EPOXY RESINS Product Overview Guide
Total Page:16
File Type:pdf, Size:1020Kb
EPOXY RESINS Product Overview Guide NORTH AMERICA Expanding Opportunities for Performance and Differentiation Epoxy technology is a fundamental building block for innovation across broad and diverse industries around the world. Dow is leading the way, applying advanced epoxy chemistry to address critical material challenges and help meet society’s energy, transportation, electronics, and infrastructure needs. 2 Dow is a global supplier of epoxy resins, diluents, curing agents, and intermediates. With more than 50 years of innovation, we offer advanced epoxy products and solutions based on the industry’s leading product and process technology. And, as one of the most vertically-integrated epoxy suppliers, we are a highly reliable source of supply. Dow is committed to your success. To better assist you during each stage of formulation development, we have compiled this convenient overview of resin products available in North America. Use it in combination with product information for our robust line of epoxy hardeners to compare product options and decide which Dow products provide the performance required in your applications. Talk to your Dow representative to learn more about how Dow can provide the products and support you need to strengthen system differentiation and your competitive position in the marketplace. 3 Resins from Dow 4 Calculation of Stoichiometric Ratios Equation 1 To calculate the Amine H equivalent Amine H eq wt = MW of amine To obtain optimum properties with poly- weight, use the following equation: no. of active hydrogens functional epoxide-reactive curing agents, 1 Example Amine H eq wt D.E.H. 20 = 103.2 = 20.6 gr/eq particularly the amines, it is desirable to react 5 the resin and the curing agent at approximately stoichiometric quantities. To determine the Equation 2 Amine H eq wt x 100 ratio required, calculations can be made as To calculate the stoichiometric ratio of phr1 of amine = D.E.H.™ 20 hardener to use with D.E.R.™ 331 Epoxide eq wt of resin follows, using D.E.H.™ 20 epoxy hardener 2 epoxy resin having an epoxide equivalent Example (NH – CH – CH – NH – CH – CH – NH ) as 2 2 2 2 2 2 weight of 189: phr D.E.H. 20 hardener to be used with D.E.R. 331 epoxy resin an example: phr = 20.6 x 100 = 10.9 189 Equation 3 Frequently, epoxy resins are blended, EEW of mix = Total Wt filled, or modified with reactive and Wt a + Wt b + Wt c 3 non-reactive components. It is therefore EEW a EEW b EEW c necessary to adjust the concentration of the curing agent to cure only the portion Total weight includes all materials, both reactive and of the mix that is reactive; e.g., the resins non-reactive. a,b,c, etc., are only the materials reactive with and any reactive diluent present. This the curing agent, and are characterized by an epoxy ring. may be simply done by calculating the epoxide equivalent weight (EEW) of the Example total mix and then applying equation (2) to 100 parts D.E.R. 331 Average EEW 189 determine the amount of curing agent to 100 parts D.E.R. 337 Average EEW 240 add to 100 parts of formulation. 30 parts BDDGE (diluent) Average EEW 130 230 parts Filler – 460 Total EEW of mix = 460 = 460 = 391 100 + 100 + 30 1.176 189 240 130 By Equation 2 Amount D.E.H. 20 = 20.6 x 100 = 5.27 parts per hundred 391 parts filled formulation ® TM Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow 1 Parts by wt per 100 parts resin 5 Resins from Dow Liquid Epoxy Resins Grade EEW Viscosity Description (gr/eq) (mPa.s @ 25 °C) Bisphenol A Epoxy Resins D.E.R.™ 332 171 – 175 4000 – 6000 High purity diglycidyl ether of bisphenol A. Its high purity and low oligomer content assures uniform performance, exceptionally low viscosity and can provide improved elevated temperature properties over standard epoxy resins. This resin grade is mainly used in filament winding, electrical laminates and encapsulation applications. D.E.R. 383 176 – 183 9000 – 10500 D.E.R. 383 epoxy resin is a low viscosity bisphenol A epoxy resin. Applications are similar to those of D.E.R. 331 liquid epoxy resin. D.E.R. 383 epoxy resin frequently crystallizes at room temperature. Heating to 50-55°C restores the resin to a liquid state. Long-term warm storage may result in a slight discoloration but does not affect the resin performance. D.E.R. 330 176 – 185 7000 – 10000 D.E.R. 330 epoxy resin is a low viscosity bisphenol A epoxy resin commonly used in civil engineering and industrial coatings. D.E.R. 330 epoxy resin frequently crystallizes at room temperature, Heating to 50-55°C restores the resin to liquid state. Long-term warm storage may result in slight