Development and Application of General Circuit Theory to Support Capacitive Coupling
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LECTURE NOTES on Utilization of Electrical Energy & Traction
LECTURE NOTES ON Utilization of Electrical Energy & Traction Name of the course: Diploma in Electrical Engineering. (6th Semester) Notes Prepared by: HIMANSU BHUSAN BEHERA Designation : LECTURER IN ELECTRICAL College : UTKALMANI GOPABANDHU INSTITUTE OF ENGINEERING, ROURKELA CHAPTER-1 ELECTROLYSIS Definition and Basic principle of Electro Deposition. Electro deposition is the process of coating a thin layer of one metal on top of different metal to modify its surface properties. It is done to achieve the desire electrical and corrosion resistance, reduce wear &friction, improve heat tolerance and for decoration. Electroplating Basics Fig-1. Electrochemical Plating Figure- 1, schematically illustrates a simple electrochemical plating system. The ―electro‖ part of the system includes the voltage/current source and the electrodes, anode and cathode, immersed in the ―chemical‖ part of the system, the electrolyte or plating bath, with the circuit being completed by the flow of ions from the plating bath to the electrodes. The metal to be deposited may be the anode and be ionized and go into solution in the electrolyte, or come from the composition of the plating bath. Copper, tin, silver and nickel metal usually comes from anodes, while gold salts are usually added to the plating bath in a controlled process to maintain the composition of the bath. The plating bath generally contains other ions to facilitate current flow between the electrodes. The deposition of metal takes place at the cathode. The overall plating process occurs in the following sequence: 1. Power supply pumps electrons into the cathode. 2. An electron from the cathode transfers to a positively charged metal ion in the solution and the reduced metal plates onto the cathode. -
Design of Contactless Capacitive Power Transfer Systems for Battery Charging Applications
Design of Contactless Capacitive Power Transfer Systems for Battery Charging Applications By DEEPAK ROZARIO A Thesis Submitted in Partial Fulfilment of the Requirements for the Degree of Master of Applied Science in The Faculty of Engineering and Applied Sciences Program UNIVERSITY OF ONTARIO INSTITUTE OF TECHNOLOGY APRIL, 2016 ©DEEPAK ROZARIO, 2016 ABSTRACT Several forms for wireless power transfer exists - Microwave, Laser, Sound, Inductive, Capacitive etc. Among these, the Inductive Power Transfer Systems (IPT) are the most extensively used form of wireless power transfer. Due to the utilization of magnetics the inductive power transfer system suffers from Electromagnetic Interference (EMI) issues. Due to the utilization of magnetic field to transfer power, the system is not preferred in an environment with metals and cannot transfer power through metal barriers. Capacitive Power Transfer System (CPT) is an emerging field in the area of wireless power transfer. The antennae of the CPT system, constitute two metal plates which are separated by a dielectric (air). When energised, the metal plates along with the dielectric resemble a loosely coupled capacitor, hence the term capacitive power transfer. The capacitive system utilizes electric field to transfer power and therefore eliminating electromagnetic interference issues. The system has low standing power losses, good anti-interference ability. The advantages, make the CPT system a dynamic alternative to the traditional wireless inductive system. As the area is still in its infancy, the first part of this thesis is dedicated to an extensive study on the literature available on the CPT systems and the basic operation of the system. From, the study it was evident that CPT systems have efficiencies ranging between 60% to 80%. -
THE ULTIMATE Tesla Coil Design and CONSTRUCTION GUIDE the ULTIMATE Tesla Coil Design and CONSTRUCTION GUIDE
