Application Processor for Smartphone Packaging Technology & Cost Review Advanced Packaging Report by Stéphane ELISABETH November 2016

Application Processor for Smartphone Packaging Technology & Cost Review Advanced Packaging report by Stéphane ELISABETH November 2016

21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 1 Table of Contents

Overview / Introduction 3 Manufacturing Process Flow 73 o Executive Summary o Global Overview o AP I/O count & Footprint o Package Fabrication Unit o AP I/O count & L/S width Cost Analysis 76 o Reverse Costing Methodology o Synthesis of the cost analysis Company Profile 10 o Main Steps of Economic Analysis o Apple, Huawei, Samsung, Qualcomm o Yields Explanation & Hypotheses o Apple, Huawei, Samsung, Qualcomm AP history o Die cost 81 o Apple, Huawei, Samsung, Qualcomm Supply Chain History  Front-End Cost o iPhone 7 Plus, Huawei P9, Samsung Galaxy S7 Teardown  Wafer & Die Cost o PoP Packaging Technology o Package Manufacturing Cost 83 Physical Analysis 32  A10 Package Cost Breakdown o Synthesis of the Physical Analysis  Kirin 955 Package Cost Breakdown o Physical Analysis Methodology  Exynos 8 Package Cost Breakdown o A10, Kirin 955, Exynos 8, Snapdragon 820 Package 34  Snapdragon 820 Package Cost Breakdown  Package Views & Dimensions o Component Cost 88  Wafer/Panel & Component Cost  Package Opening  Component Cost Breakdown  Package Opening Comparison o PoP Cross-Section 47 Company services 91  Package Details Cross-Section  Package Cross-Section Comparison o Die & Land-Side Decoupling Capacitor Comparison 66  Die View & Dimensions  LSC Capacitor View & Dimensions  LSC Capacitor Footprint  Embedded LSC Capacitor Cross-Section  Soldered LSC Capacitor Cross-Section o Summary of the physical Data 72

Overview / Introduction o Executive Summary • Located under the DRAM chip on the main board, the application processors (AP) are packaged using PoP o Reverse Costing Methodology technology. The Apple A10 can be found in the iPhone 7 series. The HiSilicon Kirin 955 can be found in the o Glossary Huawei P9 and the Samsung Exynos 8 as the Qualcomm Snapdragon 820 can be found in the Samsung Company Profile & Supply Galaxy S7 series depending on the world version (US and Asia for the Snapdragon and International for the Chain Exynos).

Physical Analysis

Manufacturing Process Flow • In this report, we highlight the differences and the innovations of the packages chosen by the end-user OEMs. Whereas some AP provider like for HiSilicon or Samsung choose to consider conventional PoP with Cost Analysis embedded land-side capacitor (LSC), others like Apple or Qualcomm used innovative technologies like Fan- Selling Price Analysis Out PoP and silicon based Deep Trench LSC or embedded die packaging with advanced PCB substrate. The detailed comparison between the four players will give the pros and the cons of the packaging About System Plus technologies.

• This report also compares the costs of the different approaches and includes a detailed technical comparison between the packaging structure of the Qualcomm Snapdragon 820, the Samsung Exynos 8, the HiSilicon Kirin 955 and the Apple A10.

Overview / Introduction

Company Profile & Supply Chain o InvenSense o ICG-20660L Characteristics

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus Apple iPhone 7 Plus Main Board (Top view)

EU Version

Huawei P9 Main Board (Top view)

USA Version

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow o Global Overview o ASIC Front-End Process o MEMS Front-End Process o Packaging Process

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis o Synthesis o Supply Chain o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow o Global Overview o ASIC Front-End Process o MEMS Front-End Process o Packaging Process

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis o Synthesis o Supply Chain o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis o Synthesis o Supply Chain o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis FRANKFURT/MAIN Europa Sales Office Manufacturing Process Flow NANTES LYON Headquarter YOLE HQ Cost Analysis TOKYO PHOENIX YOLE KK Selling Price Analysis YOLE Inc. GREATER CHINA About System Plus YOLE o Company services o Feedbacks o Contact o Legal

Headquarters Europe Sales Office America Sales Office Asia Sales Office 21 rue La Noue Bras de Fer Lizzie LEVENEZ Steve LAFERRIERE Takashi ONOZAWA 44200 Nantes Frankfurt am Main Phoenix Tokyo FRANCE GERMANY USA JAPAN +33 2 40 18 09 16 +49 151 23 54 41 82 [email protected] [email protected] [email protected] [email protected] Mavis WANG GREATER CHINA [email protected] www.systemplus.fr

Overview / Introduction

Company Profile & Supply Chain DISCLAIMER Physical Analysis System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the Manufacturing Process Flow report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this Cost Analysis report. The quoted trademarks are property of their owners. Reverse Costing® is a deposed brand, by System Plus Consulting. Selling Price Analysis

About System Plus o Company services SERVICES o Feedbacks o Contact Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by o Legal industry experts. These results are open for discussion. We can reevaluate this circuit with your information.