A Decade of Semiconductor Companies : 1988 Edition
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Semiconductor Industry Social Media Review
Revealed SOCIAL SUCCESS White Paper Who’s winning the social media battle in the semiconductor industry? Issue 2, September 3, 2014 The contents of this White Paper are protected by copyright and must not be reproduced without permission © 2014 Publitek Ltd. All rights reserved Who’s winning the social media battle in the semiconductor industry? Issue 2 SOCIAL SUCCESS Who’s winning the social media battle in the semiconductor industry? Report title OVERVIEW This time, in the interest of We’ve combined quantitative balance, we have decided to and qualitative measures to This report is an update to our include these companies - Intel, reach a ranking for each original white paper from channel. Cross-channel ranking Samsung, Sony, Toshiba, Nvidia led us to the overall index. September 2013. - as well as others, to again analyse the following channels: As before, we took a company’s Last time, we took the top individual “number semiconductor companies 1. Blogs score” (quantitative measure) (according to gross turnover - 2. Facebook for a channel, and multiplied main source: Wikipedia), of this by its “good practice score” 3. Google+ which five were ruled out due (qualitative measure). 4. LinkedIn to the diversity of their offering 5. Twitter The companies were ranked by and the difficulty of segmenting performance in each channel. 6. YouTube activity relating to An average was then taken of semiconductors. ! their positions in each to create the final table. !2 Who’s winning the social media battle in the semiconductor industry? Issue 2 Due to the instantaneous nature of social media, this time we decided to analyse a narrower time frame, and picked a single month - August 2014. -
Mobile Audio IC Industry Report, 2007-2008
Mobile Audio IC Industry Report, 2007-2008 MobileaudioICismainlyappliedtomobilephoneandMP3 playersandnowitisextendedtogameconsole,hand-held navigation,digitalcameraandotherfields.However, applicationinthesefieldsisstillsmall,Comparedtothatin mobilephoneandMP3players.MobilephoneaudioICis dividedintothreecategories,namelymelodyIC,CODEC,and audioamplifierIC.TheaudioICofMP3playersmainlyadopts MP3decoderICandCODEC. MelodyICmarketprospectsarebleak.Keyglobalmobile phonemanufacturers,likeNokia,Motorola,Sony-Ericssonand Siemens,seldomadoptmelodyIC.Especiallysince2005,the fourbigproducershavegenerallyusedapplicationprocessor andcustomizedanalogbaseband toreplacemelodyIC.In earlystage,mainlyJapanesemobilephoneproducers, Samsung,LGandChinesehandsetproducersadoptedmelody ICchips.Nowadays,onlyJapanesemanufacturersstillinsist onadoptingmelodyIC,andtherestallhavegivenitup. ThereareonlyasmallnumberofaudioCODECmanufacturers,mainlyTI,AKMandWolfson Microelectronics.Audio CODECmarketentrythresholdisveryhigh,andonlythemanufacturersmasteringDELTA-SIGMAconversioncan winthemselvesaplaceinthefield.What'smore,audioCODECis mostlyappliedtocompressedmusicplayers,and especiallyahugeamountisusedinMP3anddigitalcamera.ToCODECproducers,mobilephoneisonlytheir sidelinebusiness,aboutwhichtheydon'tcaremuch,iftheyloseit.AsforMP3player,Wolfson isabsolutelythe marketdominator,monopolizingthemarket.Asfornon-portablemusicplayerslikeCDplayerandprofessional acousticsequipment,ADI,AKMandCirrussharethemarket.Wolfson isseldominvolvedinthehigh-quality audiomarket.Thesemanufacturersarecomparativelyconservative,andtheydon'tpaymuchattentiontoportable -
The Birth, Evolution and Future of Microprocessor
