EMEA Arrow EMEA Design Partner Network Catalogue

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EMEA Arrow EMEA Design Partner Network Catalogue EMEA Arrow EMEA Design Partner Network Catalogue [email protected] Engineering Solutions Center Expertise | Enablement | Support The mission of Arrow’s Engineering Solutions Center is to support the field team in their design activities ranging from NPI proposals, consultancy in complex areas like software, IoT, FPGAs, high-end to complete system concepts and Arrow’s ready-to-use solutions. Through the TestDrive board loan program, the ESC provides many supplier development boards and Arrow developed solutions to enable quick design starts. Design, customization, prototyping and certification services are available from Arrow’s comprehensive 3rd Party Network. 2 Editorial Dear Arrow Colleagues, A warm welcome to what I hope you will find to be a useful and informative first edition of the Arrow EMEA Design Partner Catalogue. To stay competitive, our customers must continuously leverage leading edge technologies while shortening design cycles. Further, the majority of today’s innovations are happening at the level of software, applications, sensing capabilities, connectivity and security. These dynamics require new skills and capabilities that our customers may lack. This is where the Arrow EMEA Design Partner Network can help. Our partners provide immediate access to pre-screened, Minimize design time qualified, and certified third-party design services companies. Arrow’s network of some of the best and speed time-to-market engineering design services companies can save your customers time and money and allow them to bring by enabling the Arrow products to market faster. Partners can support them EMEA Partner Network all the way from specification development to turnkey board design or be an extension to their engineering to get involved early in team. your customer design This catalogue enables you to quickly identify design cycle. partners with the expertise and capabilities to help your customers meet their design objectives. Let us connect our customers to the right design partners! Amir Sherman Director of Engineering Solutions & Embedded Technology EMEA 3 ESC Hotline / Internal: 100-8111 / +49-6102-5030-8111 [email protected] Design Partner Locations EMEA Europe USA Israel 4 Table of Contents Partner Overview Products, services and areas of expertise ................. 6 Web, mobile and cloud design (IoT) expertise. 8 RF expertise ..............................................10 Qualcomm® hardware and design services support .........11 Notes to Arrow sales and FAE personnel .....................12 Partner ABC Smart Card ..........................................14 ASH Wireless Electronics .................................16 BayLibre ..................................................18 ByteSnap Design .........................................20 Circomm Technologies. .22 Dreamchip Technologies. .24 eInfochips .................................................26 FAE++ ...................................................28 HandsOn Training .........................................30 Helion Vision ..............................................32 I/F/I ......................................................34 Ingenieurbuero Gardiner ..................................36 IoTechnics. 38 ipTronix ....................................................40 Linux4biz .................................................42 MaCo-Engineering .......................................44 Mission Embedded .......................................46 Mixed Mode ...............................................48 MMSolutions (MMS) ......................................50 NewTec ...................................................52 Novasom Industries .......................................54 Novtech. .56 Power Induced Design (PID). .58 ReFLEX CES ..............................................60 RevisionOne Engineering .................................62 SEVENSTAX. .64 Sintecs ....................................................66 SMARTLOGIC ............................................68 SYSTART .................................................70 Taylor Dowding Innovation ................................72 Timesys ...................................................74 Trenz Electronic ...........................................76 Witekio ...................................................78 Contacts ......................................................80 5 ESC Hotline / Internal: 100-8111 / +49-6102-5030-8111 [email protected] Partner Overview Products, services and areas of expertise Design partner HQ location Languages Full-time employeesPart-time/contractDesigns Hardwarewith employees ArrowSoftwareApplicationCloud CertificationsTrainingSOMs, SBCsAnalog & power supported ABC Smart Card France 