROM OUR CEO Throughout our 40-year history, Intel has pushed the boundaries of innovation, creating products that have fundamentally changed the way people live and work. But what we make possible goes well beyond our product roadmap. By working with others, we are finding opportunities to apply our technology and expertise to help tackle some of the world’s greatest challenges—from climate change and water conservation to education quality and the digital divide. Our commitment to corporate responsibility is unwavering, even during economic downturns. In education, we surpassed the milestone of training 6 million teachers worldwide through the Taking a proactive, integrated approach to managing our impact on local communities and the Intel® Teach Program. In addition, we partnered with governments to support the advancement environment not only benefits people and our planet, but is good for our business. Making of their education programs, and helped put affordable, portable, Intel-powered classmate PCs corporate responsibility an integral part of Intel’s strategy helps us mitigate risk, build strong into the hands of students in close to 40 countries. We announced a joint business venture with relationships with our stakeholders, and expand our market opportunities. Grameen Trust, using a “social business” model aimed at applying tech nology to address issues related to education, poverty, and healthcare in developing countries. While I am proud of the many recognitions that we have received—including our number one spot on Corporate Responsibility Officer magazine’s 100 Best Corporate Citizens list for At the heart of our commitment to corporate responsibility are Intel’s more than 80,000 2008—we continue to push ourselves to do more.