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NEMI Infrastructure NNEMEMII InInfrastrufrastructucture:re: Roadmapping Industry Needs and Closing Technology Gaps Bob Pfahl January 30, 2003 What Does NEMI Do? Leverage the combined Power of Member Companies to Provide Industry Leadership • NEMI Roadmaps the Needs of the North American Electronics Industry • NEMI Identifies Gaps (both business & technical) in the North American Infrastructure • NEMI Conducts Industry Forums on Emerging Topics • NEMI Stimulates R&D Projects to fill Gaps • NEMI Establishes Implementation Projects to Eliminate Gaps • NEMI Stimulates Standards to speed the Introduction of New Technology & Business Practices Connect with and Strengthen Your Supply Chain 2 NEMI Organization NENEMIMI Board Board Optoelectronics ofof Directors Directors NEMINEMI Staff Staff Chair Technology Elected by NEMI Council Secretary to BoD Integration Technology Elected by NEMI Council Secretary to BoD RepresentativesRepresentatives CommunicationsCommunications Group Working EMS Directors EMS Directors MembershipMembership Development Development Group OEM OEM Directors Directors TechnicalTechnical Facilitation Facilitation SupplierSupplier Directors Directors Substrates StrategicStrategic Objectives Objectives OperationalOperational Responsibility Responsibility Technology Chair Integration Group Technology Working Group Board Assembly Roadmapping TechnicalTechnical Committee Committee Implementation Technology EMS, OEM, Supplier & Chair 18 Industry EMS, OEM, Supplier & 5 NEMI Integration Academia/GovernmentAcademia/Government Group Groups Representatives Groups Technology Representatives Working Factory Group Information Systems Technology Integration BusinessBusiness Leadership Leadership Group Team Team ESE Chair EMS & OEM Representatives (Lead Free, EMS & OEM Representatives Etc.) Technology Technology Working Integration Group Group Connect with and Strengthen Your Supply Chain 3 Current NEMI Membership • 3M • Indium Corporation of America • 3 SAE Technologies • IPC • Adept Technology, Inc. • IEEC SUNY, Binghamton • Advanced Micro Devices, Inc. (AMD) • Intel Corporation • iManage • Aerotech World Trade • Jabil Circuits • Agile Software Corporation • Kester Solder • Agilent Technologies, Inc. • KIC Thermal Profiling • Alcatel Canada, Inc. • kSARIA • American Electronics Association (AEA) • Kulicke and Soffa Industries, Inc. • AMR Research • LACE Technologies • Asymtek • Loctite Corporation • Aurora Instruments • Lucent Technologies, Inc. • BTU International • Merix Corporation • CalNet • META Group • Centre for Microelectronics Assembly & Packaging (CMAP) • Ministere de L’industrie et du Commerce Government du Quebec • Celestica, Inc. • Motorola • National Center for Manufacturing Sciences (NCMS) • ChipPac, Inc. • National Institute of Standards and Technology (NIST) • Cimetrix, Inc. • Nextrom Photonics • Compaq Computer Corporation • Nortel Networks • Cookson Electronics • Orbotech • CyberOptics Corporation • Plexus Corp. • Delphi Delco Electronics Corporation • PTC Corp. • Dover Technologies International • Sanmina-SCI Corporation • E2open • Shipley Company • Eastman Kodak Company • Solectron Corporation • Electronic Industries Association (EIA) • Storage Technology Corporation • FCI • Sumitomo Electric Lightwave • Georgia Institute of Technology • Sun Microsystems • Technomatix-Unicam, Inc. • GSI Lumonics • Texas Instruments, Inc. • Heraeus • Virginia’s Center for Innovative Technology (CIT) • Hewlett Packard Company • Vytran • IBM Corporation Connect with and Strengthen Your Supply Chain 4 Major Accomplishments • Roadmapping – Global acceptance as the source that provides systems view of electronics manufacturing – published biennially. – Coordinated with other major organizations: SIA, IPC, OIDA, NSIC, Supply Chain Council, USDC. – Has accurately predicted emergence of a number of manufacturing technologies (e.g. Microvia PWB, open systems architectures in mfg. software). – Broad industry view (2002 version created by 370+ people from 170 companies/organizations). – Evolving to address changing priorities: Supply Chain Management, Environmentally Conscious Electronics, challenges of distributed manufacturing model. Connect with and Strengthen Your Supply Chain 5 NEMI Roadmap Linkages Optoelectronics and Optical Storage NEMI NEMI Optoelectronics Mass Data TWG Storage TWG Magnetic and Optical Storage Displays NEMI Supply Chain Management TWG Supply Chain Management NEMI Roadmap NEMI / SIA NEMI / IPC Packaging Interconnect Semiconductors TWG TWG Interconnect Substrates—Org anic Interconnect Substrates—Ceramic Connect with and Strengthen Your Supply Chain 6 How TIGs are Defined • TWG chairs identify potential gaps during roadmap development process, recommend follow-up activities. • NEMI Technical Committee (TC) reviews