Ensemble® 6000 Series OpenVPX™ Intel® Xeon® D-15xx Processor Family LDS6526 Low Density Server Blade with embedded I/O Xeon D processing performance, mezzanine sites, and built-in sensor I/O routed directly to the fabric via open architecture POET interface DATASHEET

• 6U OpenVPX single server blade • Intel® Xeon® D (Broadwell microarchitecture) server-class processing • 40 Gigabit Ethernet high bandwidth SW defined fabrics • Four channels built-in sensor I/O • Dual XMC mezzanine sites • 16 GB DDR4-2400 SDRAM • PCIe connectivity to OpenVPX expansion plane

The Ensemble LDS6526 is a 6U, OpenVPX™ processing blade Broadwell DE-Based Xeon D Ecosystem that seamlessly integrates the latest Intel® Xeon® D server- The Ensemble LDS6526 features a 64-bit Xeon D family processor class, general purpose processing capability with configurable which is protected and cooled by Mercury’s fifth generation of high- data plane and built-in sensor I/O pipes to form an ultra-wide- performance packaging, which has previously been deployed in prior band, powerful ingestion processing engine. generations of 6U OpenVPX LDS and HDS processing modules. The The Ensemble LDS6526 is an innovative integration of the best Xeon D family of processors includes a System on Chip (SoC) approach, general processing capability, configurable mezzanine sites, built-in combining the processor and the Intel platform controller hub (PCH) and SW defined I/O and data plane interfaces which are efficiently function within a single device. As a solderable BGA, the Xeon D family managed by FPGA-based Processing Packet Offload Engine Technol- extends the capability of the LDS architecture. As an example, the ogy (POET™). POET enables these interfaces to be bonded directly D-1559 device delivers up to 576 GFLOPS of processing power, which to the Intel processor or to remote endpoints connected to the data is a significant performance boost for the LDS architecture. With two plane fabric. high-speed DDR4-2400 memory controllers, the Xeon D processor is able to support up to 16 GB of DRAM, with future capabilities of up to The Ensemble LDS6526 is part of Mercury’s Xeon server-class eco- 32 GB per module. Significant PCIe interface capabilities are built in to system of building blocks that includes Xeon D-based high density the chip, which enable data interfaces both on and off-board. servers (HDS), high-speed switch modules, and FPGA- or GPU-based pre-processing modules. The inclusion of Xeon D based low-density The on-device PCH functionality enables the Ensemble LDS6526 to servers (LDS) brings additional processing resources to bear, access additional I/O, including USB and SATA on the backplane. The enabling processing and I/O on the module to remain balanced, Xeon D family of processors have dual 10 Gigabit Ethernet interfaces, avoiding data starvation or processor overload. enabling backplane access for sensor data or additional inter-processor communication and support for the AVX 2.0 instruction set that boosts www.mrcy.com floating-point algorithm performance and is portable to future Intel architectures.

Mercury Systems is a leading commercial provider of secure processing subsystems designed and made in the USA. Optimized for customer and 100101010 100101010 100101010 100101010 100101010 001101011 001101011 001101011 001101011 001101011 mission success, Mercury’s solutions power a wide variety of critical 110101100 110101100 110101100 110101100 110101100

defense and intelligence programs. ACQUIRE ACQUIREDIGITIZE ACQUIREPROCESDIGITIZES ACQUIRESTORAGEPROCESDIGITIZES ACQUIRESTORAGEPROCESDIGITIZEEXPLOITS DISSEMINAACQUIRESTORAGEPROCESDIGITIZEEXPLOITSTE

