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TI Designs: TIDA-01428 Automotive Discrete SBC Pre-Buck, Post-Boost with CAN Reference Design
TI Designs: TIDA-01428 Automotive Discrete SBC Pre-Buck, Post-Boost With CAN Reference Design Description Features The TIDA-01428 reference design implements a • Wide-Input Voltage, Fixed 3.3-V Buck Converter discrete system basis chip (SBC) with a 1-A, wide-VIN, • Low-Input Voltage, Fixed 5-V Boost Converter buck converter to 3.3 V followed by a compact, low- • CAN Transceiver With Flexible Data-Rate (FD) up input voltage, fixed 5-V boost converter for powering a to 5 MBPS controller area network (CAN) physical layer interface. The design has been tested for CISPR 25 radiated • Passes Class 4 CISPR 25 Radiated Emissions emissions and conducted emissions using the voltage • Passes Class 4 CISPR 25 Conducted Emissions method and for immunity to bulk current injection (BCI) • Passes ISO 11452-4 Bulk Current Injection per ISO 11452-4 with CAN communication operating at 500 KBPS. The TIDA-01428 is an EMC-vetted • Able to Survive Load Dump Voltages up to 42 V power tree plus CAN reference design that can be • Maintains Regulated 3.3-V and 5-V Supplies used in many automotive applications. Through Battery Input Voltages Down to 4.3 V Resources Applications • Automotive Body Control Module (BCM) TIDA-01428 Design Folder LM53601-Q1 Product Folder • Automotive Front Camera TPS61240-Q1 Product Folder • Automotive Head Unit TMS320F28030PAGQ Product Folder TCAN1042V-Q1 Product Folder SN74LVC2G06-Q1 Product Folder CSD17313Q2 Product Folder ASK Our E2E Experts 3.3-V .uck 5-V La53601-v1 TtS61240-v1 CANH a/h t]}o}¡ CAb TMS320 TCAb1042V-v1 C28030tADv CANL Copyright © 2017, Texas Instruments Incorporated An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and other important disclaimers and information. -
Shieldbuddy TC275 User Manual
ShieldBuddy TC275 User Manual Basic information on the ShieldBuddy TC275 development board Connectors, board layout, component placement, power options, programming Released User Manual 4269.40100, 2.8, 2015-05 User Manual ShieldBuddy TC275 Development Platform Aurix 32-Bit Triple Core CONFIDENTIAL Edition 2015-05 Published by: Hitex (U.K.) Limited. University Of Warwick Science Park, Coventry, CV4 7EZ, UK © 2019 Hitex (U.K.) Limited. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the product, Hitex (UK) Ltd. hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Hitex Office (www.hitex.co.uk). ShieldBuddy TC275 Development Platform Aurix 32-Bit Triple Core CONFIDENTIAL Document Change History Date Version Changed By Change Description 8/8/2014 0.1 M Beach First version 9/8/2014 M Beach Revised top view 0.2 20/2/2015 0.3 M Beach/D Greenhill Revised for Rev B HW 9/4/2015 0.8 M Beach Added board test 16/9/2015 0.9 M Beach Corrected P33.6 8/11/2016 1.0 M Beach Added IDE extensions 29/11/2016 1.1 M Beach Added new connector diagram 9/1/2017 1.2 M Beach Changed Fast_digitalWrite() 13/1/2017 1.3 M Beach Added Wire changes 23/1/2017 1.4 M Beach Added EEPROM support. -
D4.1 Preliminary BMS Design and Sensor Integration Concept
Ref. Ares(2021)2904016 - 30/04/2021 Delivering the 3b generation of LNMO cells for the xEV market of 2025 and beyond Preliminary BMS design and sensor integration concept Horizon 2020 | LC-BAT-5-2019 Research and innovation for advanced Li-ion cells (generation 3b) GA # 875033 Deliverable No. D4.1 Deliverable Title Preliminary BMS design and sensor integration concept Due Date 2020-04-30 Deliverable Type Report Dissemination level Public Written By Stefan Waldhör (FhG) 2021-04-30 Checked by Simone Mannori (ENEA) 2021-04-24 Approved by Claudio Lanciotti (MIT), Boschidar Ganev (AIT) 2021-04-29 Status Final 2021-04-30 This project has received funding from the European Union’s H2020 research and innovation programme under Grant Agreement no. 875033. This publication reflects only the author’s view and the Innovation and Networks Executive Agency (INEA) is not responsible for any use that may be made of the information it contains. Revision History Version Date Who Changes 1.1 2021-04-30 AIT • Reviewed final version of the document 1.0 2021-04-28 FhG • Final version of the document 0.14 2021-04-28 MIT • Review of the document 0.13 2021-04-21 FHG • Add conclusion • Add section on mechanical integration 0.12 2021-04-21 VALEO • Add section on thermal management system • Add image of foxBMS 2 Master Unit • Add paragraph on foxBMS 2 Master Unit • Update system architecture block diagram with TMB 0.11 2021-04-19 FhG • Add section on the Interface Board • Add section on data storage and connectivity • Add section on mechanical integration • Fix -
