ASIC Design Using Programmable Interconnects Based on CBRAM
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Universal Memory
BRIEFING No.4 ICT UNIVERSAL MEMORY Memory is an integral part of information processing devices and is needed for short‐term stor‐ age such as when computer programs are being executed or text documents are processed. Currently, three main types of memory exist: SRAM offers very high speed at a high cost, DRAM is average in terms of speed and cost, and Flash memory is a low cost, low speed solution for applications that need to retain the data even when power is disconnected. A group of emerg‐ ing memory devices called universal memory aim to combine all these features in a single de‐ vice.1 Developments in universal memory devices may eventually lead to the introduction of novel October 2010 October memory architectures that offer increased performance, enable smaller mobile devices, and offer novel features in traditional products such as cars or domestic appliances. Nanotechnol‐ ogy is an integral part of emerging memory research as it is becoming increasingly difficult to enhance the performance of current devices by scaling the technology further. It is unlikely that a single technology will emerge as the universal memory technology; however, the develop‐ ments in this sector will enhance the energy efficiency and performance of memory devices. Currently, the Integrated Circuit (IC) market is dominated by US and Asia based companies. Uni‐ versal memory and nanotechnology based solutions could provide an opportunity for Europe to gain ground in the sector. Background volatility. Its disadvantage compared to SRAM and DRAM is speed. None of the existing memory technologies provide all of the required properties. -
Nanotechnology Trends in Nonvolatile Memory Devices
IBM Research Nanotechnology Trends in Nonvolatile Memory Devices Gian-Luca Bona [email protected] IBM Research, Almaden Research Center © 2008 IBM Corporation IBM Research The Elusive Universal Memory © 2008 IBM Corporation IBM Research Incumbent Semiconductor Memories SRAM Cost NOR FLASH DRAM NAND FLASH Attributes for universal memories: –Highest performance –Lowest active and standby power –Unlimited Read/Write endurance –Non-Volatility –Compatible to existing technologies –Continuously scalable –Lowest cost per bit Performance © 2008 IBM Corporation IBM Research Incumbent Semiconductor Memories SRAM Cost NOR FLASH DRAM NAND FLASH m+1 SLm SLm-1 WLn-1 WLn WLn+1 A new class of universal storage device : – a fast solid-state, nonvolatile RAM – enables compact, robust storage systems with solid state reliability and significantly improved cost- performance Performance © 2008 IBM Corporation IBM Research Non-volatile, universal semiconductor memory SL m+1 SL m SL m-1 WL n-1 WL n WL n+1 Everyone is looking for a dense (cheap) crosspoint memory. It is relatively easy to identify materials that show bistable hysteretic behavior (easily distinguishable, stable on/off states). IBM © 2006 IBM Corporation IBM Research The Memory Landscape © 2008 IBM Corporation IBM Research IBM Research Histogram of Memory Papers Papers presented at Symposium on VLSI Technology and IEDM; Ref.: G. Burr et al., IBM Journal of R&D, Vol.52, No.4/5, July 2008 © 2008 IBM Corporation IBM Research IBM Research Emerging Memory Technologies Memory technology remains an -
Scalability and Reliability of Phase Change Memory
SCALABILITY AND RELIABILITY OF PHASE CHANGE MEMORY A DISSERTATION SUBMITTED TO THE DEPARTMENT OF ELECTRICAL ENGINEERING AND THE COMMITTEE ON GRADUATE STUDIES OF STANFORD UNIVERSITY IN PARTIAL FULFILLMENT OF THE REQUIREMENTS FOR THE DEGREE OF DOCTOR OF PHILOSOPHY SangBum Kim Aug 2010 © 2010 by SangBum Kim. All Rights Reserved. Re-distributed by Stanford University under license with the author. This work is licensed under a Creative Commons Attribution- Noncommercial 3.0 United States License. http://creativecommons.org/licenses/by-nc/3.0/us/ This dissertation is online at: http://purl.stanford.edu/kk866zc2173 ii I certify that I have read this dissertation and that, in my opinion, it is fully adequate in scope and quality as a dissertation for the degree of Doctor of Philosophy. Philip Wong, Primary Adviser I certify that I have read this dissertation