THE ULTIMATE Tesla Coil Design AND CONSTRUCTION GUIDE THE ULTIMATE Tesla Coil Design AND CONSTRUCTION GUIDE Mitch Tilbury New York Chicago San Francisco Lisbon London Madrid Mexico City Milan New Delhi San Juan Seoul Singapore Sydney Toronto Copyright © 2008 by The McGraw-Hill Companies, Inc. All rights reserved. Manufactured in the United States of America. Except as permitted under the United States Copyright Act of 1976, no part of this publication may be reproduced or distributed in any form or by any means, or stored in a database or retrieval system, without the prior written permission of the publisher. 0-07-159589-9 The material in this eBook also appears in the print version of this title: 0-07-149737-4. All trademarks are trademarks of their respective owners. Rather than put a trademark symbol after every occurrence of a trademarked name, we use names in an editorial fashion only, and to the benefit of the trademark owner, with no intention of infringement of the trademark. Where such designations appear in this book, they have been printed with initial caps. McGraw-Hill eBooks are available at special quantity discounts to use as premiums and sales promotions, or for use in corporate training programs. For more information, please contact George Hoare, Special Sales, at [email protected] or (212) 904-4069. TERMS OF USE This is a copyrighted work and The McGraw-Hill Companies, Inc. (“McGraw-Hill”) and its licensors reserve all rights in and to the work. Use of this work is subject to these terms. Except as permitted under the Copyright Act of 1976 and the right to store and retrieve one copy of the work, you may not decompile, disassemble, reverse engineer, reproduce, modify, create derivative works based upon, transmit, distribute, disseminate, sell, publish or sublicense the work or any part of it without McGraw-Hill’s prior consent. -
IEEE/PES Transformers Committee Fall 2017 Meeting Minutes
Transformers Committee Chair: Stephen Antosz Vice Chair: Sue McNelly Secretary: Bruce Forsyth Treasurer: Greg Anderson Awards Chair/Past Chair: Don Platts Standards Coordinator: Jim Graham IEEE/PES Transformers Committee Fall 2017 Meeting Minutes Louisville, KY October 30 – November 2, 2017 Unapproved (These minutes are on the agenda to be approved at the next meeting in Spring 2018) TABLE OF CONTENTS GENERAL ADMINISTRATIVE ITEMS 1.0 Agenda 2.0 Attendance OPENING SESSION – MONDAY OCTOBER 30, 2017 3.0 Approval of Agenda and Previous Minutes – Stephen Antosz 4.0 Chair’s Remarks & Report – Stephen Antosz 5.0 Vice Chair’s Report – Susan McNelly 6.0 Secretary’s Report – Bruce Forsyth 7.0 Treasurer’s Report – Gregory Anderson 8.0 Awards Report – Don Platts 9.0 Administrative SC Meeting Report – Stephen Antosz 10.0 Standards Report – Jim Graham 11.0 Liaison Reports 11.1. CIGRE – Raj Ahuja 11.2. IEC TC14 – Phil Hopkinson 11.3. Standards Coordinating Committee, SCC No. 18 (NFPA/NEC) – David Brender 11.4. Standards Coordinating Committee, SCC No. 4 (Electrical Insulation) – Paulette Payne Powell 12.0 Hot Topics for the Upcoming – Subcommittee Chairs 13.0 Opening Session Adjournment CLOSING SESSION – THURSDAY NOVEMBER 2, 2017 14.0 Chair’s Remarks and Announcements – Stephen Antosz 15.0 Meetings Planning SC Minutes & Report – Gregory Anderson 16.0 Reports from Technical Subcommittees (decisions made during the week) 17.0 Report from Standards Subcommittee (issues from the week) 18.0 New Business 19.0 Closing Session Adjournment APPENDIXES – ADDITIONAL DOCUMENTATION Appendix 1 – Meeting Schedule Appendix 2 – Semi-Annual Standards Report Appendix 3 – IEC TC14 Liaison Report Appendix 4 – CIGRE Report Page 2 of 55 ANNEXES – UNAPPROVED MINUTES OF TECHNICAL SUBCOMMITTEES NOTE: The Annexes included in these minutes are unapproved by the respective subcommittees and are accurate as of the date the Transformers Committee meeting minutes were published. -
Operational Amplifier “Op Amp”
Buffering • You saw that the parallel resistor lowers the voltage • A voltage measurement device with a non-infinite resistance does the same; we would therefore like a way to connect a voltmeter to the touchscreen without loading the system and lowering the voltage • This is easily done using a buffer. A buffer has a high input resistance, but can source the current needed by the load. Energy needed by load from another supply as needed. Input voltage High input reproduced at resistance output • In effect, a buffer (nearly) reproduces the input voltage, but doesn’t load the input • Note that a buffer cannot produce energy, so it draws the energy the load requests from some other power supply 49 