Embedded Operating Systems
7 Embedded Operating Systems Claudio Scordino1, Errico Guidieri1, Bruno Morelli1, Andrea Marongiu2,3, Giuseppe Tagliavini3 and Paolo Gai1 1Evidence SRL, Italy 2Swiss Federal Institute of Technology in Zurich (ETHZ), Switzerland 3University of Bologna, Italy In this chapter, we will provide a description of existing open-source operating systems (OSs) which have been analyzed with the objective of providing a porting for the reference architecture described in Chapter 2. Among the various possibilities, the ERIKA Enterprise RTOS (Real-Time Operating System) and Linux with preemption patches have been selected. A description of the porting effort on the reference architecture has also been provided. 7.1 Introduction In the past, OSs for high-performance computing (HPC) were based on custom-tailored solutions to fully exploit all performance opportunities of supercomputers. Nowadays, instead, HPC systems are being moved away from in-house OSs to more generic OS solutions like Linux. Such a trend can be observed in the TOP500 list [1] that includes the 500 most powerful supercomputers in the world, in which Linux dominates the competition. In fact, in around 20 years, Linux has been capable of conquering all the TOP500 list from scratch (for the first time in November 2017). Each manufacturer, however, still implements specific changes to the Linux OS to better exploit specific computer hardware features. This is especially true in the case of computing nodes in which lightweight kernels are used to speed up the computation. 173 174 Embedded Operating Systems Figure 7.1 Number of Linux-based supercomputers in the TOP500 list. Linux is a full-featured OS, originally designed to be used in server or desktop environments. -
Fault Tolerant Design Techniques for Smart Power Drivers and Diagnostic Circuits
Fault Tolerant Design Techniques for Smart Power Drivers and Diagnostic Circuits Fehlertolerante Design-Techniken für Smart Power-Treiber und Diagnoseschaltungen Der Technischen Fakultat der Friedrich-Alexander Universität Erlangen-Nürnberg Zur Erlangung des Grades DOKTOR-INGENIEUR vorgelegt von Sri Navaneethakrishnan Easwaran Erode, India 1 Als Dissertation genehmigt von der Technischen Fakultät der Friedrich-Alexander-Universität Erlangen-Nürnberg Tag der mündlichen Prüfung: 23.05.2017 Vorsitzender des Promotionsorgans: Prof. Dr.-Ing. Reinhard Lerch Gutachter: Prof. Dr.-Ing. Dr.-Ing. habil. Robert Weigel Prof. Dr.-Ing. Martin März 2 Dedicated to my family 3 Abstract The demand for electronic control is increasing and is replacing most of the hydraulics in the automotive. Automobiles produced today have a longer life expectancy than at any time in the past. One of the strongest contributors for this is the increase in electronic equipment and systems that have replaced mechanical devices. Without proper electrical protection, however, these electronic systems in automobiles can fail without warning there by creating risk for the driver and passengers including injuries and life threat. Power semiconductor devices that are used in these electronic systems handle high currents in the order of 2A at 40V. Due to this high voltage and high current several design measures have to be considered in the design to make these circuits fault tolerant. The unintentional or inadvertent activation of the powerFETs should be avoided else it would trigger very high currents. In the light of this, the purpose of the present doctoral dissertation is set to contribute to the design of Smart Power Drivers for airbag squib driver applications. -
