HANDOUT – CPU Explained Objective 101.04

Total Page：16

File Type：pdf, Size：1020Kb

HANDOUT – CPU Explained Objective 101.04 What is a CPU? The CPU, Central Processing Unit, is the brain of the PC. It may also be referred to as the processor or central processor. A CPU is really a microprocessor or MPU that is made up of millions of transistors on a silicon wafer. The transistors act like tiny switches that are either turned on or off. The CPU uses these switches to execute a sequence of stored instructions called a program. There are four basic processes in the execution of instructions: 1. Fetch 2. Decode 3. Execute 4. Write-back. All the work done by a CPU is done using binary numbers – either a 1 or a 0. The 1 is the switch in the on position causing a presence of voltage, and the 0 is the switch in the off position causing an absence of voltage. The CPU has an Arithmetic Logical Unit or ALU that performs arithmetic and logical operations on the binary numbers. The CPU also has a Control Unit that extracts instructions from the memory, decodes and executes the instructions. CPU Manufacturers Intel IBM used to control the PC industry and market. IBM worked with a company called Intel, which manufactured CPUs for IBM. Over time, Intel has become the world leader in microprocessor development. Intel develops their chips, which fall into generations or families. The first generation was the 8080, 8088, and the 8086 chips. The next generation was the 80286, 80386, and 80486 chips. The next family was the Pentium 1, Pentium Pro, P2, P3 and P4 microprocessors. Other families of Intel CPUs are o Core o Celeron o Xeon (Server) o Atom (Mobile Computer) Page | 1 HANDOUT – CPU Explained Objective 101.04 AMD Intel is not the only microprocessor manufacturer out there. Advanced Micro Devices (AMD) is a manufacturer that started making chips the same time Intel did. In the beginning, AMD made chips almost identical to Intel’s, but because of legal battles and changes in the computing industry, AMD has developed their very own CPU architecture. AMD was the first to produce chips that could process 64 bits of data per clock. AMD produces the following CPU families: Phenom Athlon Duron Sempron Opteron (Server) Turion (Mobile Computing) CPU packages Many different CPUs have been developed over time. With each new model, from each manufacturer, there have been changes in the size, shape, voltages, signals, number of pins, shape of the pins and style of CPUs. These packages include single edge cartridge (SEC), pin grid array (PGA), and land grid array (LGA). Every MB has a CPU socket which must match the exact specifications of a specific CPU. There is no guessing. A MB is completely configured around the specific abilities of a specific CPU. Nearly every new advancement in CPU technology brings a change in package. Page | 2.

Copy Link

Recommended publications

Super 7™ Motherboard
SY-5EH5/5EHM V1.0 Super 7Ô Motherboard ************************************************ Pentium® Class CPU supported ETEQ82C663 PCI/AGP Motherboard AT Form Factor ************************************************ User's Guide & Technical Reference NSTL “Year 2000 Test” Certification Letter September 23, 1998 Testing Date: September 23, 1998 Certification Date: September 23, 1998 Certification Number: NCY2000-980923-004 To Whom It May Concern: We are please to inform you that the “SY-5EHM/5EH5” system has passed NSTL Year 2000 certification test program. The Year 2000 test program tests a personal computer for its ability to support the year 2000. The “SY-5EHM/5EH5: system is eligible to carry the NSTL :Year 2000 Certification” seal. The Year 2000 certification test has been done under the following system configuration: Company Name : SOYO COMPUTER INC. System Model Name : SY-5EHM/5EH5 Hardware Revision : N/A