discoloration but does not effect the resin performance. D.E.R. 331 182 – 192 11000 – 14000 A widely used, general-purpose liquid epoxy resin based on bisphenol A. It is recognized as a standard from which many variations have been developed. D.E.R. 317 192 – 203 16000 – 25000 High viscosity, fast reacting bisphenol A epoxy resin. Modified Bisphenol A Epoxy Resins D.E.R. 321 180 – 188 500 – 700 Diglycidylether of bisphenol A/CGE. D.E.R. 3212 179 – 193 750 – 1400 Diglycidylether of bisphenol A/CGE. D.E.R. 322 183 – 193 5500 – 8500 Diglycidylether of bisphenol A/reactive diluent. D.E.R. 323 190 – 204 1000 – 1200 Aliphatic glycidyl ether reactive diluent, modified liquid epoxy resin which is very similar to D.E.R. 324 liquid epoxy resin but with lower diluent content. D.E.R. 324 195 – 204 600 – 800 D.E.R. 324 liquid epoxy resin offers low viscosity and low surface tension. The low surface tension explains why this resin wets the surface better, gives better adhesion and will have slightly lower viscosity at any given filler loading. The diluent increases pot-life, flexibility (impact resistance) and acid resistance, but limits the solvent resistance. D.E.R. 324 liquid epoxy resin is prone to crystallization. D.E.R. 325 185 – 206 850 – 2800 Diglycidylether of bisphenol A/AGE. D.E.R. 329 145 – 155 900 – 1300 Diglycidylether of bisphenol A/TMPTGE. D.E.R 362 185 – 205 4500 – 6500 Modified liquid epoxy resin. XZ 92742.00 160 – 180 500 – 700 Diglycidylether of bisphenol A/BDDGE. TM Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow 6 Liquid Epoxy Resins (cont.) Grade EEW Viscosity Description (gr/eq) (mPa.s @ 25 °C) Modified Bisphenol A/F Epoxy Resins D.E.R.™ 353 190 – 200 800 – 1000 D.E.R. 353 liquid epoxy resin is a low viscosity epoxy resin with a very low crystallization tendency. The performance of D.E.R. 353 in ambient cure formulations is similar to those obtained when using D.E.R. 324 liquid epoxy resin. Bisphenol F Epoxy Resins D.E.R. 354 167 – 174 3400 – 4200 Standard bisphenol F-based epoxy resin of low viscosity, used for solvent-free coatings, concrete reinforcements, adhesives, electrical insulation and filament winding. This resin can provide improved resistance performance against solvents compared to standard bisphenol A liquid epoxy resins. Flexible Epoxy Resins D.E.R. 736 175 – 205 30 – 60 D.E.R. 736 is a short chain length polyglycol di-epoxide liquid resin. Its applications include coatings and adhesives for improved flexibility, elongation, and impact resistance. D.E.R. 732 310 – 330 60 – 70 D.E.R. 732 is a long chain length polyglycol di-epoxide liquid resin. Its applications include coatings and adhesives for improved flexibility, elongation, and impact resistance. D.E.R. 750 176 – 186 2500 – 4500 Diglycidylether of bisphenol A/flexible epoxy resin. D.E.R. 3913 345 – 365 7500 – 9500 D.E.R. 3913 epoxy resin is designed to impart flexibility into epoxy binder systems. In combination with suitable curing agents, high elongations at break can be achieved, at room temperature as well as at -20 °C. 7 Resins from Dow Epoxy Emulsions and Dispersions Grade EEW (gr/eq) Solids Content Description on solids (wt%) D.E.R.TM 917 193 – 204 63 – 65 Aqueous liquid epoxy resin emulsion of the D.E.R. 331 liquid epoxy resin type. This material is suitable for coatings on metallic substrates, coating on concrete and also in concrete ad-mixtures (i.e. epoxy cement concrete). Note that the use of water-borne systems requires some control of atmospheric conditions (temperature and humidity) to develop optimum performance and appearance. D.E.R. 916 184 – 204 57 – 59 Aqueous semi-solid epoxy novolac resin emulsion of the D.E.N.TM 438 epoxy novolac resin type. This product can produce highly cross-linked matrices, providing excellent heat and chemical resistance similar to solvent-borne novolac resins. D.E.R. 915 475 – 500 46 – 48 Experimental aqueous solid “1-type“ epoxy resin dispersion of the D.E.R. 671 solid epoxy resin type. This resin emulsion is not only suggested for corrosion protection applications on steel but can also be used for coatings on concrete where solvent cannot be tolerated. Epoxy Toughening Agents and Toughened Epoxy Resins Grade EEW Viscosity Description (gr/eq) (mPa.s @ 25 °C) FORTEGRATM 100 Epoxy N/A 3000 – 4000 FORTEGRA 100 epoxy toughener is a low viscosity toughening agent, designed for use in amine cured Toughening Agent epoxy systems. FORTEGRA 102 345 – 374 5000 – 8000 Blend of bisphenol A liquid epoxy resin (50 wt%) and a block copolymer toughening agent (50 wt%). Toughened Epoxy Resin FORTEGRA 104 960 – 1060 N/A Blend of bisphenol A solid epoxy resin (88 wt%) and FORTEGRA 100 (12 wt%).