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AMD Athlon™ Processor X86 Code Optimization Guide
AMD AthlonTM Processor x86 Code Optimization Guide © 2000 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD’s products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other applica- tion in which the failure of AMD’s product could create a situation where per- sonal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice. Trademarks AMD, the AMD logo, AMD Athlon, K6, 3DNow!, and combinations thereof, AMD-751, K86, and Super7 are trademarks, and AMD-K6 is a registered trademark of Advanced Micro Devices, Inc. Microsoft, Windows, and Windows NT are registered trademarks of Microsoft Corporation. -
Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance
White Paper Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance Ofri Wechsler Intel Fellow, Mobility Group Director, Mobility Microprocessor Architecture Intel Corporation White Paper Inside Intel®Core™ Microarchitecture Introduction Introduction 2 The Intel® Core™ microarchitecture is a new foundation for Intel®Core™ Microarchitecture Design Goals 3 Intel® architecture-based desktop, mobile, and mainstream server multi-core processors. This state-of-the-art multi-core optimized Delivering Energy-Efficient Performance 4 and power-efficient microarchitecture is designed to deliver Intel®Core™ Microarchitecture Innovations 5 increased performance and performance-per-watt—thus increasing Intel® Wide Dynamic Execution 6 overall energy efficiency. This new microarchitecture extends the energy efficient philosophy first delivered in Intel's mobile Intel® Intelligent Power Capability 8 microarchitecture found in the Intel® Pentium® M processor, and Intel® Advanced Smart Cache 8 greatly enhances it with many new and leading edge microar- Intel® Smart Memory Access 9 chitectural innovations as well as existing Intel NetBurst® microarchitecture features. What’s more, it incorporates many Intel® Advanced Digital Media Boost 10 new and significant innovations designed to optimize the Intel®Core™ Microarchitecture and Software 11 power, performance, and scalability of multi-core processors. Summary 12 The Intel Core microarchitecture shows Intel’s continued Learn More 12 innovation by delivering both greater energy efficiency Author Biographies 12 and compute capability required for the new workloads and usage models now making their way across computing. With its higher performance and low power, the new Intel Core microarchitecture will be the basis for many new solutions and form factors. In the home, these include higher performing, ultra-quiet, sleek and low-power computer designs, and new advances in more sophisticated, user-friendly entertainment systems. -
Intel® Core™ Microarchitecture • Wrap Up