and that, in my opinion, it is fully adequate in scope and quality as a dissertation for the degree of Doctor of Philosophy. Yi Cui I certify that I have read this dissertation and that, in my opinion, it is fully adequate in scope and quality as a dissertation for the degree of Doctor of Philosophy. Yoshio Nishi Approved for the Stanford University Committee on Graduate Studies. Patricia J. Gumport, Vice Provost Graduate Education This signature page was generated electronically upon submission of this dissertation in electronic format. An original signed hard copy of the signature page is on file in University Archives. iii Abstract Various memory devices are being widely used for a wide range of applications. There has not been any universal memory device so far because each memory device has a unique set of features. -
Architecting Racetrack Memory Preshift Through Pattern-Based Prediction Mechanisms
Architecting Racetrack Memory preshift through pattern-based prediction mechanisms Abstract— Racetrack Memories (RM) are a promising metalic racetrack, providing higher package density, lower spintronic technology able to provide multi-bit storage in a single energy and more robust data stability [5]. As seen in Fig. 1, each cell (tape-like) through a ferromagnetic nanowire with multiple RM cell is able to store multiple data bits in a single wire domains. This technology offers superior density, non-volatility programming domains to a certain direction (DWM) or by the and low static power compared to CMOS memories. These absence or presence of a skyrmion (SK-RM). Applying a current features have attracted great interest in the adoption of RM as a through the wire ends, domains or skyrmions can be shifted replacement of RAM technology, from Main memory (DRAM) to left/right at a constant velocity. With such a tape-like operation, maybe on-chip cache hierarchy (SRAM). One of the main every domain can be aligned with a read/write port, drawbacks of this technology is the serialized access to the bits implemented through a Magnetic Tunnel Junction (MTJ). The stored in each domain, resulting in unpredictable access time. An bit-cell structure required for shifting and read/write is shown in appropriate header management policy can potentially reduce the number of shift operations required to access the correct position. Fig. 1.down. Read/write operations are performed precharging Simple policies such as leaving read/write head on the last domain bitlines (BL and BLB) to the appropriate values and turning on accessed (or on the next) provide enough improvement in the the access transistors (TRW1 and TRW2). -
Racetrack Memory Based Logic Design for In‑Memory Computing
This document is downloaded from DR‑NTU (https://dr.ntu.edu.sg) Nanyang Technological University, Singapore. Racetrack memory based logic design for in‑memory computing Luo, Tao 2018 Luo, T. (2018). Racetrack memory based logic design for in‑memory computing. Doctoral thesis, Nanyang Technological University, Singapore. http://hdl.handle.net/10356/73359 https://doi.org/10.32657/10356/73359 Downloaded on 27 Sep 2021 05:57:42 SGT RACETRACK MEMORY BASED LOGIC DESIGN FOR IN-MEMORY COMPUTING School of Computer Science and Engineering A thesis submitted to the Nanyang Technological University in partial fulfilment of the requirement for the degree of Doctor of Philosophy LUO TAO August 2017 Abstract In-memory computing has been demonstrated to be an efficient computing in- frastructure in the big data era for many applications such as graph processing and encryption. The area and power overhead of CMOS technology based mem- ory design is growing rapidly because of the increasing data capacity and leak- age power along with the shrinking technology node. Thus, a newly introduced emerging memory technology, racetrack memory, is proposed to increase the data capacity and power efficiency of modern memory systems. As the design require- ments of the conventional logic are different from that of the emerging memory based logic for in-memory computing, the conventional well-developed CMOS technology based logic designs are less relevant to the emerging memory based in-memory computing. Therefore, novel logic designs for racetrack memory are required. Traditional logic design with separate chips is focusing on high speed, which causes large area and power consumption. -
