1995 Annual Report
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OMAP2430 Applications Processor
TM Technology for Innovators OMAP2430 applications processor All-in-One Key features entertainment • Advanced Imaging, Video and Audio Accelerator (IVA™ 2) boosts video for 3G mobile performance in mobile phones by up to 4X and imaging performance by up to 1.5X phones • Delivering a multimedia experience with consumer electronics quality to the handset • Multi-engine parallel processing architecture for supporting complex usage scenarios • Built-in M-Shield™ mobile security technology enables value-added services and terminal security • Support for all major High Level Operating Systems (HLOS) aids applications development PRODUCT BULLETIN Leading imaging The new OMAP2430 processor from Texas Instruments (TI) delivers a new and video level of multimedia performance to third-generation (3G) mobile phones and performance other handheld systems. Leveraging TI’s proven OMAP™ 2 architecture, the OMAP2430 features an advanced imaging, video and audio accelerator (IVA™ 2) that provides a 4X improvement in video processing and 1.5X improvement in image processing over previously available solutions for mobile phones. The processor’s high video performance enables advanced codec algorithms that promote higher compression ratios allowing networks to support more data, bringing down costs for service providers and allowing them to deploy revenue- generating services such as mobile digital TV and mobile-to-mobile gaming. Support for these services, plus high-resolution, high-speed decode of standard video compression algorithms, brings a TV-like viewing quality and the familiar features of consumer electronics to mobile communications. The OMAP2430 is optimized for the complex applications characteristic of 3G wireless communications. Offering even higher performance than first-generation OMAP 2 processors while at a lower cost, the OMAP2430 processor provides the ultimate balance between multimedia performance, flexibility, power and cost. -
The Evolving Role of Semiconductor Consortia in the United States and Japan
Portland State University PDXScholar Business Faculty Publications and Presentations The School of Business Fall 1998 The Evolving Role of Semiconductor Consortia in the United States and Japan Rose Marie Ham University of California - Berkeley Greg Linden University of California - Berkeley Melissa M. Appleyard Portland State University, [email protected] Follow this and additional works at: https://pdxscholar.library.pdx.edu/busadmin_fac Part of the Business Administration, Management, and Operations Commons Let us know how access to this document benefits ou.y Citation Details Ham, R., Linden, G., & Appleyard, M. M. (1998). The Evolving Role of Semiconductor Consortia in the United States and Japan. California Management Review, 41(1), 137-163. This Article is brought to you for free and open access. It has been accepted for inclusion in Business Faculty Publications and Presentations by an authorized administrator of PDXScholar. Please contact us if we can make this document more accessible: [email protected]. The Evolving Role of Semiconductor Consortia in the United States and Japan Rose Marie Ham Greg Linden Melissa M. Appleyard ince the late 1970s, governments throughout the industrialized economics have proclaimed the benefits of research consortia. In the United States, tor example, ihe 1984 National Cooperative Research SAct (NCRA) relaxed U.S. antitrust laws to encourage the formation of research consortia hy firms in the same industry; by the end of 1995, over 575 consortia had heen registered under the NCRA in a variety of -
Intel Corporation
