Thyristor Triggering and Protection of Diodes and Thyristors
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UCC27531 35-V Gate Driver for Sic MOSFET Applications (Rev. A)
(1) Application Report SLUA770A–March 2016–Revised May 2018 UCC27531 35-V Gate Driver for SiC MOSFET Applications Richard Herring........................................................................................... High Power Driver Solutions ABSTRACT SiC MOSFETs are gaining popularity in many high-power applications due to their significant switching performance advantages. SiC MOSFETs are also available with attractive voltage ratings and current capabilities. However, the characteristics of SiC MOSFETs require consideration of the gate-driver circuit to optimize the switching performance of the SiC device. Although SiC MOSFETs are not difficult to drive properly, many typical MOSFET drivers may result in compromised switching speed performance. The UCC27531 gate driver includes features and has operating parameters that allow for driving SiC power MOSFETs within the recommended optimum drive configuration. This application note reviews the characteristics of SiC MOSFETs and how to drive them to achieve the performance improvement that SiC can bring at the system level. The features of UCC27531 to achieve optimal performance of SiC are explained and results from a demonstration circuit are provided. 1 Introduction In the past, the majority of applications such as uninterruptible power supplies (UPS), photovoltaic (PV) inverters, and motor drive have utilized IGBTs for the power devices due to the combination of high- voltage ratings exceeding 1 kV and high current capability. Usable switching frequency of IGBTs has typically been limited to 20–30 kHz, due to the high turnoff losses caused by the long turnoff current tail. Design comparisons have shown that SiC MOSFET designs can operate at considerably higher switching frequency and achieve the same or better efficiency. Although the device cost of the SiC MOSFETs are higher than the equivalent IGBTs, the significant savings in transformer, capacitor, and enclosure size results in a lower system cost. -
Egan® Ics for Low Voltage DC-DC Applications Egan® Ics for Low Voltage DC-DC Applications EFFICIENT POWER CONVERSION
APPLICATION NOTE: AN025 eGaN® ICs for Low Voltage DC-DC Applications eGaN® ICs for Low Voltage DC-DC Applications EFFICIENT POWER CONVERSION Michael de Rooij, Ph.D., Vice President of Applications Engineering , Yuanzhe Zhang, Ph.D., Director of Applications Engineering eGaN® FETs from EPC have repeatedly demonstrated higher performance over Monolithic integration of the gate driver to the MOSFET counterparts in many applications [1]. The lateral structure and material FET offers the lowest possible common source properties of eGaN FETs make it possible to monolithically integrate a number of FETs inductance (CSI) as it is moved to within the as demonstrated by products such as the EPC2107 [2]. The next phase in the eGaN IC structure. Furthermore the gate driver has been optimized for the FET being driven to offer FET and IC evolution includes gate driver integration. Integrating the gate driver with maximum performance under any operating the FET offers a number of additional advantages over discrete gate driver and FET condition. These benefits are on top of the well- solutions such as extremely low common source inductance, matched gate driver established low capacitance and inductance, and to FET, and ease of design. All the traditional eGaN FET benefits such as significantly zero reverse recovery charge (QRR) that enable lower capacitance and inductance with zero reverse recovery charge (QRR) in a smaller efficient operation at high switching frequencies even under hard switching conditions. The key footprint for a given on-resistance (RDS(on)) than comparable MOSFETs are retained. However, the combined effect of the new characteristics and benefits ensures an ever characteristics of the EPC2112 are given in table 1. -
Resonant Gate-Drive Circuits for High-Frequency Power Converters
Resonant Gate-Drive Circuits for High-Frequency Power Converters A dissertation submitted in partial fulfillment of the requirements for the degree of Doctor of Philosophy By Hur Jedi B. S., University of Baghdad, Baghdad, Iraq, 2003 M. S., University Putra Malaysia, Selangor, Malaysia, 2010 2018 Wright State University WRIGHT STATE UNIVERSITY GRADUATE SCHOOL November 16, 2018 I HEREBY RECOMMEND THAT THE DISSERTATION PREPARED UNDER MY SUPERVISION BY Hur Jedi ENTITLED Resonant Gate-Drive Circuits for High-Frequency Power Converters BE ACCEPTED IN PARTIAL FULFILLMENT OF THE REQUIREMENTS FOR THE DEGREE OF Doctor of Philosophy. Marian K. Kazimierczuk, Ph.D. Dissertation Director Arnab Shaw, Ph.D. Director, Electrical Engineering Ph.D. Program Barry Milligan, Ph.D. Interim Dean of the Graduate School Committee on Final Examination Marian K. Kazimierczuk, Ph.D. Ray Siferd, Ph.D. Henry Chen, Ph.D. Saiyu Ren, Ph.D. Yan Zhuang, Ph.D. Abstract Jedi, Hur. Ph.D., Electrical Engineering Ph.D. Program, Department of Electrical Engineering, Wright State University, 2018. Resonant Gate-Drive Circuits for High- Frequency Power Converters. The development trend of power converters motivates the pursuit with high den- sity, high efficiency, and low cost. Increasing the frequency can improve the power density and lead to small passive elements and a fast dynamic response. Each one of these power converters must be driven by a gate-drive circuit to operate efficiently. Conventional gate-drivers are used up to frequencies of about 5 MHz and suffer from switching losses. Therefore, the development of switch-mode power supplies (SMPS) operating at high frequencies requires high-speed gate drivers. -