The Birth, Evolution and Future of Microprocessor Swetha Kogatam Computer Science Department San Jose State University San Jose, CA 95192 408-924-1000 [email protected] ABSTRACT timed sequence through the bus system to output devices such as The world's first microprocessor, the 4004, was co-developed by CRT Screens, networks, or printers. In some cases, the terms Busicom, a Japanese manufacturer of calculators, and Intel, a U.S. 'CPU' and 'microprocessor' are used interchangeably to denote the manufacturer of semiconductors. The basic architecture of 4004 same device. was developed in August 1969; a concrete plan for the 4004 The different ways in which microprocessors are categorized are: system was finalized in December 1969; and the first microprocessor was successfully developed in March 1971. a) CISC (Complex Instruction Set Computers) Microprocessors, which became the "technology to open up a new b) RISC (Reduced Instruction Set Computers) era," brought two outstanding impacts, "power of intelligence" and "power of computing". First, microprocessors opened up a new a) VLIW(Very Long Instruction Word Computers) "era of programming" through replacing with software, the b) Super scalar processors hardwired logic based on IC's of the former "era of logic". At the same time, microprocessors allowed young engineers access to "power of computing" for the creative development of personal 2. BIRTH OF THE MICROPROCESSOR computers and computer games, which in turn led to growth in the In 1970, Intel introduced the first dynamic RAM, which increased software industry, and paved the way to the development of high- IC memory by a factor of four. -
North American Company Profiles 8X8
North American Company Profiles 8x8 8X8 8x8, Inc. 2445 Mission College Boulevard Santa Clara, California 95054 Telephone: (408) 727-1885 Fax: (408) 980-0432 Web Site: www.8x8.com Email: [email protected] Fabless IC Supplier Regional Headquarters/Representative Locations Europe: 8x8, Inc. • Bucks, England U.K. Telephone: (44) (1628) 402800 • Fax: (44) (1628) 402829 Financial History ($M), Fiscal Year Ends March 31 1992 1993 1994 1995 1996 1997 1998 Sales 36 31 34 20 29 19 50 Net Income 5 (1) (0.3) (6) (3) (14) 4 R&D Expenditures 7 7 7 8 8 11 12 Capital Expenditures — — — — 1 1 1 Employees 114 100 105 110 81 100 100 Ownership: Publicly held. NASDAQ: EGHT. Company Overview and Strategy 8x8, Inc. is a worldwide leader in the development, manufacture and deployment of an advanced Visual Information Architecture (VIA) encompassing A/V compression/decompression silicon, software, subsystems, and consumer appliances for video telephony, videoconferencing, and video multimedia applications. 8x8, Inc. was founded in 1987. The “8x8” refers to the company’s core technology, which is based upon Discrete Cosine Transform (DCT) image compression and decompression. In DCT, 8-pixel by 8-pixel blocks of image data form the fundamental processing unit. 2-1 8x8 North American Company Profiles Management Paul Voois Chairman and Chief Executive Officer Keith Barraclough President and Chief Operating Officer Bryan Martin Vice President, Engineering and Chief Technical Officer Sandra Abbott Vice President, Finance and Chief Financial Officer Chris McNiffe Vice President, Marketing and Sales Chris Peters Vice President, Sales Michael Noonen Vice President, Business Development Samuel Wang Vice President, Process Technology David Harper Vice President, European Operations Brett Byers Vice President, General Counsel and Investor Relations Products and Processes 8x8 has developed a Video Information Architecture (VIA) incorporating programmable integrated circuits (ICs) and compression/decompression algorithms (codecs) for audio/video communications. -
