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Titan X Amd 1.2 V4 Ig 20210319
English TITAN X_AMD 1.2 Installation Guide V4 Parts List A CPU Water Block A A-1 BPTA-CPUMS-V2-SKA ..........1 pc A-1 A-2 A-2 Backplane assembly ..............1 set B Fittings B-1 BPTA-DOTFH1622 ...............4 pcs B-2 TA-F61 ...................................2 pcs B-3 BPTA-F95 ..............................2 pcs B-4 BP-RIGOS5 ...........................2 pcs B-5 TA-F60 ..................................2 pcs B-6 TA-F40 ..................................2 pcs C Accessory C-1 Hard tube ..............................2 pcs C-2 Fitting + soft tube ....................1 pc C-3 CPU set SCM3FL20 SPRING B SCM3F6 1mm Spacer Back Pad Paste Pad Metal Backplane M3x32mm Screw B-1 B-2 B-3 B-4 B-5 B-6 C C-1 Hard Tube ※ The allowable variance in tube length is ± 2mm C-2 Fitting + soft tube Bitspower reserves the right to change the product design and interpretations. These are subject to change without notice. Product colors and accessories are based on the actual product. — 1 — I. AMD Motherboard system 54 AMD SOCKET 939 / 754 / 940 IN 48 AMD SOCKET AM4 AMD SOCKET AM3 / AM3+ AMD SOCKET AM2 / AM2+ AMD SOCKET FM1 / FM2+ Bitspower Fan and DRGB RF Remote Controller Hub (Not included) are now available at microcenter.com DRGB PIN on Motherboard or other equipment. 96 90 BPTA-RFCHUB The CPU water block has a DRGB cable, which AMD SOCKET AM4 AMD SOCKET AM3 AM3+ / AMD SOCKET AM2 AM2+ / AMD SOCKET FM1 / FM2+ can be connected to the DRGB extension cable of the radiator fans. Fan and DRGB RF Remote Motherboard Controller Hub (Not included) OUT DRGB LED Do not over-tighten the thumb screws Installation (SCM3FL20). -
Super 7™ Motherboard
SY-5EH5/5EHM V1.0 Super 7Ô Motherboard ************************************************ Pentium® Class CPU supported ETEQ82C663 PCI/AGP Motherboard AT Form Factor ************************************************ User's Guide & Technical Reference NSTL “Year 2000 Test” Certification Letter September 23, 1998 Testing Date: September 23, 1998 Certification Date: September 23, 1998 Certification Number: NCY2000-980923-004 To Whom It May Concern: We are please to inform you that the “SY-5EHM/5EH5” system has passed NSTL Year 2000 certification test program. The Year 2000 test program tests a personal computer for its ability to support the year 2000. The “SY-5EHM/5EH5: system is eligible to carry the NSTL :Year 2000 Certification” seal. The Year 2000 certification test has been done under the following system configuration: Company Name : SOYO COMPUTER INC. System Model Name : SY-5EHM/5EH5 Hardware Revision : N/A CPU Model : Intel Pentium 200/66Mhz On Board Memory/L2 Cache : PC100 SDRAM DIMM 32MBx1 /1MB System BIOS : Award Modular BIOS V4.51PG, An Energy Star Ally Copyright © 1984—98, EH-1A6,07/15/1998-VP3-586B- 8669-2A5LES2AC-00 Best regards, SPORTON INTERNATIONAL INC. Declaration of Conformity According to 47 CFR, Part 2 and 15 of the FCC Rules Declaration No.: D872907 July.10 1998 The following designated product EQUIPMENT: Main Board MODEL NO.: SY-5EH Which is the Class B digital device complies with 47 CFR Parts 2 and 15 of the FCC rules. Operation is subject to the following two conditions : (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. -
FCC Information and Copyright
