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Icrp-7/Spp-28/Gec-63 Second Announcement and Call for Papers ICRP-7/SPP-28/GEC-63 October 4 - 8, 2010 Maison de la Chimie Paris, France 7th International Conference on Reactive Plasmas, 28th Symposium on Plasma Processing and 63rd Gaseous Electronics Conference Sponsored by The Japan Society of Applied Physics American Physical Society http://www.plasma.engg.nagoya-u.ac.jp/icrp-7/ Cooperative Societies The Ceramic Society of Japan The Chemical Society of Japan The Electrochemical Society of Japan The Fullerenes and Nanotubes Research Society The Illuminating Engineering Institute of Japan The Institute of Electrical Engineers of Japan The Institute of Electronics, Information and Communication Engineers The Institute of Electrostatics Japan The Institute of Engineers on Electrical Discharges in Japan The Iron and Steel Institute of Japan The Japan Society for Aeronautical and Space Sciences The Japan Society of Plasma Science and Nuclear Fusion Research The Japan Institute of Metals Japan Ozone Association Japanese Society for Medical and Biological Engineering Japan Welding Society The Laser Society of Japan The Physical Society of Japan The Society for Atomic Collision Research The Society of Chemical Engineers, Japan The Society of Polymer Science, Japan The Surface Finishing Society of Japan The Surface Science Society of Japan The Vacuum Society of Japan Contents Cooperative Societies ................................................................ 1 General Information ................................................................ 2 Scientific Program ................................................................... 3 Contributed Papers ................................................................... 7 Committees .............................................................................. 8 Social Events ............................................................................ 10 Registration ............................................................................. 10 Hotel Accommodation ............................................................. 10 Visas ......................................................................................... 11 Calendar of Events ..................................................................11 Travel Information ................................................................... 12 - 1 - General Information The International Conference on Reactive Plasmas (ICRP) has been held in Japan since 1991, organized on the initiative of the Division of Plasma Electronics, The Japan Society of Applied Physics: the 1st in Nagoya, the 2nd in Yokohama, 1994, the 3rd in Nara, 1997 and the 6th in Matsushima, 2006. ICRP have been also held as joint conference, i.e., the 4th ICRP with GEC and the 5th ICRP with ESCAMPIG in Hawaii, 1998 and Grenoble, 2002, respectively. The Symposium on Plasma Processing (SPP) is an annual domestic meeting, which has also been held by the Plasma Electronics Division since 1984. The joint conference ICRP/SPP is aimed at bringing together the researchers and engineers involved in various aspects of reactive plasmas and their applications, and at facilitating the exchange of information and ideas among them within an international framework. Subjects cover the entire field of reactive plasmas and their applications to surface modification, etching, deposition, and other materials processing, with emphasis on basic phenomena and technologies and the underlying basic physics and chemistry. The conference particularly encourages papers dealing with basic properties of the plasma itself, its generation and control, fundamental processes in the plasma, and plasma-solid interactions; papers dealing with specific results of processing should place emphasis on the related plasma characteristics in obtaining the results. The 7th International Conference on Reactive Plasmas will be held in October 4-8, 2010, in Paris, France, joined with 63rd Gaseous Electronics Conference and the 28th Symposium on Plasma Processing. The conference site “Maison de la Chimie” is located in downtown of Paris, one of the famous cities in the world. The ICRP-7/SPP-28/GEC-63, a five-day conference, will consist of parallel oral sessions (composed of both invited and contributed papers), poster sessions, and so on. Sessions will be organized around coherent subjects in order to facilitate useful discussions and focus on appropriate solutions to problems. The official language of the conference is English, and will be used for all presentations and printed materials. - 2 - Scientific Program Conference Topics General Sessions: 1 Atomic and Molecular Processes 1.1 Electron and photon collisions with atoms and molecules: excitation 1.2 Electron and photon collisions with atoms and