DOCSLIB.ORG

Pb-Free Surface Finish Project

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Pb-Free Surface Finish Project EvaluationEvaluation ofof SubstrateSubstrate SurfaceSurface FinishesFinishes forfor PbPb--freefree AssemblyAssembly ProjectProject Chair: Keith Newman, Sun Microsystems Pb-free Surface Finish Project Objective Evaluate the effects of alternative surface finishes for circuit boards and package substrates on Pb-free solder joint reliability during accelerated stress testing. Project Participants Agere, ASE, Cisco, Cookson, Dage, Foxconn, Henkel, HP, IBM, Intel, Lucent, Plexus, Solectron, Sun Microsystems, Texas Instruments, TTM and Vitronics- Soltec Pb-free Surface Finish Project Abstract The transition to the use of Pb-free solder alloys introduces new solder joint reliability concerns. The implementation of alternative surface finishes for circuit boards and package substrates compounds these concerns. This iNEMI project is conducting comparative four-point bend testing, drop testing and board-level thermal cycling of Pb-free components assembled on test boards, as well as comparative solder ball shear/pull testing on BGA and CSP components. The test packages include BGA, CSP and QFP devices, manufactured in a variety of Pb-free surface finishes. OSP and immersion Ag surface finishes are being evaluated for the circuit boards. Sn3Ag0.5Cu solder paste has been selected for the component attachment. Project completion is targeted for March 2007. Pb-free Surface Finish Project Pb-free Surface Finishes PWB Laminate OSP (Entek+ CU106AXHT) Immersion Ag (Alpha Star i-Ag) BGA Substrates Electrolytic Ni/Au ENIG Ni/Pd/Au Cu (SOC, OSP & i-Sn) Lead-frames Matte Sn Matte Sn/Ni Ni/Pd/Au Pb-free Surface Finish Project PWB Laminate Thermal Cycle Test Board Polyclad 370HR 18 metal layers 2.35 mm (0.093 in.) thick 4-Point Monotonic Bend Test Boards Polyclad 370HR 18 metal layers 2.35 mm (0.093 in.) thick Drop Test Boards Polyclad 370HR 8 metal layers 1.55 mm (0.062 in.) thick Pb-free Surface Finish Project Pb-free Components Flip-Chip BGA 1681 FC-BGA, 42.5 mm sq., 1.0 mm pitch (ASE) 1680 FC-BGA, 42.5 mm sq., 1.0 mm pitch (IBM) 479 FC-BGA, 35 mm sq., 1.27 mm pitch (Intel) Wirebond BGA/CSP 676 BGA, 27 mm sq., 1.0 mm pitch (Amkor) 84 CSP, 7 mm sq., 0.5 mm pitch (Amkor) 64 CSP, 8 mm sq., 0.8 mm pitch (Amkor) Wirebond Leadframe 56 MLCC, 7 mm sq., 0.4 mm pitch (Agere) 176 QFP, 20 mm sq., 0.4 mm pitch (Agere) 176 TQFP, 20 mm sq., 0.4 mm pitch (Texas Instruments) Pb-free Surface Finish Project 2 IST Coupons 11.8" x 2.0" 2 ATC Test Boards 11.8“ x 8.2" Bend Test Coupons 10.6“ x 19.5" iNEMI PANEL A LAYOUT [ 24” x 21” PANEL SIZE ] Pb-free Surface Finish Project U361 U321 MLCC 56 U751 Intel Intel IBM FCBGA 479 FCBGA 479 IBM FCBGA 1680 FCBGA 1680 MLCC 56 U741 U231 U221 CSP 64 CSP 84 J3 J1 BOARD LABEL U611 U511 J4 Amkor PBGA 676 Agere Agere TI QFP 176 QFP 176 TQFP 176 U411 U841 U851 U961 R0201 R0603 R2512 ASE ASE ASE FCBGA 1681 FCBGA 1681 Intel FCBGA 1681 FCBGA 479 J2 U131 U111 U3X1 U121 i N E M I L E A D - F R E E S U R F A C E F I N I S H T E S T V E H I C L E [ A T C C O U P O N S ] ATC TEST BOARD LAYOUT ( iNEMI PANEL A ) Pb-free Surface Finish Project ASE Intel IBM FCBGA 1681 FCBGA 479 FCBGA 1680 U312 U112 U222 ASE Intel Amkor FCBGA 1681 FCBGA 479 PBGA 676 U412 U322 U122 ASE Intel IBM FCBGA 1681 FCBGA 479 FCBGA 1680 U332 U132 U232 U612 U742 U752 U512 Amkor Agere Agere Amkor CSP 84 MLCC 56 MLCC 56 CSP 64 i N E M I L E A D - F R E E S U R F A C E F I N I S H T E S T V E H I C L E [ B E N D T E S T C O U P O N S ] BEND TEST BOARD LAYOUT ( iNEMI PANEL A ) Pb-free Surface Finish Project 24.0” x 21.0” 22.5” x 19.5” Intel IBM FCBGA 479 FCBGA 1680 U3Y3 U2Y3 ASE Intel FCBGA 1936 FCBGA 479 DROP TEST PANEL LAYOUT ( iNEMI PANEL B ) Pb-free Surface Finish Project 24.0” x 21.0” 22.5” x 19.5” ASE ASE FCBGA 1681 FCBGA 1681 U1Y3B U1Y3A ASE Intel FCBGA 1936 FCBGA 479 DROP TEST PANEL LAYOUT ( iNEMI PANEL C ) Lead-free Surface Finish Project Project Status During 2005 a comprehensive test plan was developed, and the daisy-chain test packages (BGA, CSP, QFP, etc.) were fabricated and delivered. Time-zero component characterization (cross-section, X-ray, CSAM, coplanarity, etc.) of these components was completed. Extensive low/high speed solder ball shear and pull testing was also completed. Thermal cycle and monotonic bend test board designs were released for fabrication. .
Load more

Recommended publications
  • The Politics of Global Production: Apple, Foxconn and Chinas New
    New Technology, Work and Employment 28:2 ISSN 0268-1072 The politics of global production: Apple, Foxconn and China’s new working class Jenny Chan, Ngai Pun and Mark Selden Apple’s commercial triumph rests in part on the outsourcing of its consumer electronics production to Asia. Drawing on exten- sive fieldwork at China’s leading exporter—the Taiwanese- owned Foxconn—the power dynamics of the buyer-driven supply chain are analysed in the context of the national ter- rains that mediate or even accentuate global pressures. Power asymmetries assure the dominance of Apple in price setting and the timing of product delivery, resulting in intense pressures and illegal overtime for workers. Responding to the high- pressure production regime, the young generation of Chinese rural migrant workers engages in a crescendo of individual and collective struggles to define their rights and defend their dignity in the face of combined corporate and state power. Keywords: Foxconn, Apple, global supply chains, labour, China, outsourcing, consumer electronics manufacturing, collective actions. Introduction The magnitude of Apple’s commercial success is paralleled by, and based upon, the scale of production in its supply chain factories, the most important of them located in Asia (Apple, 2012a: 7). As the principal manufacturer of products and components for Apple, Taiwanese company Foxconn1 currently employs 1.4 million workers in China alone. Arguably, then, just as Apple has achieved a globally dominant position, described as ‘the world’s most valuable brand’ (Brand Finance Global 500, 2013), so too have the fortunes of Foxconn been entwined with Apple’s success, facilitating Foxconn’s rise to become the world’s largest electronics contractor (Dinges, 2010).