WARNING: “600 Series” and/or National Security Controls - These commodities, technology, or software are controlled for export from the United States in accor- dance with the Export Administration Act of 1979 as amended (Title 50 U.S.C.; App. 2401, et seq.), through the Export Administration Regulations (EAR). Transfers to foreign persons requires prior approval from the U.S. Department of Commerce, Bureau of Industry and Security. Integrated FPGA Resources High Speed Fabric Interfaces The Ensemble LDS6526 integrates an Altera Arria 10 FPGA device with The Ensemble LDS6526 continues the Mercury tradition of combining the Intel Xeon D processor to provide Mercury’s POET integrated data the processing power of Intel processors with high speed switched plane functionality and sensor I/O capabilities. The FPGA resources fabric interfaces. By scaling the data plane bandwidth to match the support the full OpenVPX data plane for flexible 40 Gigabit Ether- increase in processing performance, the Ensemble LDS6526 architec- net configurations, with the ability to support additional protocols, ture ensures that the processor is never starved for data. integrated switching, and high-speed DMA engines in a single device. By utilizing the Altera Arria 10 FPGA and innovative OpenVPX in- In addition to the data plane, the Ethernet control plane is integrated terconnect technology; the Ensemble LDS6526 is a model for open with the Altera device to allow for additional flexibility in configuration architecture high performance computing throughout the embedded and capability. By offloading traditional ASIC-based functionality in a industry. Mercury OpenVPX subsystems feature robust signal rates that FPGA, the Ensemble LDS6526 blade reduces DMS/EOL concerns for comfortably exceed the margin of the channel to surpass the rate of long-term support of program requirements. modern fabrics, delivering the fastest compute solution in the industry In addition to the data plane interfaces, the Ensemble LDS6526 deliv- with future proof performance headroom. ers four channels of protocol-configurable sensor I/O to the P6 user I/O PCIe Architecture connector. These high-speed sensor interfaces are interfaced with the The Ensemble LDS6526 provides on-board Gen3 PCIe switches for both POET FPGA-based switch and DMA functionality such that incoming on-board switching and off-board expansion. This switch complex pro- sensor data can be routed to the local Intel processor, or to remotely vides an x8 PCIe interface to each of the two XMC sites, as well as an connected fabric endpoints over the OpenVPX data plane. This elimi- x4 connection to a PCIe to PCI-X® bridge for the single PMC site. This nates the need for XMC-based sensor data feeds for many applica- allows mezzanines to operate at full bandwidth, optimizing the flow of tions, providing a significant cost advantage over similar OpenVPX I/O into the processing subsystem. Externally, the Ensemble LDS6526 products.

PMC2/XMC2

IPMB-A / IPMB-B 5 5 5 P25 P2 P21 P23 Thermal, Optional

– air-cooled only Voltage, P64s/X38s to Mezz. System Signals (P0/P1)

PMC/XMC Current IPMC

I/O on P3 P0

P22 P24 P26 Sensors REF_CLK

Accessory AUX_CLK X12d+X8d to Mezz. PCIe to PCIx I/O on P4 Bridge

x8 PCIe3 MUX x8 PCIe3 4x - SerDes P

D XMC1 PCIe Switch 4x - SerDes P1 DDP D P15 Arria 10 x8 PCIe3 Gen3 4x - SerDes

p x8 PCIe3

Ap POET FPGA XMC

TA 4x - SerDes

AT X38s to Mezz. SA

eS e I/O on P5 P16

X12d+X8d to Mezz. F I/O on P6 R 16 SERDES to P6 O N T

x8 PCIe3 P2 x8 PCIe3 P DDR4DDR4 8GB+E DDR4DDR4 8GB+E x16 PCIe3 A SSDRAMDRAM SSDRAMDRAM 10GBASE-KR from Xeon D

CC CC 10GBASE-KR from Xeon D N DDP USB2.0 E SATA P3 DDR4 DDR 4

2600 RS-232/422/485 2600

L P64S/X38s to Mezz

X12d + X8d to Mezz 9 9 RS-232 1000BASE-BX – CP2 DB - uDB- u SATA x16 PCIe3 NAND Flash Intel Xeon D-15xx 1000BASE-BX – CP1 Ethernet interfaces to P4 PCH processor USB (8-16 Cores) 1000BASE-T-Enet2

US B MUX LPC TPM 1000BASE-T-Enet1 www.mrcy.com USB 2. 0 USB 2. 0 USB 3. 0 x4 PCIe SA SA TA TA USB 3.0 P5 USB 2.0 SATA Subsystem RTO SATA

