Preparation and Microstructural Analysis of High-Performance Ceramics
© 2004 ASM International. All Rights Reserved. www.asminternational.org ASM Handbook Volume 9: Metallography and Microstructures (#06044G) Preparation and Microstructural Analysis of High-Performance Ceramics Ulrike Ta¨ffner, Veronika Carle, and Ute Scha¨fer, Max-Planck-Institut fu¨r Metallforschung, Stuttgart, Germany Michael J. Hoffmann, Institut fu¨r Keramik im Maschinenbau, Universita¨t Karlsruhe, Germany IN CONTRAST TO METALS, high-perfor- and impurities. These microstructural variables cubic ZrO2 lattice). Cubic stabilized zirconia is mance ceramics have higher hardness, lower have a strong influence on the method selected also used in as k-sensors for automobile catalytic ductility, and a basically brittle nature. Other for preparation. An example for two different converters and for p(O2) measurement in liquid general properties to note are: excellent high- ZrO2 ceramic materials is illustrated in Fig. 1 and metals. temperature performance, good wear resistance 2. Figure 1 shows the microstructure of tetrag- Because of these differences in mechanical and thermal insulation (low thermal conductiv- onal ZrO2 (TZP, or tetragonal zirconia polycrys- properties and microstructure, the ceramo- ity), as well as high resistance to corrosion and tals). This is a high-strength structural ceramic graphic preparation of TZP and CSZ is quite dif- oxidation. However, the full advantage that these used for room-temperature applications (e.g., ferent. The tough, fine-grained TZP requires materials can provide is strongly dependent on knives and scissors). Tetragonal zirconia poly- longer polishing times for the fine-polishing step composition and microstructure. crystals have a grain size less than 1 lm, an ex- with 1 and 0.25 lm diamond, while CSZ needs Most high-performance ceramics are based on tremely high bending strength ranging from 800 longer polishing times for the coarser polishing high-purity oxides, nitrides, carbides, and bo- to 2400 MPa (115 to 350 ksi), and fracture with 6 and 3 lm diamond compounds.
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