N68S3B Setup Manual FCC Information and Copyright This equipment has been tested and found to comply with the limits of a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. There is no guarantee that interference will not occur in a particular installation. The vendor makes no representations or warranties with respect to the contents here and specially disclaims any implied warranties of merchantability or fitness for any purpose. Further the vendor reserves the right to revise this publication and to make changes to the contents here without obligation to notify any party beforehand. Duplication of this publication, in part or in whole, is not allowed without first obtaining the vendor’s approval in writing. The content of this user’s manual is subject to be changed without notice and we will not be responsible for any mistakes found in this user’s manual. All the brand and product names are trademarks of their respective companies. Dichiarazione di conformità Short Declaration of conformity sintetica We declare this product is complying Ai sensi dell’art. 2 comma 3 del D.M. with the laws in force and meeting all 275 del 30/10/2002 the essential requirements as specified by the directives Si dichiara che questo prodotto è conforme alle normative vigenti e 2004/108/CE, 2006/95/CE and soddisfa i requisiti essenziali richiesti 1999/05/CE dalle direttive whenever these laws may be applied 2004/108/CE, 2006/95/CE e 1999/05/CE quando ad esso applicabili Table of Contents Chapter 1: Introduction ....................................... -
System Management BIOS (SMBIOS) Reference 6 Specification
1 2 Document Number: DSP0134 3 Date: 2011-01-26 4 Version: 2.7.1 5 System Management BIOS (SMBIOS) Reference 6 Specification 7 Document Type: Specification 8 Document Status: DMTF Standard 9 Document Language: en-US 10 System Management BIOS (SMBIOS) Reference Specification DSP0134 11 Copyright Notice 12 Copyright © 2000, 2002, 2004–2011 Distributed Management Task Force, Inc. (DMTF). All rights 13 reserved. 14 DMTF is a not-for-profit association of industry members dedicated to promoting enterprise and systems 15 management and interoperability. Members and non-members may reproduce DMTF specifications and 16 documents, provided that correct attribution is given. As DMTF specifications may be revised from time to 17 time, the particular version and release date should always be noted. 18 Implementation of certain elements of this standard or proposed standard may be subject to third party 19 patent rights, including provisional patent rights (herein "patent rights"). DMTF makes no representations 20 to users of the standard as to the existence of such rights, and is not responsible to recognize, disclose, 21 or identify any or all such third party patent right, owners or claimants, nor for any incomplete or 22 inaccurate identification or disclosure of such rights, owners or claimants. DMTF shall have no liability to 23 any party, in any manner or circumstance, under any legal theory whatsoever, for failure to recognize, 24 disclose, or identify any such third party patent rights, or for such party’s reliance on the standard or 25 incorporation -
SAMPLE CHAPTER 1 Chapter Personal Computer 1 System Components the FOLLOWING COMPTIA A+ ESSENTIALS EXAM OBJECTIVES ARE COVERED in THIS CHAPTER
SAMPLE CHAPTER 1 Chapter Personal Computer 1 System Components THE FOLLOWING COMPTIA A+ ESSENTIALS EXAM OBJECTIVES ARE COVERED IN THIS CHAPTER: Ûß1.2 Explain motherboard components, types and features Nß Form Factor Nß ATX / BTX, Nß micro ATX Nß NLX Nß I/O interfaces Material Nß Sound Nß Video Nß USB 1.1 and 2.0 Nß Serial Nß IEEE 1394 / FireWire Nß Parallel Nß NIC Nß Modem Nß PS/2 Nß Memory slots Nß RIMM Nß DIMM Nß SODIMM CopyrightedNß SIMM Nß Processor sockets Nß Bus architecture 86498book.indb 1 7/22/09 5:37:17 AM Nß Bus slots Nß PCI Nß AGP Nß PCIe Nß AMR Nß CNR Nß PCMCIA Chipsets Nß BIOS / CMOS / Firmware Nß POST Nß CMOS battery Nß Riser card / daughterboard Nß [Additional subobjectives covered in chapter 2] Ûß1.4 Explain the purpose and characteristics of CPUs and their features Nß Identify CPU types Nß AMD Nß Intel Nß Hyper threading Nß Multi core Nß Dual core Nß Triple core Nß Quad core Nß Onchip cache Nß L1 Nß L2 Nß Speed (real vs. actual) Nß 32 bit vs. 64 bit Ûß1.5 Explain cooling methods and devices Nß Heat sinks Nß CPU and case fans 86498book.indb 2 7/22/09 5:37:18 AM Nß Liquid cooling systems Nß Thermal compound Ûß1.6 Compare and contrast memory types, characteristics and their purpose Nß Types Nß DRAM Nß SRAM Nß SDRAM Nß DDR / DDR2 / DDR3 Nß RAMBUS Nß Parity vs. Non-parity Nß ECC vs. non-ECC Nß Single sided vs. double sided Nß Single channel vs. -