RJ-45RJ-45

16 SERDES to POET FPGA AAir-cooledir-cooled P6 only

LDS6526

Figure 1 - LDS6525 functional block diagram

WARNING: “600 Series” and/or National Security Controls - These commodities, technology, or software are controlled for export from the United States in accor- dance with the Export Administration Act of 1979 as amended (Title 50 U.S.C.; App. 2401, et seq.), through the Export Administration Regulations (EAR). Transfers to foreign persons requires prior approval from the U.S. Department of Commerce, Bureau of Industry and Security. implements a full Gen3 x16 PCIe connection to the OpenVPX expan- Additional Features sion plane on the P2 VPX connector. This expansion plane interface The Ensemble LDS6526 module provides all the features typically enables the Ensemble LDS6526’s compatibility with Mercury’s GPU or found on an avionics-class single-board computer. In addition to the FPGA based co-processing modules. These configuration options let sophisticated management subsystem and fabric interconnect, the En- the module effectively act as an upstream/downstream PCIe switch to semble LDS6526 module provides users with a toolkit enabling many allow the “chaining” of PCIe devices. different application features including: System Management • Thermal and voltage sensors integrated on-board The Ensemble LDS6526 module implements the advanced system man- • Real-time clock with accuracy better than 10ppm<1second per agement functionality inherent to the VITA 46.11 standard to enable day remote monitoring, alarm management, hardware revision and health • General purpose timers status. Using the standard IPMI-A and IPMI-B bus, intelligent platform management controller (IPMC), and IPMI protocol, the on-board system • Global clock synchronization capabilities via utility plane clock signals management block implementation is designed to comply with the VITA 46.11 standard. This allows the Ensemble LDS6526 module to: • Watchdog timer to support interrupt or reset • Read sensor values • Multiple boot paths, include netboot, USB boot, boot from SATA, • Read and write sensor thresholds, allowing an application to or from the on-board SATA flash device react to thermal, voltage, or current variations that exceed those thresholds Open Software Environment • Reset the entire module Mercury leverages over 30 years of multi-computing software exper- tise, including multicore processor expertise, across its many plat- • Power up/down the entire module forms. This strategy is fully applied to the Ensemble LDS6526 module. • Retrieve module field replaceable unit (FRU) information The same Linux® development and run-time environment is implement- ed on the Ensemble LDS6526 module as on other Intel based Mercury Mezzanine Configurability modules across the Ensemble 3000 and 6000 Series. Off-the-shelf open The Ensemble LDS6526 provides two mezzanine sites: one PMC/ software products such as OFED and OpenMPI are fully supported by XMC and one XMC-only. Each of the standard mezzanine sites on the open Ethernet-based POET data plane. the Ensemble LDS6526 module can be configured with off-the-shelf Mercury Sensor Processing Ecosystem mezzanine cards to bring additional I/O into the system for processing or control. PMC cards are supported with a 32-bit or 64-bit PCI/PCI-X Sensor chain awareness is having the technical expertise and resourc- interface at up to 133 MHz on the PMC/XMC site, with PMC user-de- es to design and build capable, compatible solutions along the whole fined I/O mapped to the backplane. XMCs are supported with x8 PCIe sensor processor chain. From RF/microwave, digital/analog signal on the J15/J25 connector per the VITA 42.3 standard. There are 16 manipulation to dense, size, weight, and power (SWaP) optimized pro- differential pairs and 38 single-ended signals of XMC user I/O mapped cessing resources to actionable intelligence dissemination; Mercury’s to the backplane via the J16/J26 connector. rugged compute subassemblies leverage the best commercial-item technology, enabling prime contractors to win more business. The Ensemble LDS6526 supports configuration with either VITA 42 or VITA 61 XMC connectors. By default, the Ensemble LDS6526 will be Modern sensor compute subassemblies are customized assemblies configured with VITA 61 XMC connectors for the best rugged and sig- of interoperable building blocks built to open standards. Mercury’s nal integrity performance. The VITA 61 connector offers superior signal hardware and software portfolio of building blocks are physically and integrity characteristics and is a more rugged design, appropriate for electrically interoperable as defined by international industrial stan- high-end XMC modules utilizing Gen3 PCIe interfaces in environmen- dards, including VITA’s OpenVPX standards. tally challenging applications.

