Programmable Address Generation Unit for Deep Neural Network Accelerators
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AMD Athlon™ Processor X86 Code Optimization Guide
AMD AthlonTM Processor x86 Code Optimization Guide © 2000 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD’s products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other applica- tion in which the failure of AMD’s product could create a situation where per- sonal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice. Trademarks AMD, the AMD logo, AMD Athlon, K6, 3DNow!, and combinations thereof, AMD-751, K86, and Super7 are trademarks, and AMD-K6 is a registered trademark of Advanced Micro Devices, Inc. Microsoft, Windows, and Windows NT are registered trademarks of Microsoft Corporation. -
Accenture AI Inferencing in Action
POV POV PUT YOUR AI SOLUTION ON STEROIDS POV PUT YOUR AI SOLUTION ON STEROIDS POINT OF VIEW POV PUT YOUR AI SOLUTION ON STEROIDS POV MATCH GPU PERFORMANCE AT HALF THE COST FOR AI INFERENCE WORKLOADS Proven CPU-based solution from Accenture and Intel boosts the performance and lowers the cost of AI inferencing by enabling an easy-to-deploy, scalable, and cost-efficient architecture AI INFERENCING—THE NEXT CRITICAL STEP AFTER AI ALGORITHM TRAINING Artificial Intelligence (AI) solutions include three main functions—identifying and preparing data, training an artificial intelligence algorithm, and using the algorithm for inferring new outcomes. Each function requires different compute recourses and deployment architecture. The choices of infrastructure components and technologies significantly impact the performance and costs associated with deploying an end-to-end AI solution. Data scientists and machine learning (ML) engineers spend significant time devising the right architecture for all stages of the AI pipeline. MODEL DATA TRAINING AND SCORING AND PREPARATION OPTIMIZATION INFERENCE Once an AI computer/algorithm has been trained through traditional or deep learning techniques, it can deliver value by interpreting data (i.e., inferring). Through inference, an AI algorithm can analyze data to: • Differentiate between various items • Identify trends and patterns that can be leveraged during decision-making • Reveal opportunities and possible solutions • Recognize voices, faces, images, etc. POV PUT YOUR AI SOLUTION ON STEROIDS POV Revealing hidden As we look to the future, AI inference will become increasingly possibilities— important to businesses operating in all segments—from health care to financial services to aerospace. And as the reliance on AI inference continues to grow, so Accenture AIP, does the importance of choosing the right AI infrastructure to support it. -
Chapter 5 Multiprocessors and Thread-Level Parallelism
Computer Architecture A Quantitative Approach, Fifth Edition Chapter 5 Multiprocessors and Thread-Level Parallelism Copyright © 2012, Elsevier Inc. All rights reserved. 1 Contents 1. Introduction 2. Centralized SMA – shared memory architecture 3. Performance of SMA 4. DMA – distributed memory architecture 5. Synchronization 6. Models of Consistency Copyright © 2012, Elsevier Inc. All rights reserved. 2 1. Introduction. Why multiprocessors? Need for more computing power Data intensive applications Utility computing requires powerful processors Several ways to increase processor performance Increased clock rate limited ability Architectural ILP, CPI – increasingly more difficult Multi-processor, multi-core systems more feasible based on current technologies Advantages of multiprocessors and multi-core Replication rather than unique design. Copyright © 2012, Elsevier Inc. All rights reserved. 3 Introduction Multiprocessor types Symmetric multiprocessors (SMP) Share single memory with uniform memory access/latency (UMA) Small number of cores Distributed shared memory (DSM) Memory distributed among processors. Non-uniform memory access/latency (NUMA) Processors connected via direct (switched) and non-direct (multi- hop) interconnection networks Copyright © 2012, Elsevier Inc. All rights reserved. 4 Important ideas Technology drives the solutions. Multi-cores have altered the game!! Thread-level parallelism (TLP) vs ILP. Computing and communication deeply intertwined. Write serialization exploits broadcast communication -
GPU Developments 2018
GPU Developments 2018 2018 GPU Developments 2018 © Copyright Jon Peddie Research 2019. All rights reserved. Reproduction in whole or in part is prohibited without written permission from Jon Peddie Research. This report is the property of Jon Peddie Research (JPR) and made available to a restricted number of clients only upon these terms and conditions. Agreement not to copy or disclose. This report and all future reports or other materials provided by JPR pursuant to this subscription (collectively, “Reports”) are protected by: (i) federal copyright, pursuant to the Copyright Act of 1976; and (ii) the nondisclosure provisions set forth immediately following. License, exclusive use, and agreement not to disclose. Reports are the trade secret property exclusively of JPR and are made available