EW N IntelIntel®® CoreCore™™ MicroarchitectureMicroarchitecture MarchMarch 8,8, 20062006 Stephen L. Smith Bob Valentine Vice President Architect Digital Enterprise Group Intel Architecture Group Agenda • Multi-core Update and New Microarchitecture Level Set • New Intel® Core™ Microarchitecture • Wrap Up 2 Intel Multi-core Roadmap – Updates since Fall IDF 3 Ramping Multi-core Everywhere 4 All products and dates are preliminary and subject to change without notice. Refresher: What is Multi-Core? Two or more independent execution cores in the same processor Specific implementations will vary over time - driven by product implementation and manufacturing efficiencies • Best mix of product architecture and volume mfg capabilities – Architecture: Shared Caches vs. Independent Caches – Mfg capabilities: volume packaging technology • Designed to deliver performance, OEM and end user experience Single die (Monolithic) based processor Multi-Chip Processor Example: 90nm Pentium® D Example: Intel Core™ Duo Example: 65nm Pentium D Processor (Smithfield) Processor (Yonah) Processor (Presler) Core0 Core1 Core0 Core1 Core0 Core1 Front Side Bus Front Side Bus Front Side Bus *Not representative of actual die photos or relative size 5 Intel® Core™ Micro-architecture *Not representative of actual die photo or relative size 6 Intel Multi-core Roadmap 7 Intel Multi-core Roadmap 8 Intel® Core™ Microarchitecture Based Platforms Platform 2006 20072007 Caneland Platform (2007) MP Servers Tigerton (QC) (2007) Bensley Platform (Q2’06)/ Glidewell Platform (Q2’06) ) DP Servers/ Woodcrest (Q3’06) DP Workstation Clovertown (QC) (Q1’07) Kaylo Platform (Q3’06)/ Wyloway Platform (Q3 ’06) UP Servers/ Conroe (Q3’06) UP Workstation Kentsfield (QC) (Q1’07) Bridge Creek Platform (Mid’06) Desktop -Home Conroe (Q3’06) Kentsfield (QC) (Q1’07) Desktop -Office Averill Platform (Mid’06) Conroe (Q3’06) Mobile Client Napa Platform (Q1’06) Merom (2H’06) All products and dates are preliminary 9 Note: only Intel® Core™ microarchitecture QC refers to Quad-Core and subject to change without notice. -
Nt* and Rtl* INT 2Eh CALL Ntdll!Kifastsystemcall
ȘFĢ: Fųřțįm’ș Đěřįvǻțįvě Bỳ Jǿșěpħ Ŀǻňđřỳ ǻňđ Ųđį Șħǻmįř Țħě Ŀǻbș țěǻm ǻț ȘěňțįňěŀǾňě řěčěňțŀỳ đįșčǿvěřěđ ǻ șǿpħįșțįčǻțěđ mǻŀẅǻřě čǻmpǻįģň șpěčįfįčǻŀŀỳ țǻřģěțįňģ ǻț ŀěǻșț ǿňě Ěųřǿpěǻň ěňěřģỳ čǿmpǻňỳ. Ųpǿň đįșčǿvěřỳ, țħě țěǻm řěvěřșě ěňģįňěěřěđ țħě čǿđě ǻňđ běŀįěvěș țħǻț bǻșěđ ǿň țħě ňǻțųřě, běħǻvįǿř ǻňđ șǿpħįșțįčǻțįǿň ǿf țħě mǻŀẅǻřě ǻňđ țħě ěxțřěmě měǻșųřěș įț țǻķěș țǿ ěvǻđě đěțěčțįǿň, įț ŀįķěŀỳ pǿįňțș țǿ ǻ ňǻțįǿň-șțǻțě șpǿňșǿřěđ įňįțįǻțįvě, pǿțěňțįǻŀŀỳ ǿřįģįňǻțįňģ įň Ěǻșțěřň Ěųřǿpě. Țħě mǻŀẅǻřě įș mǿșț ŀįķěŀỳ ǻ đřǿppěř țǿǿŀ běįňģ ųșěđ țǿ ģǻįň ǻččěșș țǿ čǻřěfųŀŀỳ țǻřģěțěđ ňěțẅǿřķ ųșěřș, ẅħįčħ įș țħěň ųșěđ ěįțħěř țǿ įňțřǿđųčě țħě pǻỳŀǿǻđ, ẅħįčħ čǿųŀđ ěįțħěř ẅǿřķ țǿ ěxțřǻčț đǻțǻ ǿř įňșěřț țħě mǻŀẅǻřě țǿ pǿțěňțįǻŀŀỳ șħųț đǿẅň ǻň ěňěřģỳ ģřįđ. Țħě ěxpŀǿįț ǻffěčțș ǻŀŀ věřșįǿňș ǿf Mįčřǿșǿfț Ẅįňđǿẅș ǻňđ ħǻș běěň đěvěŀǿpěđ țǿ bỳpǻșș țřǻđįțįǿňǻŀ ǻňțįvįřųș șǿŀųțįǿňș, ňěxț-ģěňěřǻțįǿň fįřěẅǻŀŀș, ǻňđ ěvěň mǿřě řěčěňț ěňđpǿįňț șǿŀųțįǿňș țħǻț ųșě șǻňđbǿxįňģ țěčħňįqųěș țǿ đěțěčț ǻđvǻňčěđ mǻŀẅǻřě. (bįǿměțřįč řěǻđěřș ǻřě ňǿň-řěŀěvǻňț țǿ țħě bỳpǻșș / đěțěčțįǿň țěčħňįqųěș, țħě mǻŀẅǻřě ẅįŀŀ șțǿp ěxěčųțįňģ įf įț đěțěčțș țħě přěșěňčě ǿf șpěčįfįč bįǿměțřįč věňđǿř șǿfțẅǻřě). Ẅě běŀįěvě țħě mǻŀẅǻřě ẅǻș řěŀěǻșěđ įň Mǻỳ ǿf țħįș ỳěǻř ǻňđ įș șțįŀŀ ǻčțįvě. İț ěxħįbįțș țřǻįțș șěěň įň přěvįǿųș ňǻțįǿň-șțǻțě Řǿǿțķįțș, ǻňđ ǻppěǻřș țǿ ħǻvě běěň đěșįģňěđ bỳ mųŀțįpŀě đěvěŀǿpěřș ẅįțħ ħįģħ-ŀěvěŀ șķįŀŀș ǻňđ ǻččěșș țǿ čǿňșįđěřǻbŀě řěșǿųřčěș. Ẅě vǻŀįđǻțěđ țħįș mǻŀẅǻřě čǻmpǻįģň ǻģǻįňșț ȘěňțįňěŀǾňě ǻňđ čǿňfįřměđ țħě șțěpș ǿųțŀįňěđ běŀǿẅ ẅěřě đěțěčțěđ bỳ ǿųř Đỳňǻmįč Běħǻvįǿř Țřǻčķįňģ (ĐBȚ) ěňģįňě. Mǻŀẅǻřě Șỳňǿpșįș Țħįș șǻmpŀě ẅǻș ẅřįțțěň įň ǻ mǻňňěř țǿ ěvǻđě șțǻțįč ǻňđ běħǻvįǿřǻŀ đěțěčțįǿň. Mǻňỳ ǻňțį-șǻňđbǿxįňģ țěčħňįqųěș ǻřě ųțįŀįżěđ. -
The Intel X86 Microarchitectures Map Version 2.0
The Intel x86 Microarchitectures Map Version 2.0 P6 (1995, 0.50 to 0.35 μm) 8086 (1978, 3 µm) 80386 (1985, 1.5 to 1 µm) P5 (1993, 0.80 to 0.35 μm) NetBurst (2000 , 180 to 130 nm) Skylake (2015, 14 nm) Alternative Names: i686 Series: Alternative Names: iAPX 386, 386, i386 Alternative Names: Pentium, 80586, 586, i586 Alternative Names: Pentium 4, Pentium IV, P4 Alternative Names: SKL (Desktop and Mobile), SKX (Server) Series: Pentium Pro (used in desktops and servers) • 16-bit data bus: 8086 (iAPX Series: Series: Series: Series: • Variant: Klamath (1997, 0.35 μm) 86) • Desktop/Server: i386DX Desktop/Server: P5, P54C • Desktop: Willamette (180 nm) • Desktop: Desktop 6th Generation Core i5 (Skylake-S and Skylake-H) • Alternative Names: Pentium II, PII • 8-bit data bus: 8088 (iAPX • Desktop lower-performance: i386SX Desktop/Server higher-performance: P54CQS, P54CS • Desktop higher-performance: Northwood Pentium 4 (130 nm), Northwood B Pentium 4 HT (130 nm), • Desktop higher-performance: Desktop 6th Generation Core i7 (Skylake-S and Skylake-H), Desktop 7th Generation Core i7 X (Skylake-X), • Series: Klamath (used in desktops) 88) • Mobile: i386SL, 80376, i386EX, Mobile: P54C, P54LM Northwood C Pentium 4 HT (130 nm), Gallatin (Pentium 4 Extreme Edition 130 nm) Desktop 7th Generation Core i9 X (Skylake-X), Desktop 9th Generation Core i7 X (Skylake-X), Desktop 9th Generation Core i9 X (Skylake-X) • Variant: Deschutes (1998, 0.25 to 0.18 μm) i386CXSA, i386SXSA, i386CXSB Compatibility: Pentium OverDrive • Desktop lower-performance: Willamette-128 -
Inside Intel® Core™ Microarchitecture and Smart Memory Access an In-Depth Look at Intel Innovations for Accelerating Execution of Memory-Related Instructions
White Paper Inside Intel® Core™ Microarchitecture and Smart Memory Access An In-Depth Look at Intel Innovations for Accelerating Execution of Memory-Related Instructions Jack Doweck Intel Principal Engineer, Merom Lead Architect Intel Corporation Entdecken Sie weitere interessante Artikel und News zum Thema auf all-electronics.de! Hier klicken & informieren! White Paper Intel Smart Memory Access and the Energy-Efficient Performance of the Intel Core Microarchitecture Introduction . 2 The Five Major Ingredients of Intel® Core™ Microarchitecture . 