WARNING: “600 Series” and/or National Security Controls - These commodities, technology, or software are controlled for export from the United States in accor- dance with the Export Administration Act of 1979 as amended (Title 50 U.S.C.; App. 2401, et seq.), through the Export Administration Regulations (EAR). Transfers to foreign persons requires prior approval from the U.S. Department of Commerce, Bureau of Industry and Security. www.mrcy.com minimizing potentialdamagetothemodule. and restorethesystemtoanoperationalstateinalimitedtimeperiod, relatively unskilledmaintenancepersonneltoreplaceafailedmodule functional density, suchastwo-levelmaintenance(2LM).2LMallows VPX-REDI offersextendedmechanicalconfigurationssupportinghigher Targeted primarilyforharsh-environmentembeddedapplications, ments. variants inthesameVPXformfactoravailableforlessruggedenviron VPX-REDI, withairandconduction-cooledAirLiquidFlow-By (VITA 48).TheEnsembleLDS6526bladeisa6Uimplementationof the RuggedizedEnhancedDesignImplementationstandard–REDI high-speed fabricinterfaces.VPXismostattractivewhenpairedwith modern high-performanceconnectorsetcapableofsupportingtoday’ The VPX(VITA 46)standarddefines6Uand3Uboardformatswitha VPX-REDI as ATCA orVME/VXS. developed tomultiplestandards,includingOpenVPXandotherssuch GPU orADC/DACtechnology, andbemade upofmultiplesubsystems and exploitationdisseminationelementsincludeFPGA,CPU, load modules.Payloadsmayhaveacquisition,digitization,processing, receiver modules,single-boardcomputersandsignalprocessingpay Mercury subsystemsmayincludeanalog,digitalandmixed-signal a broadrangeofadvancedsensorchainprocessingrequirements. architecture buildingblocksthatarecombinedandscaledtomeet Mercury subsystemsaredesignedfromasuiteofsophisticatedopen the mostpowerfulandreliableprocessingsolutions. MTBF byanorderofmagnitudeandenablesembeddeddeployment of contamination, boostsSWaP, reducesoperatingtemperature,extends 1-inch pitchrequirement,ishighlyresilienttoliquidandparticle standards (includingVITA 48.7),AirFlow-BymaintainsOpenVPX’s available withinasealedandruggedpackage.FullycomplianttoVIT technology eliminatesfiltrationwiththemostelegantcoolingsolution contaminants fromtheircoolingairstreams.Mercury’s AirFlow-By™ Air- andconduction-cooledsubsystemsrelyonfiltrationtoremove Rugged aircooling,AirFlow-By WARNING: Series”“600 and/orNational Security Controls - These commodities, technology, orsoftware are controlled for export from theUnited States inaccor dance with theExport Administration Act of 1979 asamended (Title50U.S.C.; App. 2401, et seq.), through the Export Administration Regulations(EAR). Transfers to foreign persons requires prior approval from the U.S. Department ofCommerce, Bureau ofIndustryandSecurity. - A s - Two x8PCIeportstoIntelprocessor Four x4portstoP6forsensorI/O Four x4portstoOpenVPXdataplane Arria 10 FPGA 576 GLOPSpeakperformancewhenconfiguredwithD-1559processor With AVX 2.0 Intel, 1.5GHz,8-16core,64bit,XeonD-15xx Main processor Specifications cially discernibleassubsystemsscalelargeranddataratesincrease. ance. Theresultingandsignificantsystemperformanceboostisespe insertion-loss andcross-talkwhilemaintainingfullOpenVPXcompli system interconnectionswithinnovativetechnologywhichmitigates industry interconnecttechnology. To addressthis,Mercuryfabricates interconnect-bound; theyarerestrictedbythelimitationsofbest All modularsolutions,includingOpenVPX,aretosomedegree sources whichdictatetheresponsivenessofentiresubsystem. Bandwidth iscriticalandespeciallyapplicabletoswitchfabricre System bandwidth–theeffectofinterconnectperformance OpenVPX profile OpenVPX SystemSpecification(VITA 65)encompasses: Compliance Module packages: 6U OpenVPX,singlewidth(1-inch) Mechanical 16 GBDDR4-2400(32planned) System Memory Chassis -SLT6-PAY-4F1Q2U2T-10.2.1 fabric configuration Module -MOD6-PAY-4F1Q2U2T-12.2.1-n, wherenisbasedonthePOET 48.7 (AirFlow-By) VITA 46.0,46.3, 46.4,46.6,46.11,andVITA 48.1,48.2(REDI)and Liquid Flow-By™ Air Flow-By™ Conduction-cooled Air-cooled - - - - Environmental Environmental Qualification Levels Air-cooled Air Flow-By Conduction-cooled Liquid Flow-By

Commercial L0 Rugged L1 Rugged L2 Rugged L4 Rugged L3 Rugged L5

Ruggedness • • • • • • • • • • • • • • Moisture/dust protection • • • • • • • • • • • • • • Typical cooling performance ~140W* ~140W* ~150W* ~200W* ~150W** 300W+*** Temperature Operating* 0ºC to +40ºC -25ºC to +55ºC -45ºC to +70ºC -40ºC to +60ºC -40ºC to +71ºC -40ºC to +71ºC*** Operating temperature N/A 5ºC/min 10ºC/min 10ºC/min 10ºC/min maximum rate of change Temperature Storage -40ºC to +85ºC -55ºC to +85ºC -55ºC to +125ºC -55ºC to +125ºC -55ºC to +125ºC

