INTEL CORPORATION (Exact Name of Registrant As Specified in Its Charter) Delaware 94-1672743 State Or Other Jurisdiction of (I.R.S
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
Fog Gateways:The Cornerstone of Iot Security
WHITE PAPER Fog Gateways: The Cornerstone of IoT Security Fog Gateways: The Cornerstone of IoT Security By Nicholas Cravotta The IoT offers tremendous value, safety. Utilities can dynamically change rates and shift loads—thus preventing overinvestment in power but also introduces major security generation. IoT-based medical devices can monitor challenges. Connecting previously offline patients continuously to identify trends and alert systems increases the attack surface for hackers— caregivers before an emergency arises. and the diversity of these systems makes it difficult to But all these benefits depend on secure data flow. deploy and manage consistent security. If the network is compromised, the result can be The nature of internal networks—such as the automation disastrous. For industrial applications, the cost could be networks that connect factory machinery—add to the the shutdown of operations or equipment damage. In a problem. Legacy networks provide minimal authorization, utilities environment, invalid data could result in black- little authentication, and not enough encryption. There outs and lost revenue. For retail applications, security is often no protection against intrusion, unauthorized breaches could halt sales and expose customer data. reconfiguration of edge equipment, or DDoS attacks. If an attacker gains access to these unsecure networks, the What Makes IoT Security Different entire organization can be at risk. In some ways, security concerns are nothing new. Most Fog computing can address these security issues today organizations already have security precautions in place and help you prepare for new challenges on the horizon. to protect sensitive IT systems and physical assets. But Fog gateways provide secure connectivity to local equip- the IoT introduces new threats that can catch businesses ment, intelligent data processing, and end-to-end off guard. -
Wind River Linux 5.X and Intel Gateway Solutions for Iot
Subject to Wind River Terms of Use - Do Not Copy – Do Not Distribute EDUCATION SERVICES Wind River Linux 5.x and Intel Gateway Solutions for IoT Version 1.0 A LECTURE GUIDE Volume 1 of 2 Subject to Wind River Terms of Use - Do Not Copy – Do Not Distribute LECTURE GUIDE Wind River Linux 5.x and Intel Gateway Solutions for IoT, Version 1.0 A Education Services Production Date: October 2014 Copyright c 2014 Wind River Systems, Inc. All rights reserved. No part of this publication may be reproduced or transmitted in any form or by any means without the prior written permission of Wind River Systems, Inc. Wind River, Tornado, and VxWorks are registered trademarks of Wind River Systems, Inc. The Wind River logo is a trademark of Wind River Systems, Inc. Any third-party trademarks refer- enced are the property of their respective owners. For further information regarding Wind River trademarks, please see: http://www.windriver.com/company/terms/trademark.html Wind River may refer to third-party documentation by listing publications or providing links to third-party Web sites for informational purposes. Wind River accepts no responsibility for the information provided in such third-party documentation. This document is designed to support the Wind River Linux 5.x and Intel Gateway Solutions for IoT course. It is not designed as a stand-alone document, nor is it intended as a substitute for documentation that accompanies Tornado, VxWorks, or Wind River Workbench or any other Wind River Systems, Inc. software or hardware product. http://education.windriver.com Education Services Department Wind River Systems, Inc. -
Multiprocessing Contents
Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References ............................................. -
Improved Quantification of CSF Bilirubin in the Presence of Hemoglobin Using Least Squares Curve-Fitting
