High Power X-Band RF Test Stand Development and High Power Testing of the CLIC Crab Cavity
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TI Designs: TIDA-01428 Automotive Discrete SBC Pre-Buck, Post-Boost with CAN Reference Design
TI Designs: TIDA-01428 Automotive Discrete SBC Pre-Buck, Post-Boost With CAN Reference Design Description Features The TIDA-01428 reference design implements a • Wide-Input Voltage, Fixed 3.3-V Buck Converter discrete system basis chip (SBC) with a 1-A, wide-VIN, • Low-Input Voltage, Fixed 5-V Boost Converter buck converter to 3.3 V followed by a compact, low- • CAN Transceiver With Flexible Data-Rate (FD) up input voltage, fixed 5-V boost converter for powering a to 5 MBPS controller area network (CAN) physical layer interface. The design has been tested for CISPR 25 radiated • Passes Class 4 CISPR 25 Radiated Emissions emissions and conducted emissions using the voltage • Passes Class 4 CISPR 25 Conducted Emissions method and for immunity to bulk current injection (BCI) • Passes ISO 11452-4 Bulk Current Injection per ISO 11452-4 with CAN communication operating at 500 KBPS. The TIDA-01428 is an EMC-vetted • Able to Survive Load Dump Voltages up to 42 V power tree plus CAN reference design that can be • Maintains Regulated 3.3-V and 5-V Supplies used in many automotive applications. Through Battery Input Voltages Down to 4.3 V Resources Applications • Automotive Body Control Module (BCM) TIDA-01428 Design Folder LM53601-Q1 Product Folder • Automotive Front Camera TPS61240-Q1 Product Folder • Automotive Head Unit TMS320F28030PAGQ Product Folder TCAN1042V-Q1 Product Folder SN74LVC2G06-Q1 Product Folder CSD17313Q2 Product Folder ASK Our E2E Experts 3.3-V .uck 5-V La53601-v1 TtS61240-v1 CANH a/h t]}o}¡ CAb TMS320 TCAb1042V-v1 C28030tADv CANL Copyright © 2017, Texas Instruments Incorporated An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and other important disclaimers and information. -
D4.1 Preliminary BMS Design and Sensor Integration Concept
Ref. Ares(2021)2904016 - 30/04/2021 Delivering the 3b generation of LNMO cells for the xEV market of 2025 and beyond Preliminary BMS design and sensor integration concept Horizon 2020 | LC-BAT-5-2019 Research and innovation for advanced Li-ion cells (generation 3b) GA # 875033 Deliverable No. D4.1 Deliverable Title Preliminary BMS design and sensor integration concept Due Date 2020-04-30 Deliverable Type Report Dissemination level Public Written By Stefan Waldhör (FhG) 2021-04-30 Checked by Simone Mannori (ENEA) 2021-04-24 Approved by Claudio Lanciotti (MIT), Boschidar Ganev (AIT) 2021-04-29 Status Final 2021-04-30 This project has received funding from the European Union’s H2020 research and innovation programme under Grant Agreement no. 875033. This publication reflects only the author’s view and the Innovation and Networks Executive Agency (INEA) is not responsible for any use that may be made of the information it contains. Revision History Version Date Who Changes 1.1 2021-04-30 AIT • Reviewed final version of the document 1.0 2021-04-28 FhG • Final version of the document 0.14 2021-04-28 MIT • Review of the document 0.13 2021-04-21 FHG • Add conclusion • Add section on mechanical integration 0.12 2021-04-21 VALEO • Add section on thermal management system • Add image of foxBMS 2 Master Unit • Add paragraph on foxBMS 2 Master Unit • Update system architecture block diagram with TMB 0.11 2021-04-19 FhG • Add section on the Interface Board • Add section on data storage and connectivity • Add section on mechanical integration • Fix -
1946 ~ Former Ref: Second Series M
University Museums and Special Collections Service MAC C C C., H.S. ~ 1878 ~ former ref: 6/60 MAC C&A C&A C. & A. Trading Agencies ~ 1946 ~ former ref: Second series MAC CAB CAB Cabahe, Michael ~ 1909 ~ former ref: 52/58 Caball, John ~ 1953 ~ former ref: Second series Cabaud, Jacques M. ~ 1957 ~ former ref: Second series Cabaut & Cia ~ 1907 ~ former ref: 57/162 Cabaut & Cia ~ 1907 ~ former ref: 203/245 Cabbon, James ~ 1900 ~ former ref: 23/88 Cabburn, John ~ 1945 ~ former ref: Second series University Museums and Special Collections Service Cabell, H.F. ~ 1961 ~ former ref: Second series Cabell, Harold F. ~ 1915 ~ former ref: 69/213 Cabell, William L. ~ 1855 ~ former ref: 224/28 Cable and Wireless Limited ~ 1946, 1956 ~ former ref: Second series Cable, George C. ~ 1947, 1951 ~ former ref: Second series