AN-937 Designing Amplifier Circuits
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Run Capacitor Info-98582
Run Cap Quiz-98582_Layout 1 4/16/15 10:26 AM Page 1 ® Run Capacitor Info WHAT IS A CAPACITOR? Very simply, a capacitor is a device that stores and discharges electrons. While you may hear capacitors referred to by a variety of names (condenser, run, start, oil, etc.) all capacitors are comprised of two or more metallic plates separated by an insulating material called a dielectric. PLATE 1 PLATE 2 A very simple capacitor can be made with two plates separated by a dielectric, in this PLATE 1 PLATE 2 case air, and connected to a source of DC current, a battery. Electrons will flow away from plate 1 and collect on plate 2, leaving it with an abundance of electrons, or a “charge”. Since current from a battery only flows one way, the capacitor plate will stay BATTERY + – charged this way unless something causes current flow. If we were to short across the plates with a screwdriver, the resulting spark would indicate the electrons “jumping” from plate 2 to plate 1 in an attempt to equalize. As soon as the screwdriver is removed, plate 2 will again collect a PLATE 1 PLATE 2 charge. + BATTERY – Now let’s connect our simple capacitor to a source of AC current and in series with the windings of an electric motor. Since AC current alternates, first one PLATE 1 PLATE 2 MOTOR plate, then the other would be charged and discharged in turn. First plate 1 is charged, then as the current reverses, a rush of electrons flow from plate 1 to plate 2 through the motor windings. -
Chapter 7: AC Transistor Amplifiers
Chapter 7: Transistors, part 2 Chapter 7: AC Transistor Amplifiers The transistor amplifiers that we studied in the last chapter have some serious problems for use in AC signals. Their most serious shortcoming is that there is a “dead region” where small signals do not turn on the transistor. So, if your signal is smaller than 0.6 V, or if it is negative, the transistor does not conduct and the amplifier does not work. Design goals for an AC amplifier Before moving on to making a better AC amplifier, let’s define some useful terms. We define the output range to be the range of possible output voltages. We refer to the maximum and minimum output voltages as the rail voltages and the output swing is the difference between the rail voltages. The input range is the range of input voltages that produce outputs which are not at either rail voltage. Our goal in designing an AC amplifier is to get an input range and output range which is symmetric around zero and ensure that there is not a dead region. To do this we need make sure that the transistor is in conduction for all of our input range. How does this work? We do it by adding an offset voltage to the input to make sure the voltage presented to the transistor’s base with no input signal, the resting or quiescent voltage , is well above ground. In lab 6, the function generator provided the offset, in this chapter we will show how to design an amplifier which provides its own offset. -
Switched-Capacitor Circuits
Switched-Capacitor Circuits David Johns and Ken Martin University of Toronto ([email protected]) ([email protected]) University of Toronto 1 of 60 © D. Johns, K. Martin, 1997 Basic Building Blocks Opamps • Ideal opamps usually assumed. • Important non-idealities — dc gain: sets the accuracy of charge transfer, hence, transfer-function accuracy. — unity-gain freq, phase margin & slew-rate: sets the max clocking frequency. A general rule is that unity-gain freq should be 5 times (or more) higher than the clock-freq. — dc offset: Can create dc offset at output. Circuit techniques to combat this which also reduce 1/f noise. University of Toronto 2 of 60 © D. Johns, K. Martin, 1997 Basic Building Blocks Double-Poly Capacitors metal C1 metal poly1 Cp1 thin oxide bottom plate C1 poly2 Cp2 thick oxide C p1 Cp2 (substrate - ac ground) cross-section view equivalent circuit • Substantial parasitics with large bottom plate capacitance (20 percent of C1) • Also, metal-metal capacitors are used but have even larger parasitic capacitances. University of Toronto 3 of 60 © D. Johns, K. Martin, 1997 Basic Building Blocks Switches I I Symbol n-channel v1 v2 v1 v2 I transmission I I gate v1 v p-channel v 2 1 v2 I • Mosfet switches are good switches. — off-resistance near G: range — on-resistance in 100: to 5k: range (depends on transistor sizing) • However, have non-linear parasitic capacitances. University of Toronto 4 of 60 © D. Johns, K. Martin, 1997 Basic Building Blocks Non-Overlapping Clocks I1 T Von I I1 Voff n – 2 n – 1 n n + 1 tTe delay 1 I fs { --- delay V 2 T on I Voff 2 n – 32e n – 12e n + 12e tTe • Non-overlapping clocks — both clocks are never on at same time • Needed to ensure charge is not inadvertently lost. -