THE MICROPROCESSOR Z Z the BEGINNING
z THE MICROPROCESSOR z z THE BEGINNING The construction of microprocessors was made possible thanks to LSI (Silicon Gate Technology) developed by the Italian Federico Faggin at Fairchild in 1968. From the 1980s onwards microprocessors are practically the only CPU implementation. z HOW DO MICROPROCESSOR WORK? Most microprocessor work digitally, transforming all the input information into a code of binary number (1 or 0 is called a bit, 8 bit is called byte) z THE FIRST MICROPROCESSOR Intel's first microprocessor, the 4004, was conceived by Ted Hoff and Stanley Mazor. Assisted by Masatoshi Shima, Federico Faggin used his experience in silicon- gate MOS technology (1968 Milestone) to squeeze the 2300 transistors of the 4-bit MPU into a 16-pin package in 1971. z WHAT WAS INTEL 4004 USED FOR? The Intel 4004 was the world's first microprocessor—a complete general-purpose CPU on a single chip. Released in March 1971, and using cutting-edge silicon- gate technology, the 4004 marked the beginning of Intel's rise to global dominance in the processor industry. z THE FIRST PERSONAL COMPUTER WITH MICROPROCESSOR MS-DOSIBM introduces its Personal Computer (PC)The first IBM PC, formally known as the IBM Model 5150, was based on a 4.77 MHz Intel 8088 microprocessor and used Microsoft´s MS-DOS operating system. The IBM PC revolutionized business computing by becoming the first PC to gain widespread adoption by industry. z BIOHACKER z WHO ARE BIOHACKER? Biohackers, also called hackers of life, are people and communities that do biological research in the hacker style: outside the institutions, in an open form, sharing information. -
TJR-1197 Goodbye.Pdf
CYPRESS SEMICONDUCTOR CORPORATION Internal Correspondence Date: August 19, 2016 WW: 3316 To: All Cypress Employees Author: T.J. Rodgers Author File#: TJR#1197 Subject: Goodbye cc: BoD, Jim Collins, Larry Sonsini It’s 2:30 in the afternoon on August 17, my last official day at Cypress. After packing my stuff, I realized there were goodbyes to write. So, this won’t be a typical “TJ memo,” revised 10 times, logical and filled with fact-checked data; it will be more stream-of-consciousness in style. In a way, writing this memo is like talking to your wife of 34 years, while she’s on her deathbed. What do you say? I’ve enjoyed being with you? We’ve done a lot of good things together? There are really no appropriate words. But, perhaps there are. In the 1970 movie Patton, as the General leaves his command, he says, “Gentlemen, all good things must come to an end. And the best thing that has happened to me in my life has been the honor and privilege of commanding the 3rd Army. Goodbye, and God bless you.” This is the way I feel about Cypress. We have a lot to be proud of. Cypress was founded in December 1982, when there were 59 publically traded American chip companies. Today, only 15 of them are left—and we are one of the 15. That statement applies to every Cypress employee, whether you came from old Cypress, Spansion, Fujitsu, Broadcom or Ramtron. Each of us has made it in the industry for a long time; we all now fight together under one flag; and we’re all still around because we’ve earned the right to be. -
Timeline of the Semiconductor Industry in South Portland