Amplifier Integrated Circuits • In an ideal world, an amplifier IC takes an input signal (for example, Vin), and multiplies it by a fixed amount to produce an output signal. Example: Vout = AVVin where AV is the multiplier, called a voltage gain • Of course, the energy for this multiplication has to come from somewhere. Therefore, an amplifier IC has power supply connections as well. 50 Operational Amplifier “Op Amp” • Two input terminals, positive (non- inverting) and negative (inverting) • One output • Power supply V+ , and Op Amp with power supply not shown (which is how we usually display op amp circuits) 51 Equivalent Circuit and Specifications • In other words, a really good buffer, since Ri . All the needed power for the output is drawn from the supply 52 Gain of an Op Amp • Key characteristic of op amp: high voltage gain • Output, A, is -
Power Processing, Part 1. Electric Machinery Analysis
DOCONEIT MORE BD 179 391 SE 029 295,. a 'AUTHOR Hamilton, Howard B. :TITLE Power Processing, Part 1.Electic Machinery Analyiis. ) INSTITUTION Pittsburgh Onii., Pa. SPONS AGENCY National Science Foundation, Washingtcn, PUB DATE 70 GRANT NSF-GY-4138 NOTE 4913.; For related documents, see SE 029 296-298 n EDRS PRICE MF01/PC10 PusiPostage. DESCRIPTORS *College Science; Ciirriculum Develoiment; ElectricityrFlectrOmechanical lechnology: Electronics; *Fagineering.Education; Higher Education;,Instructional'Materials; *Science Courses; Science Curiiculum:.*Science Education; *Science Materials; SCientific Concepts ABSTRACT A This publication was developed as aportion of a two-semester sequence commeicing ateither the sixth cr'seventh term of,the undergraduate program inelectrical engineering at the University of Pittsburgh. The materials of thetwo courses, produced by a ional Science Foundation grant, are concernedwith power convrs systems comprising power electronicdevices, electrouthchanical energy converters, and associated,logic Configurations necessary to cause the system to behave in a prescribed fashion. The emphisis in this portionof the two course sequence (Part 1)is on electric machinery analysis. lechnigues app;icable'to electric machines under dynamicconditions are anallzed. This publication consists of sevenchapters which cW-al with: (1) basic principles: (2) elementary concept of torqueand geherated voltage; (3)tile generalized machine;(4i direct current (7) macrimes; (5) cross field machines;(6),synchronous machines; and polyphase -
Analysis and Modeling of Capacitive Coupling Along Metal Interconnect Lines by Andrew K
Analysis and Modeling of Capacitive Coupling Along Metal Interconnect Lines by Andrew K. Percey Submitted to the Department of Electrical Engineering and Computer Science in partial fulfillment of the requirements for the degrees of Bachelor of Science in Electrical Science and Engineering and Master of Engineering in Electrical Engineering and Computer Science at the MASSACHUSETTS INSTITUTE OF TECHNOLOGY June 1996 @ Andrew K. Percey, MCMXCVI. All rights reserved. The author hereby grants to MIT permission to reproduce and distribute publicly paper and electronic copies of this thesis document in whole or in part, and to grant others the right to do so. MASSACH'USETTS NSTi'U L' OF TECHNOLOGY JUN 1 1996 Author............ LIBRARIES Department of Electrical Engineering andCo mputer Science Eng. May 28, 1996 Certified by .......... ........ ...... Jacob White Professor of Electrical Engineering ",sis Supervisor A ccepted ',, ....I........... .. ............... ............. F. R. Morgenthaler Chairman, Departme Committee on Graduate Theses Analysis and Modeling of Capacitive Coupling Along Metal Interconnect Lines by Andrew K. Percey Submitted to the Department of Electrical Engineering and Computer Science on May 28, 1996, in partial fulfillment of the requirements for the degrees of Bachelor of Science in Electrical Science and Engineering and Master of Engineering in Electrical Engineering and Computer Science Abstract Electrical signals propagating along metal interconnect lines within contemporary microchips experience significant delay and noise due to capacitive coupling effects. Analysis and modeling of these effects was performed at the author's VI-A Internship company. Numerous CAD circuit simulations were performed to acquire a better understanding of these coupling effects. A program was created to assist circuit designers in analyzing these effects for their particular circuit topologies. -