CPU Model : Intel Pentium 200/66Mhz On Board Memory/L2 Cache : PC100 SDRAM DIMM 32MBx1 /1MB System BIOS : Award Modular BIOS V4.51PG, An Energy Star Ally Copyright © 1984—98, EH-1A6,07/15/1998-VP3-586B- 8669-2A5LES2AC-00 Best regards, SPORTON INTERNATIONAL INC. Declaration of Conformity According to 47 CFR, Part 2 and 15 of the FCC Rules Declaration No.: D872907 July.10 1998 The following designated product EQUIPMENT: Main Board MODEL NO.: SY-5EH Which is the Class B digital device complies with 47 CFR Parts 2 and 15 of the FCC rules. Operation is subject to the following two conditions : (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
[Show full text]
System Management BIOS (SMBIOS) Reference 6 Specification
1 2 Document Number: DSP0134 3 Date: 2011-01-26 4 Version: 2.7.1 5 System Management BIOS (SMBIOS) Reference 6 Specification 7 Document Type: Specification 8 Document Status: DMTF Standard 9 Document Language: en-US 10 System Management BIOS (SMBIOS) Reference Specification DSP0134 11 Copyright Notice 12 Copyright © 2000, 2002, 2004–2011 Distributed Management Task Force, Inc. (DMTF). All rights 13 reserved. 14 DMTF is a not-for-profit association of industry members dedicated to promoting enterprise and systems 15 management and interoperability. Members and non-members may reproduce DMTF specifications and 16 documents, provided that correct attribution is given. As DMTF specifications may be revised from time to 17 time, the particular version and release date should always be noted. 18 Implementation of certain elements of this standard or proposed standard may be subject to third party 19 patent rights, including provisional patent rights (herein "patent rights"). DMTF makes no representations 20 to users of the standard as to the existence of such rights, and is not responsible to recognize, disclose, 21 or identify any or all such third party patent right, owners or claimants, nor for any incomplete or 22 inaccurate identification or disclosure of such rights, owners or claimants. DMTF shall have no liability to 23 any party, in any manner or circumstance, under any legal theory whatsoever, for failure to recognize, 24 disclose, or identify any such third party patent rights, or for such party’s reliance on the standard or 25 incorporation
[Show full text]
SAMPLE CHAPTER 1 Chapter Personal Computer 1 System Components the FOLLOWING COMPTIA A+ ESSENTIALS EXAM OBJECTIVES ARE COVERED in THIS CHAPTER
SAMPLE CHAPTER 1 Chapter Personal Computer 1 System Components THE FOLLOWING COMPTIA A+ ESSENTIALS EXAM OBJECTIVES ARE COVERED IN THIS CHAPTER: Ûß1.2 Explain motherboard components, types and features Nß Form Factor Nß ATX / BTX, Nß micro ATX Nß NLX Nß I/O interfaces Material Nß Sound Nß Video Nß USB 1.1 and 2.0 Nß Serial Nß IEEE 1394 / FireWire Nß Parallel Nß NIC Nß Modem Nß PS/2 Nß Memory slots Nß RIMM Nß DIMM Nß SODIMM CopyrightedNß SIMM Nß Processor sockets Nß Bus architecture 86498book.indb 1 7/22/09 5:37:17 AM Nß Bus slots Nß PCI Nß AGP Nß PCIe Nß AMR Nß CNR Nß PCMCIA Chipsets Nß BIOS / CMOS / Firmware Nß POST Nß CMOS battery Nß Riser card / daughterboard Nß [Additional subobjectives covered in chapter 2] Ûß1.4 Explain the purpose and characteristics of CPUs and their features Nß Identify CPU types Nß AMD Nß Intel Nß Hyper threading Nß Multi core Nß Dual core Nß Triple core Nß Quad core Nß Onchip cache Nß L1 Nß L2 Nß Speed (real vs. actual) Nß 32 bit vs. 64 bit Ûß1.5 Explain cooling methods and devices Nß Heat sinks Nß CPU and case fans 86498book.indb 2 7/22/09 5:37:18 AM Nß Liquid cooling systems Nß Thermal compound Ûß1.6 Compare and contrast memory types, characteristics and their purpose Nß Types Nß DRAM Nß SRAM Nß SDRAM Nß DDR / DDR2 / DDR3 Nß RAMBUS Nß Parity vs. Non-parity Nß ECC vs. non-ECC Nß Single sided vs. double sided Nß Single channel vs.