2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2011) Boston, Massachusetts, USA 30 August – 3 September 2011 Pages 1-396 IEEE Catalog Number: CFP11EMB-PRT ISBN: 978-1-4244-4121-1 1/17 Program in Chronological Order * Author Name – Corresponding Author ● * Following Paper Title – Paper not Available Tuesday, 30 August 2011 TuP01: 15:15-16:45 America Ballroom Westin 3.1.13 Advances in Optical and Photonic Sensors and Systems (Poster Session) 15:15-16:45 TuP01.1 Improved Quantification of CSF Bilirubin in the Presence of Hemoglobin Using Least Squares Curve-Fitting ......... 1-4 Butler, Josh (Univ. of Cincinnati); Booher, Blaine (Xanthostat Diagnostics Inc.); Bowman, Peggy (Univ. of Cincinnati); Clark, Joseph F (Univ. of Cincinnati); Beyette, Fred R* (Univ. of Cincinnati) 15:15-16:45 TuP01.2 CMOS Direct Time Interval Measurement of Long-Lived Luminescence Lifetimes .................................................. 5-9 Yao, Lei (Inst. of Microelectronics, Singapore); Yung, Ka Yi (Univ. at Buffalo); Cheung, Maurice (McGill Univ.); Chodavarapu, Vamsy* (McGill Univ.); Bright, Frank (Univ. at Buffalo) 15:15-16:45 TuP01.3 CMOS Integrated Avalanche Photodiodes and Frequency-Mixing Optical Sensor Front End for Portable NIR Spectroscopy Instruments ........................................................................................... 10-13 Yun, Ruida (Tufts Univ.); Sthalekar, Chirag* (Tufts Univ.); Joyner, Valencia (Tufts Univ.) 15:15-16:45 TuP01.4 Inclusion Mechanical Property Estimation Using Tactile Images, Finite Element Method, and Artificial Neural Network ...................................................................................................................................... 14-17 Lee, Jong-Ha (Temple Univ.); Won, Chang-Hee* (Temple Univ.) 15:15-16:45 TuP01.5 Development of an Optoelectronic Sensor for the Investigation of Photoplethysmographic Signals from the Anterior Fontanel of the Newborn ................................................................................................ -
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
Case 2:16-cv-02026-DMF Document 1 Filed 06/22/16 Page 1 of 25 1 AIKEN SCHENK HAWKINS & RICCIARDI P.C. 2390 East Camelback Road, Suite 400 2 Phoenix, Arizona 85016 Telephone: (602) 248-8203 3 Facsimile: (602) 248-8840 E-Mail: [email protected] 4 E-Mail: [email protected] 5 Joseph A. Schenk – 009260 6 Bradley W. Caldwell (pro hac vice to be filed) Jason D. Cassady (pro hac vice to be filed) 7 J. Austin Curry (pro hac vice to be filed) Warren J. McCarty (pro hac vice to be filed) 8 Jason S. McManis (pro hac vice to be filed) CALDWELL CASSADY CURRY P.C. 9 2101 Cedar Springs Rd., Suite 1000 Dallas, Texas 75201 10 Telephone: (214) 888-4848 Facsimile: (214) 888-4849 11 Email: [email protected] Email: [email protected] 12 Email: [email protected] Email: [email protected] 13 Email: [email protected] 14 ATTORNEYS FOR PLAINTIFF CONTINENTAL CIRCUITS, LLC 15 IN THE UNITED STATES DISTRICT COURT 16 FOR THE DISTRICT OF ARIZONA 17 CONTINENTAL CIRCUITS, LLC, CASE NO. 18 Plaintiff, 19 COMPLAINT FOR PATENT v. INFRINGEMENT 20 INTEL CORP.; IBIDEN U.S.A. CORP.; 21 IBIDEN CO., LTD., JURY TRIAL DEMANDED 22 Defendants. 23 24 Plaintiff Continental Circuits LLC files this Complaint against Defendants Intel 25 Corporation, Ibiden U.S.A. Corporation, and Ibiden Co., Ltd. (collectively, “Defendants”) 26 for patent infringement under 35 U.S.C. § 271 and alleges, based on its own personal 27 knowledge with respect to its own actions and based upon information and belief with 28 respect to all others’ actions, as follows: 582424.1 Case 2:16-cv-02026-DMF Document 1 Filed 06/22/16 Page 2 of 25 1 THE PARTIES 2 1. -
Intel® Quark™ SE Microcontroller
Bringing intelligence to the internet of things Introducing the Intel® Quark™ SE Microcontroller John Moore Intel IoT Application Engineer 2nd Nov 2016 Legal Disclaimers You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty- free license to any patent claim thereafter drafted which includes subject matter disclosed herein No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-4725 or by visiting: http://www.intel.com/design/literature.htm Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase. For more complete information about performance and benchmark results, visit http://www.intel.com/performance. Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at intel.com. -
Everything Matters