molecules: ionization 1.3 Heavy particle collisions 1.4 Dissociation, recombination and attachment 1.5 Distribution functions and transport coefficients for electrons and ions 1.6 Other atomic and molecular collision phenomena 2 Plasma science 2.1 Nonequilibrium kinetics of low-temperature plasmas 2.2 Basic plasma physics phenomena in low-temperature plasmas 2.3 Plasma boundaries: sheaths, boundary layers, others 2.4 Gas phase plasma chemistry 2.5 Plasma-surface interactions 2.6 Plasma diagnostic techniques 2.7 Modeling and simulation 2.8 Glows: dc, pulsed, microwave, others 2.9 Capacitively coupled plasmas 2.10 Inductively coupled plasmas 2.11 Magnetically-enhanced plasmas: ECR, helicon, magnetron, others 2.12 High pressure discharges: Dielectric barrier discharges, coronas, breakdown, sparks 2.13 Microdischarges: dc, rf, microwave 2.14 Thermal plasmas: arcs, jets, switches, others 2.15 Plasmas in liquids 2.16 Negative ion and dust particle containing plasmas 2.17 Other plasma science topics 3 Plasma applications 3.1 Plasmas for light production: laser media, glows, arcs, flat panels and novel sources 3.2 Plasma etching 3.3 Plasma deposition 3.4 Plasma Ion Implantation 3.5 Green Plasma technologies: Environmental and energy applications 3.6 Plasma processing for photovoltaic applications 3.7 Biological and biomedical applications of plasmas 3.8 Plasma propulsion and Aerodynamics 3.9 Plasmas for nanotechnologies, flexible electronics and other emerging applications High-frequency gas breakdown workshop: (4th October, 2010) Collision data archive project: (4th October, 2010) Tuesday Evening Session: (5th October, 2010) History and future of plasma processing and collision physics - 3 - Plenary and Invited Speakers (tentative) <Allis Prize and Plenary> Allis Prize M. Kushner, University of Michigan (USA) "Controlling the Properties of Low Temperature Plasmas: The Role of Modelling in Investigating the Science & Developing the Technology." ICRP Plenary Speakers R. Hatakeyama, Tohoku University, Japan "Plasma Processing Power for Nanocarbon Nanobioelectronics." J. Meier, Oerlikon Solar AG, Switzerland "Thin Film Silicon Solar Cells and Modules Deposited by PECVD: From R&D Lab Developments to Large-Area Production Tools." <General Session> Modeling and Simulation A. Fruchtman, Holon Institute of Technology, Israel "The effect of neutral-gas depletion on the plasma density and momentum." Particles and Dust H. Kobayashi, Hitachi Ltd., Japan "Behavior of particles in plasma etching apparatus." Microplasmas and Atmospheric Pressure Plasmas D. O'Connell, Queen's University Belfast, UK "Interactions of multiple atmospheric pressure plasma jets and DNA." F. Iza, Loughborough University, UK "Experimental and computational characterization of He+H2O plasmas at atmospheric pressure." Plasma Thrusters S. Mazouffre, ICARE, France "Ion and atom flow in a Hall discharge: Impact of operating parameters." Plasma Production and Control G. H. Kim, Seoul National University, Korea (to be confirmed) R. Bravenec, Tokyo Electron America, USA "Simulations of plasma formation and sustainment in an RLSA (radial-line slot antenna) microwave plasma source." Plasma Diagnostics G. Hebner, Sandia National Lab, USA "Energy transport and frequency dependent ion kinetics in a capacitively coupled plasma reactor" H. Y. Chang, KAIST, Korea "Advanced plasma sources for large area processes." J. Boffard, University of Wisconsin, USA "Optical diagnostics using spectroscopic measurements of rare gases." - 4 - Plasma Etching K. Ono, Kyoto University, Japan "Plasma-surface interactions in plasma etching processes for nanometer-scaled microelectronic devices." H. Hayashi, Toshiba Corporation, Japan "Fine ion energy control for sub-32 nm node device RIE using pulsed-DC superimposed 100 MHz rf CCP." O. Joubert, CNRS-LTM, France "Synchronised pulsed plasmas: potential process improvements for patterning technologies." Plasma Deposition K. Yasutake, Osaka University, Japan “Purified Si Film Formation from Metallurgical-Grade Si by Hydrogen Plasma Induced Chemical Transport." Plasma Interaction and Surface Modification R. D. Mundo, University of Bari, Italy "Plasma nanotexturing of polymers in single step processes for superior wetting and optical performance." H. P. Brinkmann, Ruhr University Bochum, Germany "The Multiple Resonance Probe-Concept, Theory, Experiments." Plasma Nanotechnology and Bio R. M. Sankaran, Case Western Reserve, USA "Bottom-up approaches to plasma synthesis of nanomaterials." U. Cvelbar, Jozef Stefan Institute, Slovenia "Blood--bicompatiable materials via Plasma Processing." J. K. Lee, Pohang University of Science and Technology, Korea "Plasma Biomedicine: Experiments and Modeling." Capacitively Coupled Plasmas Z. Donko, Research Institute for Solid
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