[Show full text]
VX97 User's Manual ASUS CONTACT INFORMATION Asustek COMPUTER INC
R VX97 Pentium Motherboard USER'S MANUAL USER'S NOTICE No part of this manual, including the products and softwares described in it, may be repro- duced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means, except documentation kept by the purchaser for backup pur- poses, without the express written permission of ASUSTeK COMPUTER INC. (“ASUS”). ASUS PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OR CONDITIONS OF MERCHANTABILITY OR FITNESS FOR A PAR- TICULAR PURPOSE. IN NO EVENT SHALL ASUS, ITS DIRECTORS, OFFICERS, EMPLOYEES OR AGENTS BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDEN- TAL, OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFITS, LOSS OF BUSINESS, LOSS OF USE OR DATA, INTERRUPTION OF BUSI- NESS AND THE LIKE), EVEN IF ASUS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES ARISING FROM ANY DEFECT OR ERROR IN THIS MANUAL OR PRODUCT. Products and corporate names appearing in this manual may or may not be registered trade- marks or copyrights of their respective companies, and are used only for identification or explanation and to the owners’ benefit, without intent to infringe. • Intel, LANDesk, and Pentium are registered trademarks of Intel Corporation. • IBM and OS/2 are registered trademarks of International Business Machines. • Symbios is a registered trademark of Symbios Logic Corporation. • Windows and MS-DOS are registered trademarks of Microsoft Corporation. • Sound Blaster AWE32 and SB16 are trademarks of Creative Technology Ltd. • Adobe and Acrobat are registered trademarks of Adobe Systems Incorporated.
[Show full text]
Hyper 212 EVO (R2 Revision) Product Sheet Page 1
Hyper 212 EVO R2 Revision - Support LGA 2011 Features Well-balanced cooling performance provides fin optimizations with perfect balance between high and low speed operations. 4 Direct Contact heat pipes with the patented CDC™ (Continuous Direct Contact) technology - creating a per- fect, sleek surface for heat conduction. Wide-range PWM fan with unique wave-shaped blade design for excel- lent airflow. Versatile all-in-one mounting solution supporting the latest Intel® LGA 2011 / 1366 / 1155 and AMD FM1 / AM3+. RR-212E-20PK-R2 Compatibility Specifications All Intel® Socket 2011/1366/1156 CPU Socket Intel® Socket LGA 2011/1366 1155/775 CPU 1156/1155/775 - Intel® Core™ i7 Extreme AMD Socket FM1/AM3+/AM3/AM2+/AM2 - Intel® Core™ i7 - Intel® Core™ i5 Dimensions 120 x 80 x 159 mm (4.7 x 3.1 x 6.3 inch) - Intel® Core™ i3 - Intel® Core™2 Extreme/Quad/Duo Heat Sink Dimensions 116 x 51 x 159 mm (4.6 x 2.0 x 6.3 inch) - Intel® Pentium® Heat Sink Material 4 Direct Contact Heat Pipes / Aluminum Fins - Intel® Celeron® Heat Sink Weight 465g (1.03 lb) All AMD Socket FM1/AM3+/AM3 Fan Dimensions 120x120x25 mm (4.7x4.7x1 inch) AM2+ / AM2 CPU - AMD FX-Series Fan Speed 600 - 2000 RPM (PWM) ± 10% - AMD A-Series Fan Air Flow 24.9 - 82.9 CFM ± 10% - AMD Phenom™ II X4 / X3 / X2 - AMD Phenom™ X4 / X3 Fan Air Pressure 0.3 - 2.7mm H2O ± 10% - AMD Athlon™ II X4 / X3 / X2 Fan Life Expectancy 40,000 hours - AMD Athlon™ X2 - AMD Athlon™ Noise Level 9 - 36dBA - AMD Sempron™ Bearing Type Long Life Sleeve Bearing (For the latest CPU support Connector 4-Pin information, please visit our Fan Weight 104g (0.23 lb) website.) Weight 580g (1.28 lb) Hyper 212 EVO R2 Revision - Support LGA 2011 Close Up Well-Balanced Cooling 4 Direct Contact Heat Pipes Fin optimizations Aluminum fins with provide perfect 4 direct contact heat balance between pipes to provide high and low speed excellent heat dissi- operations.