    [Show full text]
  • Value Chain Assignment
    Value Chain Assignment 2008 MBA/ENG 290G International Competition in Technology Team 1 • Team 1: Cloud 1 Project: Software cloud • Franck Formis - franck_formis[at]mba.berkeley.edu • Vincent Wai-Shan Ng - vincentng[at]berkeley.edu • Jameson Slattery - jameson_slattery[at]mba.berkeley.edu • Robert Ka Chun Kong - rkong[at]berkeley.edu • Chuohao Yeo - zuohao[at]eecs.berkeley.edu 2 PC Value Chain Analysis MBA 290G.1 9/24/2008 Team 1: Franck Formis, Robert Kong, Vincent Ng, Jameson Slattery & Chuohao Yeo Acer value chain and its dependencies Distribution & R&D Components Manufacturer Marketing •Apacer •Toshiba •Wistron •Channel Business •AQR •Fujitsu •BenQ Model – indirect •Kingdom Corp. •Sony •AMBIT •Resellers •Animeta System •Hitachi •ALi partnership •Mitsubishi •Aegis •Global •Lite-On Semiconductor distributor •IBM •Yam Digital Tech. •Acer Computer •Ambit •Legend Tech. •Logistron Service •Sumida •RDC Semiconductor •Broadwalk Capital •Sanyo •Feiya Tech. Red – heavy presence by Acer 4 Blue – no or light presence by Acer Example 5 Source: http://somo.nl/html/paginas/pdf/Acer_Incorporated_Company_Prof_2005_EN.pdf Asus value chain and its dependencies •R&D center •Chips •Motherboard •Eee PC •Sales, •Sales, •Core •Logic IC •LED display •Ultra marketing marketing technology •PCB •Sound blaster Mobile PC and PM and PM center •Connectors •Eee PC •phone groups groups •DRAM •Intel, nVIDIA etc •Procurement and material management center Red – heavy presence by Asus 6 Blue – no or light presence by Asus Dell Value Chain Marketing & R&D Components Design
    [Show full text]
  • THE STORY of ELECTRONICS: Annotated Script
    THE STORY OF ELECTRONICS: Annotated Script By Annie Leonard The other day, I couldn’t find my computer charger. My computer is my lifeline to my work, my friends, my music. So I looked everywhere, even in that drawer where this lives. I know you have one too, a tangle of old chargers, the sad remains of electronics past. How did I end up with so many of these things? It’s not like I’m always after the latest gadget. My old devices broke or became so obsolete I couldn’t use them anymore. And not one of these old chargers fits my computer. Augh. This isn’t just bad luck. It’s bad design.1 I call it “designed for the dump.” “Designed for the dump” sounds crazy, right? But when you’re trying to sell lots of stuff, it makes perfect sense. It’s a key strategy of the companies that make our electronics.2 In fact it’s a key part of our whole unsustainable materials economy. Designed for the dump means making stuff to be thrown away quickly. Today’s electronics are hard to upgrade, easy to break, and impractical to repair. My DVD player broke and I took it to a shop to get fixed. The repair guy wanted $50 just to look at it! A new one at Target costs $39.3 In the 1960s, Gordon Moore, the giant brain and semiconductor pioneer, predicted that electronics 1. It may seem crazy, but many of these products are actually designed where consumers access data on the Internet – or “the cloud” – to break after a certain amount of time.
    [Show full text]
  • Solectron Corporation
    Table of Contents UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 FORM 10−K (MARK ONE) [X] ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the fiscal year ended August 30, 2002 OR [ ] TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 FOR THE TRANSITION PERIOD FROM ___________ TO _____________ Commission File Number 001−11098 SOLECTRON CORPORATION (Exact name of Registrant as Specified in its Charter) Delaware 94−2447045 (State or Other Jurisdiction of Incorporation or Organization) (I.R.S. Employer Identification Number) 777 Gibraltar Drive Milpitas, California 95035 (Address of Principal Executive Offices including Zip Code) (408) 957−8500 (Registrant’s Telephone Number, Including Area Code) Securities registered pursuant to Section 12(b) of the Act: 7.25% Adjustable Conversion−Rate Equity Security Units 3.25% Liquid Yield Option Notes due 2020 2.75% Liquid Yield Option Notes due 2020 Common Stock Securities registered pursuant to Section 12(g) of the Act: None Indicate by check mark whether the registrant (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past 90 days. Yes [X] No [ ] Indicate by check mark if disclosure of delinquent filers pursuant to Item 405 of Regulation S−K is not contained herein, and will not be contained, to the best of Registrant’s knowledge, in definitive proxy or information statements incorporated by reference in Part III of this Form 10−K, or any amendment to this Form 10−K.