PURE Crossfirex 790GX
PC-AM3RS790G - PURE CrossFireX 790GX The Sapphire PURE CrossFireX 790GX AM3 is designed for AMD Phenom II™ AM3 true quad-core processors and next generation graphics with high speed DDR3 DRAM module. Performance, scalability, and personalization are coupled with an innovative and efficient design incorporating new ATI CrossFireX and Hybrid CrossFire technologies. The Sapphire PURE CrossFireX 790GX AM3 is designed for PC enthusiasts, high-performance gamers and professional overclockers**. Cut to the chase and open up the system BIOS to mad tweaking for the hardcore overclocker, via real-time control and then using the AMD OverDrive utility. Get the power of multi GPU graphics behind you to experience the ultimate in high definition gaming . Loaded with next generation technologies like PCI Express® 2.0 and HyperTransport™ 3.0 technology, get the ammo you need in gaming, HD editing, and high resolution video to lead the pack, not follow it. Build your dream PC. Start with a Sapphire PURE CrossFireX 790GX AM3 motherboard. Overview Features Features and Benefits AMD Phenom&tarade; Quad-Core Processors with True Quad-Core Technology Realize new possibilities for connecting with friends, family, and digital entertainment with the phenomenal performance of the AMD Phenom™ II AM3 series quad-core processor. Built from the ground up for true quad-core performance, AMD Phenom™ processors speed through advanced multitasking, critical business productivity, advanced visual design and modeling, serious gaming, and visually stunning digital media -
VX97 User's Manual ASUS CONTACT INFORMATION Asustek COMPUTER INC
R VX97 Pentium Motherboard USER'S MANUAL USER'S NOTICE No part of this manual, including the products and softwares described in it, may be repro- duced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means, except documentation kept by the purchaser for backup pur- poses, without the express written permission of ASUSTeK COMPUTER INC. (“ASUS”). ASUS PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OR CONDITIONS OF MERCHANTABILITY OR FITNESS FOR A PAR- TICULAR PURPOSE. IN NO EVENT SHALL ASUS, ITS DIRECTORS, OFFICERS, EMPLOYEES OR AGENTS BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDEN- TAL, OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFITS, LOSS OF BUSINESS, LOSS OF USE OR DATA, INTERRUPTION OF BUSI- NESS AND THE LIKE), EVEN IF ASUS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES ARISING FROM ANY DEFECT OR ERROR IN THIS MANUAL OR PRODUCT. Products and corporate names appearing in this manual may or may not be registered trade- marks or copyrights of their respective companies, and are used only for identification or explanation and to the owners’ benefit, without intent to infringe. • Intel, LANDesk, and Pentium are registered trademarks of Intel Corporation. • IBM and OS/2 are registered trademarks of International Business Machines. • Symbios is a registered trademark of Symbios Logic Corporation. • Windows and MS-DOS are registered trademarks of Microsoft Corporation. • Sound Blaster AWE32 and SB16 are trademarks of Creative Technology Ltd. • Adobe and Acrobat are registered trademarks of Adobe Systems Incorporated. -
HANDOUT – CPU Explained Objective 101.04