Cable, Herbert ~ 1942 ~ former ref: Second series Cable, John A. ~ 1958 ~ former ref: Second series Cable, Lindsay W. ~ 1942 ~ former ref: Second series Cabran, Auguste ~ 1925 ~ former ref: 88/110 MAC CAC CAC Cachia, Frank ~ 1933 ~ former ref: 152/141 Cacoulides, Libraire C. ~ 1948-61 ~ Booksellers Re: A Greek edition of Composition Excercises in Everyday English by AS Hornby [qv] ~ former ref: Second series University Museums and Special Collections Service MAC CAD CAD Cadbury Bros. Ltd. ~ 1946-62 ~ Chocolate manufacturers Re: The supply of illustrative material for Macmillan titles including The Co-operative Movement at Home and Overseas by Spaull and Kay; Living in Communities Bk II and History Class Pictures; also a request to Macmillan from Cadbu ~ former ref: Second series Cadbury, Geraldine S. ~ 1937 ~ former ref: 179/137 Cadbury, Henry J. -
Fault Tolerant Design Techniques for Smart Power Drivers and Diagnostic Circuits
Fault Tolerant Design Techniques for Smart Power Drivers and Diagnostic Circuits Fehlertolerante Design-Techniken für Smart Power-Treiber und Diagnoseschaltungen Der Technischen Fakultat der Friedrich-Alexander Universität Erlangen-Nürnberg Zur Erlangung des Grades DOKTOR-INGENIEUR vorgelegt von Sri Navaneethakrishnan Easwaran Erode, India 1 Als Dissertation genehmigt von der Technischen Fakultät der Friedrich-Alexander-Universität Erlangen-Nürnberg Tag der mündlichen Prüfung: 23.05.2017 Vorsitzender des Promotionsorgans: Prof. Dr.-Ing. Reinhard Lerch Gutachter: Prof. Dr.-Ing. Dr.-Ing. habil. Robert Weigel Prof. Dr.-Ing. Martin März 2 Dedicated to my family 3 Abstract The demand for electronic control is increasing and is replacing most of the hydraulics in the automotive. Automobiles produced today have a longer life expectancy than at any time in the past. One of the strongest contributors for this is the increase in electronic equipment and systems that have replaced mechanical devices. Without proper electrical protection, however, these electronic systems in automobiles can fail without warning there by creating risk for the driver and passengers including injuries and life threat. Power semiconductor devices that are used in these electronic systems handle high currents in the order of 2A at 40V. Due to this high voltage and high current several design measures have to be considered in the design to make these circuits fault tolerant. The unintentional or inadvertent activation of the powerFETs should be avoided else it would trigger very high currents. In the light of this, the purpose of the present doctoral dissertation is set to contribute to the design of Smart Power Drivers for airbag squib driver applications. -
MC33907 08 Safe System Basis Chip Hardware Design and Product Guidelines
NXP Semiconductors Document Number: AN4766 Application Note Rev. 6.0, 2/2019 MC33907_08 safe system basis chip hardware design and product guidelines 1 Introduction Contents 1 Introduction . 1 This application note provides design guidelines for integrating the 2 Overview . 1 MC33907_08 system basis chip (SBC) into automotive and 2.1 Typical block diagram . 2 industrial electronic systems. It shows how to optimize PCB layout 2.2 Voltage regulators . 3 and gives recommendations regarding external components. 2.3 Built-in CAN transceiver . 4 2.4 Built-in LIN transceiver . 4 To minimize the EMC impact from embedded DC/DC converters, 2.5 Analog multiplexer . 4 pay attention to PCB component routing when designing with the 2.6 Configurable I/Os . 4 MC33907_08. 2.7 Safety outputs . 4 2.8 Fail-safe machine . 5 2.9 Low-power mode off . 5 2.10 Watchdog . 5 2.11 MCU flash programming . 5 2 Overview 2.12 Simplified internal power tree . 6 3 Known device behaviors . 7 The MC33907 and MC33908 are multi-output power supply 3.1 Unexpected current limitation report after start up . 7 integrated circuits dedicated to the automotive market. The 4 Application schematic . 8 MC33907_08 simplifies system implementation by providing ISO 5 Optional configurations . 9 26262 system solutions, documentation, and an optimized MCU 5.1 Pre-regulator, buck or buck-boost configuration . 9 interface, enabling customers to minimize the cost and complexity 5.2 VCCA, current capability . 10 of their designs. The MC33907_08’s integral EMC and ESD 5.3 VAUX . 10 protection also facilitates less complex system designs with 5.4 IO_0 ignition connection . -
Easy to Find?