    [Show full text]
  • Apple Inc.: Managing a Global Supply Chain1
    For the exclusive use of T. Ausby, 2015. W14161 APPLE INC.: MANAGING A GLOBAL SUPPLY CHAIN1 Ken Mark wrote this case under the supervision of Professor P. Fraser Johnson solely to provide material for class discussion. The authors do not intend to illustrate either effective or ineffective handling of a managerial situation. The authors may have disguised certain names and other identifying information to protect confidentiality. This publication may not be transmitted, photocopied, digitized or otherwise reproduced in any form or by any means without the permission of the copyright holder. Reproduction of this material is not covered under authorization by any reproduction rights organization. To order copies or request permission to reproduce materials, contact Ivey Publishing, Ivey Business School, Western University, London, Ontario, Canada, N6G 0N1; (t) 519.661.3208; (e) [email protected]; www.iveycases.com. Copyright © 2014, Richard Ivey School of Business Foundation Version: 2014-06-12 INTRODUCTION Jessica Grant was an analyst with BXE Capital (BXE), a money management firm based in Toronto.2 It was February 28, 2014, and Grant was discussing her U.S. equity mandate with BXE’s vice president, Phillip Duchene. Both Grant and Duchene were trying to identify what changes, if any, they should make to BXE’s portfolio. “Apple is investing in its next generation of products, potentially the first new major product lines since Tim Cook took over from Steve Jobs,” she said. Apple Inc., the world’s largest company by market capitalization, had introduced a series of consumer products during the past dozen years that had transformed it into the industry leader in consumer devices.
    [Show full text]
  • Abbott Laboratories Advanced Micro Devices, Inc
    FORTUNE 1000 CUSTOMERS equipped with the power to save lives 3M (3 Com Corporation) Gannett Co, Inc. Pittston Co 3M (3M Company) General Electric Pratt & Whitney Abbott Laboratories Gencorp Praxair Advanced Micro Devices, Inc. General Dynamics Corporation Procter & Gamble Agilent Technologies, Inc. General Mills Progressive Insurance AK Steel General Motors Purolator Alcoa Gillette Quantum Corporation Allstate Gold Kist, Inc. Raytheon Amazon Goldman Sachs Group, Inc. Readers Digest Amerada Hess Corporation Goodyear Reebok American Express Great Lakes Chemical Corp Revlon, Inc. Anadarko Petroleum Corporation Guidant Corporation Rockwell International AON Corporation Halliburton Company Rohm and Haas Company Apache Corporation Harley-Davidson Safeco Corporation Applied Materials Harris Corporation Sentry Insurance Ashland, Inc. Heinz Sherwin-Williams AT&T Hercules Incorporated Sierra Pacific Resources Ball Corporation Hewlett Packard Sisco Bank of America Corporation Hilton Spartan Stores Bank of New York Company, Inc. Hon Industries, Inc. Sprint Bear Stearns Companies, Inc. Honeywell Solectron Corporation Bethlehem Steel Hubbell Corporation Solutia, Inc. Blockbuster IBM Southern Company Boeing Intel Southern Union Company, Inc. Bristol-Myers Squibb International Paper Standard Register Company Cabot ITT Industries, Inc. State Farm Calpine Corporation Jabil Circuit, Inc. Steelcase, Inc. Carrier Corporation John Deere Textron, Inc. Caterpillar Johnson & Johnson The Gap Charter Communications, Inc. Johnson Controls Timberland Company Chevron
    [Show full text]
  • 2002-2003 Annual Report
    2002-2003 Annual Report Office of the County Assessor Lawrence E. Stone, Assessor Property Assessment Calendar Do you e-file? January 1 Lien Date for next assessment roll year. This is the e-filing is a new program that time when taxes for the next fiscal year become a lien allows taxpayers to confiden- on the property. Assessed values on this lien date are tially file their Business Prop- the basis for the property tax bills that are due in installments in December and the following April. erty Statement on-line, quickly and easily. Businesses selected February 15 Deadline to file all exemption claims. to participate in this program will be notified in January, April 1 Due date for filing statements for business personal 2003. See the Assessor’s property, aircraft and boats. Business property owners website for more must file a property statement each year detailing the cost of all supplies, machinery, equipment, leasehold information improvements, fixtures and land owned at each location within Santa Clara County. April 10 Last day to pay second installment of secured property taxes without penalty. This tax payment is Table of Contents based on property values determined for the January lien date 15 months earlier. May Annual mailing of assessment notices to all Santa Message from the Assessor ..................................................... 1 Clara County real property owners stating the taxable Assessment Roll Summary ..................................................... 4 value of the property. Real property owners who disagree with the Assessor’s valuation, may present any Ten-year Assessment Roll Summary ....................................... 5 pertinent factual information to the Assessor’s Office to determine the market value of the property before Factors Causing Change to the 2002-2003 Assessment Roll .