Noise Coupling Models in Heterogeneous 3-D Ics Boris Vaisband, Student Member, IEEE, and Eby G
2778 IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, VOL. 24, NO. 8, AUGUST 2016 Noise Coupling Models in Heterogeneous 3-D ICs Boris Vaisband, Student Member, IEEE, and Eby G. Friedman, Fellow, IEEE Abstract— Models of coupling noise from an aggressor module to a victim module by way of through silicon vias (TSVs) within heterogeneous 3-D integrated circuits (ICs) are presented in this paper. Existing TSV models are enhanced for different substrate materials within heterogeneous 3-D ICs. Each model is adapted to each substrate material according to the local noise coupling characteristics. The 3-D noise coupling system is evaluated for isolation efficiency over frequencies of up to 100 GHz. Isolation improvement techniques, such as reducing the ground network inductance and increasing the distance between the aggressor and victim modules, are quantified in terms of noise improvements. A maximum improvement of 73.5 dB for different ground network impedances and a difference of 38.5 dB in isolation efficiency for greater separation between the aggressor and victim modules are demonstrated. Compact, accurate, and computationally efficient models are extracted from the transfer function for each of the heterogeneous substrate materials. The reduced transfer functions are used to explore different manufacturing and design parameters to evaluate coupling noise across multiple 3-D planes. Index Terms— 3-D integrated circuit (IC), heterogeneous 3-D system, noise coupling, substrate coupling, through silicon via (TSV) noise coupling model. Fig. 1. Heterogeneous 3-D IC. I. INTRODUCTION OISE coupling is of increasing importance within the TABLE I integrated circuits (ICs) community [1]–[6]. -
AN-937 Designing Amplifier Circuits
AN-937 APPLICATION NOTE One Technology Way • P. O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Designing Amplifier Circuits: How to Avoid Common Problems by Charles Kitchin INTRODUCTION down toward the negative supply. The bias voltage is amplified When compared to assemblies of discrete semiconductors, by the closed-loop dc gain of the amplifier. modern operational amplifiers (op amps) and instrumenta- This process can be lengthy. For example, an amplifier with a tion amplifiers (in-amps) provide great benefits to designers. field effect transistor (FET) input, having a 1 pA bias current, Although there are many published articles on circuit coupled via a 0.1-μF capacitor, has an IC charging rate, I/C, of applications, all too often, in the haste to assemble a circuit, 10–12/10–7 = 10 μV per sec basic issues are overlooked leading to a circuit that does not function as expected. This application note discusses the most or 600 μV per minute. If the gain is 100, the output drifts at common design problems and offers practical solutions. 0.06 V per minute. Therefore, a casual lab test, using an ac- coupled scope, may not detect this problem, and the circuit MISSING DC BIAS CURRENT RETURN PATH may not fail until hours later. It is important to avoid this One of the most common application problems encountered is problem altogether. the failure to provide a dc return path for bias current in ac- +VS coupled op amp or in-amp circuits. -
Harmonic Distortion in Renewable Energy Systems: Capacitive Couplings
11 Harmonic Distortion in Renewable Energy Systems: Capacitive Couplings Miguel García-Gracia, Nabil El Halabi, Adrián Alonso and M.Paz Comech CIRCE (Centre of Research for Energy Resources and Consumption) University of Zaragoza Spain 1. Introduction Renewable energy systems such as wind farms and solar photovoltaic (PV) installations are being considered as a promising generation sources to cover the continuous augment demand of energy. With the incoming high penetration of distributed generation (DG), both electric utilities and end users of electric power are becoming increasingly concerned about the quality of electric network (Dugan et al., 2002). This latter issue is an umbrella concept for a multitude of individual types