ETK-S20.1 Emulator Probe for the Infineon AURIX MCU Family User's
ETK-S20.1 Emulator Probe for the Infineon AURIX MCU Family User’s Guide Copyright The data in this document may not be altered or amended without special noti- fication from ETAS GmbH. ETAS GmbH undertakes no further obligation in rela- tion to this document. The software described in it can only be used if the customer is in possession of a general license agreement or single license. Using and copying is only allowed in concurrence with the specifications stipulated in the contract. Under no circumstances may any part of this document be copied, reproduced, transmitted, stored in a retrieval system or translated into another language without the express written permission of ETAS GmbH. © Copyright 2019 ETAS GmbH, Stuttgart The names and designations used in this document are trademarks or brands belonging to the respective owners. ETK-S20.1 - User’s Guide R09 EN - 01.2019 2 ETAS Contents Contents 1 About this Manual. 6 1.1 Identification of Safety Notices . 6 1.2 Presentation of Information . 6 1.3 Scope of Supply . 7 1.4 Additional Information . 7 2 Basic Safety Notices . 8 2.1 General Safety Information . 8 2.2 Requirements for Users and Duties for Operators . 8 2.3 Intended Use . 8 2.4 Identifications on the Product . 11 2.5 Taking the Product Back and Recycling . 12 2.6 CE marking . 12 2.7 RoHS Conformity . 12 2.7.1 European Union . 12 2.7.2 China . 12 2.8 Declarable Substances . 13 2.9 Use of Open Source Software . 13 3 Introduction . 14 3.1 Applications . -
MC33907 08 Safe System Basis Chip Hardware Design and Product Guidelines
NXP Semiconductors Document Number: AN4766 Application Note Rev. 6.0, 2/2019 MC33907_08 safe system basis chip hardware design and product guidelines 1 Introduction Contents 1 Introduction . 1 This application note provides design guidelines for integrating the 2 Overview . 1 MC33907_08 system basis chip (SBC) into automotive and 2.1 Typical block diagram . 2 industrial electronic systems. It shows how to optimize PCB layout 2.2 Voltage regulators . 3 and gives recommendations regarding external components. 2.3 Built-in CAN transceiver . 4 2.4 Built-in LIN transceiver . 4 To minimize the EMC impact from embedded DC/DC converters, 2.5 Analog multiplexer . 4 pay attention to PCB component routing when designing with the 2.6 Configurable I/Os . 4 MC33907_08. 2.7 Safety outputs . 4 2.8 Fail-safe machine . 5 2.9 Low-power mode off . 5 2.10 Watchdog . 5 2.11 MCU flash programming . 5 2 Overview 2.12 Simplified internal power tree . 6 3 Known device behaviors . 7 The MC33907 and MC33908 are multi-output power supply 3.1 Unexpected current limitation report after start up . 7 integrated circuits dedicated to the automotive market. The 4 Application schematic . 8 MC33907_08 simplifies system implementation by providing ISO 5 Optional configurations . 9 26262 system solutions, documentation, and an optimized MCU 5.1 Pre-regulator, buck or buck-boost configuration . 9 interface, enabling customers to minimize the cost and complexity 5.2 VCCA, current capability . 10 of their designs. The MC33907_08’s integral EMC and ESD 5.3 VAUX . 10 protection also facilitates less complex system designs with 5.4 IO_0 ignition connection . -
Aurix™ 32-Bit Microcontroller Family One Family, Multiple Use Cases
CONTINUITY INNOVATION CONTINUITY INNOVATION AURIX™ 32-BIT MICROCONTROLLER FAMILY ONE FAMILY, MULTIPLE USE CASES Murat Temiz (EBV) System Application Engineer [email protected] +49 172 86 00 433 1 1 What is AURIX™ ? AURIX™ - 32-bit multicore microcontroller family is characterized by…. › Infineon Tricore™ based on unified RISC/MCU/DSP processor cores › High real-time performance and embedded safety (up to ASIL D/SIL 3) and integrated security features (HardwareSecurityModule) › Highly scalable product family (various packages, scalable HW) › Ideal platform for a wide range of automotive, CAV and industrial applications › Quality and robustness: Long-term availability (through 2034), up to TA 150°C › AURIX™ comprises of two major families High Efficiency™ High Performance™ › TC21x/TC22x/TC23x › TC26x/TC27x/TC29x › 32-bit high efficient single core with Lockstep (up to ASIL › Up to three high performance 32-bit super-scalar D/SIL 3) TriCore™ V1.6.1 CPUs running up to 300 MHz › High efficiency/low power architecture › Up to 8MB Flash, 2.7MB SRAM › 4 pipeline stages for up to 200MHz › Up to 2MB Flash, 704KB SRAM 2018-08-14 confidential Copyright © Infineon Technologies AG 2018. All rights reserved. 