    [Show full text]
  • ECE Annual Report-2006-07.Pdf (1.603Mb)
    copyright 2007 table of contents 2006-2007 ECE Annual Report 2 The Numbers: Facts at a Glance 5 Students 10 Ph.D. Students Graduated 14 Faculty 16 Academic Faculty List 21 Research Highlights 24 Development Activities 25 ECE Advisory Board 26 Grants and Gifts 29 Capital Campaign 30 Support Activities 31 Glossary of Acronyms 32 Contact Information from the chair SchoolProjects of in Electrical progress and Computer Engineering Dear Colleagues, As the largest school on the Georgia Tech campus, the School of Electrical and Computer Engineering is a prime catalyst in Atlanta’s high-tech advancement through our innovative research, educational, and commercialization activities conducted with our corporate and government partners, alumni, and friends. Our reach extends beyond the city’s borders, with our School playing key leadership roles with the Georgia Tech Savannah campus, the Georgia Tech Lorraine campus in France, and the Georgia Tech Shanghai Initiative in China. With this breadth and depth in our activities, the nation and world are continu- ally taking notice of our work and our people. ECE research awards for fiscal year 2007 shattered yet another record, topping $6.5 million–an increase of $3 million from the previous year. Our programs range from areas of traditional strength like electrical energy systems operations to the burgeoning areas of robotics, distance learning technologies, and electronics that operate at ever increasing speeds. We continue to be a dominant player in the Institute’s commercialization activities, as Jacket Micro Devices became the eighth ECE-founded company to attain graduate status from the Advanced Technology Development Center.
    [Show full text]
  • Shareholder Value Creators in the S&P
    Working Paper WP-909 February, 2011 SHAREHOLDER VALUE CREATORS IN THE S&P 500: 1991 – 2010 Pablo Fernández Javier Aguirreamalloa Luis Corres IESE Business School – University of Navarra Av. Pearson, 21 – 08034 Barcelona, Spain. Phone: (+34) 93 253 42 00 Fax: (+34) 93 253 43 43 Camino del Cerro del Águila, 3 (Ctra. de Castilla, km 5,180) – 28023 Madrid, Spain. Phone: (+34) 91 357 08 09 Fax: (+34) 91 357 29 13 Copyright © 2011 IESE Business School. IESE Business School-University of Navarra - 1 The CIIF, International Center for Financial Research, is an interdisciplinary center with an international outlook and a focus on teaching and research in finance. It was created at the beginning of 1992 to channel the financial research interests of a multidisciplinary group of professors at IESE Business School and has established itself as a nucleus of study within the School’s activities. Ten years on, our chief objectives remain the same: • Find answers to the questions that confront the owners and managers of finance companies and the financial directors of all kinds of companies in the performance of their duties • Develop new tools for financial management • Study in depth the changes that occur in the market and their effects on the financial dimension of business activity All of these activities are programmed and carried out with the support of our sponsoring companies. Apart from providing vital financial assistance, our sponsors also help to define the Center’s research projects, ensuring their practical relevance. The companies in question, to which we reiterate our thanks, are: Aena, A.T.
