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Intel Xeon Processor 7200 Series and 7300 Series and Dual-Core Intel® Xeon® Processor 7200 Series

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Intel Xeon Processor 7200 Series and 7300 Series and Dual-Core Intel® Xeon® Processor 7200 Series Intel® Xeon® Processor 7200 Series and 7300 Series Datasheet September 2008 Notice: The Intel® Xeon® Processor 7200 Series and 7300 Series may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Document Number: 318080-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Xeon® Processor 7200 Series and 7300 Series may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-548-4725 or by visiting Intel's website at http://www.intel.com. Intel, Pentium, Intel Xeon, Intel SpeedStep, Intel Core, and Intel Virtualization Technology, are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Intel® 64 requires a computer system with a processor, chipset, BIOS, OS, device drivers and applications enabled for Intel® 64. Processor will not operate (including 32-bit operation) without an Intel® 64-enabled BIOS. Performance will vary depending on your hardware and software configurations. Intel® 64-enabled OS, BIOS, device drivers and applications may not be available. Check with your vendor for more information. * Other names and brands may be claimed as the property of others. Copyright © 2006 - 2008, Intel Corporation 2 Document Number: 318080-002 Contents 1Introduction..............................................................................................................9 1.1 Terminology ..................................................................................................... 11 1.2 State of Data .................................................................................................... 13 1.3 References ....................................................................................................... 13 2 Electrical Specifications ........................................................................................... 15 2.1 Front Side Bus and GTLREF ................................................................................ 15 2.2 Decoupling Guidelines........................................................................................ 15 2.2.1 VCC Decoupling...................................................................................... 16 2.2.2 VTT Decoupling ...................................................................................... 16 2.2.3 Front Side Bus AGTL+ Decoupling ............................................................ 16 2.3 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 16 2.3.1 Front Side Bus Frequency Select Signals (BSEL[2:0]).................................. 17 2.3.2 PLL Power Supply................................................................................... 17 2.4 Voltage Identification (VID) ................................................................................ 17 2.5 Reserved, Unused, or Test Signals....................................................................... 20 2.6 Front Side Bus Signal Groups.............................................................................. 20 2.7 CMOS Asynchronous and Open Drain Asynchronous Signals .................................... 22 2.8 Test Access Port (TAP) Connection....................................................................... 22 2.9 Mixing Processors.............................................................................................. 23 2.10 Absolute Maximum and Minimum Ratings ............................................................. 23 2.11 Processor DC Specifications ................................................................................ 24 2.11.1 Flexible Motherboard Guidelines (FMB) ...................................................... 25 2.11.2 Platform Environmental Control Interface (PECI) DC Specifications................ 35 2.11.3 VCC Overshoot Specification .................................................................... 37 2.11.4 AGTL+ FSB Specifications........................................................................ 38 2.12 Front Side Bus AC Specifications ......................................................................... 40 2.13 Processor AC Timing Waveforms ......................................................................... 45 3 Mechanical Specifications ........................................................................................ 57 3.1 Package Mechanical Drawing............................................................................... 57 3.2 Processor Component Keepout Zones................................................................... 60 3.3 Package Loading Specifications ........................................................................... 66 3.4 Package Handling Guidelines............................................................................... 67 3.5 Package Insertion Specifications.......................................................................... 67 3.6 Processor Mass Specifications ............................................................................. 67 3.7 Processor Materials............................................................................................ 67 3.8 Processor Markings............................................................................................ 68 3.9 Processor Pin-Out Coordinates ............................................................................ 69 4 Pin Listing ............................................................................................................... 71 4.1 Pin Assignments................................................................................................ 71 4.1.1 Pin Listing by Pin Name........................................................................... 71 4.1.2 Pin Listing by Pin Number........................................................................ 79 5 Signal Definitions .................................................................................................... 87 5.1 Signal Definitions. ............................................................................................. 87 6 Thermal Specifications ............................................................................................ 95 6.1 Package Thermal Specifications........................................................................... 95 6.1.1 Thermal Specifications ............................................................................ 95 6.1.2 Thermal Metrology ............................................................................... 102 6.2 Processor Thermal Features.............................................................................. 103 6.2.1 Thermal Monitor Features...................................................................... 103 6.2.2 Thermal Monitor................................................................................... 103 Document Number: 318080-002 3 6.2.3 Thermal Monitor 2 ................................................................................ 104 6.2.4 On-Demand Mode................................................................................. 105 6.2.5 PROCHOT# Signal ................................................................................ 106 6.2.6 FORCEPR# Signal ................................................................................. 106 6.2.7 THERMTRIP# Signal .............................................................................. 106 6.3 Platform Environment Control Interface (PECI) .................................................... 107 6.3.1 Introduction......................................................................................... 107 6.3.2 PECI Specifications ............................................................................... 108 7Features................................................................................................................ 111 7.1 Power-On Configuration Options ........................................................................ 111 7.2 Clock Control and Low Power States..................................................................
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