Timeline of the Semiconductor Industry in South Portland Note: Thank you to Kathy DiPhilippo, Executive Director/Curator of the South Portland Historical Society and Judith Borelli, Governmental Relations of Texas Inc. for providing some of the information for this timeline below. Fairchild Semiconductor 1962 Fairchild Semiconductor (a subsidiary of Fairchild Camera and Instrument Corp.) opened in the former Boland's auto building (present day Back in Motion) at 185 Ocean Street in June of 1962. They were there only temporarily, as the Western Avenue building was still being constructed. 1963 Fairchild Semiconductor moves to Western Avenue in February 1963. 1979 Fairchild Camera and Instrument Corp. is acquired/merged with Schlumberger, Ltd. (New York) for $363 million. 1987 Schlumberger, Ltd. sells its Fairchild Semiconductor Corp. subsidiary to National Semiconductor Corp. for $122 million. 1997 National Semiconductor sells the majority ownership interest in Fairchild Semiconductor to an investment group (made up of Fairchild managers, including Kirk Pond, and Citcorp Venture Capital Ltd.) for $550 million. Added Corporate Campus on Running Hill Road. 1999 In an initial public offering in August 1999, Fairchild Semiconductor International, Inc. becomes a publicly traded corporation on the New York Stock Exchange. 2016 Fairchild Semiconductor International, Inc. is acquired by ON Semiconductor for $2.4 billion. National Semiconductor 1987 National Semiconductor acquires Fairchild Semiconductor Corp. from Schlumberger, Ltd. for $122 million. 1995 National Semiconductor breaks ground on new 200mm factory in December 1995. 1996 National Semiconductor announces plans for a $600 million expansion of its facilities in South Portland; construction of a new wafer fabrication plant begins. 1997 Plant construction for 200mm factory completed and production starts. -
Self-Aligned Gate Technology
Self-Aligned Gate Technology Self-Aligned Gate Technology Semiconductor Process Integration [email protected] EE 6372 Summer Semester Self-Aligned Gate Technology Relevant References 1. “Self-Aligned Gate,” https://en.wikipedia.org/wiki/Self-aligned_gate 2. Federico Faggin, “The Intel 4004 Microprocessor and the Silicon Gate Technology,” http://www.intel4004.com/sgate.htm 3. “1968: Silicon Gate Technology Developed for ICs,” https://www.computerhistory.org/siliconengine/silicon-gate-technology- developed-for-ics/ 4. “Self-Aligned Gate Process,” https://books.google.com/books?id=72Mkl80d- FMC&pg=PA15&lpg=PA15&dq=aluminum+gate+mos+process+bower&so urce=bl&ots=htRTQyCWq0&sig=pn8WMix8gnWk4- vQaiAunJyDMsc&hl=en&sa=X&ei=JXDIUZf7Jc_J0AHiiYGgBA&ved=0C E0Q6AEwBA#v=onepage&q=aluminum%20gate%20mos%20process%20b ower&f=false Semiconductor Process Integration [email protected] EE 6372 Summer Semester Self-Aligned Gate Technology • Aluminum Used to Generate Original MOSFET Gates Prevented Development of Self-Aligned Gates Aluminum Melts at 660 ˚C Diffusions and Anneals of Silicon Typically Require Around 1000 ˚C Causing Any Aluminum Present During Processing to Melt Therefore Must Form Source and Drain Prior to Forming the Gate Causing Misalignment of the Gate to the Source and Drain Must Increase Size of the Gate to Assure Overlap of the Gate to the Source and Drain This Gate Misalignment Also Caused Substantial Variability Semiconductor Process Integration [email protected] EE 6372 Summer Semester Self-Aligned Gate Technology • Using -
Pcn Wafer Foundry Site Qualification Template
