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1 2 METALLOGRAPHIC HANDBOOK Donald C. Zipperian, Ph.D. Chief Technical Officier PACE Technologies Tucson, Arizona USA Copyright 2011 by PACE Technologies, USA No part of this manual may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the written permission of the copyright owner. First printing, 2011 3 Great care is taken in the compilation and production of this book, but it should be made clear that NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, ARE GIVEN IN CONNECTION WITH THIS PUBLICATION. Although this information is believed to be accurate by PACE Technologies, PACE Technologies cannot guarantee that favorable results will be obtained from the use of this publication alone. This publication is intended for use by persons having technical skill, at their sole discretion and risk. Since the conditions of product or material use are outside of PACE Technologies control, PACE Technologies assumes no liability or obligation in connection with any use of this information. No claim of any kind, whether as to products or information in this publication, and whether or not based on negligence, shall be greater in amount than the purchase price of this product or publication in respect of which damages are claimed. THE REMEDY HEREBY PROVIDED SHALL BE THE EXCLUSIVE AND SOLE REMEDY OR BUYER, AND IN NO EVENT SHALL EITHER PARTY BE LIABLE FOR SPECIAL, INDIRECT OR CONSEQUENTIAL DAMAGES WHETHER OR NOT CAUSED BY OR RESULTING FROM THE NEGLIGENCE OF SUCH PARTY. As with any material, evaluation of the material under end use conditions prior to specifications is essential. Therefore, specific testing under actual conditions is recommended. Nothing contained in this book shall be construed as a grant of any right of manufacture, sale, use, or reproduction in connection with any method, process, apparatus, product, composition, or system, whether or not covered by letter patent, copyright, or trademark, and nothing contained in this book shall be construed as a defense against any alleged infringement of letters, patent, copyright, or trademark, or as a defense against liability for such infringement. Comments, criticism, and suggestions are invited, and should be forwarded to PACE Technologies staff who worked on this project whom included Donald C Zipperian, Ph.D, Vice President of Technology. PACE Technologies 3601 E. 34th St. Tucson, AZ Printed in China 4 Table of Contents CHAPTER 1 Introduction to Metallography ................................................................ 11 Grain Size ........................................................................................................ 12 Twin Boundaries ............................................................................................. 12 Porosity and Voids ............................................................................................ 13 Cracks ............................................................................................................... 13 Phases ............................................................................................................... 14 Dendrites .......................................................................................................... 15 Corrosion .......................................................................................................... 15 Intergranular Attack ........................................................................................ 16 Coating Thickness ........................................................................................... 17 Inclusions ........................................................................................................ 18 Weld Analysis ................................................................................................... 19 Solder Joint Integrity ....................................................................................... 21 Composites ........................................................................................................ 22 Graphite Nodularity ........................................................................................ 22 Recast ................................................................................................................ 23 Carburizing ...................................................................................................... 24 Decarburization ............................................................................................... 25 Nitriding .......................................................................................................... 26 Intergranular Fracture .................................................................................... 26 Weld Sensitization ........................................................................................... 27 Flow Line Stress ............................................................................................... 28 CHAPTER 2 Abrasive Sectioning ............................................................................... 28 2.0 ABRASIVE SECTIONING ...................................................................... 29 2.1 ABRASIVE BLADE SELECTION GUIDELINES .................................. 30 2.2 ABRASIVE CUTTING PROCESS DESCRIPTION ............................. 32 2.3 RECOMMENDED CUTTING PROCEDURES .................................... 32 2.4 CUTTING FLUIDS .................................................................................. 33 2.5 ABRASIVE SECTIONING TROUBLESHOOTING ............................ 34 5 CHAPTER 3 Precision Wafer Sectioning .................................................................. 35 3.0 PRECISION WAFER SECTIONING ..................................................... 35 3.1 WAFERING BLADE CHARACTERISTICS .......................................... 36 3.2 CUTTING PARAMETERS ...................................................................... 42 CHAPTER 4 Specimen Mounting .............................................................................. 44 4.0 SPECIMEN MOUNTING ....................................................................... 44 4.1 CASTABLE MOUNTING ...................................................................... 44 4.1.2 Acrylic Castable Resins .......................................................................... 47 4.1.3 Polyester Castable Resins ....................................................................... 49 4.2 CASTABLE MOUNTING PROCEDURES ........................................... 50 4.2.1 Vacuum/Pressure Mounting .................................................................. 51 4.3 CASTABLE MOUNTING MISCELLANEOUS ................................... 52 4.4 CASTABLE MOUNTING TROUBLESHOOTING ............................. 54 4.5 COMPRESSION MOUNTING ............................................................. 55 4.6 COMPRESSION MOUNTING RESIN PROPERTIES ...................... 58 4.6.1 Phenolics ................................................................................................ 61 4.6.2 Acrylics ................................................................................................... 61 4.6.3 Epoxies / Diallyl Phthalates .................................................................. 63 4.6.4 Specialized Compression Mounting Resins ........................................ 64 4.7 COMPRESSION MOUNTING PROCEDURES ................................. 64 4.8 COMPRESSION MOUNTING TROUBLESHOOTING ................... 65 CHAPTER 5 Abrasive Grinding .................................................................................. 66 5.0 ABRASIVE GRINDING .......................................................................... 66 5.1.1 Silicon Carbide ....................................................................................... 67 5.1.2 Alumina .................................................................................................. 74 5.1.3 Diamond ................................................................................................. 74 5.1.4 Zircon ...................................................................................................... 78 5.2 ABRASIVE BONDING ........................................................................... 78 5.2.1 Fixed Abrasive Grinding ........................................................................ 78 5.2.2 Free Abrasive Grinding .......................................................................... 79 5.2.3 Semi-fixed Abrasive Grinding ............................................................... 79 5.3 ROUGH GRINDING PARAMETERS .................................................... 81 5.3.1 Grinding Pressure ................................................................................... 81 5.3.2 Relative Velocity ...................................................................................... 82 5.3.3 Machine Considerations ....................................................................... 86 6 5.4 PLANAR GRINDING (ROUGH GRINDING) ...................................... 89 5.4.1 Soft Nonferrous Metals ........................................................................... 89 5.4.2 Soft Ferrous Metals ................................................................................. 89 5.4.3 Hard Ferrous Metals ..............................................................................