Power Electronics
Diodes and Transistors Semiconductors • Semiconductor devices are made of alternating layers of positively doped material (P) and negatively doped material (N). • Diodes are PN or NP, BJTs are PNP or NPN, IGBTs are PNPN. Other devices are more complex Diodes • A diode is a device which allows flow in one direction but not the other. • When conducting, the diodes create a voltage drop, kind of acting like a resistor • There are three main types of power diodes – Power Diode – Fast recovery diode – Schottky Diodes Power Diodes • Max properties: 1500V, 400A, 1kHz • Forward voltage drop of 0.7 V when on Diode circuit voltage measurements: (a) Forward biased. (b) Reverse biased. Fast Recovery Diodes • Max properties: similar to regular power diodes but recover time as low as 50ns • The following is a graph of a diode’s recovery time. trr is shorter for fast recovery diodes Schottky Diodes • Max properties: 400V, 400A • Very fast recovery time • Lower voltage drop when conducting than regular diodes • Ideal for high current low voltage applications Current vs Voltage Characteristics • All diodes have two main weaknesses – Leakage current when the diode is off. This is power loss – Voltage drop when the diode is conducting. This is directly converted to heat, i.e. power loss • Other problems to watch for: – Notice the reverse current in the recovery time graph. This can be limited through certain circuits. Ways Around Maximum Properties • To overcome maximum voltage, we can use the diodes in series. Here is a voltage sharing circuit • To overcome maximum current, we can use the diodes in parallel. -
Kirchhoff's Laws in Dynamic Circuits
Kirchhoff’s Laws in Dynamic Circuits Dynamic circuits are circuits that contain capacitors and inductors. Later we will learn to analyze some dynamic circuits by writing and solving differential equations. In these notes, we consider some simpler examples that can be solved using only Kirchhoff’s laws and the element equations of the capacitor and the inductor. Example 1: Consider this circuit Additionally, we are given the following representations of the voltage source voltage and one of the resistor voltages: ⎧⎧10 V fortt<< 0 2 V for 0 vvs ==⎨⎨and 1 −5t ⎩⎩20 V forte>+ 0 8 4 V fort> 0 We wish to express the capacitor current, i 2 , as a function of time, t. Plan: First, apply Kirchhoff’s voltage law (KVL) to the loop consisting of the source, resistor R1 and the capacitor to determine the capacitor voltage, v 2 , as a function of time, t. Next, use the element equation of the capacitor to determine the capacitor current as a function of time, t. Solution: Apply Kirchhoff’s voltage law (KVL) to the loop consisting of the source, resistor R1 and the capacitor to write ⎧ 8 V fort < 0 vvv12+−=ss0 ⇒ v2 =−= vv 1⎨ −5t ⎩16− 8et V for> 0 Use the element equation of the capacitor to write ⎧ 0 A fort < 0 dv22 dv ⎪ ⎧ 0 A fort < 0 iC2 ==0.025 =⎨⎨d −5t =−5t dt dt ⎪0.025() 16−> 8et for 0 ⎩1et A for> 0 ⎩ dt 1 Example 2: Consider this circuit where the resistor currents are given by ⎧⎧0.8 A fortt<< 0 0 A for 0 ii13==⎨⎨−−22ttand ⎩⎩0.8et−> 0.8 A for 0 −0.8 e A fort> 0 Express the inductor voltage, v 2 , as a function of time, t. -
Capacitive Voltage Transformers: Transient Overreach Concerns and Solutions for Distance Relaying