2 AURIX™ – one family multiple use cases Target application segments Beyond classic ATV segments 2018-08-14 confidential Copyright © Infineon Technologies AG 2018. All rights reserved. 3 AURIX™ - Industrial focus applications Power & Energy Smart Vehicles Factory Automation Others Off high way PLC, µPLC Drones Solar Inverter Fun vehicles, e.g. skidoo,jet ski Servo Drives Radar applications Wind Inverter Agricultural Robotics / eRobotics Medical Renewable Energies Earth moving e.g terex In-factory vehicles Construction e.g. -
Second Quarter FY 2021 Quarterly Update
Second Quarter FY 2021 Quarterly Update Infineon Technologies AG Investor Relations 1 Infineon at a glance Addressing long-term high-growth trends Illustrative aggregated FY20 revenue by segment › IoT (edge comp., data center, 5G, sensing, connectivity) 14% › electro-mobility Automotive (ATV) Industrial Power Control (IPC) 43% › assisted driving, autonomous driving Power & Sensor Systems (PSS) 29% › energy efficiency, renewables, EV infrastructure Connected Secure Systems (CSS) › security 14% Financials Illustrative aggregated FY20 revenue by product category [EUR m] 8,567 9000 8,029 7,063 7,599 ~5% memories for 6,473 specific applications 6000 ~10% RF & sensors 17.1% 17.8% 16.4% 3000 15.2% 13.7% embedded control ~30% and connectivity 982 1,208 1,353 1,319 1,170 0 ~55% power semi- FY16 FY17 FY18 FY19 FY20 conductors Revenue Segment Result Margin of total revenue ATV IPC PSS CSS 2021-05-04 Copyright © Infineon Technologies AG 2021. All rights reserved. 2 Illustrative aggregated FY20 revenue including contribution from Cypress of ~€1,900m from 1 Oct 2019 through 30 Sep 2020 Illustrative aggregated FY20 revenue of ~€9,600m by target application industrial and consumer IoT; 10% powertrain ICE; 8% xEV (incl. MHEV); 5% payment, identification, ticketing; 4% other PSS; 2% CSS safety excl. ADAS; 6% industrial; 7% 14% ADAS; 4% ATV consumer; 6% PSS 43% 29% comfort, premium; 12% smartphones; 5% IPC communications; 3% 14% infotainment; 2% computing; 6% other ATV; 6% other IPC; 1% drives; 4% power infrastructure; 1% transportation; 2% renewables; 4% home appliances; 2% 2021-05-04 Copyright © Infineon Technologies AG 2021. All rights reserved. -
Fourth Quarter FY 2020 Quarterly Update
Fourth Quarter FY 2020 Quarterly Update Infineon Technologies AG Investor Relations Infineon at a glance Addressing long-term high-growth trends Illustrative aggregated FY20 revenue by segment › IoT (incl. data center, 5G, sensing, connectivity) 14% › electro-mobility Automotive (ATV) Industrial Power Control (IPC) 43% › assisted driving, autonomous driving Power & Sensor Systems (PSS) 29% › energy efficiency, renewable energies Connected Secure Systems (CSS) 14% › security Financials Illustrative aggregated FY20 revenue by product category [EUR m] 8,567 9000 8,029 7,063 7,599 ~5% memory for specific 6,473 applications 6000 ~10% RF & sensors 17.1% 17.8% 3000 16.4% 15.2% 13.7% embedded control ~30% 982 1,208 1,353 1,319 1,170 and connectivity 0 power semi- FY16 FY17 FY18 FY19 FY20 ~55% conductors of total revenue Revenue Segment Result Margin ATV IPC PSS CSS 2020-11-09 Copyright © Infineon Technologies AG 2020. All rights reserved. 2 Illustrative aggregated FY20 revenue including contribution from Cypress of ~€1,900m from 1 Oct 2019 through 30 Sep 2020 Illustrative aggregated FY20 revenue of ~€9,600m by target application powertrain ICE; 8% industrial and consumer IoT; 10% xEV (incl. MHEV); 5% payment, identification, ticketing; 4% other PSS; 2% CSS safety excl. ADAS; 6% industrial; 7% 14% ADAS; 4% ATV consumer; 6% PSS 43% 29% comfort, premium; 12% smartphones; 5% IPC communications; 3% 14% infotainment; 2% computing; 6% other ATV; 6% other IPC; 3% drives; 4% traction; 1% renewables; 4% home appliances; 2% 2020-11-09 Copyright © Infineon -