[Show full text]
AMD EPYC 7002 Architecture Extends Benefits for Storage-Centric
Micron Technical Brief AMD EPYC™ 7002 Architecture Extends Benefits for Storage-Centric Solutions Overview With the release of the second generation of AMD EPYC™ family of processors, Micron believes that AMD has extended the benefits of EPYC as a foundation for storage-centric, all-flash solutions beyond the previous generation. As more enterprises are evaluating and deploying commodity server-based software-defined storage (SDS) solutions, platforms built using AMD EPYC 7002 processors continue to provide massive storage flexibility and throughput using the latest generation of PCI Express® (PCIe™) and NVM Express® (NVMe™) SSDs. With this new offering, Micron revisits our previously released analysis of the advantages that AMD EPYC architecture-based servers provide storage-centric solutions. To best assess the AMD EPYC architecture, we discuss the EPYC 7002 for solid-state storage solutions, based on AMD EPYC product features, capabilities and server manufacturer recommendations. We have not included any specific testing performed by Micron. Each OEM/ODM will have differing server implementation and additional support components, which could ultimately affect solution performance. Architecture Overview The new EPYC 7002 series of enterprise-class server processors, AMD created a second generation of its “Zen” microarchitecture and a second- generation Infinity Fabric™ to interconnect up to eight processor core complex die (CCD) per socket. Each CCD can host up to eight cores together with a centralized I/O controller that handles all PCIe and memory traffic (Figure 1). AMD has doubled the performance of each system-on-a- chip (SoC) while reducing the overall power consumption per core through advanced 7nm process technology over the first generation’s 14nm process, doubling memory DIMM size support to 256GB LRDIMMs while also providing a 2x peripheral throughput increase with the introduction of PCIe Generation 4.0 I/O controllers.
[Show full text]
P5SD-AS Mainboard User’S Manual P5SD-AS User’S Manual
P5SD-AS Mainboard User’s Manual P5SD-AS User’s Manual FCC & DOC Compliance Federal Communications Commission Statement This device complies with FCC Rules Part 15. Operation is subject to the following two conditions: • This device may not cause harmful interference, and • This device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’ s instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encour- aged to try to correct the interference by one or more of the following measures: • Re-orient or relocate the receiving antenna. • Increase the separation between the equipment and the receiver. • Connect the equipment to an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. Warning! The use of shielded cables for the connection of the monitor to the graphics card is required to assure compliance with FCC regulations. Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’ s authority to operate this equip- ment.
[Show full text]
Project Olympus AMD EPYC™ Processor Motherboard Specification
Project Olympus AMD EPYC™ Processor Motherboard Specification Author: Fenghua Shen, Senior Hardware Engineer, Microsoft Mark A. Shaw, Principal Hardware Engineering Manager, Microsoft Open Compute Project • Project Olympus AMD EPYC™ Processor Motherboard Specification Revision History Date Description 11/1/17 Version 1.0 http://opencompute.org ii Open Compute Project • Project Olympus AMD EPYC™ Processor Motherboard Specification © 2017 Microsoft Corporation. As of November 1, 2017, the following persons or entities have made this Specification available under the Open Web Foundation Final Specification Agreement (OWFa 1.0), which is available at http://www.openwebfoundation.org/legal/the- owf-1-0-agreements/owfa-1-0 Microsoft Corporation. You can review the signed copies of the Open Web Foundation Agreement Version 1.0 for this Specification at Project Olympus License Agreements, which may also include additional parties to those listed above. Your use of this Specification may be subject to other third party rights. THIS SPECIFICATION IS PROVIDED "AS IS." The contributors expressly disclaim any