HANDOUT – CPU Explained Objective 101.04 What is a CPU? The CPU, Central Processing Unit, is the brain of the PC. It may also be referred to as the processor or central processor. A CPU is really a microprocessor or MPU that is made up of millions of transistors on a silicon wafer. The transistors act like tiny switches that are either turned on or off. The CPU uses these switches to execute a sequence of stored instructions called a program. There are four basic processes in the execution of instructions: 1. Fetch 2. Decode 3. Execute 4. Write-back. All the work done by a CPU is done using binary numbers – either a 1 or a 0. The 1 is the switch in the on position causing a presence of voltage, and the 0 is the switch in the off position causing an absence of voltage. The CPU has an Arithmetic Logical Unit or ALU that performs arithmetic and logical operations on the binary numbers. The CPU also has a Control Unit that extracts instructions from the memory, decodes and executes the instructions. CPU Manufacturers Intel IBM used to control the PC industry and market. IBM worked with a company called Intel, which manufactured CPUs for IBM. Over time, Intel has become the world leader in microprocessor development. Intel develops their chips, which fall into generations or families. The first generation was the 8080, 8088, and the 8086 chips. The next generation was the 80286, 80386, and 80486 chips. The next family was the Pentium 1, Pentium Pro, P2, P3 and P4 microprocessors. -
2018 Annual Report on Form 10-K
2018 ANNUAL REPORT ON FORM 10-K MARCH 2019 DEAR SHAREHOLDERS: From the industry’s first 1GHz CPU to the world’s first GPU delivering a teraflop of computing power, AMD has always stood for pushing the boundaries of what is possible. A few years ago, we made several big bets to accelerate our pace of innovation, strengthen our execution, and enable AMD to deliver a leadership portfolio of computing and graphics processors capable of increasing our share of the $75 billion high-performance computing market. In 2018, we saw those bets begin to pay off as we delivered our second straight year of greater than 20% annual revenue growth and significantly improved our gross margin and profitability from the previous year. REVENUE GROSS MARGIN % R&D INVESTMENT EXPENSE/REVENUE % $ Billions $ Billions $6.5B 38% $1.43B 34% $5.3B 34% 33% $4.3B $1.20B 23% $1.01B 31% 2016 2017 2018 2016 2017 2018 2016 2017 2018 2016 2017 2018 Added $2.2B in revenue Significantly improved gross Increased R&D by more than Significant improvement over the last 2 years margin over last 2 years based 40% over the last 2 years in OPEX leverage on new product portfolio Our newest Ryzen™, EPYC™ and datacenter GPU products contributed more than $1.2 billion of revenue in 2018 and helped us gain share across our priority markets. In 2018, we added 3.9% points of desktop processor unit share, 5.3% points of notebook processor unit share and met our goal of exiting the year with mid-single digit server processor market share. -
Hyper 212 EVO (R2 Revision) Product Sheet Page 1
Hyper 212 EVO R2 Revision - Support LGA 2011 Features Well-balanced cooling performance provides fin optimizations with perfect balance between high and low speed operations. 4 Direct Contact heat pipes with the patented CDC™ (Continuous Direct Contact) technology - creating a per- fect, sleek surface for heat conduction. Wide-range PWM fan with unique wave-shaped blade design for excel- lent airflow. Versatile all-in-one mounting solution supporting the latest Intel® LGA 2011 / 1366 / 1155 and AMD FM1 / AM3+. RR-212E-20PK-R2 Compatibility Specifications All Intel® Socket 2011/1366/1156 CPU Socket Intel® Socket LGA 2011/1366 1155/775 CPU 1156/1155/775 - Intel® Core™ i7 Extreme AMD Socket FM1/AM3+/AM3/AM2+/AM2 - Intel® Core™ i7 - Intel® Core™ i5 Dimensions 120 x 80 x 159 mm (4.7 x 3.1 x 6.3 inch) - Intel® Core™ i3 - Intel® Core™2 