TWG recommendations. • TC decides on formation of Technical Integration Groups (TIGs) to address gaps. • TIGs review identified gaps and develop NEMI Technical Plan; TC approves. • TIGs, with TC approval, undertake projects to close gaps. Connect with and Strengthen Your Supply Chain 7 1998 NEMI Roadmap • Identified Embedded Passives as a Potential Paradigm Shift • Outlined a Gap Analysis on Technology Requirements Area of 2000 2003 2005 2011 Concern Materials Demonstrable Meets Requirements Manufacturing Low Yields Acceptable Availible Yields, Cost-Effective Infrastructure Existant EMBEDDED Infrastructure RESISTORS AND Design & Test Demonstrable Widespread DISTRIBUTED Common Practice PLANAR CAPACITANCE Cost High Competitive Cost Price Savings Availability Few Suppliers Available from Standard Parts Available from No Standards a Few Multiple Sources Sources Connect with and Strengthen Your Supply Chain 8 1999 Embedded Passives Gap Analysis R Materials 1999 2001 2003 2005 Large Resistivity Values, with Good Tolerances (to end-of-life) Power Density Other Elect., Chemical, Mech. Properti es - C Materials Large Capacitance Density Good C Tolerances (to end-of-life) Temperature and Frequency Characteristics Other Elect., Chemical, Mech. Properties Manufacturing New Processes for Capacitor, Resistor Well-defined Areas, Thickness Control Yield Rapid Prototype Cost Lead-free Design Resistor Layout and Artwork Generation Capacitor Layout and Artwork Generation Performance Simulation Test Methodology Equipment to Handle Panels Throughput Laser Trim X = Not Req'd Mfg. Technology Sufficient Inadequate Mfg. Technology—More Dev. needed Critical Need for Mfg. R&D R = Research D = Development I = Implementation Connect with and Strengthen Your Supply Chain 9 1999 Embedded Passives Implementation Plan INTEGRAL PASSIVES ATTRIBUTES INTEGRAL PASSIVES ATTRIBUTES INTEGRAL PASSIVES ATTRIBUTES 18”x24” Panel Size 12”x18” Panel Size 18”x24” Panel Size Plated Subtractive R is the baseline R Resistivity to 100 Ohms/square R Resistivity to 1 MOhm/square R Resistivity to 1 MOhm/square R Cost (No Trim) $0.20-0.30/ in2 R Cost (With Trim) $0.20-0.30/ in2 R Cost (With Trim) $0.08-0.25/ in2 R Density (Mixed R Values) 20/ in2 R Density (Mixed R Values) 60/ in2 R Density (Mixed R Values) 200/ in2 R Tolerance (No Trim) ±15% R Tolerance (Trimmed) ± 5% R Tolerance (Trimmed) ± 2% C Density ‹ 3 nF/ in2 C Density 30 nF/ in2 C Density 200 nF/ in2 C Cost $0.05-0.30/ in2 C Cost $0.20/ in2 C Cost <$0.10/ in2 DEPLOYED TECHNOLOGY DEPLOYED TECHNOLOGY DEPLOYED TECHNOLOGY Plated Subtractive Resistors Additive Plated and/or Screened Resistors Jetted Resistors Filled Epoxy Resistors Individual Capacitors Resistors and Capacitors in One Layer Distributed Capacitance Integrated Test/Trim of Resistors Complex Passives Test of Resistors (Slow) Seamless Resistor Layout Integrated Test/Trim of Capacitors Resistor Layout Capability (Limited) Capacitor Layout Capability (Limited) Seamless Resistor and Capacitor Layout Resistor Simulation Integrated Simulation Distributed Capacitance Simulation Low Value Inductors DEVELOPMENT DEVELOPMENT Additive Resistor Materials Compatible Resistors and Capacitors High Capacitance Density Materials Very High Speed Trim Test for 18”x24” Panels Jetted Resistors Trim Equipment Advanced CAD Tools Trim Patterns and Methods Complex Passives CAD Tool Enhancement Reduced Test Real Estate Manufacturing Techniques Inductor Materials and Processes Resistor Jetting RESEARCH Jettable R Materials Advanced Simulation Methods 1999 2002 2005 Dedicated to the AdvancementConnect of w theith North and AmericanStrengthen Electronics Your Supply Manufacturing Chain Infrastructure 10 Embedded Passives Project Goals • Develop materials, design and processing technology for embedding passive devices (resistors and capacitors) into circuit board substrates. – Meet industry need for denser, higher-performance products. – Improve cost, space requirements, performance and reliability. • Target frequencies of 1–10 GHz. – Use embedded passives to maintain signal integrity, enabling significant improvement in data transmission rates. • Reduce system cost of resistors to half that of chip resistors. • Provide cost modeling and process design tools that can be easily used by project designers. Connect with and Strengthen Your Supply Chain 11 Advanced Embedded Passives Technology Consortium Participants NEMI’s Embedded Passives Project is part of the Advanced Embedded Passives Technology Consortium. Work performed by this group received funding from the U.S. Department of Commerce, National Institute of Standards and Technology, Advanced Technology Program, Cooperative Agreement Number 70NANB8H4025 Connect with and Strengthen Your Supply Chain 12 High Frequency Materials for
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