Design for Smaller, Lighter and Faster ICT Products: Technical Expertise, Infrastructures and Processes
Total Page:16
File Type:pdf, Size:1020Kb
Advances in Science, Technology and Engineering Systems Journal Vol. 2, No. 3, 1114-1128 (2017) ASTESJ www.astesj.com ISSN: 2415-6698 Special Issue on Recent Advances in Engineering Systems Design for Smaller, Lighter and Faster ICT Products: Technical Expertise, Infrastructures and Processes Omer Aydin*, Orhan Uçar Research and Development Department, Netaş, 34912, Turkey A R T I C L E I N F O A B S T R A C T Article history: For the design of Information and Communications Technology (ICT) related products, Received: 12 May, 2017 basic level of technical expertise and simple development tools were enough in the early Accepted: 14 June, 2017 1980s. As time goes by, new generation products designed by engineers are always Online: 16 July, 2017 expected to be smaller, lighter and faster, due to the increasing global competition and Keywords: the application of hardware and software in every area of our lives. In order to be able to Information and Communications respond to these needs, engineers have always had to produce new technologies and Technology solutions. In this sense, hardware related technologies have been growing much faster Product Development such as System on Chips (SoC), displays, batteries and other materials used in the ICT products. Designers have been diversifying software development processes and tools remarkably for new applications and constantly developing new communication standards. In this article, all the main design phases are presented starting from the system design to the product validation and test. As can be seen from the relevant sections, in order to design an ICT product, very deep technical expertise, expensive development and verification infrastructures are needed in the relevant fields. 1. Introduction consumer decisions. Especially for mobile and wearable ICT products, the owned products are tools through which consumers Before the 1980s, in the design process of Information and express their identities. Thus, besides the proper functionality of Communication Technology (ICT) products, it was sufficient to the product, different factors, such as emotional response of the have technical expertise at the basic level such as entry-level customers should be taken into account in the product design. material knowledge, basic skills in using measurement equipment, Therefore, today’s development processes are becoming too and the ability to use simple compilers in related fields. In those complex and multifaceted. years, functionality was the main concern for the product design. Furthermore, the development processes and infrastructures were Until mid 1970s, the design and manufacturing processes of much simpler than today. In the modern era, due to the advents in ICT products were mostly based on nonautomated or semi- technology, the emergence of new composite materials, the automated processes, where technical hand-skill of the operator introduction of effective production methods and the rise and on- usually plays a crucial role. PCB (Printed Circuit Board) design going diversification of consumer expectations, product design and production were made by hand work, with Letraset and paper process is getting more complex. In order to meet new product [1]. The use of the computer in the design process of ICT development requirements, a multidisciplinary approach is products was a revolution. Computer-aided design not only required to synthesize respective knowledge from various accelerated the design and manufacturing processes, but also disciplines, such as anthropology, sociology, physics, chemistry, resulted in a significant reduction in the related human errors. environment, etc.. In the rise of today’s consumer culture, Moreover, the decrease in the duration of the design allows the functional satisfaction is no longer a mere reason of purchasing production of more complex ICT products. The automation of the goods and services, while social factors substantially affect manufacturing of ICT products greatly increased the manufacturing volume and reduced the cost of the products that *Corresponding Author: Omer Aydin, Research and Development Department, Netaş, 34912, Turkey, +902165222682, [email protected] could provide the functionality never achieved before. www.astesj.com 1114 https://dx.doi.org/10.25046/aj0203141 O. Aydin et al. / Advances in Science, Technology and Engineering Systems Journal Vol. 2, No. 3, 1114-1128 (2017) The first commercial microprocessor was Intel 4004 (4-bit), time and cost elements of the product design, production, which was intended for use for use in a calculator in 1971 [2]. delivery and maintenance activities [5]. System engineers may Today, multi-core processors with high processing power are suggest either a new product on a new product or adding a new required in the design of broadband wired or wireless products or feature to an existing product, based on the feasibility study. Prior high-capacity IP (Internet Protocol) switching devices. These to a detailed system design, the general system-level design needs processors include dedicated coprocessors, special data transfer to be prepared by the system engineers. After performing a paths and data processing units, along with a large number of detailed study of product description, the functional behaviour ARM (Advanced RISC-Reduced Instruction Set Computing- and the basic system architecture are developed. This is the most Machine) and DSP (Digital Signal Processor) processor cores critical step in the design of complex products. The ability to running at gigahertz speeds [3]. In order to meet wide range of meet the additional requirements for the designed system depends the required features, it is necessary to develop high performance on the flexibility and extensibility of the system design. For a software spread across tens of thousands of source files and, system engineer, expertise and skills in all areas described in this composed of millions of lines, which is designed to exploit the paper are required in order to achieve the necessary engineering potential of the available hardware resources [4]. On the other activities. hand, the hardware provides multi-core CPUs capable of performing hundreds of billions of operations per second and 3. Design for Software Platform: Hardware Design very high-speed and high-capacity data transmission interfaces. Hardware design consists of establishing system and/or In addition, for the design of an ICT product, technical expertise subsystem hardware and mechanical infrastructure in order to and dedicated infrastructure is required related to mechanical achieve defined system, software and platform requirements. design, thermal analysis, electromagnetic compatibility, product These requirements are concerned with the platform, mechanical integrity and reliability, product testing and verification. As a dimensions, power consumption and environmental conditions, result, the complex technological structure of ICT products such as high/low temperature, humidity, shock, vibration, entails the use of various advanced engineering skills in the radiation, air pressure, Electromagnetic Compatibility (EMC) and design process. Electromagnetic Interference (EMI). In this article, various technical expertise, infrastructure and In this Section, first PCB design with signal and power processes necessary to design an ICT product will be described. integrity issues will be introduced. After that, the evolution of These technical expertises are related to system design, hardware hardware IC design and developments in manufacturing design, mechanical design and software design, verification and techniques will be explained. Later, SoC IC concept; application production. specific and high capacity ICs with multiple functions and After a brief and formal definition of system design given in interfaces will be pointed out. On the last part, 3D(3 Dimension) Section 2, issues in today’s hardware design is discussed in IC design technique for smaller and less power consuming ICs, details in Section 3. In this section, PCB design, signal and power developments in RF design, EMI/EMC and energy efficiency integrity, recent developments in IC (Integrated Circuit) subjects will be covered. technologies, developments in manufacturing technologies, 3.1. PCBs (Printed Circuit Boards) System on Chip (SoC) technologies, recent developments in RF (Radio Frequency) design and EMC/EMI, and concerns related to The first PCBs were used as early as 1900's. In those years, energy efficiency are considered. In this section, the requirements various materials like Bakelite and Masonite, plain old thin of a specific hardware design in today's technology are wooden pieces were used as PCB materials [6]. These PCB considered as an example. materials were drilled into the holes and the brass wires were Section 4 is concerned with mechanical design and discusses riveting on the material. Over the following years, circuit sizes design considerations in the choice of materials to meet the were reduced with the use of double-sided and multilayer PCBs requirements of the used process. and hot air soldering methods. Section 5 discusses issues in software design. In this section, In the 1980s, surface mount components became the preferred the development steps and troubles from the past to the present option rather than through-hole components. In the 1990s and are given, followed by the related development processes, which 2000s, the complexity of modern circuit boards increased and are formed because