US RESEARCH | PUBLISHED BY RAYMOND JAMES & ASSOCIATES INTEL CORPORATION (INTC-NASDAQ) JULY 26, 2021 | 8:27 PM EDT Semiconductors COMPANY BRIEF Chris Caso | (212) 856-4893 | [email protected] Melissa Fairbanks | (727) 567-1081 | [email protected] Underperform 4 New Names, Same Problems Suitability M/ACC Intel hosted its "Intel Accelerated" manufacturing roadmap update Monday evening, detailing their process roadmap through 2025. The presentation laid a path through which Intel hopes to MARKET DATA Current Price (Jul-26-21) $54.31 have achieved parity with TSMC (and by extension, AMD) by 2024, and a goal of process leadership Market Cap (mln) $221,802 by 2025. This is no different from the goals laid out by Intel’s new CEO when he came on board Current Net Debt (mln) $10,552 a quarter ago, but the company did provide more details about how they intend to achieve that Enterprise Value (mln) $232,354 Shares Outstanding (mln) 4,084.0 goal. Attaining leadership by 2025 requires Intel to introduce a full process node improvement 30-Day Avg. Daily Value (mln) $1,362.7 each year for the next 4 years – an aggressive assumption given the production missteps from Dividend $1.39 the past several years. What Intel didn’t disclose were the costs of this roadmap, which we Dividend Yield 2.6% 52-Week Range $43.61 - $68.49 expect them to discuss during the November analyst day. And while there is great uncertainty BVPS $14.76 about Intel’s ability to achieve these targets, what’s less uncertain is a requirement for higher Long-Term Debt (mln) $24,632 capital intensity. -
GS40 0.11-Μm CMOS Standard Cell/Gate Array
GS40 0.11-µm CMOS Standard Cell/Gate Array Version 1.0 January 29, 2001 Copyright Texas Instruments Incorporated, 2001 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the materials, methods, techniques, or apparatus described herein are the exclusive property of Texas Instruments. No disclosure of information or drawings shall be made to any other person or organization without the prior consent of Texas Instruments. IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this war- ranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WAR- RANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. -
Integrated Step-Down Converter with SVID Interface for Intel® CPU
Product Order Technical Tools & Support & Folder Now Documents Software Community TPS53820 SLUSE33 –FEBRUARY 2020 Integrated Step-Down Converter with SVID Interface for Intel® CPU Power Supply 1 Features 3 Description The TPS53820 device is D-CAP+ mode integrated 1• Single chip to support Intel VR13.HC SVID POL applications step-down converter for low current SVID rails of Intel CPU power supply. It provides up to two outputs to • Two outputs to support VCCANA (5.5 A) and power the low current SVID rails such as VCCANA P1V8 (4 A) (5.5 A) and P1V8 (4 A). The device employs D-CAP+ • D-CAP+™ Control for Fast Transient Response mode control to provide fast load transient • Wide Input Voltage (4.5 V to 15 V) performance. Internal compensation allows ease of use and reduces external components. • Differential Remote Sense • Programmable Internal Loop Compensation The device also provides telemetry, including input voltage, output voltage, output current and • Per-Phase Cycle-by-Cycle Current Limit temperature reporting. Over voltage, over current and • Programmable Frequency from 800 kHz to 2 MHz over temperature protections are provided as well. 2 • I C System Interface for Telemetry of Voltage, The TPS53820 device is packaged in a thermally Current, Output Power, Temperature, and Fault enhanced 35-pin QFN and operates between –40°C Conditions and 125°C. • Over-Current, Over-Voltage, Over-Temperature (1) protections Table 1. Device Information • Low Quiescent Current PART NUMBER PACKAGE BODY SIZE (NOM) • 5 mm × 5 mm, 35-Pin QFN, PowerPAD Package TPS53820 RWZ (35) 5 mm × 5 mm (1) For all available packages, see the orderable addendum at 2 Applications the end of the data sheet. -
North American Company Profiles 8X8