Cypress Semiconductor Corporation, 198 Champion Court, San Jose, CA 95134. Tel: (408) 943-2600 PRODUCT CHANGE NOTIFICATION PCN: PCN170501 Date: February 28, 2017 Subject: Qualification of Texas Instruments’ DMOS6 as an Additional Wafer Fab Site, Cypress’ Test 25 as an Additional Wafer Sort Site for 2Mb F-RAM Serial Product Family To: FUTURE ELECTRONICS FUTURE ELE [email protected] Change Type: Major Description of Change: Cypress announces the qualification of Texas Instruments DMOS6 as an additional wafer fab site and Test 25 as an additional wafer sort site for its 2Mb F-RAM Serial Product Family. This qualification is part of the flexible manufacturing initiative which allows Cypress to meet its delivery commitments in dynamic, changing market conditions. Benefit of Change: By adding the DMOS6 and Test 25 sites, Cypress will have the added capability to meet upside market demand, and ensure consistent and reliable delivery to customers. Affected Parts: 6 Part Numbers Affected: See the attached ‘Affected Parts List’ file for a list of all part numbers affected by this change. Note that any new parts that are introduced after the publication of this PCN will include all changes outlined in this PCN. Qualification Status: The changes listed in this PCN have been qualified through a series of tests documented in the Qualification Test Plan (QTP) reports indicated in the table below. These qualification reports can be found as attachments to this notification or by visiting www.cypress.com and typing the QTP number in the keyword search window. Qualification QTP Report Number TI DMOS6 Wafer Fab for 64Kb F-RAM Serial Industrial-Grade 143905 FRAM Wafer Sort at Test 25 Site Sample Status: Qualification samples are not built ahead of time for all part numbers affected by this change. -
Advance Program 2015 Ieee International Solid-State
2015_MiniAP_Cover_AP 1/19/15 9:33 AM Page 1 ADVANCE PROGRAM & MORE S / B CMOS LOW-VOLTAGE CIRCUIT DESIGN CMOS LOW-VOLTAGE THURSDAY ALL-DAY THURSDAY : ADVANCES IN WIRELESS POWER; LOW POWER FOR ADVANCES : E; RF TRANSMITTER ADVANCES; IO @ 25G E; RF TRANSMITTER ADVANCES; O 2015 IEEE SHORT-COURSE I INTERNATIONAL 4 FORUMS SOLID-STATE CIRCUITS CONFERENCE FEBRUARY 22, 23, 24, 25, 26 CONFERENCE THEME: IEEE SOLID-STATE CIRCUITS SOCIETY IEEE SOLID-STATE SILICON SYSTEMS ALL-DAY SUNDAY SMALL CHIPS FOR BIG DATA ANALOG; FREQUENCY SYNTHESIZERS; 3D IMAGING ICs GRADUATE STUDENT RESEARCH IN PROGRESS, ICsGRADUATE TO NEURONS TALKING SAN FRANCISCO TO WEARABLE TRENDS: BIG DATA ADCs; MEMORY HIGH-SPEED INTERLEAVED MARRIOTT MARQUIS HOTEL : RF RECEIVERS; DRAM INTERFACES; ULTRA-LOW-POWER WIRELESS; NEAR-THRESHOLD DESIGN; ULTRA-LOW-POWER RF RECEIVERS; DRAM INTERFACES; : 2 FORUMS NEW THIS YEAR: HIGH-SPEED CURRENT-STEERING DACs; CLOCK & DATA RECOVERY; MANY-CORE PROCESSORS; NANO-POWER MANY-CORE RECOVERY; DACs; CLOCK & DATA HIGH-SPEED CURRENT-STEERING 2 EVENING EVENTS ON ISSCCX 10 TUTORIALS ISSCC PREVIEWS: CIRCUIT & SYSTEM INSIGHTS SEE PAGE: 61 5-DAY PROGRAM 2015_MiniAP_Cover_AP 1/19/15 9:33 AM Page 2 ISSCC VISION STATEMENT The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at thecutting edge of IC design and application to maintain technical currency, and to network with leading experts. CONFERENCE TECHNICAL HIGHLIGHTS On Sunday, February 22nd, the day before the official opening of the Conference, ISSCC 2015 offers: • A choice of up to 4 of a total of 10 Tutorials • A choice of 1 of 2 all-day Advanced-Circuit-Design Forums The 90-minute tutorials offer background information and a review of the basics in specific circuit-design topics. -
Microsoft Top 100 Production Suppliers (Based on FY14 Spend for Commercially Available Hardware Products)