Capacitive Voltage Transformers: Transient Overreach Concerns and Solutions for Distance Relaying Daqing Hou and Jeff Roberts Schweitzer Engineering Laboratories, Inc. Revised edition released October 2010 Previously presented at the 1996 Canadian Conference on Electrical and Computer Engineering, May 1996, 50th Annual Georgia Tech Protective Relaying Conference, May 1996, and 49th Annual Conference for Protective Relay Engineers, April 1996 Previous revised edition released July 2000 Originally presented at the 22nd Annual Western Protective Relay Conference, October 1995 CAPACITIVE VOLTAGE TRANSFORMERS: TRANSIENT OVERREACH CONCERNS AND SOLUTIONS FOR DISTANCE RELAYING Daqing Hou and Jeff Roberts Schweitzer Engineering Laboratories, Inc. Pullman, W A USA ABSTRACT Capacitive Voltage Transformers (CVTs) are common in high-voltage transmission line applications. These same applications require fast, yet secure protection. However, as the requirement for faster protective relays grows, so does the concern over the poor transient response of some CVTs for certain system conditions. Solid-state and microprocessor relays can respond to a CVT transient due to their high operating speed and iflCreased sensitivity .This paper discusses CVT models whose purpose is to identify which major CVT components contribute to the CVT transient. Some surprises include a recom- mendation for CVT burden and the type offerroresonant-suppression circuit that gives the least CVT transient. This paper also reviews how the System Impedance Ratio (SIR) affects the CVT transient response. The higher the SIR, the worse the CVT transient for a given CVT . Finally, this paper discusses improvements in relaying logic. The new method of detecting CVT transients is more precise than past detection methods and does not penalize distance protection speed for close-in faults. -
Modeling of Crosstalk in High Speed Planar Structure Parallel Data Buses and Suppression by Uniformly Spaced Short Circuits Gabriel A
Florida International University FIU Digital Commons FIU Electronic Theses and Dissertations University Graduate School 3-29-2012 Modeling of Crosstalk in High Speed Planar Structure Parallel Data Buses and Suppression by Uniformly Spaced Short Circuits Gabriel A. Solana Florida International University, [email protected] DOI: 10.25148/etd.FI12050215 Follow this and additional works at: https://digitalcommons.fiu.edu/etd Recommended Citation Solana, Gabriel A., "Modeling of Crosstalk in High Speed Planar Structure Parallel Data Buses and Suppression by Uniformly Spaced Short Circuits" (2012). FIU Electronic Theses and Dissertations. 606. https://digitalcommons.fiu.edu/etd/606 This work is brought to you for free and open access by the University Graduate School at FIU Digital Commons. It has been accepted for inclusion in FIU Electronic Theses and Dissertations by an authorized administrator of FIU Digital Commons. For more information, please contact [email protected]. FLORIDA INTERNATIONAL UNIVERSITY Miami, Florida MODELING OF CROSSTALK IN HIGH SPEED PLANAR STRUCTURE PARALLEL DATA BUSES AND SUPPRESSION BY UNIFORMLY SPACED SHORT CIRCUITS A thesis submitted in partial fulfillment of the requirements for the degree of MASTER OF SCIENCE in ELECTRICAL ENGINEERING by Gabriel Alejandro Solana 2012 To: Dean Amir Mirmiran College of Engineering and Computing This thesis, written by Gabriel Alejandro Solana, and entitled, Modeling of Crosstalk in High Speed Planar Structure Parallel Data Buses and Suppression by Uniformly Spaced Short Circuits, having been approved in respect to style and intellectual content, is referred to you for judgment. We have read this thesis and recommend that it be approved. _____________________________________________________ Stavros V. Georgakopoulos _____________________________________________________ Jean H. -
Notes for Lab 1 (Bipolar (Junction) Transistor Lab)