Device-Aware Inference Operations in SONOS Non- Volatile Memory Arrays
Device-aware inference operations in SONOS non- volatile memory arrays Christopher H. Bennett1*, T. Patrick Xiao1*, Ryan Dellana1, Ben Feinberg1, Sapan Agarwal1, and Matthew J. Marinella1 1. Sandia National Laboratories, Albuquerque, NM 87185-1084, USA {cbennet,txiao,mmarine}@sandia.gov *These authors contributed equally Vineet Agrawal2, Venkatraman Prabhakar2, Krishnaswamy Ramkumar2, Long Hinh2, Swatilekha Saha2, Vijay Raghavan3, Ramesh Chettuvetty3 2. Cypress Semiconductor Corporation, 198 Champion Court, San Jose, CA, 95134, USA 3. Cypress Semiconductor Corporation, Ste #120, 536 Chapel Hills Drive, Colorado Springs, CO, 80920, USA [email protected] Abstract— Non-volatile memory arrays can deploy pre-trained noise, variability, and circuit non-idealities [6],[7]. We neural network models for edge inference. However, these additionally investigate the impact of retention loss as systems are affected by device-level noise and retention issues. measured in real devices and show that the same device-aware Here, we examine damage caused by these effects, introduce a training methods can be applied to mitigate the effects of mitigation strategy, and demonstrate its use in fabricated array weight drift. In the following sections, we demonstrate that the of SONOS (Silicon-Oxide-Nitride-Oxide-Silicon) devices. On following two approaches – in terms of software neural MNIST, fashion-MNIST, and CIFAR-10 tasks, our approach network and circuit architecture respectively – can mitigate increases resilience to synaptic noise and drift. We also show device non-idealities: strong performance can be realized with ADCs of 5-8 bits precision. The use of noise regularization during training which implicitly counteracts generic noise disturbance, device- Index Terms-- SONOS, CTM, neural networks, edge inference to-device variability, and charge decay phenomenon: The use of an appropriate 1T,1CTM cells in a dual array I. -
Data in the Fast Lanes of Racetrack Memory
INFOTECH Data in the Fast Lanes of RACETRACK MEMORY A device that slides magnetic bits back and forth along nanowire “racetracks” could pack data in a three-dimensional microchip and may replace nearly all forms of conventional data storage By Stuart S. P. Parkin he world today is very different from that when the computer powers down—or crashes. of just a decade ago, thanks to our ability A few computers use nonvolatile chips, which T to readily access enormous quantities of retain data when the power is off, as a solid-state information. Tools that we take for granted— drive in place of an HDD. The now ubiquitous social networks, Internet search engines, online smart cell phones and other handheld devices maps with point-to-point directions, and online also use nonvolatile memory, but there is a trade- libraries of songs, movies, books and photo- off between cost and performance. The cheapest KEY CONCEPTS graphs—were unavailable just a few years ago. nonvolatile memory is a kind called flash memo- ■ A radical new design for We owe the arrival of this information age to the ry, which, among other uses, is the basis of the computer data storage rapid development of remarkable technologies little flash drives that some people have hanging called racetrack memory in high-speed communications, data processing from their key rings. Flash memory, however, is (RM) moves magnetic and—perhaps most important of all but least ap- slow and unreliable in comparison with other bits along nanoscopic preciated—digital data storage. memory chips. Each time the high-voltage pulse “racetracks.” Each type of data storage has its Achilles’ heel, (the “flash” of the name) writes a memory cell, ■ RM would be nonvola- however, which is why computers use several the cell is damaged; it becomes unusable after tile—retaining its data types for different purposes. -
A Stacked Memory Device on Logic 3D Technology for Ultra-High-Density Data Storage