Central Library of Rochester and Monroe County - City Directory Collection - 1939 384 Are You Your name in bold type, under all headings where a buyer might look, referring to a carefully worded descriptive space in this book, to Find? Easy is simply insurance that business will find you. Buttacavoli Angeline tailoress r 1052 Norton Hutz John sec Laffler BYRNE (Gertrude) Engraving Co Inc , Battiste shoe rpr 1052 Norton h do 552 Clinton av N h at Irond Edwd J Rev prof StBernard's Seminary r 2260 Lake Christina studt r 1052 Norton Roy formn 303 State h 108 Vayo Irond Frank r lab 1052 Norton Butzer Ephraim (Flora M) h 112 Rugby av Evelyn M tel opr r 108 Averill av Jos baker r 1052 Norton Marjorie G asst bkpr 47 Main W h 834 Benning Francis r 31 Frost av Mary studt r 1052 Norton ton dr Gr Frank T (Maiy E) v-pres RT Corp 183 Main E rm Buttaccio Francis A (Anna M) asst mgr 14 Franklin Verna M asst bkpr 47 Main W r 834 Bennington 1123 h 312 Roslyn rm 1103 h 163 Augustine dr Gr Fredk A lab r 108 Averill av Jos A (Florence A) h 6 Laura Buxton Lola L wid Fredk G h 1203 Genesee Harrietta L r 178 Magee av Veto A (Margt A) gen agt Manhattan Life Ins Co Robt asst resident surg Strong Memorial Hosp r do Helen r 25 Tracy of N Y 5 StPaul rm 418 h 2325 Clifford av Wm P special agt 183 Main E rm 1004 h 302 Helen E sec 5 StPaul rm 228 r 178 Magee av Buttacovoli John (Jennie) h 58 Ontario Barrington Helen L r 1915 Lake av Buttarazzi Alf mason r 326 Emerson Buyck Ina D Mrs bkpr 121 N Fitzhugh h 1845 Titus Jas J (Lucille) shoe wkr 250 N Goodman r 123 Angelina -
Printing Photovoltaics by Electrospray Xinyan Zhao1,2 and Weiwei Deng2*
Opto-Electronic Review Advances 2020, Vol. 3, No. 6 DOI: 10.29026/oea.2020.190038 Printing photovoltaics by electrospray Xinyan Zhao1,2 and Weiwei Deng2* Solution processible photovoltaics (PV) are poised to play an important role in scalable manufacturing of low-cost solar cells. Electrospray is uniquely suited for fabricating PVs due to its several desirable characteristics of an ideal manufac- turing process such as compatibility with roll-to-roll production processes, tunability and uniformity of droplet size, capa- bility of operating at atmospheric pressure, and negligible material waste and nano structures. This review begins with an introduction of the fundamentals and unique properties of electrospray. We put emphasis on the evaporation time and residence time that jointly affect the deposition outcome. Then we review the efforts of electrospray printing polymer solar cells, perovskite solar cells, and dye sensitized solar cells. Collectively, these results demonstrate the advantages of electrospray for solution processed PV. Electrospray has also exhibited the capability of producing uniform films as well as nanostructured and even multiscale films. So far, the electrospray has been found to improve active layer morphology, and create devices with efficiencies comparable with that of spin-coating. Finally, we discuss challenges and research opportunities that enable electrospray to become a mainstream technique for industrial scale production. Keywords: photovoltaics; electrospray; solution process; polymer solar cells; perovskite solar cells; dye sensitized solar cells Zhao X Y, Deng W W. Printing photovoltaics by electrospray: a review. Opto‐Electron Adv 3, 190038 (2020). mobilities, efficient high light absorptions, and long Introduction charge-carrier diffusion lengths1,2. Moreover, lead halide Photovoltaics (PV) are devices that directly convert the perovskites are synthesized from inexpensive and clean, renewable and abundant solar energy into electric- earth-abundant materials by solution process at relatively ity. -
TLIN1028-Q1 Automotive Local Interconnect Network (LIN)
