Tungsten-Titanium (W-Ti) Sputtering Targets

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ADVANCED MATERIALS GROUP Tungsten - Titanium Sputtering Targets Tungsten-Titanium (W-Ti) Sputtering Targets Materion Advanced Materials Group is an industry leader in producing superior quality products for thin film deposition markets and a worldwide supplier for W-Ti material. DATA SHEET Our high purity W-Ti sputtering targets are specifically developed to produce low defect and high performance W-Ti thin films. BENEFITS n Particulation rate is less than one FEATURES Competitor third our competitor’s due to our Our W-Ti targets’ microstructure low porosity and low inclusion and phase structure are customized content, engineered target for low particulation, high uniformity, surfaces and lack of ß (Ti-W). conductive films. n High deposition uniformity High density and low variability resulting from a consistent grain across the target size of less than 20μm, uniform n >98% bulk density phase structure, and high density n Less than <+/-0.5% density variation over the entire target. across targets n Consistent performance over Materion Low defect content including low the lifetime of the target due to porosity, and very low exogenous and uniform grain size, pore content, indigenous inclusions and phase structure through the target thickness. Minimal lamellar ß (Ti-W) phase n Large lot sizes for added target- Engineered target surfaces to suppress secondary flaking due to back to-target consistence for large deposition volume applications. n High Purity with low oxygen and low The above comparison of sputter deposited W-Ti films High purity for demanding shows the lower particulation rate associated with applications and high performance. alkali content. Purity levels available as high Materion targets relative to the competitor’s targets. as 99.999% n Surface engineered to minimize flaking, thus reducing extrinsic Large lot sizes allowing a larger APPLICATIONS number of targets from a single wafer defects and impairing nodule Materion is a leading supplier production lot formation on the target. of sputtering targets for W-Ti wafer Consistent grain sizes of less than bumping. W-Ti is also used as a diffusion 20μm both over the area of the target and barrier layer and as a capping layer in through the thickness interconnect metallization. Target Specifications Alloy Composition 5 - 30% wt% Ti Typically ±0.5wt% ADVANCED MATERIALS GROUP Compositional Tolerance Asia: +65 6559.4450 Purity Up to 99.999% Europe: +441 488.686056 USA: 800-327-1355 Grain size Typically <20μm MATERION CORPORATION Form factor Up to 17.5" (450mm) diameter monolithic www.materion.com.

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Repoussé Work for Amateurs
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