IOP PUBLISHING NANOTECHNOLOGY Nanotechnology 22 (2011) 254006 (7pp) doi:10.1088/0957-4484/22/25/254006 A stacked memory device on logic 3D technology for ultra-high-density data storage Jiyoung Kim1,2, Augustin J Hong1, Sung Min Kim1,2, Kyeong-Sik Shin1, Emil B Song1, Yongha Hwang1, Faxian Xiu1, Kosmas Galatsis1, Chi On Chui1, Rob N Candler1, Siyoung Choi2, Joo-Tae Moon2 and Kang L Wang1 1 Device Research Laboratory, Department of Electrical Engineering, University of California, Los Angeles, CA 90095, USA 2 Advanced Technology Development Team and Process Development Team, Memory R&D Center, Samsung Electronics Co. Ltd, Korea E-mail: [email protected] Received 22 June 2010, in final form 29 September 2010 Published 16 May 2011 Online at stacks.iop.org/Nano/22/254006 Abstract We have demonstrated, for the first time, a novel three-dimensional (3D) memory chip architecture of stacked-memory-devices-on-logic (SMOL) achieving up to 95% of cell-area efficiency by directly building up memory devices on top of front-end CMOS devices. In order to realize the SMOL, a unique 3D Flash memory device and vertical integration structure have been successfully developed. The SMOL architecture has great potential to achieve tera-bit level memory density by stacking memory devices vertically and maximizing cell-area efficiency. Furthermore, various emerging devices could replace the 3D memory device to develop new 3D chip architectures. S Online supplementary data available from stacks.iop.org/Nano/22/254006/mmedia (Some figures in this article are in colour only in the electronic version) 1. Introduction patterning resolution, transistor short-channel effects, and ever increasing interference between adjacent cells [3, 5–8]. -
Investigation of High-К Dielectric Films Incorporated with Lanthanum and Their Application in Flash Memory Devices
View metadata, citation and similar papers at core.ac.uk brought to you by CORE provided by ScholarBank@NUS INVESTIGATION OF HIGH-К DIELECTRIC FILMS INCORPORATED WITH LANTHANUM AND THEIR APPLICATION IN FLASH MEMORY DEVICES HE WEI NATIONAL UNIVERSITY OF SINGAPORE 2009 INVESTIGATION OF HIGH-К DIELECTRIC FILMS INCORPORATED WITH LANTHANUM AND THEIR APPLICATION IN FLASH MEMORY DEVICES He Wei (B. Eng., Harbin Institute of Technology) A THESIS SUBMITTED FOR THE DEGREE OF DOCTOR OF PHILOSOPHY DEPARTMENT OF ELECTRICAL & COMPUTER ENGINEERING NATIONAL UNIVERSITY OF SINGAPORE 2009 Abstract Abstract The SONOS-type of flash memory is one of the promising candidates to replace the conventional floating-gate type flash memory to enable continued memory device down-sizing. For a typical SONOS-type flash memory, there is a tradeoff between data retention and operation speeds. In order to break this tradeoff, Al2O3 as a blocking oxide has been proposed and exhibits promising results. However, the permittivity of Al2O3 is not high (only around 9) and even higher permittivity dielectrics, such as LaAlOx and HfLaOx, were investigated here to further improve the memory performance. The lanthanum-incorporated dielectrics (LaAlOx and HfLaOx) were deposited using the atomic layer deposition (ALD) method at 300ºC. The enhancement of deposition rate of La2O3 was observed when co-introducing the Hf or Al precursor into the process chamber to form HfLaOx or LaAlOx, respectively. Overall, the ALD processes of both HfLaOx and LaAlOx showed good self-limiting behavior, good film uniformity, low carbon impurity and a strictly linear relationship between the film thickness and deposition cycles, indicating good ALD characteristics. -
Resistive-RAM for Data Storage Applications by Siddharth Gaba A
Resistive-RAM for Data Storage Applications by Siddharth Gaba A dissertation submitted in partial fulfillment of the requirements for the degree of Doctor of Philosophy (Electrical Engineering) in the University of Michigan 2014 Doctoral Committee Associate Professor Wei Lu, Chair Assistant Professor Emmanouil Kioupakis Professor Jerome P. Lynch Assistant Professor Zhengya Zhang Associate Professor Zhaohui Zhong TABLE OF CONTENTS List of Figures…………………………………………………………………………………….vi List of Tables……………………………………………………………………………………xiii Abstract………………………………………………………………………………………….xiv Chapter 1 Introduction ............................................................................................................. 1 1.1 Data Explosion .................................................................................................. 