North American Company Profiles 8x8 8X8 8x8, Inc. 2445 Mission College Boulevard Santa Clara, California 95054 Telephone: (408) 727-1885 Fax: (408) 980-0432 Web Site: www.8x8.com Email: [email protected] Fabless IC Supplier Regional Headquarters/Representative Locations Europe: 8x8, Inc. • Bucks, England U.K. Telephone: (44) (1628) 402800 • Fax: (44) (1628) 402829 Financial History ($M), Fiscal Year Ends March 31 1992 1993 1994 1995 1996 1997 1998 Sales 36 31 34 20 29 19 50 Net Income 5 (1) (0.3) (6) (3) (14) 4 R&D Expenditures 7 7 7 8 8 11 12 Capital Expenditures — — — — 1 1 1 Employees 114 100 105 110 81 100 100 Ownership: Publicly held. NASDAQ: EGHT. Company Overview and Strategy 8x8, Inc. is a worldwide leader in the development, manufacture and deployment of an advanced Visual Information Architecture (VIA) encompassing A/V compression/decompression silicon, software, subsystems, and consumer appliances for video telephony, videoconferencing, and video multimedia applications. 8x8, Inc. was founded in 1987. The “8x8” refers to the company’s core technology, which is based upon Discrete Cosine Transform (DCT) image compression and decompression. In DCT, 8-pixel by 8-pixel blocks of image data form the fundamental processing unit. 2-1 8x8 North American Company Profiles Management Paul Voois Chairman and Chief Executive Officer Keith Barraclough President and Chief Operating Officer Bryan Martin Vice President, Engineering and Chief Technical Officer Sandra Abbott Vice President, Finance and Chief Financial Officer Chris McNiffe Vice President, Marketing and Sales Chris Peters Vice President, Sales Michael Noonen Vice President, Business Development Samuel Wang Vice President, Process Technology David Harper Vice President, European Operations Brett Byers Vice President, General Counsel and Investor Relations Products and Processes 8x8 has developed a Video Information Architecture (VIA) incorporating programmable integrated circuits (ICs) and compression/decompression algorithms (codecs) for audio/video communications. -
Ipox® Portfolio Holding Analysis 02/24/2021
IPOX® PORTFOLIO HOLDING ANALYSIS 02/24/2021 To learn more, visit www.ipox.com; Email: [email protected] MARVELL TECHNOLOGY GROUP LTD (MRVL US) | AQUANTIA CORP (AQ US) Office: +1 (312) 526-3634 COMPANY DESCRIPTION Support +1 (312) 339-4114 ACQUIRER Founded in 1995, Marvell Technology Group is semiconductor company headquartered in Santa Clara, CA. Marvell provides data infrastructure semiconductor solutions for data storage, processing, networking, security and connectivity. TARGET Founded in 2004, Aquantia Corp is a fabless semiconductor company that designs, develops and markets advanced high-speed communications integrated circuits (ICs) for Ethernet connectivity. TARGET IPO HISTORY Aquantia began trading on the NYSE on 11/3/2017 led by Morgan Stanley. The ICs developer sold 6,818,000 shares at $9.00 per share, below its expected price range ($10 to $12). With the 15% greenshoe options fully exercised, Aquantia was valued at ca. $300.09 million. The shares opened at $9.31/share and closed the first day higher at $9.51 (▲5.67%). Aquantia Corp entered the IPOX® Universe on the 7th day of trading. M&A HISTORY Marvell Technology Group announced to buy Aquantia for $452 million on 5/9/2019 at $13.25 per share in cash, which represented a 38.60% premium to Aquantia’s previous close. The acquisition of the Multi-Gig Ethernet company was completed on 9/19/2019. Marvell Technology Group was included in the IPOX® 100 U.S. Portfolio (ETF: FPX) on 3/23/2020 and currently weights approximately 4.90% of the portfolio. *Marvell Technology Group was added to the Nasdaq-100 Index® on December 21, 2020. -
Timeline of the Semiconductor Industry in South Portland
Timeline of the Semiconductor Industry in South Portland Note: Thank you to Kathy DiPhilippo, Executive Director/Curator of the South Portland Historical Society and Judith Borelli, Governmental Relations of Texas Inc. for providing some of the information for this timeline below. Fairchild Semiconductor 1962 Fairchild Semiconductor (a subsidiary of Fairchild Camera and Instrument Corp.) opened in the former Boland's auto building (present day Back in Motion) at 185 Ocean Street in June of 1962. They were there only temporarily, as the Western Avenue building was still being constructed. 1963 Fairchild Semiconductor moves to Western Avenue in February 1963. 1979 Fairchild Camera and Instrument Corp. is acquired/merged with Schlumberger, Ltd. (New York) for $363 million. 