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RAD750 at Our Website: Click HERE RAD750• Board Full-service, independent repair center -~ ARTISAN® with experienced engineers and technicians on staff. TECHNOLOGY GROUP ~I We buy your excess, underutilized, and idle equipment along with credit for buybacks and trade-ins. Custom engineering Your definitive source so your equipment works exactly as you specify. for quality pre-owned • Critical and expedited services • Leasing / Rentals/ Demos equipment. • In stock/ Ready-to-ship • !TAR-certified secure asset solutions Expert team I Trust guarantee I 100% satisfaction Artisan Technology Group (217) 352-9330 | [email protected] | artisantg.com All trademarks, brand names, and brands appearing herein are the property o f their respective owners. Find the BAE Systems RAD750 at our website: Click HERE RAD750 Board Hardware Specification Document Number 234A524 Release Date August 1, 2000 Copyright by BAE SYSTEMS All Rights Reserved Document Number: 234A524 RAD750 CompactPCI Hardware Specification Notices Before using this information and the product it supports, be sure to read the general information on the back cover of this book. Trademarks The following are trademarks of International Business Machines Corporation in the United States, or other countries, or both: IBM IBM Logo PowerPC PowerPC 750 The following are trademarks of BAE SYSTEMS in the United States, or other countries, or both: RAD750 The following are registered trademarks of PCI Industrial Computer Manufacturing Group in the United States, or other countries, or both: PICMG CompactPCI Other company, product, and service names may be trademarks or service marks of others. Preliminary Edition (Version 4.0, 8/1/2000) This unpublished document is the preliminary edition of RAD750 3U CompactPCI board Hardware Specification. Make sure you are using the correct edition for the level of the product. This document contains information on a new product under development by BAE SYSTEMS. BAE SYSTEMS reserves the right to change or discontinue this product without notice. © BAE SYSTEMS 2000. All rights reserved. i Document Number: 234A524 RAD750 CompactPCI Hardware Specification Preface This is the preliminary version of the document and includes all sections planned for the final version. Items marked TBA or TBD are not yet known as of this publication. Many of these will require the actual hardware prior to their resolution. Items marked (TBR) represent estimates that will also require the real hardware to verify and adjust. All such items may change in future versions of this document. ii Document Number: 234A524 RAD750 CompactPCI Hardware Specification Revision History REVISION REVISION HISTORY DATE 1.0 Draft for Internal Review 08/13/99 2.0 Preliminary Version Delivery Date 08/30/99 2.1 Minor rewording of capabilities, updates to registers, general clean-up 03/20/00 4.0 Release to web 08/01/00 iii Document Number: 234A524 RAD750 CompactPCI Hardware Specification TABLE OF CONTENTS SECTION 1 INTRODUCTION................................................................................................................. 1 1.1 SCOPE ............................................................................................................................................. 1 1.2 APPLICABLE AND RELATED DOCUMENTS ............................................................................................ 1 1.3 CONVENTIONS / NOMENCLATURE....................................................................................................... 4 1.4 TERMINOLOGY AND ACRONYMS ......................................................................................................... 4 SECTION 2 OVERVIEW....................................................................................................................... 10 2.1 RAD750 3U COMPACTPCI BOARD MODULE FUNCTIONS ................................................................. 10 2.2 EMBEDDED SOFTWARE ................................................................................................................... 14 2.3 POWER MANAGEMENT ..................................................................................................................... 14 2.4 PERFORMANCE ............................................................................................................................... 15 2.5 GENERAL PARAMETERS .................................................................................................................. 15 SECTION 3 EXTERNAL ELECTRICAL INTERFACE ......................................................................... 16 3.1 COMPACTPCI DEFINED SIGNALS ..................................................................................................... 16 3.2 NON-PCI INTERFACES .................................................................................................................... 27 3.3 POWER INTERFACES ....................................................................................................................... 40 SECTION 4 ELECTRICAL AND THERMAL CHARACTERISTICS .................................................... 42 4.1 DC ELECTRICAL CONDITIONS .......................................................................................................... 42 4.2 AC ELECTRICAL CHARACTERISTICS ................................................................................................. 44 SECTION 5 MECHANICAL INTERFACE ............................................................................................ 52 5.1 RAD750 3U COMPACTPCI BOARD MODULE ASSEMBLY................................................................... 52 5.2 GROUNDING REQUIREMENTS........................................................................................................... 54 5.3 RAD750 3U COMPACTPCI BOARD ELECTRICAL CONNECTORS ........................................................ 55 5.4 NAME PLATE AND PRODUCT MARKINGS ........................................................................................... 62 5.5 LIFETIME......................................................................................................................................... 62 SECTION 6 ENVIRONMENTAL CONDITIONS................................................................................... 63 6.1 TEMPERATURE................................................................................................................................63 6.2 LAUNCH ATMOSPHERIC ENVIRONMENT............................................................................................. 63 6.3 GROUND HANDLING ........................................................................................................................ 63 6.4 LAUNCH DYNAMIC ENVIRONMENTS .................................................................................................. 64 6.5 THERMAL..................................................................................................................................... 66 6.6 ELECTROMAGNETIC COMPATIBILITY ................................................................................................. 67 6.7 RADIATION...................................................................................................................................... 71 iv Document Number: 234A524 RAD750 CompactPCI Hardware Specification SECTION 7 FUNCTIONAL INTERFACE ............................................................................................. 73 7.1 RAD750 PROGRAMMING INTERFACE ............................................................................................... 73 7.2 EXTERNAL PCI BUS INTERFACE....................................................................................................... 77 7.3 EMBEDDED MICRO-CONTROLLER PROGRAMMING INTERFACES ......................................................... 79 7.4 EXTERNAL JTAG INTERFACES......................................................................................................... 80 7.5 MODULE INITIALIZATION................................................................................................................... 80 SECTION 8 RAD750 3U COMPACTPCI BOARD REGISTER DEFINITION...................................... 81 8.1 RAD750 REGISTER MAP ................................................................................................................ 81 8.2 POWER PCI ASIC REGISTER MAP .................................................................................................. 82 SECTION 9 ORDERING INFORMATION ............................................................................................ 93 SECTION 10 COMMENTS.......................................................................................................................... 94 v Document Number: 234A524 RAD750 CompactPCI Hardware Specification LIST OF FIGURES FIGURE 1. NOTIONAL C&DH ARCHITECTURE USING A RAD750 BOARD .......................................................... 10 FIGURE 2. RAD750 3U COMPACTPCI BOARD FUNCTIONAL BLOCK DIAGRAM ................................................. 11 FIGURE 3. RAD750 3U COMPACTPCI BOARD CLOCKING. ............................................................................. 14 FIGURE 4. RAD750 3U COMPACTPCI BOARD INTERFACE DIAGRAM .............................................................. 16 FIGURE 5. JTAG BACKPANEL INTERFACE I/O ................................................................................................ 32 FIGURE 6. JTAG RAD750 INTERFACE I/O ...................................................................................................
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