TLIN1028-Q1 Automotive Local Interconnect Network (LIN)
TLIN1028-Q1 www.ti.com SLLSEX4A – AUGUST 2019 – REVISEDTLIN1028-Q1 OCTOBER 2020 SLLSEX4A – AUGUST 2019 – REVISED OCTOBER 2020 TLIN1028-Q1 Automotive LIN 125-mA System Basis Chip (SBC) 1 Features 2 Applications • AEC-Q100 (Grade 1): Qualified for automotive • Body electronics and lighting applications • Hybrid, electric & powertrain systems • Local interconnect network (LIN) physical layer • Automotive infotainment and cluster specification ISO/DIS 17987–4 compliant and • Appliances conforms to SAE J2602 recommended practice for LIN 3 Description • Functional Safety-Capable The TLIN1028-Q1 is a local interconnect network – Documentation available to aid functional safety (LIN) physical layer transceiver, compliant to LIN 2.2A system design ISO/DIS 17987–4 standards, with an integrated low • Supports 12-V applications dropout (LDO) voltage regulator. • Wide operating ranges This LIN system basis chip (SBC) reduces system – ±58 V LIN bus fault protection complexity by providing a 3.3 V or 5 V rail with up to – LDO output supporting 3.3 V or 5 V 70 mA (D) or 125 mA (DRB and DDA) of current to – Sleep mode: Ultra-low current power microprocessors, sensors or other devices. consumption allows wake-up event from: The TLIN1028-Q1 has an optimized current-limited • LIN bus or local wake through EN pin wave-shaping driver which reduces electromagnetic – Power-up and down glitch-free operation emissions (EME). The TLIN1028-Q1 converts the LIN protocol data stream on the TXD input into a LIN bus • Protection features: signal. The receiver converts the data stream to logic- – ESD protection, VSUP under-voltage protection level signals that are sent to the microprocessor – TXD dominant time out (DTO) protection, through the open-drain RXD pin. -
Automotive Solutions for Electro-Mobility Contents
Automotive Solutions for Electro-Mobility Contents 3 Smart Mobility 4 Electro-Mobility 5 Key Applications 6 Main Traction Inverter 7 On-Board Charger (OBC) 8 48V Start-Stop System 9 Bidirectional DC/DC Converter 10 Battery Management System 11 48V Electric Traction 12 Acoustic Vehicle Alerting System (AVAS) 13 HV Battery Disconnect & Fire-off System 14 Vehicle Control Unit (VCU) 16 Key Technologies 18 Development Tools 18 Product Selectors samples, Evaluation Boards 19 SPC5 Automotive MCU Evaluation Tools 21 AutoDevKit Smart Mobility It is estimated that 80% of all innovations in the automotive industry today are directly or indirectly enabled by electronics. With vehicle functionality improving with every new model this means a continuous increase in the semiconductor content per car. With over 30 years’ experience in automotive electronics, ST is a solid, innovative, and reliable partner with whom to build the future of transportation. ST’s Smart Mobility products and solutions are making driving safer, greener and more connected through the combination of several of our technologies. SAFER Driving is safer thanks to our Advanced Driver Assistance Systems (ADAS) – vision processing, radar, imaging and sensors, as well as our adaptive lighting systems, user display and monitoring technologies. GREENER Driving is greener with our automotive processors for engine management units, engine management systems, high-efficiency smart power electronics at the heart of all automotive sub-systems and devices for hybrid and electric vehicle applications. 80% MORE CONNECTED And vehicles are more connected using our infotainment-system and telematics of all innovations processors and sensors, as well as our radio tuners and amplifiers, positioning in the automotive technologies, and secure car-to-car and car-to-infrastructure (V2X) connectivity solutions.