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Application Processor for Smartphone Packaging Technology & Cost Review Advanced Packaging Report by Stéphane ELISABETH November 2016

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Application Processor for Smartphone Packaging Technology & Cost Review Advanced Packaging Report by Stéphane ELISABETH November 2016 Application Processor for Smartphone Packaging Technology & Cost Review Advanced Packaging report by Stéphane ELISABETH November 2016 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 1 Table of Contents Overview / Introduction 3 Manufacturing Process Flow 73 o Executive Summary o Global Overview o AP I/O count & Footprint o Package Fabrication Unit o AP I/O count & L/S width Cost Analysis 76 o Reverse Costing Methodology o Synthesis of the cost analysis Company Profile 10 o Main Steps of Economic Analysis o Apple, Huawei, Samsung, Qualcomm o Yields Explanation & Hypotheses o Apple, Huawei, Samsung, Qualcomm AP history o Die cost 81 o Apple, Huawei, Samsung, Qualcomm Supply Chain History Front-End Cost o iPhone 7 Plus, Huawei P9, Samsung Galaxy S7 Teardown Wafer & Die Cost o PoP Packaging Technology o Package Manufacturing Cost 83 Physical Analysis 32 A10 Package Cost Breakdown o Synthesis of the Physical Analysis Kirin 955 Package Cost Breakdown o Physical Analysis Methodology Exynos 8 Package Cost Breakdown o A10, Kirin 955, Exynos 8, Snapdragon 820 Package 34 Snapdragon 820 Package Cost Breakdown Package Views & Dimensions o Component Cost 88 Wafer/Panel & Component Cost Package Opening Component Cost Breakdown Package Opening Comparison o PoP Cross-Section 47 Company services 91 Package Details Cross-Section Package Cross-Section Comparison o Die & Land-Side Decoupling Capacitor Comparison 66 Die View & Dimensions LSC Capacitor View & Dimensions LSC Capacitor Footprint Embedded LSC Capacitor Cross-Section Soldered LSC Capacitor Cross-Section o Summary of the physical Data 72 ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 2 Executive Summary Overview / Introduction o Executive Summary • Located under the DRAM chip on the main board, the application processors (AP) are packaged using PoP o Reverse Costing Methodology technology. The Apple A10 can be found in the iPhone 7 series. The HiSilicon Kirin 955 can be found in the o Glossary Huawei P9 and the Samsung Exynos 8 as the Qualcomm Snapdragon 820 can be found in the Samsung Company Profile & Supply Galaxy S7 series depending on the world version (US and Asia for the Snapdragon and International for the Chain Exynos). Physical Analysis Manufacturing Process Flow • In this report, we highlight the differences and the innovations of the packages chosen by the end-user OEMs. Whereas some AP provider like for HiSilicon or Samsung choose to consider conventional PoP with Cost Analysis embedded land-side capacitor (LSC), others like Apple or Qualcomm used innovative technologies like Fan- Selling Price Analysis Out PoP and silicon based Deep Trench LSC or embedded die packaging with advanced PCB substrate. The detailed comparison between the four players will give the pros and the cons of the packaging About System Plus technologies. • This report also compares the costs of the different approaches and includes a detailed technical comparison between the packaging structure of the Qualcomm Snapdragon 820, the Samsung Exynos 8, the HiSilicon Kirin 955 and the Apple A10. ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 3 Smartphones Teardown Overview / Introduction Company Profile & Supply Chain o InvenSense o ICG-20660L Characteristics Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus Apple iPhone 7 Plus Main Board (Top view) EU Version Huawei P9 Main Board (Top view) USA Version Samsung Galaxy S7 Edge Main Board (Top view) ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 4 A10 Package View & Dimensions Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 5 A10 Package Opening Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 6 A10 Package Opening Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 7 Package Opening Comparison Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 8 A10 Package Cross-Section Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 9 A10 Package Cross-Section Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 10 Package Cross-Section Comparison Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 11 Dies Comparison Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 12 Packages Land-Side Decoupling Capacitor Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 13 Summary of the physical Data Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 14 Global Overview Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow o Global Overview o ASIC Front-End Process o MEMS Front-End Process o Packaging Process Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 15 A10 Wafer & Die Cost Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Synthesis o Supply Chain o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost Selling Price Analysis About System Plus ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 16 A10 Package Manufacturing Cost Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow o Global Overview o ASIC Front-End Process o MEMS Front-End Process o Packaging Process Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 17 Component Cost Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Synthesis o Supply Chain o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost Selling Price Analysis About System Plus ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 18 Component Cost Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Synthesis o Supply Chain o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost Selling Price Analysis About System Plus ©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 19 Contact Overview / Introduction Company Profile & Supply Chain Physical Analysis FRANKFURT/MAIN Europa Sales Office Manufacturing Process Flow NANTES LYON Headquarter YOLE HQ Cost Analysis TOKYO PHOENIX YOLE KK Selling Price Analysis YOLE Inc. GREATER CHINA About System Plus YOLE o Company services o Feedbacks o Contact o Legal Headquarters Europe Sales Office America Sales Office Asia Sales Office 21 rue La Noue Bras de Fer Lizzie LEVENEZ Steve LAFERRIERE Takashi ONOZAWA 44200 Nantes Frankfurt am Main Phoenix Tokyo FRANCE GERMANY USA JAPAN +33 2 40 18 09 16 +49 151 23 54 41 82 [email protected] [email protected] [email protected] [email protected] Mavis WANG GREATER CHINA [email protected] www.systemplus.fr ©2016 System Plus Consulting | 2016 Comparison of Application Processor
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