ECE 327: Electronic Devices and Circuits Laboratory I Notes for Lab 1 (Bipolar (Junction) Transistor Lab) 1. Introduce bipolar junction transistors • “Transistor man” (from The Art of Electronics (2nd edition) by Horowitz and Hill) – Transistors are not “switches” – Base–emitter diode current sets collector–emitter resistance – Transistors are “dynamic resistors” (i.e., “transfer resistor”) – Act like closed switch in “saturation” mode – Act like open switch in “cutoff” mode – Act like current amplifier in “active” mode • Active-mode BJT model – Collector resistance is dynamically set so that collector current is β times base current – β is assumed to be very high (β ≈ 100–200 in this laboratory) – Under most conditions, base current is negligible, so collector and emitter current are equal – β ≈ hfe ≈ hFE – Good designs only depend on β being large – The active-mode model: ∗ Assumptions: · Must have vEC > 0.2 V (otherwise, in saturation) · Must have very low input impedance compared to βRE ∗ Consequences: · iB ≈ 0 · vE = vB ± 0.7 V · iC ≈ iE – Typically, use base and emitter voltages to find emitter current. Finish analysis by setting collector current equal to emitter current. • Symbols – Arrow represents base–emitter diode (i.e., emitter always has arrow) – npn transistor: Base–emitter diode is “not pointing in” – pnp transistor: Emitter–base diode “points in proudly” – See part pin-outs for easy wiring key • “Common” configurations: hold one terminal constant, vary a second, and use the third as output – common-collector ties collector -
Capacitors Demystified: Practical Information on Capacitor Usage in EE133
EE133–Winter 2004 Capacitors Demystified Capacitors Demystified: Practical information on capacitor usage in EE133 Why do I need to read this? Despite all we know about capacitors from previous exposure (including everyone’s favorite capacitor fact – ‘Well, I know the voltage across a capacitor cannot change instantaneously!’), there is a quite a bit about the (good) properties and (bad) non- idealities of these devices that effects the way they are actually used in RF circuits. So, with the practical predisposition of EE133, let’s take another look at our old friend… The Starting Line-up Like fine cheeses or candy bars, capacitors come in wide variety of sizes, shapes, and prices- and they can be made from a host of different materials (except for nougat). However, all of these characteristics are interrelated because, in classic Murphy fashion, a capacitor that ranks well in one or two of these properties is usually terrible in the other categories. The physical size and shape are only of marginal importance to us since the former is pretty much irrelevant at the size of our solder board and the latter is only for aesthetics (which is a foreign term to EE’s anyway). But, the composite material is an important factor in determining the behavior of the capacitor, so for the purpose of this class we will identify four major types (Refer to page 21 of “The Art of Electronics” by Horowitz & Hill for a more complete listing of capacitor families): Material/Comments Picture Ceramics (10 pF – 22µF): Inexpensive, but not good at high frequencies Tantalum (0.1µF – 500µF): Polarized, low inductance Electrolytic (0.1µF – 75µF): Polarized, not good at high frequencies (NOTE: longer lead is usually the positive terminal) Silver Mica (1 pF – 4.7 nF): Expensive with only small capacitive values, but great for RF 1 EE133–Winter 2004 Capacitors Demystified Some Commonly Asked Questions about Capacitors Resistors are color-coded. -
ECE 255, MOSFET Basic Configurations
ECE 255, MOSFET Basic Configurations 8 March 2018 In this lecture, we will go back to Section 7.3, and the basic configurations of MOSFET amplifiers will be studied similar to that of BJT. Previously, it has been shown that with the transistor DC biased at the appropriate point (Q point or operating point), linear relations can be derived between the small voltage signal and current signal. We will continue this analysis with MOSFETs, starting with the common-source amplifier. 1 Common-Source (CS) Amplifier The common-source (CS) amplifier for MOSFET is the analogue of the common- emitter amplifier for BJT. Its popularity arises from its high gain, and that by cascading a number of them, larger amplification of the signal can be achieved. 1.1 Chararacteristic Parameters of the CS Amplifier Figure 1(a) shows the small-signal model for the common-source amplifier. Here, RD is considered part of the amplifier and is the resistance that one measures between the drain and the ground. The small-signal model can be replaced by its hybrid-π model as shown in Figure 1(b). Then the current induced in the output port is i = −gmvgs as indicated by the current source. Thus vo = −gmvgsRD (1.1) By inspection, one sees that Rin = 1; vi = vsig; vgs = vi (1.2) Thus the open-circuit voltage gain is vo Avo = = −gmRD (1.3) vi Printed on March 14, 2018 at 10 : 48: W.C. Chew and S.K. Gupta. 1 One can replace a linear circuit driven by a source by its Th´evenin equivalence. -
