DOCSLIB.ORG

Electrostatic Discharge Analysis of Multi Layer Ceramic Capacitors

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Electrostatic Discharge Analysis of Multi Layer Ceramic Capacitors Electrostatic Discharge Analysis of Multi Layer Ceramic Capacitors Cyrous Rostamzadeh, Robert Bosch LLC – USA February 17, 2011 Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Mr. Kimball Williams Thank you for your Colossal Contributions and Dedication to IEEE EMC Society. You have educated, trained, inspired, managed and encouraged many of the EMC Engineers and Technicians in the SE Michigan area. You are well respected by everyone throughout the EMC Society and Automotive Community. I had the privilege to prepare this presentation, per your invitation, and I hope you will continue to guide the EMC Society long after your retirement from the Professional Responsibilities as of February 2012, thank you. Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Mr. Kimball Williams Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 A privilege for me to be educated, mentored, collaborated with some of the finest minds of EMC… Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Dr. Al Reuhli (IBM) Dr.Clayton Paul Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Dr. Howard Johnson Signal Integrity 1994 2001 Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Professor Flavio Canavero Politecnico di Torino Professor Christos Christopouplos University of Nottingham Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Professor Sergio Pignari Politecnico di Milano Professor Farhad Rachidi Swiss Federal Institute of Technology (EPFL) Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 ProfessorProfessor JamesJames DrewniakDrewniak Dr.Dr. BruceBruce ArchambeaultArchambeault MissouriMissouri STST UniversityUniversity IBM,IBM, RTPRTP ProfessorProfessor DavidDavid PommerenkePommerenke HenryHenry OttOtt MissouriMissouri STST UniversityUniversity Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Gordon Mapes, Phil Bator, Andy Macko, Mike Bosley,Arnie Nielsen, Terry North, Victor Lau, Mark Steffka, Kimball Williams, Howard Kendall, Don Seyerle, Rick Grunow, Jim Muccioli, Thorsten Schneider, Tom Livernois, Rick Lombardi, Richard Wiese, Bill Sperber, Scott Lytle, Keith Frazier, Lloyd Elsworth, Laura Ball, Larry Banasky, Larry J. Boguslawski, Chingchi Chen, Samuel R. Connor, Prof. Marcello D'Amore, Dr. Phil Fanson, Bill Gilmore, Poul Anderson, Dr. Flavia Grassi, Dr. Todd Hubing, Dr. Chris Holloway, Professor Michel Ianoz, Dr. Thomas A. Jerse, Rob Kado, Richard Kautz, Jarek Tracz, Jack King, Joe Kramer, Roy Leventhal, Filippo Marliani, Scott Mee, Prof. Antonio Orlandi, Vipul Patel, Sreeniwas Ranganathan, Andrew J. Shune, James P. Spivey, John P. Sundeen, Daniel M Traynor, Dr. Al Wexler, Dr. David Hill, Dr. Perry Wilson, Doug Smith, Dr. Erping Li, Dustin Willim, Mark Wisnewski, Matthew Yager, Paul Sarna, Jack Meyer, Mark Miles… Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Back to basics… Electric Currents Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Electric Currents Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Conduction Current & Displacement Current Conduction Current Displacement Current Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Conduction Current & Displacement Current Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Conduction Current & Displacement Current Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Conduction Current & Displacement Current Conduction Current >> Magnetic Field Displacement Current >> Electric Field Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Motivation and Objectives Multi layer Ceramic Capacitors are utilized for ESD Protection of Connector I/O Pins → Low Cost, Small Footprint (i.e., 0603 - X7R Class II) ideal for High Density Electronic Control Modules. But Need to determine ESD Robustness or any Degradation due to ESD: ¾ Pre_ESD and Post_ESD Impedance vs. Frequency Characterization. ¾ Optical Examination of Dielectric Structure after ESD Exposure. Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Motivation and Objectives In this Work ¾ Electrostatic Discharge according to IEC61000-4-2 ¾ Human Body Model up to 25 kV (100 pF , 2 kΩ Discharge Network) ¾ MLCC (0603 package 1.6 mm X 0.5 mm) 680 pF and 10 nF (100 Volts), X7R Type II (-55oC -> +125oC) ¾ In addition, MLCC (0805 package) ¾ Discharge to PCB Mounted MLCC ¾ Discharge to Non-PCB Mounted MLCC Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 MLCCMLCC ProcessProcess Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 ε ε nA C = 0 r Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 t Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 CeramicCeramic MLCCMLCC TypesTypes C0G,C0G, X7R,X7R, X5R,X5R, X8R,X8R, X8LX8L Class I – Most stable over Temperature and Voltage, & Frequency but Lowest Volumetric Efficiency (C0G or NPO) Class II – Lower Accuracy and Stability (+/- 15%, -55 0C –> 125 0C) X7R Class III – Highest Volumetric Efficiency, but Poor Accuracy & Stability Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 MLCCMLCC CharacteristicsCharacteristics AnAn ElectricalElectrical ModelModel…… Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 1 F n X = 1 C j2πfC F n 0 1 Linear Scale Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 F n 1 1 X = C j2πfC F n 0 1 Logarithmic Scale Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 WhatWhat isis inin aa ModelModel…… C 1 X = C j2πfC Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 