1987 Schlumberger, Ltd. sells its Fairchild Semiconductor Corp. subsidiary to National Semiconductor Corp. for $122 million. 1997 National Semiconductor sells the majority ownership interest in Fairchild Semiconductor to an investment group (made up of Fairchild managers, including Kirk Pond, and Citcorp Venture Capital Ltd.) for $550 million. Added Corporate Campus on Running Hill Road. 1999 In an initial public offering in August 1999, Fairchild Semiconductor International, Inc. becomes a publicly traded corporation on the New York Stock Exchange. 2016 Fairchild Semiconductor International, Inc. is acquired by ON Semiconductor for $2.4 billion. National Semiconductor 1987 National Semiconductor acquires Fairchild Semiconductor Corp. from Schlumberger, Ltd. for $122 million. 1995 National Semiconductor breaks ground on new 200mm factory in December 1995. 1996 National Semiconductor announces plans for a $600 million expansion of its facilities in South Portland; construction of a new wafer fabrication plant begins. 1997 Plant construction for 200mm factory completed and production starts. -
AMD Socket AM2 with AMD M690T Chipset Reference Schematic D D
5 4 3 2 1 AMD Socket AM2 with AMD M690T Chipset Reference Schematic D D NOTES: Page Index Page Index ------- -------------------------------------------- ------- -------------------------------------------- 1) This schematic supports the AMD Socket AM2 CPU devices. 1 Cover Page 17 SB600 PCIe, PCI, LPC, Straps, & CPU Control 2) These are "Reference Schematics" and as such they have 2 Revision History 18 SB600 ACPI, GPIO, USB, and Audio Interfaces not been verified by an actual board build. 3 Block Diagram 19 SB SATA, IDE, SPI, and HW Management Interfaces 3) This reference schematic supports AMD M960T revision 4 Clock Structure 20 SB600 Power A12 or later. If A12 or later revision is not used, please 5 Power Configuration (1) 21 CRT Connector see your customer support representative for the 6 Power Configuration (2) 22 Broadcom Ethernet Controller necessary application notes for workarounds. 7 Reset & Voltage Sequence 23 Realtek Audio Codec C 4) This reference schematic supports SB600 revision 8 Socket AM2 HT Interface 24 LPC BIOS C A21 or later. If A21 or later revision is not used, please 9 Socket AM2 DDRII Memory Interface 25 USB Power and Connectors see your customer support representative for the 10 Socket AM2 Control & Debug 26 Power Main System, SB600 PCIe, & Other necessary application notes for workarounds. 11 Socket AM2 Power & Ground 27 Standby Power & Powergood 5) Unless otherwise specified, resistors have 5% tolerance. 12 SODIMM DDR2 28 Power for CPU Core 13 M690T HT, PCI, PCIe(R), PCIe Graphics Port 29 Power for DDR2 Memory and Interface 6) Unless otherwise specified, capacitors have 20% tolerance. 14 M690T PLL and Video Interface 30 Power M690T Core, PCIe Interface 15 M690T Power and Side Port Memory Interface 31 Unused Interfaces 16 Clock Generator IMPORTANT NOTICE: B 1. -
Advance Program 2015 Ieee International Solid-State
2015_MiniAP_Cover_AP 1/19/15 9:33 AM Page 1 ADVANCE PROGRAM & MORE S / B CMOS LOW-VOLTAGE CIRCUIT DESIGN CMOS LOW-VOLTAGE THURSDAY ALL-DAY THURSDAY : ADVANCES IN WIRELESS POWER; LOW POWER FOR ADVANCES : E; RF TRANSMITTER ADVANCES; IO @ 25G E; RF TRANSMITTER ADVANCES; O 2015 IEEE SHORT-COURSE I INTERNATIONAL 4 FORUMS SOLID-STATE CIRCUITS CONFERENCE FEBRUARY 22, 23, 24, 25, 26 CONFERENCE THEME: IEEE SOLID-STATE CIRCUITS SOCIETY IEEE SOLID-STATE SILICON SYSTEMS ALL-DAY SUNDAY SMALL CHIPS FOR BIG DATA ANALOG; FREQUENCY SYNTHESIZERS; 3D IMAGING ICs GRADUATE STUDENT RESEARCH IN PROGRESS, ICsGRADUATE TO NEURONS TALKING SAN FRANCISCO TO WEARABLE TRENDS: BIG DATA ADCs; MEMORY HIGH-SPEED INTERLEAVED MARRIOTT MARQUIS HOTEL : RF RECEIVERS; DRAM INTERFACES; ULTRA-LOW-POWER WIRELESS; NEAR-THRESHOLD DESIGN; ULTRA-LOW-POWER RF RECEIVERS; DRAM INTERFACES; : 2 FORUMS NEW THIS YEAR: HIGH-SPEED CURRENT-STEERING DACs; CLOCK & DATA RECOVERY; MANY-CORE PROCESSORS; NANO-POWER MANY-CORE RECOVERY; DACs; CLOCK & DATA HIGH-SPEED