Igbts (Insulated Gate Bipolar Transistor) Application Note
IGBTs (Insulated Gate Bipolar Transistor) Application Note IGBTs (Insulated Gate Bipolar Transistor) Description This document describes the basic structures, ratings, and electrical characteristics of IGBTs. It also provides usage considerations for IGBTs. © 2018 1 2018-09-01 Toshiba Electronic Devices & Storage Corporation IGBTs (Insulated Gate Bipolar Transistor) Application Note Table of Contents Description ............................................................................................................................................ 1 Table of Contents ................................................................................................................................. 2 1. Device structure and characteristics of IGBTs ............................................................................. 6 1.1. Basic structure of the IGBT ................................................................................................................ 6 1.2. Comparison of different types of transistors (bipolar transistors, MOSFETs, and IGBTs) ....... 8 2. Different types of IGBTs and their structures ............................................................................ 11 2.1. Gating structures ................................................................................................................................11 2.2. IGBT classification based on the vertical structure ...................................................................... 12 2.2.1. Punch-through (PT) IGBTs ................................................................................................................12 -
ON Semiconductor Is an Equal Opportunity/Affirmative Action Employer
ON Semiconductor Is Now To learn more about onsemi™, please visit our website at www.onsemi.com onsemi and and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. -
VCSEL Pulse Driver Designs for Tof Applications
Vixar Application Note VCSEL Pulse Driver Designs for ToF Applications 1 Introduction ............................................................................................................................. 2 2 Design Theory ......................................................................................................................... 2 2.1 Schematic Components .................................................................................................... 2 2.2 Design Inductance ............................................................................................................ 3 2.3 Rise and Fall Time ........................................................................................................... 5 2.4 Timing Delay.................................................................................................................... 5 3 Low Power Driver Design ...................................................................................................... 5 4 High Power Driver Design...................................................................................................... 7 4.1 GaN FETs ......................................................................................................................... 7 4.2 Gate Drivers ..................................................................................................................... 7 5 VCSEL Performance .............................................................................................................. 8 6 Conclusions -
Thyristor Switches
CHAPTER 5 Thyristor Switches Limits of the traditional contactor switched banks • High inrush current and over voltages • Risk of over voltages due to the arc breaking • Longer reconnecting time: more than 30 sec • More demanding maintenance compared with static switches. General advantages of Power Factor Correction • Reduced losses on mains and power transformers • Increase of plant available power • Less voltage drop in the plant Thyristor switched capacitor bank benefits include: • Minimises network disturbances such as Voltage Drop and Flicker Thyristor switched capacitor bank is the best and sometimes • No moving parts therefore reduced maintenance (i.e. no the sole choice when it is necessary to compensate loads Electro-magnetic contactors) over short periods of time. Examples are steel companies, • Enhanced capacitor