of power system disturbances. A particular issue that falls under this umbrella is the capacitive coupling with grounding systems, which become significant because of the high-frequency current imposed by power converters. The major reasons for being concerned about capacitive couplings are: a. Increase the harmonics and, thus, power (converters) losses in both utility and customer equipment. b. Ground capacitive currents may cause malfunctioning of sensitive load and control devices. c. The circulation of capacitive currents through power equipments can provoke a reduction of their lifetime and limits the power capability. d. Ground potential rise due to capacitive ground currents can represent unsafe conditions for working along the installation or electric network. e. Electromagnetic interference in communication systems and metering infrastructure. For these reasons, it has been noticed the importance of modelling renewable energy installations considering capacitive coupling with the grounding system and thereby accurately simulate the DC and AC components of the current waveform measured in the electric network. -
Chapter 11 Noise and Noise Rejection
CHAPTER 11 NOISE AND NOISE REJECTION INTRODUCTION In general, noise is any unsteady component of a signal which causes the instantaneous value to differ from the true value. (Finite response time effects, leading to dynamic error, are part of an instrument's response characteristics and are not considered to be noise.) In electrical signals, noise often appears as a highly erratic component superimposed on the desired signal. If the noise signal amplitude is generally lower than the desired signal amplitude, then the signal may look like the signal shown in Figure 1. Figure 1: Sinusoidal Signal with Noise. Noise is often random in nature and thus it is described in terms of its average behavior (see the last section of Chapter 8). In particular we describe a random signal in terms of its power spectral density, (x (f )) , which shows how the average signal power is distributed over a range of frequencies, or in terms of its average power, or mean square value. Since we assume the average signal power to be the power dissipated when the signal voltage is connected across a 1 Ω resistor, the numerical values of signal power and signal mean square value are equal, only the units differ. To determine the signal power we can use either the time history or the power spectral density (Parseval's Theorem). Let the signal be x(t), then the average signal power or mean square voltage is: T t 2 221 x(t) x(t)dtx (f)df (1) T T t 0 2 11-2 Note: the bar notation, , denotes a time average taken over many oscillations of the signal. -
2. Capacitors Contents
2. Capacitors Contents 1 Capacitor 1 1.1 History ................................................. 2 1.2 Theory of operation .......................................... 2 1.2.1 Overview ........................................... 3 1.2.2 Hydraulic analogy ....................................... 3 1.2.3 Energy of electric field .................................... 4 1.2.4 Current–voltage relation ................................... 4 1.2.5 DC circuits .......................................... 4 1.2.6 AC circuits .......................................... 5 1.2.7 Laplace circuit analysis (s-domain) .............................. 5 1.2.8 Parallel-plate model ...................................... 5 1.2.9 Networks ........................................... 6 1.3 Non-ideal behavior .......................................... 7 1.3.1 Breakdown voltage ...................................... 7 1.3.2 Equivalent circuit ....................................... 7 1.3.3 Q factor ............................................ 8 1.3.4 Ripple current ......................................... 8 1.3.5 Capacitance instability .................................... 8 1.3.6 Current and voltage reversal ................................. 9 1.3.7 Dielectric absorption ..................................... 9 1.3.8 Leakage ............................................ 9 1.3.9 Electrolytic failure from disuse ................................ 9 1.4 Capacitor types ............................................ 9 1.4.1 Dielectric materials .....................................