to a restricted number of clients, for their exclusive use and only upon the following terms and conditions. JPR grants site-wide license to read and utilize the information in the Reports, exclusively to the initial subscriber to the Reports, its subsidiaries, divisions, and employees (collectively, “Subscriber”). The Reports shall, at all times, be treated by Subscriber as proprietary and confidential documents, for internal use only. Subscriber agrees that it will not reproduce for or share any of the material in the Reports (“Material”) with any entity or individual other than Subscriber (“Shared Third Party”) (collectively, “Share” or “Sharing”), without the advance written permission of JPR. Subscriber shall be liable for any breach of this agreement and shall be subject to cancellation of its subscription to Reports. Without limiting this liability, Subscriber shall be liable for any damages suffered by JPR as a result of any Sharing of any Material, without advance written permission of JPR. -
Persistent Memory for Artificial Intelligence
Persistent Memory for Artificial Intelligence Bill Gervasi Principal Systems Architect [email protected] Santa Clara, CA August 2018 1 Demand Outpacing Capacity In-Memory Computing Artificial Intelligence Machine Learning Deep Learning Memory Demand DRAM Capacity Santa Clara, CA August 2018 2 Driving New Capacity Models Non-volatile memories Industry successfully snuggling large memories to the processors… Memory Demand DRAM Capacity …but we can do oh! so much more Santa Clara, CA August 2018 3 My Three Talks at FMS NVDIMM Analysis Memory Class Storage Artificial Intelligence Santa Clara, CA August 2018 4 History of Architectures Let’s go back in time… Santa Clara, CA August 2018 5 Historical Trends in Computing Edge Co- Computing Processing Power Failure Santa Clara, CA August 2018 Data Loss 6 Some Moments in History Central Distributed Processing Processing Shared Processor Processor per user Dumb terminals Peer-to-peer networks Santa Clara, CA August 2018 7 Some Moments in History Central Distributed Processing Processing “Native Signal Processing” Hercules graphics Main CPU drivers Sound Blaster audio Cheap analog I/O Rockwell modem Ethernet DSP Tightly-coupled coprocessing Santa Clara, CA August 2018 8 The Lone Survivor… Integrated graphics Graphics add-in cards …survived the NSP war Santa Clara, CA August 2018 9 Some Moments in History Central Distributed Processing Processing Phone providers Phone apps provide controlled all local services data processing Edge computing reduces latency Santa Clara, CA August 2018 10 When the Playing -
Benchmark Evaluations of Modern Multi Processor Vlsi Ds Pm Ps
1220 Session 1220 Benchmark Evaluations of Modern Multi-Processor VLSI DSPµPs Aaron L. Robinson and Fred O. Simons, Jr. High-Performance Computing and Simulation (HCS) Research Laboratory Electrical Engineering Department Florida A&M University and Florida State University Tallahassee, FL 32316-2175 Abstract - The authors continue their tradition of presenting technical reviews and performance comparisons of the newest multi-processor VLSI DSPµPs with the intention of providing concise focused analyses designed to help established or aspiring DSP analysts evaluate the applicability of new DSP technology to their specific applications. As in the past, the Analog Devices SHARCTM and Texas Instruments TMS320C80 families of DSPµPs will be the focus of our presentation because these manufacturers continue to push the envelop of new DSPµPs (Digital Signal Processing microProcessors) development. However, in addition to the standard performance analyses and benchmark evaluations, the authors will present a new image-processing bench marking technique designed specifically for evaluating new DSPµP image processing capabilities. 1. Introduction The combination of constantly evolving DSP algorithm development and continually advancing DSPuP hardware have formed the basis for an exponential growth in DSP applications. The increased market demand for these applications and their required hardware has resulted in the production of DSPuPs with very powerful components capable of performing a wide range of complicated operations. Due to the complicated architectures of these new processors, it would be time consuming for even the experienced DSP analysts to review and evaluate these new DSPuPs. Furthermore, the inexperienced DSP analysts would find it even more time consuming, and possibly very difficult to appreciate the significance and opportunities for these new components. -
AI Accelerator Latencies in Hybrid Vehicular Simulation