Microsoft Top 100 Production Suppliers (Based on FY14 spend for commercially available hardware products) AAC ACOUSTIC TECHNOLOGIES INTEL ALLEGRO MICROSYSTEMS, INC. INTERNATIONAL BUSINESS MACHINES (IBM ALPS ELECTRIC COMPANY CORP.) AMD INTERNATIONAL RECTIFIER AMPEREX TECHNOLOGY, LTD. JOHNSON ELECTRIC GROUP AMPHENOL KIONIX, INC. ANALOG DEVICES KYOCERA/AVX ASKEY COMPUTER CORPORATION LAIRD TECHNOLOGIES ATMEL CORPORATION LELON ELECTRONICS (SUZHOU) CO., LTD BIZLINK TECHNOLOGY INC (BIZCONN) LG CHEM BOYD CORPORATION LITE-ON BRADY MARLOW INDUSTRIES, INC. CHICONY POWER MARVELL SEMICONDUCTOR COMPEQ MANUFACTURING CO., LTD. MICROCHIP TECHNOLOGY COOLER MASTER, INC. MICRON TECHNOLOGY, INC. COOPER BUSSMANN MOLEX, INC. CYMMETRIK MONOLITHIC POWER SYSTEMS, INC. CYNTEC CO., LTD. MURATA MANUFACTURING CO., LTD. DELTA ELECTRONICS, INC. NEWMAX TECHNOLOGY CO., LTD. DIGITAL OPTICS VISTA POINT NICHICON CORPORATION DIODE, INC. NIDEC CORPORATION E&E MAGNETICS PRODUCTS, LTD. NUVOTON TECHNOLOGY CORPORATION ELLINGTON ELECTRONICS TECHNOLOGY NVIDIA CORPORATION FAIRCHILD SEMICONDUCTOR CORPORATION NXP SEMICONDUCTORS FLEXTRONICS ON SEMICONDUCTOR FOXCONN OSRAM FOXLINK PALCONN, PALPILOT INTERNATIONAL CORP. FREESCALE PANASONIC GOERTEK, INC. PEGATRON CORPORATION HANNSTAR BOARD PHILIPS PLDS HITACHI-LG DATA STORAGE PRIMESENSE HONDA PRINTING QUALCOMM HYNIX SEMICONDUCTOR REALTEK SEMICONDUCTOR CORPORATION INFINEON RF MICRO DEVICES, INC. INNOVATOR ELECTRONIC SHENZHEN CO., LTD RICHTEK TECHNOLOGY CORP. ROHM CORPORATION SAMSUNG DISPLAY SAMSUNG ELECTRONICS SAMSUNG SDI SAMSUNG SEMICONDUCTOR SEAGATE SHEN ZHEN JIA AI MOTOR CO., LTD. SHENZHEN HORN AUDIO CO., LTD. SHINKO ELECTRIC INDUSTRIES CO., LTD. STARLITE PRINTER, LTD. STMICROELECTRONICS SUNG WEI SUNUNION ENVIRONMENTAL PACKAGING CO., LTD TDK TE CONNECTIVITY TEXAS INSTRUMENTS TOSHIBA TPK TOUCH SOLUTIONS, INC. UNIMICRON TECHNOLOGY CORP. UNIPLAS (SHANGHAI) CO., LTD. UNISTEEL UNIVERSAL ELECTRONICS INCORPORATED VOLEX WACOM CO., LTD. WELL SHIN TECHNOLOGY WINBOND WOLFSON MICROELECTRONICS, LTD. X-CON ELECTRONICS, LTD. YUE WAH CIRCUITS CO., LTD. -
C 2016 Anupam Das UNDERSTANDING and MITIGATING the PRIVACY RISKS of SMARTPHONE SENSOR FINGERPRINTING
c 2016 Anupam Das UNDERSTANDING AND MITIGATING THE PRIVACY RISKS OF SMARTPHONE SENSOR FINGERPRINTING BY ANUPAM DAS DISSERTATION Submitted in partial fulfillment of the requirements for the degree of Doctor of Philosophy in Computer Science in the Graduate College of the University of Illinois at Urbana-Champaign, 2016 Urbana, Illinois Doctoral Committee: Associate Professor Nikita Borisov, Chair Associate Professor Matthew Caesar Associate Professor Romit Roy Choudhury Assistant Professor Paris Smaragdis Professor Dan Boneh, Stanford University ABSTRACT The widespread use of smartphones in our everyday life gives rise to pri- vacy concerns. Fingerprinting smartphones can jeopardize user privacy by enabling remote identification of users without users' awareness. In this dissertation we study the feasibility of using onboard sensors such as micro- phones, accelerometers and gyroscopes to fingerprint smartphones. During fabrication, subtle imperfections arise in device sensors which induce distinc- tive anomalies in the generated signal. Using machine learning techniques we can distinguish smartphones generating such distinctive anomalies. We first look at fingerprinting smartphones through onboard microphones and speakers. We explore different acoustic features and analyze their ability to successfully fingerprint smartphones. Our study identifies the prominent acoustic features capable of fingerprinting smartphones with a high success rate, and also examines the impact of background noise and other variables on fingerprinting accuracy. Next, we surreptitiously fingerprint smartphones us- ing the imperfections of motion sensors (i.e., accelerometers and gyroscopes) embedded in modern smartphones, through a web page. We analyze how well motion sensor fingerprinting works under real-world constraints by col- lecting data from a large number of smartphones under both lab and public environments.