Everything intel.com/go/responsibility Matters Global Citizenship Report 2003 Contents Executive Summary 3 Everything Adds Up Corporate Performance 4 Organizational Profile 6 Everywhere Matters 8 Stakeholder Relationships 10 Performance Summary 11 Goals & Targets 12 Ethics & Compliance 13 Economic Performance Environment, Health & Safety 14 Every Effort Contributes 16 Performance Indicators 18 Inspections & Compliance 19 Workplace Health & Safety 20 Environmental Footprint 22 Product Ecology 23 EHS Around the World Social Programs & Performance 24 Everyone Counts 26 Workplace Environment 31 Everyone Has a Say 32 Diversity 34 Education 36 Technology in the Community 37 Contributing to the Community 38 External Recognition 39 Intel: 35 Years of Innovation GRI Content Table Section # GRI Section Intel Report Reference Page # 1.1 Vision & Strategy Executive Summary 3 1.2 CEO Statement Executive Summary 3 2.1– 2.9 Organizational Profile Organizational Profile, Stakeholder Relationships 4–9 2.10– 2.16 Report Scope Report Scope & Profile 2 2.17– 2.22 Report Profile Report Scope & Profile 2 3.1– 3.8 Structure & Governance Ethics & Compliance 12 3.9– 3.12 Stakeholder Engagement Stakeholder Relationships 8–9 3.13– 3.20 Overarching Policies & Management Systems Ethics & Compliance, For More Information 12, 40 4.1 GRI Content Index GRI Content Table 2 Performance Summary 2003 Performance, 2004 Goals & Targets 10–11 5.0 Economic Performance Indicators Economic Performance 13 5.0 Environmental Performance Indicators Environment, Health & Safety 14– 23 5.0 Social Performance Indicators Social Programs & Performance 24–37 Report Scope and Profile: This report, addressing Intel’s worldwide operations, was published in May 2004. The report contains data from 2001 through 2003. -
Wen-Mei William Hwu
Wen-mei William Hwu PERSONAL INFORMATION Office: Home: Coordinated Science Laboratory 2709 Bayhill Drive 1308 West Main Street, Champaign, Illinois, 61822-7988 Urbana, Illinois, 61801-2307 (217) 359-8984 (217) 244-8270 (217) 333-5579 (FAX) Email: [email protected] EDUCATION Ph.D., Computer Science,1987, University of California, Berkeley B.S., Electrical Engineering, 1983, National Taiwan University, Taiwan CURRENT POSITION Professor and Sanders III Advanced Micro Devices, Inc., Endowed Chair, Electrical and Computer Engineering; Research Professor of Coordinated Science Laboratory, University of Illinois, Urbana-Champaign (UIUC). Chief Technology Officer and Co-Founder, MulticoreWare, Sunnnyvale, California, St. Louis, Missouri, Champaign, Illinois, Chennai, India, Chang-Chun and Beijing, China. Chief Scientist, Parallel Computing Institute, University of Illinois at Urbana-Champaign Board Member, Personify, Inc., Champaign, IL PROFESSIONAL EXPERIENCE September 2016 to present Co-Director (with Jinjun Xiong of IBM) of the IBM-Illinois Center for Cognitive Computing Systems Research, funded by IBM at a total of $8M for five years. The center funds a total of 30+ researchers working on hardware, software, and algorithms for building cognitive computing systems for innovative AI applications. June 2010 to present Co-Director (with Mateo Valero) of the PUMPS Summer School in Barcelona jointly offered by UIUC and the Universitat Politècnica de Catalunya. The summer school has been attended by about 100 faculty and graduate students worldwide every year to study the advanced parallel algorithm techniques for manycore computing systems. June 2008 to present Principle Investigator of the UIUC CUDA Center of Excellence, funded by NVIDIA at over $2.0 M in cash and equipment. -
The List of Oral and Poster Presentations with 4-Page Paper
The list of oral and poster presentations with 4-page paper at 35th Annual International Conference of IEEE Engineering in Medicine and Biology Society in Conjunction with 52nd Annual Conference of Japanese Society for Medical and Biological Engineering The articles listed below can be accessed via IEEE Xplore® as “Engineering in Medicine and Biolo- gy Society (EMBC), Annual International Conference of the IEEE”. Thursday, 4 July 2013 ThA01: 08:00-09:30 Conference Hall (12F) 1.1.1 Nonstationary Processing of Biomedical Signals I (Oral Session) Chair: Yoshida, Hisashi (Kinki Univ.) 08:00-08:15 ThA01.1 Estimation of Dynamic Neural Activity Including Informative Priors into a Kalman Filter Based Ap- proach: A simulation study Martinez-Vargas, Juan David Universidad Nacional de Colombia; Castano-Candamil, Juan Sebastian Universidad Nacional de Colombia; Castellanos-Dominguez, German Universidad Nacional de Colombia 08:15-08:30 ThA01.2 Reconstruction and Analysis of the Pupil Dilation Signal: Application to a Psychophysiological Af- fective Protocol Onorati, Francesco Politecnico di Milano; Barbieri, Riccardo MGH-Harvard Medical School-MIT; Mauri, Maurizio IULM University of Milan; Russo, Vincenzo IULM University of Milan; Mainardi, Luca Politecnico di Milano 08:30-08:45 ThA01.3 Adaptive Sensing of ECG Signals Using R-R Interval Prediction Nakaya, Shogo NEC Corporation; Nakamura, Yuichi NEC Corp. 08:45-09:00 ThA01.4 Real Time Eye Blink Noise Removal from EEG Signals Using Morphological Component Analysis Matiko, Joseph Wambura University of -