AI Accelerator Latencies in Hybrid Vehicular Simulation Jussi Hanhirova Matias Hyyppä Abstract Aalto University Aalto University We study the use of accelerators for vehicular AI (Artifi- Espoo, Finland Espoo, Finland cial Intelligence) applications. Managing the computation jussi.hanhirova@aalto.fi juho.hyyppa@aalto.fi is complex as vehicular AI applications call for high per- formance computations in a real-time distributed environ- ment, in which low and predictable latencies are essential. We have used the CARLA simulator together with machine learning based on CNNs (Convolutional Neural Networks) in our research. In this paper, we present the latency be- Anton Debner Vesa Hirvisalo havior with GPU acceleration for CNN processing. Our ex- Aalto University Aalto University perimentation is motivated by using the simulator to find the Espoo, Finland Espoo, Finland corner cases that are demanding for the accelerated CNN anton.debner@aalto.fi vesa.hirvisalo@aalto.fi processing. Author Keywords Computation acceleration; GPU; deep learning ACM Classification Keywords D.4.8 [Performance]: Simulation; I.2.9 [Robotics]: Autonomous vehicles; I.3.7 [Three-Dimensional Graphics and Realism]: Virtual reality Introduction In this paper, we address the usage of accelerators in ve- hicular AI (Artificial Intelligence) systems and in the simula- tors that are needed in the development of such systems. The recent development of AI system is enabling many new Convolutional Neural Net- applications including autonomous driving of motor vehi- software [5] together with deep learning based inference on works (CNN) are a specific cles on public roads. Many of such systems process sen- TensorFlow [6]. Our measurements show the basic viability class of neural networks that sor data related to environment perception in real-time, be- of the hybrid simulation approach, but they also underline are often used in deep form cause they trigger actions which have latency requirements. -
Computer Organization & Architecture Eie
COMPUTER ORGANIZATION & ARCHITECTURE EIE 411 Course Lecturer: Engr Banji Adedayo. Reg COREN. The characteristics of different computers vary considerably from category to category. Computers for data processing activities have different features than those with scientific features. Even computers configured within the same application area have variations in design. Computer architecture is the science of integrating those components to achieve a level of functionality and performance. It is logical organization or designs of the hardware that make up the computer system. The internal organization of a digital system is defined by the sequence of micro operations it performs on the data stored in its registers. The internal structure of a MICRO-PROCESSOR is called its architecture and includes the number lay out and functionality of registers, memory cell, decoders, controllers and clocks. HISTORY OF COMPUTER HARDWARE The first use of the word ‘Computer’ was recorded in 1613, referring to a person who carried out calculation or computation. A brief History: Computer as we all know 2day had its beginning with 19th century English Mathematics Professor named Chales Babage. He designed the analytical engine and it was this design that the basic frame work of the computer of today are based on. 1st Generation 1937-1946 The first electronic digital computer was built by Dr John V. Atanasoff & Berry Cliford (ABC). In 1943 an electronic computer named colossus was built for military. 1946 – The first general purpose digital computer- the Electronic Numerical Integrator and computer (ENIAC) was built. This computer weighed 30 tons and had 18,000 vacuum tubes which were used for processing. -
Parallel Computer Architecture
Parallel Computer Architecture Introduction to Parallel Computing CIS 410/510 Department of Computer and Information Science Lecture 2 – Parallel Architecture Outline q Parallel architecture types q Instruction-level parallelism q Vector processing q SIMD q Shared memory ❍ Memory organization: UMA, NUMA ❍ Coherency: CC-UMA, CC-NUMA q Interconnection networks q Distributed memory q Clusters q Clusters of SMPs q Heterogeneous clusters of SMPs Introduction to Parallel Computing, University of Oregon, IPCC Lecture 2 – Parallel Architecture 2 Parallel Architecture Types • Uniprocessor • Shared Memory – Scalar processor Multiprocessor (SMP) processor – Shared memory address space – Bus-based memory system memory processor … processor – Vector processor bus processor vector memory memory – Interconnection network – Single Instruction Multiple processor … processor Data (SIMD) network processor … … memory memory Introduction to Parallel Computing, University of Oregon, IPCC Lecture 2 – Parallel Architecture 3 Parallel Architecture Types (2) • Distributed Memory • Cluster of SMPs Multiprocessor – Shared memory addressing – Message passing within SMP node between nodes – Message passing between SMP memory memory nodes … M M processor processor … … P … P P P interconnec2on network network interface interconnec2on network processor processor … P … P P … P memory memory … M M – Massively Parallel Processor (MPP) – Can also be regarded as MPP if • Many, many processors processor number is large Introduction to Parallel Computing, University of Oregon, -
(12) Patent Application Publication (10) Pub. No.: US 2011/0231717 A1 HUR Et Al