3 Intel® Wide Dynamic Execution . 3 Intel® Advanced Digital Media Boost . 4 Intel® Intelligent Power Capability . 4 Intel® Advanced Smart Cache . 5 Intel® Smart Memory Access . .5 How Intel Smart Memory Access Improves Execution Throughput . .6 Memory Disambiguation . 7 Predictor Lookup . 8 Load Dispatch . 8 Prediction Verification . .8 Watchdog Mechanism . .8 Instruction Pointer-Based (IP) Prefetcher to Level 1 Data Cache . .9 Traffic Control and Resource Allocation . 10 Prefetch Monitor . 10 Summary . .11 Author’s Bio . .11 Learn More . .11 References . .11 2 Intel Smart Memory Access and the Energy-Efficient Performance of the Intel Core Microarchitectures White Paper Introduction The Intel® Core™ microarchitecture is a new foundation for Intel® architecture-based desktop, mobile, and mainstream server multi-core processors. This state-of-the-art, power-efficient multi-core microarchi- tecture delivers increased performance and performance per watt, thus increasing overall energy efficiency. Intel Core microarchitecture extends the energy-efficient philosophy first delivered in Intel's mobile microarchitecture (Intel® Pentium® M processor), and greatly enhances it with many leading edge microarchitectural advancements, as well as some improvements on the best of Intel NetBurst® microarchitecture. -
Intel Mobile CPU (2007-2010)
Intel Mobile CPU (2007-2010) Brand Core 2 Extreme Core 2 Quad Core 2 Extreme Core i7 Processor # X9000 X9100 Q9000 Q9100 QX9xxx Voltage Extreme Extreme Power optimized Standard V Standard V Extreme Codename Penryn 6M Penryn QC Auburndale Clarksfield Platform Santa Rosa Montevina Montevina Calpella Micro-architecture Core MA Core MA Nehalem # of Core Dual Core Quad Core Dual Core Quad Core Hyper-Threading N/A 2 threads/core 2 threads/core Intel 64 Intel 64 Intel 64 Intel 64 VT VT Extended VT-x/d Extended VT-x/d EIST(SpeedStep) EIST(SpeedStep) EIST(SpeedStep) IDA N/A IDA Turbo Mode Cache 6MB L2 2x3MB L2 2x6MB 512KB L2+4MB L3 1MB L2+8MB L3 FSB FSB 800 FSB1066 FSB1066 PCIe x16/DMI PCIe x16/DMI Memory interface N/A N/A DDR3 x2 DDR3 x2 GPU core N/A N/A GPU core N/A Package PGA PGA rPGA989 rPGA989 Socket Socket P Socket P Process Technology 45nm 45nm 45nm 45nm # of Die 1 2 2 2 2(CPU+GMCH) 1 TDP 44W 45W 45W 45W 35W 45W? 45W? 55W Launch Q1'08 Q2'08 Q1'09 Q3'08 Q3'08 Q3'09 09 09 Q3'09 Brand Atom Celeron Core 2 Duo Core 2 Duo Core 2 Duo Processor # N2xx 7xx T8100/8300 T9300/9500 SP9200/9400 P8400/8600 P9500 T9400/9600 Voltage Standard V Standard V ULV Standard V Power optimized Power optimized Standard V Codename Diamondville SC Pineview SC Pineview DC Penryn Penryn 3M Penryn 6M Penryn 6M Penryn 3M Penryn 6M Platform Montevina Santa Rosa Montevina Micro-architecture Silverthorne Lincroft Core MA Core MA Core MA # of Core Single Core Single Core Dual Core Single Core Dual Core Dual Core Hyper-Threading 2 threads/core 2 threads/core N/A N/A N/A Intel -
ARM Против Intel: Успешная Стратегия Для RISC Или Выгода Для CISC?