warranties (express, implied, or otherwise), including implied warranties of merchantability, non-infringement, fitness for a particular purpose, or title, related to the Specification. The entire risk as to implementing or otherwise using the Specification is assumed by the Specification implementer and user. IN NO EVENT WILL ANY PARTY BE LIABLE TO ANY OTHER PARTY FOR LOST PROFITS OR ANY FORM OF INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES OF ANY CHARACTER FROM ANY CAUSES OF ACTION OF ANY KIND WITH RESPECT TO THIS SPECIFICATION OR ITS GOVERNING AGREEMENT, WHETHER BASED ON BREACH OF CONTRACT, TORT (INCLUDING NEGLIGENCE), OR OTHERWISE, AND WHETHER OR NOT THE OTHER PARTY HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
[Show full text]
5 Microprocessors
Color profile: Disabled Composite Default screen BaseTech / Mike Meyers’ CompTIA A+ Guide to Managing and Troubleshooting PCs / Mike Meyers / 380-8 / Chapter 5 5 Microprocessors “MEGAHERTZ: This is a really, really big hertz.” —DAVE BARRY In this chapter, you will learn or all practical purposes, the terms microprocessor and central processing how to Funit (CPU) mean the same thing: it’s that big chip inside your computer ■ Identify the core components of a that many people often describe as the brain of the system. You know that CPU CPU makers name their microprocessors in a fashion similar to the automobile ■ Describe the relationship of CPUs and memory industry: CPU names get a make and a model, such as Intel Core i7 or AMD ■ Explain the varieties of modern Phenom II X4. But what’s happening inside the CPU to make it able to do the CPUs amazing things asked of it every time you step up to the keyboard? ■ Install and upgrade CPUs 124 P:\010Comp\BaseTech\380-8\ch05.vp Friday, December 18, 2009 4:59:24 PM Color profile: Disabled Composite Default screen BaseTech / Mike Meyers’ CompTIA A+ Guide to Managing and Troubleshooting PCs / Mike Meyers / 380-8 / Chapter 5 Historical/Conceptual ■ CPU Core Components Although the computer might seem to act quite intelligently, comparing the CPU to a human brain hugely overstates its capabilities. A CPU functions more like a very powerful calculator than like a brain—but, oh, what a cal- culator! Today’s CPUs add, subtract, multiply, divide, and move billions of numbers per second.
[Show full text]
Tuning Guide for AMD EPYC™ 7002 Series Processors
High Performance Computing: Tuning Guide for AMD EPYC™ 7002 Series Processors Publication # 56827 Revision: 1.0 Issue Date: January 2020 Authors: Anre Kashyap Advanced Micro Devices ©2020 Advanced Micro Devices, Inc. All rights reserved. The information contained herein is for informational purposes only and is subject to change without notice. While every precaution has been taken in the preparation of this document, it may contain technical inaccuracies, omissions and typographical errors, and AMD is under no obligation to update or otherwise correct this information. Advanced Micro Devices, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this document, and assumes no liability of any kind, including the implied warranties of noninfringement, merchantability or fitness for particular purposes, with respect to the operation or use of AMD hardware, software or other products described herein. No license, including implied or arising by estoppel, to any intellectual property rights is granted by this document. Terms and limitations applicable to the purchase or use of AMD’s products are as set forth in a signed agreement between the parties or in AMD's Standard Terms and Conditions of Sale. Trademarks AMD, the AMD Arrow logo, AMD EPYC, and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies. 56827 Rev. 1.0 Anre Kashyap High Performance Computing: Tuning Guide for AMD EPYC™ 7002 Series Processors Contents Chapter 1 Introduction .............................................................................................................. 6 1.1 Prerequisites ....................................................................................................................... 6 1.2 History ..............................................................................................................................
