Improving DRAM Performance by Parallelizing Refreshes
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Product Guide SAMSUNG ELECTRONICS RESERVES the RIGHT to CHANGE PRODUCTS, INFORMATION and SPECIFICATIONS WITHOUT NOTICE
May. 2018 DDR4 SDRAM Memory Product Guide SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or other- wise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. © 2018 Samsung Electronics Co., Ltd. All rights reserved. - 1 - May. 2018 Product Guide DDR4 SDRAM Memory 1. DDR4 SDRAM MEMORY ORDERING INFORMATION 1 2 3 4 5 6 7 8 9 10 11 K 4 A X X X X X X X - X X X X SAMSUNG Memory Speed DRAM Temp & Power DRAM Type Package Type Density Revision Bit Organization Interface (VDD, VDDQ) # of Internal Banks 1. SAMSUNG Memory : K 8. Revision M: 1st Gen. A: 2nd Gen. 2. DRAM : 4 B: 3rd Gen. C: 4th Gen. D: 5th Gen. -
You Need to Know About Ddr4
Overcoming DDR Challenges in High-Performance Designs Mazyar Razzaz, Applications Engineering Jeff Steinheider, Product Marketing September 2018 | AMF-NET-T3267 Company Public – NXP, the NXP logo, and NXP secure connections for a smarter world are trademarks of NXP B.V. All other product or service names are the property of their respective owners. © 2018 NXP B.V. Agenda • Basic DDR SDRAM Structure • DDR3 vs. DDR4 SDRAM Differences • DDR Bring up Issues • Configurations and Validation via QCVS Tool COMPANY PUBLIC 1 BASIC DDR SDRAM STRUCTURE COMPANY PUBLIC 2 Single Transistor Memory Cell Access Transistor Column (bit) line Row (word) line G S D “1” => Vcc “0” => Gnd “precharged” to Vcc/2 Cbit Ccol Storage Parasitic Line Capacitor Vcc/2 Capacitance COMPANY PUBLIC 3 Memory Arrays B0 B1 B2 B3 B4 B5 B6 B7 ROW ADDRESS DECODER ADDRESS ROW W0 W1 W2 SENSE AMPS & WRITE DRIVERS COLUMN ADDRESS DECODER COMPANY PUBLIC 4 Internal Memory Banks • Multiple arrays organized into banks • Multiple banks per memory device − DDR3 – 8 banks, and 3 bank address (BA) bits − DDR4 – 16 banks with 4 banks in each of 4 sub bank groups − Can have one active row in each bank at any given time • Concurrency − Can be opening or closing a row in one bank while accessing another bank Bank 0 Bank 1 Bank 2 Bank 3 Row 0 Row 1 Row 2 Row 3 Row … Row Buffers COMPANY PUBLIC 5 Memory Access • A requested row is ACTIVATED and made accessible through the bank’s row buffers • READ and/or WRITE are issued to the active row in the row buffers • The row is PRECHARGED and is no longer -
NON-CONFIDENTIAL for Publication COMP
EUROPEAN COMMISSION Brussels, 15.1.2010 SG-Greffe(2010) D/275 C(2010) 150 Subject: Case COMP/C-3/ 38 636 Rambus (Please quote this reference in all correspondence) […]* 1. I refer to Hynix' complaint to the Commission of 18 December 2002 lodged jointly with Infineon pursuant to Article 3 of Council Regulation No. 17/621 against Rambus Inc. ("Rambus"), an undertaking incorporated in 1990 in California and reincorporated in Delaware, USA, in 1997, with its principal place of business in Los Altos, California, regarding alleged violations of Article 101 and Article 102 of the Treaty on the Functioning of the European Union ("TFEU")2 in connection with computer memory chips which are known as synchronous DRAM chips ("the Complaint"). I also refer to the letters listed here below, by which Hynix provided additional information/explanations on the above matter, as well as the Commission’s letter of 13 October 2009 ["Article 7 letter"] addressed to Hynix in that matter and the response to the Article 7 letter of 12 November 2009. […] 2. For the reasons set out below, the Commission considers that there is no sufficient degree of Community interest for conducting a further investigation into the alleged infringement and rejects your complaint pursuant to Article 7(2) of the Commission Regulation (EC) 773/20043. * This version of the Commission Decision of 15.1.2010 does not contain any business secrets or other confidential information. 1 Regulation No. 17 of the Council of 6 February 1962, First Regulation implementing Articles 85 and 86 of the Treaty (OJ No. 13, 21.2.1962, p. -
Refresh Now and Then Seungjae Baek, Member, IEEE, Sangyeun Cho, Senior Member, IEEE, and Rami Melhem, Fellow, IEEE