ARM против INTEL: успешная стратегия для RISC или выгода для CISC? Брайан Дайперт (BRIAN DIPERT), старший технический редактор, EDN Корпорация ARM и владельцы лицензии на ее продукты намерены расши- рить присутствие на рынке и занять ниши, традиционно занимаемые процессорами Intel x86. В ответ Intel решила потеснить корпорацию ARM в сегменте рынка электронных устройств. корпорации ARM и Intel окончатель- пустили при переходе с ARM11. ядро повышенную защиту. второй тип про- но вступили в открытую конкуренцию. Cortex-A8 обеспечивает поддержку цессоров ориентирован больше на первая активно продвигает технологию попарно запускаемых суперскалярных беспроводную передачу данных и под- RISC, в то время как Intel делает упор инструкций и имеет более глубокий держивает большой набор протоколов на процессоры с набором команд CISC. конвейер в каждом ядре, содержащий передачи данных и голоса. еще три года назад, когда Intel представ- 13 уровней вместо 8. Блок вычислений с ляла свой первый процессор семейства плавающей запятой в отличие от ARM11 NVIDIA — ставка на мультимеДиа Atom, компания ясно дала понять, что является обязательным. кроме того, компания Nvidia стала обладатель- нацелена не только на настольные ком- для Cortex-A8 требуется 64-разрядный ницей лицензии на ARM после несколь- пьютеры среднего уровня и ноутбуки, SIMD-вычислитель Neon. ких приобретений: компании MediaQ но и на портативные устройства, в кото- в Cortex-A9 разработчик сам решает, в 2003 г. и PortalPlayer в 2006 г. первая рых исторически пальма первенства реализовывать ли Neon и блок опера- снк Nvidia, Tegra, содержала процессор принадлежит ARM. в ответ ARM пред- ций с плавающей запятой. оба они не ARM11. она не получила широкого при- ставила ядро Cortex-A15, область при- являются обязательными. -
R&D and the Market for Acquisitions
R&D and the Market for Acquisitions Gordon PhillipsW and Alexei Zhdanov** COMMENTS WELCOME: First version January 10, 2010. This Version: February 20, 2011 We provide a new theory and empirical tests showing how an active acquisition market posi- tively aects rm incentives to innovate and conduct R&D. Our model shows how the incentives of small rms to conduct R&D in order to innovate increase with competition, demand and the probability that they are taken over. In contrast, we show that large rms optimally may decide to purchase smaller innovative rms and conduct less R&D themselves. Empirically, we document that the R&D of small rms responds more than the R&D of larger rms to demand shocks and the probability of being an acquisition target. The results also show that rm R&D increases with product-market competition and with industry acquisition liquidity and that these eects are stronger for smaller rms. WUniversity of Maryland and NBER, **University of Lausanne and Swiss FinanceInstitute. Phillipscanbereachedat [email protected], Zhdanov can be reached at [email protected]. We would like to thank Denis Gromb, Urs Peyer and seminar participants at Insead for helpful comments and discussion. R&D and the Market for Acquisitions ABSTRACT We provide a new theory and empirical tests showing how an active acquisition market posi- tively aects rm incentives to innovate and conduct R&D. Our model shows how the incentives of small rms to conduct R&D in order to innovate increase with competition, demand and the probability that they are taken over. -
A Study of the Soc and Smartphone Industries
Vertical Structure and Innovation: A Study of the SoC and Smartphone Industries Chenyu Yang∗ Department of Economics, University of Maryland, College Park December 19, 2019 Abstract This article studies how vertical integration and upstream R&D subsidy affect innovation and welfare in vertically separated industries. I formulate a dynamic structural model of a dominant upstream firm and oligopolistic downstream firms that invest in complementary innovations. I estimate the model using data on the System-on-Chip (SoC) and smartphone industries. The results suggest that a vertical merger can increase innovation and welfare, mainly driven by the investment coordination of the merged firms. I also find that subsidizing the upstream innovation increases overall private investment, innovation and welfare. 