[Show full text]
Project Olympus Intel Xeon Scalable Processor Motherboard
Project Olympus Intel® Xeon® Scalable Processor Motherboard Specification Author: Mark A. Shaw, Principal Hardware Engineering Manager, Microsoft Open Compute Project • Project Olympus Intel® Xeon® Scalable Processor Motherboard Specification Revision History Date Description 11/1/2017 Version 1.0 11/17/2017 Version 1.1 - Added Section 11 to describe PCB Stack-up http://opencompute.org ii Open Compute Project • Project Olympus Intel® Scalable Processor Motherboard Specification © 2017 Microsoft Corporation. As of November 117, 2017, the following persons or entities have made this Specification available under the Open Web Foundation Final Specification Agreement (OWFa 1.0), which is available at http://www.openwebfoundation.org/legal/the- owf-1-0-agreements/owfa-1-0 Microsoft Corporation. You can review the signed copies of the Open Web Foundation Agreement Version 1.0 for this Specification at Project Olympus License Agreements, which may also include additional parties to those listed above. Your use of this Specification may be subject to other third party rights. THIS SPECIFICATION IS PROVIDED "AS IS." The contributors expressly disclaim any warranties (express, implied, or otherwise), including implied warranties of merchantability, non-infringement, fitness for a particular purpose, or title, related to the Specification. The entire risk as to implementing or otherwise using the Specification is assumed by the Specification implementer and user. IN NO EVENT WILL ANY PARTY BE LIABLE TO ANY OTHER PARTY FOR LOST PROFITS OR ANY FORM OF INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES OF ANY CHARACTER FROM ANY CAUSES OF ACTION OF ANY KIND WITH RESPECT TO THIS SPECIFICATION OR ITS GOVERNING AGREEMENT, WHETHER BASED ON BREACH OF CONTRACT, TORT (INCLUDING NEGLIGENCE), OR OTHERWISE, AND WHETHER OR NOT THE OTHER PARTY HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
[Show full text]
Table of Contents 1 01
www.ieiworld.com Table of Contents 1 01. Industrial Industrial Computing Solutions Computing Solutions 1.3 Industrial Motherboard Industrial Industrial Motherboard Selection Guide 1-61 ~ 1-62 Motherboard IMBA-Q454 1-63 eKINO-945GSE IMBA-9654 Intel® 945GSE+ ICH7M 1.1. Single Board Computer Intel® Atom™ Processor IMBA-XQ354 1-64 PICMG 1.3 Full Size PICMG 1.3 Selection guide 1-1 ~ 1-4 IMBA-X9654 SPCIE-5100DX 1-5 ~1-6 IMBA-9454 1-65 3.5" WAFER 3.5" WAFER Selection Guide 1-104 ~ 1-105 SPCIE-5100P 1-7 IMBA-9454B WAFER-945GSELVDS2 IMBA-9454ISA 1-106 PICMG 1.3 Backplane 1-8 ~ 1-9 1-66 WAFER-US15WP2 IMBA-8650-R22 PCIE-Q57A 1-10 WAFER-945GSE IMB-G41A 1-67 1-107 PCIE-G41A WAFER-8522 1-11 IMB-Q354 PCIE-Q350-R11 1-68 WAFER-945GSE2 1-108 IMB-9454G-R20 PCIE-9650-R11 1-12 WAFER-945GSE3 PCIE-9450-R30 Industrial Motherboard Dimensions 1-69 ~ 1-70 1-109 WAFER-8523 PCIE-9652 1-13 1.4 Embedded Single Boards PCIE-9452-R12 WAFER-9102 Mini ITX Mini-ITX Selection Guide 1-71 ~ 1-72 1-110 PICMG 1.3 Passive Backplane 1-14 ~1-18 WAFER-US15WP Series IEI Mini-ITX Introduction 1-73 PICMG 1.0 Full Size PICMG 1.0 Selection WAFER-GX 1-19 ~1-20 KINO-QM57A 1-74 1-111 Guide WAFER-LX-R12 KINO-G45A WSB-Q354 1-21 1-75 WAFER-LX2-R12 KINO-9454-R20 1-112 WSB-945GSE 1-22 WAFER-LX3-R20 KINO-GM45A 1-76 WSB-9454-R12 1-23 WAFER Dimensions 1-113 ~1-114 WSB-9150-R21 KINO-780AM2 1-77 ETX ETX IEM Series Introduction 1-115 WSB-9452-R20 KINO-780EB 1-78 1-24 IEM-945GSE 1-116 WSB-9152-R30 KINO-9653 1-79 ROCKY-4786EVG-R40 KINO-9652-R11 IEM-9452 1-25 1-117 ROCKY-3786EVGU2-R41 KINO-9453-R20 IEM-8522
[Show full text]