BuildingBuilding aa ModelModel…… Heat 1 Z = + R j2πfC Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 BuildingBuilding aa ModelModel…… Heat 1 Z = + R + j2πfL j2πfC Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 10nF, |Z| Cyrous Rostamzadeh, Senior 10nF, |ESR| Describing MLCC with Matlab 1 j2 πfC IEEE Member, February 17, 2011 j2 πfL 0603 (100 V) MLCC Characteristics 1 nF Superior for freq. > 50 MHz 100 mΩ 10 mΩ Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 DissipationDissipation FactorFactor ImpedanceImpedance PlanePlane Loss ESR ESR DF = tan(δ ) = = 1 X Q δ C − jX C DF = Resistive power Loss in ESR / Reactive Power oscillating in Capacitor Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 ESRESR isis aa functionfunction ofof FrequencyFrequency Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 TemperatureTemperature FactorFactor Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 anan ESDESD EventEvent…… Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 ¾ESD voltages as high as 30 kV has been observed in automotive environment. ¾ESD is rich in high-frequency (> 3 GHz) ! ¾ESD event can create currents in excess of 30 Amps! ¾ESD currents can destroy IC’s, PCB traces and other components. ¾ESD can create time-varying Magnetic Field: 25 A/m. ¾ESD can create time-varying Electric Field as high as: 10 kV/m. ¾ESD can create Susceptibility Problems. Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 ESD phenomena involves ElectricalElectrical && ThermalThermal TransportsTransports on the Scale of nanometers (nm), Circuits and Electronics on the Scale of micrometers (µm), Semiconductor Chip designs range from picoseconds (ps) to microseconds (µs), Electrical Currents of interest range from mA to 10’s of Amperes. Voltages range from Volts to kiloVolts (kV). Temperatures vary from room temperature to melting temperatures of 1000’s 0K… Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Must Quantify the Scale in SpaceSpace && TimeTime ESD phenomena involves: Microscopic to Macroscopic Scales. ¾ESD is a Thermo-Electric Transport of Material Physics Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 Capacitance – ESD Charge Storage Element Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 ChargeCharge StorageStorage CapacitanceCapacitance 4πε C = ⎛ 1 1 ⎞ r ⎜ − ⎟ 1 ⎝ r1 r2 ⎠ r2 −12 if r2 ⇒ ∞, and for free space, ε = 8.85×10 F / m C = ()111× r pF, a human has a surface area ≈ to 1 meter diameter sphere, ⇒ CHuman Body ≈ 50 pF Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 FreeFree--SpaceSpace CapacitanceCapacitance Human Body Capacitance 50 pF Earth’s Capacitance 700 µF An object a size of marble 1 pF ¾¾InIn addition,addition, wewe mustmust considerconsider ParallelParallel PlatePlate CapacitanceCapacitance duedue toto thethe proximityproximity ofof anan objectobject toto thethe surroundingsurrounding Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 HumanHuman BodyBody ModelModel (HBM)(HBM) Self-Capacitance 50 - 100 pF 50 pF to infinity 500 Ω to 10 kΩ 100 pF Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 HumanHuman BodyBody ModelModel (HBM)(HBM) ¾¾Therefore,Therefore, thethe CapacitanceCapacitance ofof aa HumanHuman BodyBody isis thethe CombinationCombination ofof FreeFree--SpaceSpace CapacitanceCapacitance ++ ParallelParallel--PlatePlate CapacitanceCapacitance andand cancan varyvary fromfrom 5050 pFpF toto 250250 pFpF Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 HumanHuman BodyBody ModelModel (HBM)(HBM) VHB CHB = 50 − 250 pF RHB = 500 Ω −10 kΩ VHB = 0 to 25 kV Cyrous Rostamzadeh, Senior IEEE Member, February 17, 2011 HumanHuman BodyBody ModelModel (HBM)(HBM) For a Human Body of 100 pF Capacitance, Charged Up to 25 kVolt,
Load more

Recommended publications
  • ESD) • Styrofoam Cups Safety Guidelines 3
    common materials, often found in business and laboratory environments, are all sources of static electricity: • common plastic bags • common types of mending and packing tape • paperwork • common untreated plastic materials Electrostatic Discharge (ESD) • styrofoam cups Safety Guidelines 3. Types of ESD Damage Copyright © 2007 Dialogic Corporation. All rights reserved. Static damage to components can take the form of upset failures or catastrophic failures. 1. Introduction Upset Failure Electrostatic Discharge, or ESD, is defined as the transfer of charge between bodies at different electrical potentials. Upset failures occur when an electrostatic discharge has caused a current flow that is not significant enough to cause total failure, but in use may intermittently If you scuff your feet as you walk across a carpet, electrons move from the result in gate leakage causing software malfunction or incorrect storage of carpet to you, leaving you with excess electrons. Touch a door knob and ZAP! information. The electrons move from you to the knob. You get a shock, at a minimum of 3,000 volts (the threshold of human feeling)! Catastrophic Failure The kind of ESD shock you feel may also be responsible for damaging electronic components in many computers and telecommunications systems. Catastrophic failures can be direct or latent. While it takes an electrostatic discharge of 3,000 volts for you to feel a shock, Direct catastrophic failures occur when a component is damaged to the point much smaller charges, well below the threshold of human sensation, can and where it no longer functions correctly. This is the easiest type of ESD damage often do damage semiconductor devices.