Extreme/Quad/Duo Heat Sink Dimensions 116 x 51 x 159 mm (4.6 x 2.0 x 6.3 inch) - Intel® Pentium® Heat Sink Material 4 Direct Contact Heat Pipes / Aluminum Fins - Intel® Celeron® Heat Sink Weight 465g (1.03 lb) All AMD Socket FM1/AM3+/AM3 Fan Dimensions 120x120x25 mm (4.7x4.7x1 inch) AM2+ / AM2 CPU - AMD FX-Series Fan Speed 600 - 2000 RPM (PWM) ± 10% - AMD A-Series Fan Air Flow 24.9 - 82.9 CFM ± 10% - AMD Phenom™ II X4 / X3 / X2 - AMD Phenom™ X4 / X3 Fan Air Pressure 0.3 - 2.7mm H2O ± 10% - AMD Athlon™ II X4 / X3 / X2 Fan Life Expectancy 40,000 hours - AMD Athlon™ X2 - AMD Athlon™ Noise Level 9 - 36dBA - AMD Sempron™ Bearing Type Long Life Sleeve Bearing (For the latest CPU support Connector 4-Pin information, please visit our Fan Weight 104g (0.23 lb) website.) Weight 580g (1.28 lb) Hyper 212 EVO R2 Revision - Support LGA 2011 Close Up Well-Balanced Cooling 4 Direct Contact Heat Pipes Fin optimizations Aluminum fins with provide perfect 4 direct contact heat balance between pipes to provide high and low speed excellent heat dissi- operations. -
Socket AM3 Processor Functional Data Sheet
AMD Confidential – Advance Information Socket AM3 Processor Functional Data Sheet Publication # 40778 Revision: 1.13 Issue Date: January 2009 Advanced Micro Devices AMD Confidential – Advance Information © 2007 – 2009 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. The information contained herein may be of a preliminary or advance nature and is subject to change without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD’s products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD’s product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice. Trademarks AMD, the AMD Arrow logo, and combinations thereof are trademarks of Advanced Micro Devices, Inc. -
AMD EPYC 7002 Architecture Extends Benefits for Storage-Centric
Micron Technical Brief AMD EPYC™ 7002 Architecture Extends Benefits for Storage-Centric Solutions Overview With the release of the second generation of AMD EPYC™ family of processors, Micron believes that AMD has extended the benefits of EPYC as a foundation for storage-centric, all-flash solutions beyond the previous generation. As more enterprises are evaluating and deploying commodity server-based software-defined storage (SDS) solutions, platforms built using AMD EPYC 7002 processors continue to provide massive storage flexibility and throughput using the latest generation of PCI Express® (PCIe™) and NVM Express® (NVMe™) SSDs. With this new offering, Micron revisits our previously released analysis of the advantages that AMD EPYC architecture-based servers provide storage-centric solutions. To best assess the AMD EPYC architecture, we discuss the EPYC 7002 for solid-state storage solutions, based on AMD EPYC product features, capabilities and server manufacturer recommendations. We have not included any specific testing performed by Micron. Each OEM/ODM will have differing server implementation and additional support components, which could ultimately affect solution performance. Architecture Overview The new EPYC 7002 series of enterprise-class server processors, AMD created a second generation of its “Zen” microarchitecture and a second- generation Infinity Fabric™ to interconnect up to eight processor core complex die (CCD) per socket. Each CCD can host up to eight cores together with a centralized I/O controller that handles all PCIe and memory traffic (Figure 1). AMD has doubled the performance of each system-on-a- chip (SoC) while reducing the overall power consumption per core through advanced 7nm process technology over the first generation’s 14nm process, doubling memory DIMM size support to 256GB LRDIMMs while also providing a 2x peripheral throughput increase with the introduction of PCIe Generation 4.0 I/O controllers.