6 Insulated-Gate Field-Effect Transistors
Chapter 6 INSULATED-GATE FIELD-EFFECT TRANSISTORS Contents 6.1 Introduction ......................................301 6.2 Depletion-type IGFETs ...............................302 6.3 Enhancement-type IGFETs – PENDING .....................311 6.4 Active-mode operation – PENDING .......................311 6.5 The common-source amplifier – PENDING ...................312 6.6 The common-drain amplifier – PENDING ....................312 6.7 The common-gate amplifier – PENDING ....................312 6.8 Biasing techniques – PENDING ..........................312 6.9 Transistor ratings and packages – PENDING .................312 6.10 IGFET quirks – PENDING .............................313 6.11 MESFETs – PENDING ................................313 6.12 IGBTs ..........................................313 *** INCOMPLETE *** 6.1 Introduction As was stated in the last chapter, there is more than one type of field-effect transistor. The junction field-effect transistor, or JFET, uses voltage applied across a reverse-biased PN junc- tion to control the width of that junction’s depletion region, which then controls the conduc- tivity of a semiconductor channel through which the controlled current moves. Another type of field-effect device – the insulated gate field-effect transistor, or IGFET – exploits a similar principle of a depletion region controlling conductivity through a semiconductor channel, but it differs primarily from the JFET in that there is no direct connection between the gate lead 301 302 CHAPTER 6. INSULATED-GATE FIELD-EFFECT TRANSISTORS and the semiconductor material itself. Rather, the gate lead is insulated from the transistor body by a thin barrier, hence the term insulated gate. This insulating barrier acts like the di- electric layer of a capacitor, and allows gate-to-source voltage to influence the depletion region electrostatically rather than by direct connection. In addition to a choice of N-channel versus P-channel design, IGFETs come in two major types: enhancement and depletion. -
Coupling for Power Line Communication: a Survey Luis Guilherme Da S
JOURNAL OF COMMUNICATION AND INFORMATION SYSTEMS, VOL. 32, NO. 1, 2017. 8 Coupling for Power Line Communication: A Survey Luis Guilherme da S. Costa, Antonio Carlos M. de Queiroz, Bamidele Adebisi, Vinicius L. R. da Costa, and Moises V. Ribeiro Abstract—The advent of power line communication (PLC) electric power cables. These power cables could be alternating for smart grids, vehicular communications, internet of things current (AC) or direct current (DC) power lines and the signals and data network access has recently gained ample interest in of PLC transceivers are subsequently coupled to them via a industry and academia. Due to the characteristics of electric power grids and regulatory constraints, the effectiveness of coupling circuit. In the case of power lines used to transmit coupling between the power line and PLC transceivers has AC power, the coupling circuit has also to filter out the AC become a very important issue. Coupling devices used to inject or mains signal. On the other hand, the coupling circuit simply extract data communication signals into or from power lines are has to block the DC mains voltage of the DC electric power very important components of a PLC system. There is, however, grids. an obvious gap in the literature for a detailed review of existing PLC couplers. In this paper, we present a comprehensive review During the late 1970s and early 1980s, new investigations of couplers, which are required for narrowband and broadband to characterize electric power grids as a medium for data PLC transceivers. Prevailing issues that protract the design of communication showed a higher potential in the range of couplers and consequently subtended the inventions of different frequencies between 5 kHz and 500 kHz [2].