TLIN1028-Q1 www.ti.com SLLSEX4A – AUGUST 2019 – REVISEDTLIN1028-Q1 OCTOBER 2020 SLLSEX4A – AUGUST 2019 – REVISED OCTOBER 2020 TLIN1028-Q1 Automotive LIN 125-mA System Basis Chip (SBC) 1 Features 2 Applications • AEC-Q100 (Grade 1): Qualified for automotive • Body electronics and lighting applications • Hybrid, electric & powertrain systems • Local interconnect network (LIN) physical layer • Automotive infotainment and cluster specification ISO/DIS 17987–4 compliant and • Appliances conforms to SAE J2602 recommended practice for LIN 3 Description • Functional Safety-Capable The TLIN1028-Q1 is a local interconnect network – Documentation available to aid functional safety (LIN) physical layer transceiver, compliant to LIN 2.2A system design ISO/DIS 17987–4 standards, with an integrated low • Supports 12-V applications dropout (LDO) voltage regulator. • Wide operating ranges This LIN system basis chip (SBC) reduces system – ±58 V LIN bus fault protection complexity by providing a 3.3 V or 5 V rail with up to – LDO output supporting 3.3 V or 5 V 70 mA (D) or 125 mA (DRB and DDA) of current to – Sleep mode: Ultra-low current power microprocessors, sensors or other devices. consumption allows wake-up event from: The TLIN1028-Q1 has an optimized current-limited • LIN bus or local wake through EN pin wave-shaping driver which reduces electromagnetic – Power-up and down glitch-free operation emissions (EME). The TLIN1028-Q1 converts the LIN protocol data stream on the TXD input into a LIN bus • Protection features: signal. The receiver converts the data stream to logic- – ESD protection, VSUP under-voltage protection level signals that are sent to the microprocessor – TXD dominant time out (DTO) protection, through the open-drain RXD pin. -
Automotive Solutions for Electro-Mobility Contents
Automotive Solutions for Electro-Mobility Contents 3 Smart Mobility 4 Electro-Mobility 5 Key Applications 6 Main Traction Inverter 7 On-Board Charger (OBC) 8 48V Start-Stop System 9 Bidirectional DC/DC Converter 10 Battery Management System 11 48V Electric Traction 12 Acoustic Vehicle Alerting System (AVAS) 13 HV Battery Disconnect & Fire-off System 14 Vehicle Control Unit (VCU) 16 Key Technologies 18 Development Tools 18 Product Selectors samples, Evaluation Boards 19 SPC5 Automotive MCU Evaluation Tools 21 AutoDevKit Smart Mobility It is estimated that 80% of all innovations in the automotive industry today are directly or indirectly enabled by electronics. With vehicle functionality improving with every new model this means a continuous increase in the semiconductor content per car. With over 30 years’ experience in automotive electronics, ST is a solid, innovative, and reliable partner with whom to build the future of transportation. ST’s Smart Mobility products and solutions are making driving safer, greener and more connected through the combination of several of our technologies. SAFER Driving is safer thanks to our Advanced Driver Assistance Systems (ADAS) – vision processing, radar, imaging and sensors, as well as our adaptive lighting systems, user display and monitoring technologies. GREENER Driving is greener with our automotive processors for engine management units, engine management systems, high-efficiency smart power electronics at the heart of all automotive sub-systems and devices for hybrid and electric vehicle applications. 80% MORE CONNECTED And vehicles are more connected using our infotainment-system and telematics of all innovations processors and sensors, as well as our radio tuners and amplifiers, positioning in the automotive technologies, and secure car-to-car and car-to-infrastructure (V2X) connectivity solutions. -
Automotive Power Selection Guide Ultimate Power – Perfect Control
Automotive Power Selection Guide Ultimate power – perfect control www.infineon.com/automotivepower The ultimate power to control your applications including automotive, transportation, industrial, lighting and motor control. For a comprehensive and reliable portfolio of products Our commitment to quality is demonstrated through for automotive and other applications, look no further than our focus on automotive excellence, the most rigorous zero the product range from Infineon. We have used our 40 defect program in the industry. years of experience of developing and producing products to meet the demands of the automotive market, and our This selection guide provides an overview of our ICs innovative technologies to design and produce a large and their packages, which are automotive qualified and number of power products that meet all requirements of available for your current and future electronic system the automotive industry and also the transportation, designs. lighting and motor-drive industries. 2 Automotive applications › Electric sunroof › Rear wiper › Airbag › Suspension › Window li › Power seat › Electric mirrors Power door › Font wiper › › Body control module/gateway › Starter alternator › Steering › Lighting › Throttle control › Headlight leveling › Engine control › Transmission › HVAC › Hybrid › Brake system Automotive power components used in other applications Industrial drives Electric toys 3 We meet all requirements for cost-effective application solutions Smart Power ICs Power System ICs Embedded Power ICs › Smart multi-channel -