1 1.2 The NVM Workhorse: FLASH ........................................................................ 1 1.3 Semiconductor Flash Memory Scaling ............................................................. 3 1.4 Emerging Non-Volatile Memories ................................................................... 5 1.5 RRAM ............................................................................................................... 8 1.6 Organization of the Thesis .............................................................................. 11 References ............................................................................................................. 12 Chapter 2 Amorphous Silicon Based Electrochemical -
A Survey of Architectural Approaches for Managing Embedded DRAM and Non-Volatile On-Chip Caches Sparsh Mittal, Jeffrey S
A Survey Of Architectural Approaches for Managing Embedded DRAM and Non-volatile On-chip Caches Sparsh Mittal, Jeffrey S. Vetter, Dong Li To cite this version: Sparsh Mittal, Jeffrey S. Vetter, Dong Li. A Survey Of Architectural Approaches for Managing Embedded DRAM and Non-volatile On-chip Caches. IEEE Transactions on Parallel and Distributed Systems, Institute of Electrical and Electronics Engineers, 2015, pp.14. 10.1109/TPDS.2014.2324563. hal-01102387 HAL Id: hal-01102387 https://hal.archives-ouvertes.fr/hal-01102387 Submitted on 12 Jan 2015 HAL is a multi-disciplinary open access L’archive ouverte pluridisciplinaire HAL, est archive for the deposit and dissemination of sci- destinée au dépôt et à la diffusion de documents entific research documents, whether they are pub- scientifiques de niveau recherche, publiés ou non, lished or not. The documents may come from émanant des établissements d’enseignement et de teaching and research institutions in France or recherche français ou étrangers, des laboratoires abroad, or from public or private research centers. publics ou privés. This is the author's version of an article that has been published in this journal. Changes were made to this version by the publisher prior to publication. The final version of record is available at http://dx.doi.org/10.1109/TPDS.2014.2324563 IEEE TRANSACTIONS ON PARALLEL AND DISTRIBUTING SYSTEMS 1 A Survey Of Architectural Approaches for Managing Embedded DRAM and Non-volatile On-chip Caches Sparsh Mittal, Member, IEEE, Jeffrey S. Vetter, Senior Member, IEEE, and Dong Li Abstract—Recent trends of CMOS scaling and increasing number of on-chip cores have led to a large increase in the size of on- chip caches. -
System Level Management of Hybrid Memory Systems
UNIVERSIDAD COMPLUTENSE DE MADRID FACULTAD DE INFORMÁTICA DEPARTAMENTO DE ARQUITECTURA DE COMPUTADORES Y AUTOMÁTICA TESIS DOCTORAL System Level Management of Hybrid Memory Systems Gestión de jerarquías de memoria híbridas a nivel de sistema MEMORIA PARA OPTAR AL GRADO DE DOCTOR PRESENTADA POR Manu Perumkunnil Komalan DIRECTORES José Ignacio Gómez Pérez Christian Tomás Tenllado Francky Catthoor Madrid, 2018 © Manu Perumkunnil Komalan, 2017 ARENBERG DOCTORAL SCHOOL Faculty of Engineering Science Universidad Complutense de Madrid Facultad de Informática Departamento de Arquitectura de Computadores y Automática System Level Management of Hybrid Memory Systems Gestión de jerarquías de memoria híbridas a nivel de sistema Manu Perumkunnil Komalan Supervisors Prof. dr. ir. José Ignacio Gómez Pérez (UCM) Prof. dr. ir. Christian Tomás Tenllado (UCM) Prof. dr. ir. Francky Catthoor (KU Leuven) March 2017 System Level Management of Hybrid Memory Sys tems Gestión de jerarquías de memoria híbridas a nivel de sistema Manu Perumkunnil KOMALAN Examination committee: Prof. dr. ir. José Ignacio Gómez Pérez Prof. dr. ir. Christian Tomás Tenllado Prof. dr. ir. Francky Catthoor Prof. dr. ir. Wim Dehaene Prof. dr. ir. Dirk Wouters Prof. dr. ir. Manuel Prieto Matías Prof. dr. ir. Luis Piñuel Prof. dr. ir. José Manuel Colmenar March 2017 2017, UC Madrid, KU Leuven, – Manu Perumkunnil Komalan Acknowledgments There is an impossibly long list of people I want to thank for helping me in the pursuit of my PhD and making it worth much more than simple technical jargon. Like I’ve been counseled many a times and experienced, my PhD like every other PhD has followed the trajectory of a sine wave.