10-90%, 5-95%, 5-95%, 5-95%, non-condensing 5-95%, non-condensing Operating* non-condensing non-condensing non-condensing 100% condensing 100% condensing Humidity 10-90%, 5-95%, 5-95%, 5-95%, non-condensing 5-95%, non-condensing Storage non-condensing non-condensing non-condensing 100% condensing 100% condensing Operating* 0-10,000ft 0-30,000ft 0-30,000ft 0-30,000ft 0-70,000ft Altitude Storage 0-30,000ft 0-50,000ft 0-70,000ft 0-70,000ft 0-70,000ft 0.003 g2/Hz; 0.04 g2/Hz; 0.04 g2/Hz; 0.1 g2/Hz; 0.1 g2/Hz; Random 20-2000 Hz, 1 hr/axis 20-2000 Hz, 1 hr/axis 20-2000 Hz, 1 hr/axis 5-2000 Hz, 1 hr/axis 5-2000 Hz, 1 hr/axis 10G peak; 10G peak; Sine N/A N/A N/A 5-2000 Hz, 1 hr/axis 5-2000 Hz, 1 hr/axis Vibration z-axis: 20g; z-axis: 50g; z-axis: 50g; z-axis: 50g; z-axis: 50g; x and y-axes: 32g; x and y-axes: 80g; x and y-axes: 80g; x and y-axes: 80g; x and y-axes: 80g; Shock (11ms 1/2-sine pulse, (11ms 1/2-sine pulse, (11ms 1/2-sine pulse, (11ms 1/2-sine pulse, (11ms 1/2-sine pulse, 3 positive, 3 negative) 3 positive, 3 negative) 3 positive, 3 negative) 3 positive, 3 negative) 3 positive, 3 negative) Salt/Fog N/A Contact Factory Contact Factory 10% NaCl 10% NaCl VITA 47 Contact Factory

* Customer must maintain required cfm level. Consult factory for the required flow rates. ** Card edge should be maintained below 71ºC Storage Temperature is defined per MIL-STD-810F, Method 502.4, para 4.5.2, where the product under non-operational test is brought to an initial high temperature cycle to remove moisture. Then the unit under non-operational test will be brought to the low storage temperature. The low temperature test is maintained for 2 hours. The product is then brought to the high storage temperature and is maintained for 2 hours. The product is then brought back to ambient temperature. All temperature transitions are at a maximum rate of 10ºC/min. One cold/hot cycle constitutes the complete non-operational storage temperature test. This assumes that the board level products are individually packaged in accordance with ASTM-D-3951 approved storage containers. These tests are not performed in Mercury shipping containers, but in an unrestrained condition. Please consult the factory if you would like additional test details. All products manufactured by Mercury meet elements of the following specifications: MIL-STD-454, IL-STD-883,M MIL-HDBK-217F, and MIL-I-46058 or IPC-CC-830, and various IPC standards. Mercury’s inspection system has been certified in accordance with MIL-I-45208A.

Additional Services

Optional Environmental Screening and Analysis Services Standard Module, Optional Services www.mrcy.com • Cold Start Testing • Safety Margin Analysis • Engineering Change Order (ECO) Notification • Alternate Mean Time Between Failure (MTBF) Calculations • Cold Soak Testing • Temperature Cycling • ECO Control • Hazmat Analysis • Custom Vibration • Power Cycling • Custom Certificate of Conformity (CofC) • Diminished Manufacturing Sources (DMS) Management • CFD Thermal Analysis • Environmental Stress Screening • Custom UID Labeling • Longevity of Suppy (LOS) • Finite Element Analysis • Longevity of Repair (LOR) Contact factory for additional information

WARNING: “600 Series” and/or National Security Controls - These commodities, technology, or software are controlled for export from the United States in accor- dance with the Export Administration Act of 1979 as amended (Title 50 U.S.C.; App. 2401, et seq.), through the Export Administration Regulations (EAR). Transfers to foreign persons requires prior approval from the U.S. Department of Commerce, Bureau of Industry and Security. Ensemble, is a registered trademark and Air Flow-By, Liquid flow-By, Innovation That Matters, and Mercury Systems are trademarks of Mercury Systems, Inc. Other product and company names mentioned may be trademarks and/or registered trademarks of their respective holders. Mercury Systems, Inc. believes this information is accurate as of its publication date and is not responsible for any inadvertent errors. The information contained herein is subject to change without notice. Copyright © 2016 Mercury Systems, Inc. 3161.01E-0516-ds-LDS6525

INNOVATION THAT MATTERS ™

Corporate Headquarters Europe Mercury Systems, Ltd. 201 Riverneck Road Unit 1 - Easter Park, Benyon Road Chelmsford, MA 01824-2820 USA Silchester, Reading (978) 967-1401 • (866) 627-6951 RG7 2PQ United Kingdom Fax (978) 256-3599 + 44 0 1189 702050 • Fax + 44 0 1189 702321 www.mrcy.com www.mrcy.com