US 20110231717A1 (19) United States (12) Patent Application Publication (10) Pub. No.: US 2011/0231717 A1 HUR et al. (43) Pub. Date: Sep. 22, 2011 (54) SEMICONDUCTOR MEMORY DEVICE Publication Classification (76) Inventors: Hwang HUR, Kyoungki-do (KR): ( 51) Int. Cl. Chang-Ho Do, Kyoungki-do (KR): C. % CR Jae-Bum Ko, Kyoungki-do (KR); ( .01) Jin-Il Chung, Kyoungki-do (KR) (21) Appl. N 13A149,683 (52) U.S. Cl. ................................. 714/718; 714/E11.145 ppl. No.: 9 (22)22) FileFiled: Mavay 31,51, 2011 (57) ABSTRACT Related U.S. Application Data Semiconductor memory device includes a cell array includ (62) Division of application No. 12/154,870, filed on May ing a plurality of unit cells; and a test circuit configured to 28, 2008, now Pat. No. 7,979,758. perform a built-in self-stress (BISS) test for detecting a defect by performing a plurality of internal operations including a (30) Foreign Application Priority Data write operation through an access to the unit cells using a plurality of patterns during a test procedure carried out at a Feb. 29, 2008 (KR) ............................. 2008-OO18761 wafer-level. O 2 FAD MoDE PE, FRS PWD PADX8 GENERATOR EAELER PEC 3. PD) PWDC CRECKCCES CKCKB RASCASECSCE SISTE CLOCKBUFFER CEE e EST CLK BSI RASCASECSCKE WREFB ESTE s ACTF 32 P 8:W 4. 38t.A 3. se. A(2) FIRST REFRESH AKE13A2) REFIREFA CONTROR ROWANC RSBSAApp.12BS ARS BA255612.ESE E L - ww.i. 33 EE 3. PE PWDA RAE7(3) ECS issi: OLREFB SECOND LAK:2) BSDT DATABUFFERG08 EABLER REFIREFA SECON REFRESH BSE Y ADDRC CONTROLLER BST YEADDK)) PWS Testaposs WKB811-12 BAADDICBAAD BSYBRST (88.11:12) "Of BST CLK 380 3. -
Unified Inference and Training at the Edge
Unified Inference and Training at the Edge By Linley Gwennap Principal Analyst October 2020 www.linleygroup.com Unified Inference and Training at the Edge By Linley Gwennap, Principal Analyst, The Linley Group As more edge devices add AI capabilities, some applications are becoming increasingly complex. Wearables and other IoT devices often have multiple sensors, requiring different neural networks for each sensor, or they may use a single complex network to combine all the input data, a tech- nique called sensor fusion. Others implement on-device training to customize the application. The GPX-10 processor can handle these advanced AI applications while keeping power to a minimum. Ambient Scientific sponsored this white paper, but the opinions and analysis are those of the author. Introduction As more IoT products implement AI inferencing on the device, some applications are becoming increasingly complex. Instead of just a single sensor, they may have several, such as a wearable device that has accelerometer, pulse rate, and temperature sensors. Each sensor may require a different neural network, or a single complex network can combine all the input data, a technique called sensor fusion. A microcontroller (e.g., Cortex-M) or DSP can handle a single sensor, but these simple cores are inefficient for more complex IoT applications. Training introduces additional complication to edge devices. Today’s neural networks are trained in the cloud using generic data from many users. This approach takes advan- tage of the massive compute power in cloud data centers, but it creates a one-size-fits-all AI model. The trained model can be distributed to many devices, but even if each device performs the inferencing, the model performs the same way for all users. -
Low-Power Ultra-Small Edge AI Accelerators for Image Recog- Nition with Convolution Neural Networks: Analysis and Future Directions
Preprints (www.preprints.org) | NOT PEER-REVIEWED | Posted: 16 July 2021 doi:10.20944/preprints202107.0375.v1 Review Low-power Ultra-small Edge AI Accelerators for Image Recog- nition with Convolution Neural Networks: Analysis and Future Directions Weison Lin 1, *, Adewale Adetomi 1 and Tughrul Arslan 1 1 Institute for Integrated Micro and Nano Systems, University of Edinburgh, Edinburgh EH9 3FF, UK; [email protected]; [email protected] * Correspondence: [email protected] Abstract: Edge AI accelerators have been emerging as a solution for near customers’ applications in areas such as unmanned aerial vehicles (UAVs), image recognition sensors, wearable devices, ro- botics, and remote sensing satellites. These applications not only require meeting performance tar- gets but also meeting strict reliability and resilience constraints due to operations in harsh and hos- tile environments. Numerous research articles have been proposed, but not all of these include full specifications. Most of these tend to compare their architecture with other existing CPUs, GPUs, or other reference research. This implies that the performance results of the articles are not compre- hensive. Thus, this work lists the three key features in the specifications such as computation ability, power consumption, and the area size of prior art edge AI accelerators and the CGRA accelerators during the past few years to define and evaluate the low power ultra-small edge AI accelerators. We introduce the actual evaluation results showing the trend in edge AI accelerator design about key performance metrics to guide designers on the actual performance of existing edge AI acceler- ators’ capability and provide future design directions and trends for other applications with chal- lenging constraints.