3 9 • • • • • FR, EN ASH Wireless Electronics United Kingdom 13 3 15 • • • • EN BayLibre France 13 2 • • • • FR, EN ByteSnap Design England 17 2 EN, NL, IT, • • • RU, ES Circomm Technologies Israel 5 12 30 • • • • • • • EN, HE Dream Chip Technologies Germany 63 7 ~10 • • • • • • • GR, EN eInfochips United States 1500 100 10+ • • • • • • EN FAE++ Italy 6 3 • • • • • • IT, EN HandsOn Training Israel 2 3 • • • EN, HE Helion Vision Germany 10 2 20+ • • • • • GR, EN I/F/I Germany 1 0 • • GR, EN Ingenieurbuero Gardiner Germany 0 0 EN, GR, • • • • IT, FR IoTechnics England 6 • • • • • EN, PL 10+ ipTronix Italy 4 3 2016 • • • IT, EN Linux4biz Israel 50 2 EN, GR, • • • • FR MaCo-Engigneering Germany 1 100+ • • GR, EN Mission Embedded Austria 30 10 ~30 • • • • EN, GR Mixed Mode Germany 100 • • • GR, EN MMSolutions (MMS) Bulgaria 185 3 • • • • BG, EN NewTec Germany 150 15 5 • • • • GR, EN Novasom Industries Italy 15 4 0 • • • • • • • EN, IT EN, HE, NovTech United States 5 5 47 • • • • ES, PT Power Induced Design (PID) Spain 1 0 • • • EN, ES ReFLEX CES France 100 10’s • • • • • EN, FR RevisionOne Engineering Germany 2 3 50+ • • • • • GR, EN SEVENSTAX Germany 10 7 • • • • GR, EN Sintecs Netherlands 19 5 • • • • • NL, EN, GR SMARTLOGIC Germany 2 4 3 • • • GR, EN SYSTART Germany 16 4 0 • • • • GR, EN Taylor Dowding Innovation Wales 4 2 • • • • EN, PL Timesys United States 50 5 EN, HI, • • • • • PL, FR Trenz Electronic Germany 29 14 4 • • • • • GR, EN, FI Witekio England 100 5 6 EN, FR, GR, 2016 • • • • • JA, MAN 6 BG - Bulgarian GR - German NL - Dutch (Netherlands) EN - English HE - Hebrew MAN - Mandarin Chinese ES - Spanish HI - Hindi PL - Polish FI - Finish IT - Italian PT - Portugese FR - French JA - Japanese RU - Russian Processor support FPGA support EMV L1- EMV L2- PCI/PTS/PED, ARM® Cortex®-A/M0 ARM® Cortex®-A, -M0+ Xilinx™ ARM®, Intel® (formerly Altera), MIPS®, Synopsys® HAPS® Microchip® PIC®, ARM® Cortex®-A/M Intel® (formerly Altera), Lattice™, Xilinx™ ARM® Cortex®-M, -A, TI MSP430™, Microchip® PIC®, Microchip® AVR® (formerly Atmel), Intel® (formerly Altera), Xilinx™ STM8, Blackfin® DSPs UltraScale™ MPSoC Intel® (formerly Altera), Lattice™ Intel® (formerly Altera), Lattice™, Qualcomm® SnapdragonTM, NXP, TI, NVIDIA®, Samsung, Marvell Microsemi®, Xilinx™ ARM® Cortex®-A/M, TI Sitara™, Samsung ARTIK™, ST - STM32, TI MSP430™, Microchip PIC®, Intel® (formerly Altera), Lattice™ , Xilinx™ NXP i.MX, NXP Kinetis®, Micrchip® ATmega (formerly Atmel), Cypress® PSoC® ARM® Cortex®-A, -R, -M Intel® (formerly Altera) Lattice™, Intel® (formerly Altera), Xilinx™, Intel® (formerly Altera), NVIDIA® Microsemi® Intel® Nios® (formerly Altera) Intel® (formerly Altera) Intel® (formerly Altera), Lattice™, Intel® x86, ARM® Cortex®-M Microsemi®, Xilinx™ ARM® , Intel®(formerly Altera) Architecture, Microchip® PIC®, Microchip® Atmel® AVR® ARM® Cortex® M/A, Intel® Nios® (formerly Altera), Intel® x86, Microchip® PIC®, Intel® (formerly Altera), Microsemi®, Microchip® Atmel® AVR® Lattice™, Xilinx™ ARM®, Intel® x86_64, MIPS®, IBM PowerPC® Intel® (formerly Altera), Xilinx™ Intel® Nios® (formerly Altera) Intel® (formerly Altera) ARM® Cortex®-M, -A, IBM PowerPC®, TI DSP, Nvidia® GPU, Intel® x86, Intel® (formerly Altera), Xilinx™ Intel® (formerly Altera) SoCs Intel® (formerly Altera), Xilinx™, ARM® Cortex®-M, -A, Intel® x86, Infineon XMC™ Microsemi®, Lattice™ Qualcomm® Snapdragon™ family, TI OMAP family, Intel® (formerly Altera), Xilinx™ Movidius Myriad 1/2/X (an Intel® company) ARM®, Microchip® Atmel® AVR®, Microchip® PIC®, Intel® MCS® -51, Intel® (formerly Altera), Xilinx™, IBM PowerPC®, Zilog® Z80 Microsemi®, Lattice™ ARM® MCUs/MPUs Intel® (formerly Altera), Xilinx™ Intel® (formerly Altera), Xilinx™, Lattice™, ARM® Cortex®-MCUs/MPUs, Intel® x86 Microsemi® Intel® x86, NXP i.MX, IBM PowerPC® Intel® (formerly Altera), Xilinx™ ARM® Cortex®, MIPS®, Cypress® PSoC® Intel® (formerly Altera), Xilinx™ Renesas RX, ARM® ,Intel® Nios®(formerly Altera), Microchip®, ST, NXP, Cypress®, Infineon Xilinx™, Intel® (formerly Altera), ARM®, IBM PowerPC®, Intel® (formerly Altera), NXP i.MX series, NXP QorlQ® Microsemi® PCI Express multi-channel DMA IP Core; Video data streaming, Sensor Interfaces Intel® (formerly Altera), Xilinx™ Intel® MCS® -51, ARM® Cortex®-A53 Xilinx™ ARM®, Microchip Atmel® AVR®, Microchip PIC® Intel® (formerly Altera), Lattice™ ARM®, NXP ColdFire® , MIPS®, IBM POWER, SuperH, phyCORE®-Vybrid, Intel® x86 Xilinx™ Intel® (formerly Altera), Lattice™, ARM®, Intel® NIOS®, Xilinx™ MicroBlaze™ Microsemi®, Xilinx™ ARM® Cortex®-A8, -A9, -M4, -M3, -M0 Intel® (formerly Altera), Xilinx™ 7 ESC Hotline / Internal: 100-8111 / +49-6102-5030-8111 [email protected] Partner Overview Web, mobile and cloud design (IoT) expertise Partner Application level support ABC Smart Card ASH Wireless Electronics BayLibre Android™, Qt,
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