IEEE TRANSACTIONS ON COMPUTERS 1 Refresh Now and Then Seungjae Baek, Member, IEEE, Sangyeun Cho, Senior Member, IEEE, and Rami Melhem, Fellow, IEEE Abstract—DRAM stores information in electric charge. Because DRAM cells lose stored charge over time due to leakage, they have to be “refreshed” in a periodic manner to retain the stored information. This refresh activity is a source of increased energy consumption as the DRAM density grows. It also incurs non-trivial performance loss due to the unavailability of memory arrays during refresh. This paper first presents a comprehensive measurement based characterization study of the cell-level data retention behavior of modern low-power DRAM chips. 99.7% of the cells could retain the stored information for longer than 1 second at a high temperature. This average cell retention behavior strongly indicates that we can deeply reduce the energy and performance penalty of DRAM refreshing with proper system support. The second part of this paper, accordingly, develops two practical techniques to reduce the frequency of DRAM refresh operations by excluding a few leaky memory cells from use and by skipping refreshing of unused DRAM regions. We have implemented the proposed techniques completely in the Linux OS for experimentation, and measured performance improvement of up to 17.2% with the refresh operation reduction of 93.8% on smartphone like low-power platforms. Index Terms—SDRAM, refresh operation, power consumption, performance improvement. ✦ 1 INTRODUCTION again. Refresh period, the time interval within which we RAM is commonly used in a computer system’s main must walk through all rows once, is typically 32 ms or D memory. -
Datasheet DDR4 SDRAM Revision History
Rev. 1.4, Apr. 2018 M378A5244CB0 M378A1K43CB2 M378A2K43CB1 288pin Unbuffered DIMM based on 8Gb C-die 78FBGA with Lead-Free & Halogen-Free (RoHS compliant) datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or other- wise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. © 2018 Samsung Electronics Co., Ltd.GG All rights reserved. - 1 - Rev. 1.4 Unbuffered DIMM datasheet DDR4 SDRAM Revision History Revision No. History Draft Date Remark Editor 1.0 - First SPEC. Release 27th Jun. 2016 - J.Y.Lee 1.1 - Deletion of Function Block Diagram [M378A1K43CB2] on page 11 29th Jun. 2016 - J.Y.Lee - Change of Physical Dimensions [M378A1K43CB1] on page 41 1.11 - Correction of Typo 7th Mar. 2017 - J.Y.Lee 1.2 - Change of Physical Dimensions [M378A1K43CB1] on page 41 23h Mar. -
Memory & Storage Challenges and Solutions
Memory & Storage Challenges and Solutions G S A 2 0 1 9 Jinman Han Senior Vice President, Memory Product Planning & Application Engineering Legal Disclaimer This presentation is intended to provide information concerning SSD and memory industry. We do our best to make sure that information presented is accurate and fully up-to-date. However, the presentation may be subject to technical inaccuracies, information that is not up-to-date or typographical errors. As a consequence, Samsung does not in any way guarantee the accuracy or completeness of information provided on this presentation. The information in this presentation or accompanying oral statements may include forward-looking statements. These forward-looking statements include all matters that are not historical facts, statements regarding the Samsung Electronics' intentions, beliefs or current expectations concerning, among other things, market prospects, growth, strategies, and the industry in which Samsung operates. By their nature, forward- looking statements involve risks and uncertainties, because they relate to events and depend on circumstances that may or may not occur in the future. Samsung cautions you that forward looking statements are not guarantees of future performance and that the actual developments of Samsung, the market, or industry in which Samsung operates may differ materially from those made or suggested by the forward-looking statements contained in this presentation or in the accompanying oral statements. In addition, even if the information contained herein or the oral statements are shown to be accurate, those developments may not be indicative developments in future periods. Abstract Memory-centric system innovation is the overarching theme of modern semiconductor technology and is one of the crucial driving forces of the future IT world. -
DDR4 8Gb C Die Unbuffered SODIMM Rev1.5 Apr.18.Book
Rev. 1.5, Apr. 2018 M471A5244CB0 M471A1K43CB1 M471A2K43CB1 260pin Unbuffered SODIMM based on 8Gb C-die 78FBGA with Lead-Free & Halogen-Free (RoHS compliant) datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or other- wise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. © 2018 Samsung Electronics Co., Ltd. All rights reserved. - 1 - Rev. 1.5 Unbuffered SODIMM datasheet DDR4 SDRAM Revision History Revision No. History Draft Date Remark Editor 1.0 - First SPEC. Release 27th Jun. 2016 - J.Y.Lee 1.1 - Change of Function Block Diagram [M471A1K43CB1] on page 10~11 29th Jun. 2016 - J.Y.Lee - Change of Physical Dimensions on page 42~43 1.2 - Change of Physical Dimensions on page 42~43 24th Feb. -