1 Introduction In vertical industries, upstream and downstream innovations are often complementary. Upstream firms upgrade the core technology essential to performance enhancement, and downstream firms combine the technology with innovative designs in new consumer products. Examples of com- plementary innovations include traction batteries (upstream) and electric vehicles (downstream), CPUs (upstream) and personal computers (downstream) and System-on-Chips (SoCs, upstream) ∗Department of Economics, University of Maryland, College Park; [email protected]. I would like to acknowl- edge the generous financial support provided by Rackham Graduate School and Michigan Institute for Teaching and Research in Economics (MITRE) at the University of Michigan. I am grateful for the guidance and support from my advisers Jeremy Fox, Daniel Ackerberg, Ying Fan and Srinivasaraghavan Sriram. I benefited greatly from the comments of many seminar participants, two anonymous referees and the editor Marc Rysman. All errors are mine. -
0-9, and Symbols A
Index Note : Online information is listed by print page number and a period followed by “e” with online page number (54.e1). Page references preceded by a single letter with hyphen refer to appendices. Page references followed by “f ,” “ t ,” and “ b ” refer to fi gures, tables, and boxes, respectively. 0-9, and symbols ID (ASID) , 436 VAX fl oating-point formats , D-29 inadequate , 497.e5–497.e6 ALU control , 249–251 . See also 1-bit ALU , A-26–A-29 . See also shared , 507–508 Arithmetic logic unit (ALU) Arithmetic logic unit (ALU) single physical , 507 , 507–508 bits , 250–251 , 250 f adder , A-27 f virtual , 436 logic , C-6–C-7 CarryOut , A-28 Address translation mapping to gates , C-4–C-7 for most signifi cant bit , A-33 f for ARM cortex-A53 , 458 f truth tables , C-5f , C-5 f illustrated , A-29f defi ned , 418–419 ALU control block , 253 logical unit for AND/OR , A-27 f fast , 428–430 defi ned , C-4–C-6 performing AND, OR, and addition , for Intel core i7 , 458 f generating ALU control bits , C-6 f A-31 , A-33 f TLB for , 428–430 ALUOp , 250 , C-6 b –C-7 b 64-bit ALU , A-29–A-31 . See also Address-control lines , C-26f bits , 250 , 251 Arithmetic logic unit (ALU) Addresses control signal , 253 from 63 copies of 1-bit ALU , A-34 f b a s e , 6 9 Amazon Web Services (AWS) , 415b with 64 1-bit ALUs , A-30f byte , 70 AMD Opteron X4 (Barcelona) , 533 , 534f defi ning in Verilog , A-36–A-37 defi ned , 68 AMD64 , 148 , 148 , 215 , 173.e5 illustrated , A-35f m e m o r y , 7 8 b Amdahl’s law , 391 , 493–494 ripple carry adder , A-29 virtual -
Intel's Haswell CPU Microarchitecture
Intel’s Haswell CPU Microarchitecture www.realworldtech.com/haswell-cpu/ David Kanter Over the last 5 years, high performance microprocessors have changed dramatically. One of the most significant influences is the increasing level of integration that is enabled by Moore’s Law. In the context of semiconductors, integration is an ever-present fact of life, reducing system power consumption and cost and increasing performance. The latest incarnation of this trend is the System-on-a-Chip (SoC) philosophy and design approach. SoCs have been the preferred solution for extremely low power systems, such as 1W mobile phone chips. However, high performance microprocessors span a much wider design space, from 15W notebook chips to 150W server sockets and the adoption of SoCs has been slower because of the more diverse market. Sandy Bridge was a dawn of a new era for Intel, and the first high-end x86 microprocessor that could truly be described as an SoC, integrating the CPU, GPU, Last Level Cache and system I/O. However, Sandy Bridge largely targets conventional PC markets, such as notebooks, desktops, workstations and servers, with a smattering of embedded applications. The competition for Sandy Bridge is largely AMD’s Bulldozer family, which has suffered from poor performance in the first few iterations. The 32nm Sandy Bridge CPU introduced AVX, a new instruction extension for floating point (FP) workloads and fundamentally changed almost every aspect of the pipeline, from instruction fetching to memory accesses. The system architecture was radically revamped, with a coherent ring interconnect for on-chip communication, a higher bandwidth Last Level Cache (LLC), integrated graphics and I/O, and comprehensive power management.