life expectancy. lifting apparatus (cranes, quay cranes, etc), cable makers (extruders, etc), welding machines, robots, compressors, In general there is a comprehensive PLANT EFFICIENCY; skiing lift stations, LV industrial networks (chemical plants, because power factor correction is fast, the power paper mills, automotive suppliers). Thyristor switched transformer and line design can be done considering only capacitor bank are also an ergonomic solution where noise the actual load. can be problematic, like hotels, banks, offices, service Therefore longer working life and reliability of plant. infrastructures (telecommunications board, informatics Static switches allow unlimited operations. ’boards, hospitals, malls). Steps switching is also done limiting transient phenomena that inside normal plants stresses the capacitors reducing their working life. General Characteristics ICAR SINCHRO FAST SWITCH FEATURES are Further ADVANTAGES described below: 1. 1Possibility to use SFS with ICAR RPE 12BTA regulator. • Switching speed: 60ms 2. -
Present Status and Future Prospects for Power Semiconductors
Present Status and Future Prospects for Power Semiconductors Ken’ya Sakurai 1. Introduction (1) Devices related to multimedia ① High-voltage silicon diodes and damper diodes From the viewpoint of a highly information-orient- with high-speed switching performance to im- ed society in the coming 21st century, the social prove the picture quality of the CRT (cathode infrastructure will undergo rapid repairs and reforma- ray tube) display monitors and televisions tions. What will bring us to a society where computers ② Low on-resistance SOP-8 power MOSFETs and communications are closely intertwined? Techni- that extend the battery life of portable elec- cal innovations have always brought us advantages as tronic appliances such as notebook computers well as disadvantages. Any future technical innova- (2) Vehicles and rolling stock tions must definitely exclude disadvantages. ① Intelligent power MOSFETs that decrease the A highly information-oriented society will result in size and improve reliability of car electronics a great increase in electric energy consumption. Prob- systems lems of the global environment, social environment, ② High-voltage, high-power NPT (non punch- and energy resources must be improved through more through)-IGBT modules and flat IGBTs that serious consideration, with electrical manufactures reduce rolling stock size, weight, and energy leading these technical innovations. Development of consumption high power generation and conversion efficiency and (3) Power conversion (inverter control) energy-saving technology for electron devices are core ① Molded IGBTs, IGBT modules, and IGBT-IPMs technologies. More specifically, power electronics that for applications including NC (numerical con- control electric energy increases in importance, and trol) equipment, general-purpose inverters, especially power semiconductor devices as the key servo mechanisms, welding machines, and devices are required for further advances in perfor- UPSs (uninterruptible power system) mance and functions. -
Chapter 12 Three-Phase Controlled Rectifiers ∫
CHAPTER 12 THREE-PHASE CONTROLLED RECTIFIERS Author : Juan Dixon (Ph.D.) Department of Electrical Engineering Pontificia Universidad Católica de Chile Vicuña Mackenna 4860 Santiago, CHILE. 12.1 INTRODUCTION Three-phase controlled rectifiers have a wide range of applications, from small rectifiers to large High Voltage Direct Current (HVDC) transmission systems. They are used for electro-chemical process, many kinds of motor drives, traction equipment, controlled power supplies, and many other applications. From the point of view of the commutation process, they can be classified in two important categories: Line Commutated Controlled Rectifiers (Thyristor Rectifiers), and Force Commutated PWM Rectifiers. 12.2 LINE COMMUTATED CONTROLLED RECTIFIERS. 12.2.1 Three- phase hal - wavef rectifie r The figure 12.1 shows the three-phase half-wave rectifier topology. To control the load voltage, the half wave rectifier uses three, common-cathode thyristor arrangement. In this figure, the power supply, and the transformer are assumed ideal. The thyristor will conduct (ON state), when the anode-to-cathode voltage vAK is positive, and a firing current pulse iG is applied to the gate terminal. Delaying the firing pulse by an angle a does the control of the load voltage. The firing angle a is measured from the crossing point between the phase supply voltages, as shown in figure 12.2. At that point, the anode-to-cathode thyristor voltage vAK begins to be positive. The figure 12.3 shows that the possible range for gating delay is between a=0° and a=180°, but in real situations, because of commutation problems, the maximum firing angle is limited to around 160°. -
Thyristors.Pdf