Performance Evaluation and Feasibility Study of Near-Data Processing on DRAM Modules (DIMM-NDP) for Scientific Applications Matthias Gries, Pau Cabré, Julio Gago
Performance Evaluation and Feasibility Study of Near-data Processing on DRAM Modules (DIMM-NDP) for Scientific Applications Matthias Gries, Pau Cabré, Julio Gago To cite this version: Matthias Gries, Pau Cabré, Julio Gago. Performance Evaluation and Feasibility Study of Near-data Processing on DRAM Modules (DIMM-NDP) for Scientific Applications. [Technical Report] Huawei Technologies Duesseldorf GmbH, Munich Research Center (MRC). 2019. hal-02100477 HAL Id: hal-02100477 https://hal.archives-ouvertes.fr/hal-02100477 Submitted on 15 Apr 2019 HAL is a multi-disciplinary open access L’archive ouverte pluridisciplinaire HAL, est archive for the deposit and dissemination of sci- destinée au dépôt et à la diffusion de documents entific research documents, whether they are pub- scientifiques de niveau recherche, publiés ou non, lished or not. The documents may come from émanant des établissements d’enseignement et de teaching and research institutions in France or recherche français ou étrangers, des laboratoires abroad, or from public or private research centers. publics ou privés. TECHNICAL REPORT MRC-2019-04-15-R1, HUAWEI TECHNOLOGIES, MUNICH RESEARCH CENTER, GERMANY, APRIL 2019 1 Performance Evaluation and Feasibility Study of Near-data Processing on DRAM Modules (DIMM-NDP) for Scientific Applications Matthias Gries , Pau Cabre,´ Julio Gago Abstract—As the performance of DRAM devices falls more and more behind computing capabilities, the limitations of the memory and power walls are imminent. We propose a practical Near-Data Processing (NDP) architecture DIMM-NDP for mitigating the effects of the memory wall in the nearer-term targeting server applications for scientific computing. DIMM-NDP exploits existing but unused DRAM bandwidth on memory modules (DIMMs) and takes advantage of a subset of the forthcoming JEDEC NVDIMM-P protocol in order to integrate application-specific, programmable functionality near memory. -
Low Power DRAM Evolution Osamu Nagashima Executive Professional Micron Memory Japan
Low Power DRAM Evolution Osamu Nagashima Executive Professional Micron Memory Japan JEDEC Mobile Copyright © 2016 Micron Technology, Inc & IOT Forum How We Got Here • Low Power DRAM evolved from a lower- voltage, lower-performance version of PC-DRAM designed for mobile packages to become one of the highest bandwidth-per-pin DRAMs available • High resolution displays, high-resolution cameras, and 3D rendered content are the primary drivers for increased bandwidth in mobile devices Mainstream DRAM Datarate by Type and Year of Introduction 4500 4000 3500 3000 2500 2000 1500 1000 500 0 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 LPDDR PC-DDR Evolution of Mainstream DRAM Energy Power Evolution 50.00 DDR2 DDR3 DDR4 LPDDR2 LPDDR3 LPDDR4 ENERGY, PJ/BITENERGY, 0.00 500 1000 1500 2000 2500 3000 3500 4000 4500 DATA RATE, MBPS Typical Mobile Device Usage 2% 8% 100% 4% 4% • The percentage of 20% 80% active usage has 20% 24% greatly increased in 60% recent years, driving 22% 13% an increase in 40% 12% memory bandwidth 20% 37% 34% • This has shifted 0% limitations from Heavy user Light user standby battery life to active battery life and Read Energy Write Energy Activate Energy thermal limits Standby Energy Refresh Energy Self Refresh Energy Near-Term Future • This evolution of system limitations is driving future LPDRAM architectures, beginning with the evolution of the LPDDR4 standard • Responding to the need for lower power, JEDEC is developing a reduced-I/O power version of LPDDR4, called LPDDR4X • LPDDR4X will reduce the Vddq level from 1.1v to 0.6v • Signaling swing will remain similar to LPDDR4 – This allows the same receiver designs and specifications to be used for both LPDDR4 and LPDDR4X LPDDR4X: I/O Energy Reduction • Reducing Vddq from 1.1v to 0.6v produces about 40% I/O energy savings LPDDR4 vs. -
SDRAM Memory Systems: Architecture Overview and Design Verification SDRAM Memory Systems: Architecture Overview and Design Verification Primer