Power Supply Platform and Functional Safety Concept Proposals for a Powertrain Transmission Electronic Control Unit
electronics Article Power Supply Platform and Functional Safety Concept Proposals for a Powertrain Transmission Electronic Control Unit Diana Raluca Biba 1, Mihaela Codruta Ancuti 1,*, Alexandru Ianovici 2, Ciprian Sorandaru 1 and Sorin Musuroi 1 1 Electrical Engineering Department, Faculty of Electrical and Power Engineering, University Politehnica Timisoara, 300223 Timisoara, Romania; [email protected] (D.R.B.); [email protected] (C.S.); [email protected] (S.M.) 2 Continental Automotive, Powertrain Transmission Department, 90411 Nurnberg, Germany; [email protected] * Correspondence: [email protected]; Tel.: +40-766-699556 Received: 12 May 2020; Accepted: 15 September 2020; Published: 27 September 2020 Abstract: In the last decade, modern vehicles have become very complex, being equipped with embedded electronic systems which include more than a thousand of electronic control units (ECUs). Therefore, it is mandatory to analyze the potential risk of automotive systems failure because it could have a significant impact on humans’ safety. This paper proposes a novel, functional safety concept at the power management level of a system basis chip (SBC), from the development phase to system design. In the presented case, the safety-critical application is represented by a powertrain transmission electronic control unit. A step-by-step design guideline procedure is presented, having as a focus the cost, safety, and performance to obtain a robust, cost-efficient, safe, and reliable design. To prove compliance with the ISO 26262 standard, quantitative worst-case evaluations of the hardware have been done. The assessment results qualify the proposed design with automotive safety integrity levels (ASIL, up to ASIL-D). -
AN13091, EV Traction Motor Power Inverter Control Reference Platform
AN13091 EV Traction Motor Power Inverter Control Reference Platform Rev. 1 — 19 March 2021 Application note 1 Acronyms Table 1. Acronyms Acronym Definition PIM Power Inverter Module VCU Vehicle Control Unit ECU Electronic Control Unit TC Traction Control SDK Software Development Kit SBC System Basis Chip SPI Serial Peripheral Interface MCU Micro-Controller Unit IGBT Insulated-Gate Bipolar Transistor GD Gate Driver ASIL Automotive Safety Integrity Level RDC Resolver-to-Digital Converter SiC Silicon Carbide CMF Common Mode Failure NXP Semiconductors AN13091 EV Traction Motor Power Inverter Control Reference Platform 2 General Description The NXP EV Power Inverter Control Reference Platform provides a hardware reference design, system basic software, and a complete system functional safety enablement as a foundation on which to develop a complete ASIL-D compliant high voltage, high-power traction motor inverter for electric vehicles. The Reference Platform has been designed into an evaluation prototype demonstrating 150 kW peak output power and >96% electrical efficiency operating from a 320 V supply voltage. The hardware reference platform is comprised of four boards: • System control board – Same design and components apply when transitioning from IGBT to SiC • Power stage driver board – GD3100 can be used for IGBT and SiC • Current sensor board • Vehicle interface board Figure 1. Inverter Control Reference Platform boards System control board: AN13091 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved. Application note Rev. 1 — 19 March 2021 2 / 42 NXP Semiconductors AN13091 EV Traction Motor Power Inverter Control Reference Platform • This board contains three key NXP integrated circuits.