Lightweight Smart Glass System with Audio Aid for Visually Impaired People
Lightweight Smart Glass System with Audio Aid for Visually Impaired People Feng Lan, Guangtao Zhai and Wei Lin Institute of Image Communication and Information Processing, Shanghai Jiao Tong University, Shanghai, China Email: fdeanlan, zhaiguangtao,linwei181491g @sjtu.edu.cn Abstract—In this paper, we present a new smart glass system for people who are blind or have low vision. Individuals with visual disability are difficult to communicate effectively with their environment. The blind or visually impaired rely largely on their other senses such as hearing, touch, and smell in order to understand their surroundings. It is pretty hard for them to go out alone, not to mention finding toilets, subway stations, restaurants and so on. Giving blind people the great accessibility to their environment is the objective of the smart glass system. This smart glass system can see the world for them and give voice instructions and hints through wireless bone conduction headphones. This smart glass system will help visually impaired people gain increased independence and freedom in city life. And Fig. 1: Snapshot of the prototype smart glass. we have implemented an application of public signs recognition on the smart glass system. This application can detect and recognize the public signs in cities, and give corresponding voice hints to the blindness. The proposed prototype system is based on Intel by Intel as a development system for wearable devices. Its Edison, and the application in the system is written in C++ with dimensions are 35:5 × 25 × 3:9mm, with components on both libraries of OpenCV. Extended demonstration of the system will sides. -
Intel® Quark™ SE Microcontroller C1000 Development Platform
Intel® Quark™ SE Microcontroller C1000 Development Platform User Guide December 2016 Document Number: 335278-002EN You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800- 548-4725 or by visiting: http://www.intel.com/design/literature.htm Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at http://www.intel.com/ or from the OEM or retailer. No computer system can be absolutely secure. Intel, Intel Quark, and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries. *Other names and brands may be claimed as the property of others. Copyright © 2016, Intel Corporation. All rights reserved. Intel® Quark™ SE Microcontroller C1000 Development Platform User Guide December 2016 2 Document Number: 335278-002EN Contents 1.0 Introduction ................................................................................................................................................ -
2008 Corporate Responsibility Report
2008 Corporate Responsibility Report What can we make possible? A world of possibilities. LETTER FROM OUR CEO Throughout our 40-year history, Intel has pushed the boundaries of innovation, creating products that have fundamentally changed the way people live and work. But what we make possible goes well beyond our product roadmap. By working with others, we are finding opportunities to apply our technology and expertise to help tackle some of the world’s greatest challenges—from climate change and water conservation to education quality and the digital divide. Our commitment to corporate responsibility is unwavering, even during economic downturns. In education, we surpassed the milestone of training 6 million teachers worldwide through the Taking a proactive, integrated approach to managing our impact on local communities and the Intel® Teach Program. In addition, we partnered with governments to support the advancement environment not only benefits people and our planet, but is good for our business. Making of their education programs, and helped put affordable, portable, Intel-powered classmate PCs corporate responsibility an integral part of Intel’s strategy helps us mitigate risk, build strong into the hands of students in close to 40 countries. We announced a joint business venture with relationships with our stakeholders, and expand our market opportunities. Grameen Trust, using a “social business” model aimed at applying tech nology to address issues related to education, poverty, and healthcare in developing countries. While I am proud of the many recognitions that we have received—including our number one spot on Corporate Responsibility Officer magazine’s 100 Best Corporate Citizens list for At the heart of our commitment to corporate responsibility are Intel’s more than 80,000 2008—we continue to push ourselves to do more.