    [Show full text]
  • Solectron Corp
    SECURITIES AND EXCHANGE COMMISSION FORM 10-K Annual report pursuant to section 13 and 15(d) Filing Date: 2001-11-15 | Period of Report: 2001-08-31 SEC Accession No. 0000835541-01-500022 (HTML Version on secdatabase.com) FILER SOLECTRON CORP Mailing Address Business Address 777 GIBRALTAR DR 777 GIBRALTAR DR CIK:835541| IRS No.: 942447045 | State of Incorp.:DE | Fiscal Year End: 0831 MILPITAS CA 95035 MILPITAS CA 95035 Type: 10-K | Act: 34 | File No.: 001-11098 | Film No.: 1792443 4089578500 SIC: 3672 Printed circuit boards Copyright © 2012 www.secdatabase.com. All Rights Reserved. Please Consider the Environment Before Printing This Document UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 FORM 10-K (MARK ONE) [X] ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the fiscal year ended August 31, 2001 OR [ ] TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 FOR THE TRANSITION PERIOD FROM ___________ TO _____________ Commission File Number 1-11098 SOLECTRON CORPORATION (Exact name of Registrant as Specified in its Charter) Delaware 94-2447045 (State or Other Jurisdiction of Incorporation or Organization) (I.R.S. Employer Identification Number) 777 Gibraltar Drive Milpitas, California 95035 (Address of Principal Executive Offices including Zip Code) (408) 957-8500 (Registrant's Telephone Number, Including Area Code) Securities registered pursuant to Section 12(b) of the Act: None Securities registered pursuant to Section 12(g) of the Act: Common Stock Indicate by check mark whether the registrant (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past 90 days.
    [Show full text]
  • The Case of the Microcomputer Hardware Industry in Ireland and Scotland
    NEW HIGH VOLUME PRODUCTION, PRODUCTION LINKAGES AND REGIONAL DEVELOPMENT: THE CASE OF THE MICROCOMPUTER HARDWARE INDUSTRY IN IRELAND AND SCOTLAND Chris Wilhelmus Andreas van Egeraat University Dublin City University Business School Supervisor Professor David Jacobson August 2002 Submitted for the degree of PhD at Dublin City University I hereby certify that this material, which I now submit for assessment on the programme of study leading to the award of a Ph D is entirely my own and has not been taken from the work of others save to the extent that such work has been cited and acknowledged within the text of my work Signed C i V -------------- 1 r ID No 96971835 Date 1 /”1/ ° 1 I( o7- REFERENCE ACKNOWLEDGEMENTS The first three years of research were funded by a Dublin City University Business School Scholarship Additional funding towards research and travel expenses was received from Forfas Ireland, which allowed me to undertake research in Scotland In the last stages, a Government of Ireland Research Scholarship in the Humanities and Social Sciences allowed me to finish the research I thank Karen for caring for our two darling daughters - Eppie Jean and Phoebe Lou - who both came to this world during the study period Furthermore, this dissertation would not have been completed without the guidance and advice of great number of academics at various institutes, notably Proinssias Breathnacht, Peter Dicken, Ivan Turok and Philip McCann Above all, I thank my supervisor David Jacobson for his support and Nick Phelps at the School of Geography,
    [Show full text]
  • The ICT Sector in the Spotlight
    Improving working conditions in the global electronics industry The ICT sector in the spotlight Leverage of public procurement decisions on working conditions in the supply chain 2 3 Electronics Watch The ICT sector in the spotlight The ICT sector in the spotlight The ICT sector in the spotlight Leverage of public procurement decisions on working conditions in the supply chain Publisher: Electronics Watch Consortium, c/o WEED e.V. www.electronicswatch.org [email protected] WEED e.V. – World Economy, Ecology & Development Eldenaer Straße 60, 10247 Berlin Germany Tel.: +49 (0)30 - 275 82 163 Fax: + 49 (0)30 - 275 96 928 [email protected] www.weed-online.org Author: Annelie Evermann Contributors: Martin Braun, Moritz Böttcher, Ulrike Tradowsky, Markus Henn Acknowledgements: We would like to thank several partners from the Good Electronics Network for their helpful comments and editing notes. Copyright: WEED e.V. Berlin, 2014 Layout: www.conceptegrafic.com Photo credits: Copyright-free photos This document has been produced by the Electronics Watch Consortium on the basis of research by WEED e.V. and with the financial assistance of the European Union and Stiftung Umwelt und Entwicklung Nordrhein-Westfalen. The contents of this document are the sole responsibility of WEED e.V. and can under no circumstances be regarded as reflecting the position of the funders. The Electronics Watch Consortium is driven by: 4 Contents 5 Electronics Watch Electronics Watch The ICT sector in the spotlight The ICT sector in the spotlight The ICT sector in the spotlight The ICT sector in the spotlight I. Introduction 7 II.
    [Show full text]