THYRISTORS Electronic Devices, 9th edition © 2012 Pearson Education. Upper Saddle River, NJ, 07458. Thomas L. Floyd All rights reserved. Thyristors Thyristors are a class of semiconductor devices characterized by 4-layers of alternating p and n material. Four-layer devices act as either open or closed switches; for this reason, they are most frequently used in control applications. Some thyristors and their symbols are (a) 4-layer diode (b) SCR (c) Diac (d) Triac (e) SCS Electronic Devices, 9th edition © 2012 Pearson Education. Upper Saddle River, NJ, 07458. Thomas L. Floyd All rights reserved. The Four-Layer Diode The 4-layer diode (or Shockley diode) is a type of thyristor that acts something like an ordinary diode but conducts in the forward direction only after a certain anode to cathode voltage called the forward-breakover voltage is reached. The basic construction of a 4-layer diode and its schematic symbol are shown The 4-layer diode has two leads, labeled the anode (A) and the Anode (A) A cathode (K). p 1 n The symbol reminds you that it acts 2 p like a diode. It does not conduct 3 when it is reverse-biased. n Cathode (K) K Electronic Devices, 9th edition © 2012 Pearson Education. Upper Saddle River, NJ, 07458. Thomas L. Floyd All rights reserved. The Four-Layer Diode The concept of 4-layer devices is usually shown as an equivalent circuit of a pnp and an npn transistor. Ideally, these devices would not conduct, but when forward biased, if there is sufficient leakage current in the upper pnp device, it can act as base current to the lower npn device causing it to conduct and bringing both transistors into saturation. -
Bremner, Duncan James (2015) 25 Years of Network Access Technologies: from Voice to Internet; the Changing Face of Telecommunications
Bremner, Duncan James (2015) 25 years of network access technologies: from voice to internet; the changing face of telecommunications. PhD thesis. http://theses.gla.ac.uk/6670/ Copyright and moral rights for this thesis are retained by the author A copy can be downloaded for personal non-commercial research or study, without prior permission or charge This thesis cannot be reproduced or quoted extensively from without first obtaining permission in writing from the Author The content must not be changed in any way or sold commercially in any format or medium without the formal permission of the Author When referring to this work, full bibliographic details including the author, title, awarding institution and date of the thesis must be given. Glasgow Theses Service http://theses.gla.ac.uk/ [email protected] 25 years of Network Access Technologies: From Voice to Internet; the changing face of telecommunications Duncan James Bremner A Thesis submitted to School of Engineering College of Science and Engineering University of Glasgow in fulfilment of the requirements for the Degree of Doctor of Philosophy by published work May 2015 Abstract This work contributes to knowledge in the field of semiconductor system architectures, circuit design and implementation, and communications protocols. The work starts by describing the challenges of interfacing legacy analogue subscriber loops to an electronic circuit contained within the Central Office (Telephone Exchange) building. It then moves on to describe the globalisation of the telecom network, the demand for software programmable devices to enable system customisation cost effectively, and the creation of circuit and system blocks to realise this. -
LM3445 Triac Dimmable Offline LED Driver
LM3445 Triac Dimmable Offline LED Driver February 19, 2010 LM3445 Triac Dimmable Offline LED Driver General Description Features The LM3445 is an adaptive constant off-time AC/DC buck ■ Triac dim decoder circuit for LED dimming (step-down) constant current controller designed to be com- ■ Application voltage range 80VAC – 277VAC patible with triac dimmers. The LM3445 provides a constant Capable of controlling LED currents greater than 1A current for illuminating high power LEDs and includes a triac ■ dim decoder. The dim decoder allows wide range LED dim- ■ Adjustable switching frequency ming using standard triac dimmers. The high frequency ca- ■ Low quiescent current pable architecture allows the use of small external passive ■ Adaptive programmable off-time allows for constant ripple components. The LM3445 includes a bleeder circuit to ensure current proper triac operation by allowing current flow while the line ■ Thermal shutdown voltage is low to enable proper firing of the triac. A passive No 120Hz flicker PFC circuit ensures good power factor by drawing current di- ■ rectly from the line for most of the cycle, and provides a ■ Low profile 10 pin MSOP Package or 14 pin SOIC constant positive voltage to the buck regulator. Additional ■ Patent pending drive architecture features include thermal shutdown, current limit and VCC un- der-voltage lockout. Applications ■ Retro Fit Triac Dimming ■ Solid State Lighting ■ Industrial and Commercial Lighting ■ Residential Lighting Typical LM3445 LED Driver Application Circuit 30060305 30060301 © 2010 National Semiconductor Corporation 300603 www.national.com Connection Diagrams LM3445 Top View Top View 30060303 10-Pin MSOP NS Package Number MUB10A 30060373 14-Pin SOIC NS Package Number M14A Ordering Information Order Number Spec.