Primer SDRAM Memory Systems: Architecture Overview and Design Verification SDRAM Memory Systems: Architecture Overview and Design Verification Primer Table of Contents Introduction . 3 - 4 DRAM Trends . .3 DRAM . 4 - 6 SDRAM . 6 - 9 DDR SDRAM . .6 DDR2 SDRAM . .7 DDR3 SDRAM . .8 DDR4 SDRAM . .9 GDDR and LPDDR . .9 DIMMs . 9 - 13 DIMM Physical Size . 9 DIMM Data Width . 9 DIMM Rank . .10 DIMM Memory Size & Speed . .10 DIMM Architecture . .10 Serial Presence Detect . .12 Memory System Design . .13 - 15 Design Simulation . .13 Design Verification . .13 Verification Strategy . .13 SDRAM Verification . .14 Glossary . .16 - 19 2 www.tektronix.com/memory SDRAM Memory Systems: Architecture Overview and Design Verification Primer Introduction Memory needs to be compatible with a wide variety of memory controller hubs used by the computer DRAM (Dynamic Random Access Memory) is attractive to manufacturers. designers because it provides a broad range of performance Memory needs to work when a mixture of different and is used in a wide variety of memory system designs for manufacturer’s memories is used in the same memory computers and embedded systems. This DRAM memory system of the computer. primer provides an overview of DRAM concepts, presents potential future DRAM developments and offers an overview Open memory standards are useful in helping to ensure for memory design improvement through verification. memory compatibility. DRAM Trends On the other hand, embedded systems typically use a fixed There is a continual demand for computer memories to be memory configuration, meaning the user does not modify larger, faster, lower powered and physically smaller. These the memory system after purchasing the product. -
Ddr4 Sdram Memory
DDR4 SDRAM MEMORY 3D4D32G72LB2758 Datasheet 2. KEY FEATURES Including decoupling and termination Industrial up to Military temperature range Organization: 512M x 64 bits + 8b ECC Max Clock rate available: 1200MHz Max Transfer Rate 2400MT/s VDD/VDDQ = 1.2V (1.14V to 1.26V) 1. PRODUCT OVERVIEW VPP = 2.5V (2.375V to 2.75V) Command/Address latency The 3D4D32G72LB2758 is a 32Gbits high speed Burst length (BL): 8 (BL8) and Burst Chop 4 DDR4 SDRAM, organized as 512M x 64 bits and (BC4) modes 8 bits additional for ECC. Bi-directional Differential Data Strobe (DQS) This synchronous device operates at a maximum DLL aligns DQ and DQS transitions with CK transfer rate of up to 2400 MT/s (DDR4-2400), for an aggregate data rate of 153.6Gbps. The module Commands entered on each positive CK is designed to comply with the key DDR4 SDRAM transition features including: (1) posted CAS by Data and data mask are referenced to both programmable additive latency, (2) On Die edges of a differential data strobe pair Termination, (3) programmable driver strength (Double data rate) data, (4) clock rate of 1200MHz. Programmable on-die termination (ODT) All the control and address inputs are Refresh: Self-refresh, Auto refresh and synchronized with a pair of externally supplied Partial array Self-refresh differential clocks. Inputs are latched at the cross ZQ calibration for DQ drive and ODT point of differential clocks (CK_t rising and CK_c falling). All I/Os are synchronized with a pair of Asynchronous RESET pin for Power-up initialization and reset function bidirectional differential data strobes (DQS_t and DQS_c) in a source synchronous fashion. -
Datakommunikasjon Og Maskinvare
Institutt for økonomi og IT Datakommunikasjon og maskinvare Kompendium til emnet 6105N Windows Server og datanett Jon Kvisli Universitetet i Sørøst-Norge, Januar 2020 © Jon Kvisli, 2020 Windows® og Windows Server® er varemerker registrert av Microsoft Corporation. Det må ikke kopieres fra dette heftet ut over det som er tillatt etter bestemmelser i «Lov om opphavsrett til åndsverk», og avtaler om kopiering inngått med Kopinor. Forsidebilde: Colourbox Sats: Jon Kvisli 2 Innhold 1. GRUNNPRINSIPPER I DATAKOMMUNIKASJON .......................................................................... 4 1.1. Punkt-til-punkt kommunikasjon ................................................................................................................ 4 1.2. Kommunikasjonsbusser ............................................................................................................................. 8 1.3. Signalering ................................................................................................................................................ 10 1.4. Dempning, støy og forvrengning.............................................................................................................. 14 1.5. Digitale og analoge signaler ..................................................................................................................... 16 1.6. Noen kommunikasjonsstandarder ........................................................................................................... 17 1.7. Sammendrag ...........................................................................................................................................