CURRENT-STEERING 2 EVENING EVENTS ON ISSCCX 10 TUTORIALS ISSCC PREVIEWS: CIRCUIT & SYSTEM INSIGHTS SEE PAGE: 61 5-DAY PROGRAM 2015_MiniAP_Cover_AP 1/19/15 9:33 AM Page 2 ISSCC VISION STATEMENT The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at thecutting edge of IC design and application to maintain technical currency, and to network with leading experts. CONFERENCE TECHNICAL HIGHLIGHTS On Sunday, February 22nd, the day before the official opening of the Conference, ISSCC 2015 offers: • A choice of up to 4 of a total of 10 Tutorials • A choice of 1 of 2 all-day Advanced-Circuit-Design Forums The 90-minute tutorials offer background information and a review of the basics in specific circuit-design topics. -
Advanced Micro Devices, Inc. 2485 Augustine Drive Santa Clara, California 95054
ADVANCED MICRO DEVICES, INC. 2485 AUGUSTINE DRIVE SANTA CLARA, CALIFORNIA 95054 NOTICE OF ANNUAL MEETING OF STOCKHOLDERS You are cordially invited to attend our 2020 annual meeting of stockholders (our “Annual Meeting”) to be held on Thursday, May 7, 2020 at 9:00 a.m. Pacific Time. In light of the coronavirus/COVID-19 outbreak and governmental decrees that in-person gatherings be postponed or canceled, and in the best interests of public health and the health and safety of our Board of Directors, employees and stockholders, the Annual Meeting will be held virtually via the Internet at www.virtualshareholdermeeting.com/AMD2020. You will not be able to attend the Annual Meeting in person. We are holding our Annual Meeting to: • Elect the eight director nominees named in this proxy statement; • Ratify the appointment of Ernst & Young LLP as our independent registered public accounting firm for the current fiscal year; • Approve on a non-binding, advisory basis the compensation of our named executive officers, as disclosed in this proxy statement pursuant to the compensation disclosure rules of the U.S. Securities and Exchange Commission (the “SEC”); and • Transact any other business that properly comes before our Annual Meeting or any adjournment or postponement thereof. We are pleased to provide access to our proxy materials over the Internet under the SEC’s “notice and access” rules. As a result, we are mailing to our stockholders (other than those who previously requested printed or emailed materials on an ongoing basis) a Notice of Internet Availability of Proxy Materials (the “Notice”) instead of printed copies of our proxy materials. -
Notes to Portfolio of Investments—March 31, 2021 (Unaudited)
Notes to portfolio of investments—March 31, 2021 (unaudited) Shares Value Common stocks: 99.36% Communication services: 9.92% Interactive media & services: 8.14% Alphabet Incorporated Class C † 4,891 $ 10,117,669 Facebook Incorporated Class A † 21,120 6,220,474 16,338,143 Wireless telecommunication services: 1.78% T-Mobile US Incorporated † 28,582 3,581,039 Consumer discretionary: 10.99% Automobiles: 1.91% General Motors Company † 66,899 3,844,017 Internet & direct marketing retail: 3.59% Amazon.com Incorporated † 2,329 7,206,112 Multiline retail: 1.69% Dollar General Corporation 16,717 3,387,199 Specialty retail: 3.80% Burlington Stores Incorporated † 15,307 4,573,732 Ulta Beauty Incorporated † 9,936 3,071,913 7,645,645 Consumer staples: 2.81% Food & staples retailing: 1.60% Sysco Corporation 40,883 3,219,127 Household products: 1.21% Church & Dwight Company Incorporated 27,734 2,422,565 Financials: 7.38% Capital markets: 4.85% CME Group Incorporated 7,970 1,627,713 Intercontinental Exchange Incorporated 24,575 2,744,536 S&P Global Incorporated 9,232 3,257,696 The Charles Schwab Corporation 32,361 2,109,290 9,739,235 Insurance: 2.53% Chubb Limited 13,181 2,082,203 Marsh & McLennan Companies Incorporated 24,610 2,997,498 5,079,701 Health care: 14.36% Biotechnology: 1.11% Alexion Pharmaceuticals Incorporated † 14,516 2,219,642 Health care equipment & supplies: 6.29% Align Technology Incorporated † 5,544 3,002,242 Boston Scientific Corporation † 79,593 3,076,269 See accompanying notes to portfolio of investments Wells Fargo VT Opportunity