    [Show full text]
  • Dissipative Etfe Dielectric Polymer Helps Control Electrostatic Discharge in Wires and Cables
    DISSIPATIVE ETFE DIELECTRIC POLYMER HELPS CONTROL ELECTROSTATIC DISCHARGE IN WIRES AND CABLES. by: Chris Yun, Principal Engineer of Aerospace, Defense and Marine, TE Connectivity Recent tests by NASA's Jet Propulsion Laboratory (JPL) and when electrically dissimilar materials rub together. But in wires and Goddard Space Flight Center show that new nano-carbon cross- cables used in spacecraFt, a static charge can be created by the linked ethylene tetrafluoroethylene (ETFE) helps controls impact of charged particles on the material. Space is filled with electrostatic discharge (ESD) in wires and cables used on charged particles that can induce a charge in materials. Satellites spacecraft. in geosynchronous orbits and deep space missions are particularly susceptible because oF higher charge density in GEO and deep Controlling static electricity in electrical interconnection systems is space. essential in spacecraft where ESD events can damage electronics and scuttle the mission. The use of high resistivity dielectric materials and electrically separated surFaces in conjunction with the connected conducting In fact, it has been reported that 54% of spacecraft surFaces oF the spacecraFt Frame promote various forms of anomalies/Failures are caused by electrostatic discharging and spacecraFt charging.3 When the charge builds up in wire and cable charging. 1 For example in April 2010, the Galaxy 15 of electrical interconnection systems, a sudden discharge can telecommunications satellite wandered from its geosynchronous damage connected logic circuits, electronic instruments, and orbit. Reports in space technology literature suggested that computer chips. spacecraFt charging caused the anomaly. Fortunately, a workaround allowed the mission to continue. Worse oFF was the Discharge voltage levels vary widely.
    [Show full text]
  • Lead-Acid Starter Batteries in Systems Usage Information
    Batteries Association ZVEI information leaflet No. 28e Edition October 2017 Lead-acid starter batteries in systems Usage information Preliminary note: This information leaflet aims to help to choose batteries and develop design solutions and operating manuals by providing general information on the usage of lead-acid batteries in vehicles, which extend beyond the relevant standard specifications. This information serves as a recommendation only, and not as a substitute for the battery user’s responsibility to make appropriate decisions. By pooling all gained experience to date, however, it should make the decision easier. Contents 1. General .............................................................................................................................................. 2 2. Mechanical loads.............................................................................................................................. 2 2.1. Battery installation................................................................................................................. 2 2.2. Vibration stress...................................................................................................................... 3 3. Thermal stress..................................................................................................................................3 3.1. Battery temperatures............................................................................................................. 4 3.2. Possible measures regarding thermal loading
    [Show full text]
  • Characterization of Methods for Surface Charge Removal for the Reduction of Electrostatic Discharge Events in Explosive Environments
    Proc. 2017 Annual Meeting of the Electrostatics of America 1 Characterization of methods for surface charge removal for the reduction of electrostatic discharge events in explosive environments K. Nusrat Islam, Mark Gilmore Dept. of Electrical and Computer Engineering University of New Mexico, Albuquerque, NM 87110 phone: (1) 505-277-2579 e-mail: [email protected], [email protected] Abstract—Electrostatic discharge (ESD) from charged dielectric materials used within ex- plosive environments presents a significant hazard. To investigate dielectric surface charging, and methods of removing the charge, in detail and in a controlled way, a test stand has been built and utilized to study the behavior of several common dielectric materials used in such environments. A corona discharge source of the type used in electrostatic printing technology has been employed at normal laboratory temperatures and at low and high relative humidity in a controlled manner. Materials tested included black Kapton, yellow Kapton, Lexan, Del- rin, and Adiprene with surface potentials (Vdiel) ranging from -1 kV to -15 kV. Uniform charg- ing and discharging of individual dielectric samples of varying thickness has been observed, as characterized by spatial scans of the surface potential at low voltages such as -1 kV to -4 kV. At higher charging voltages, the surface potential is found to decay or increase with time in complex ways, showing a dependence on the magnitude of the surface potential (Vdiel), as well as two characteristic time constants d (τ1, τ2) in some cases. The initial decay of Vdiel (d) is rapid, while the subsequent decay of surface potential is much slower.
    [Show full text]
  • Pre-Breakdown Arcing and Electrostatic Discharge in Dielectrics Under High DC Electric Field Stress
    Utah State University DigitalCommons@USU Conference Proceedings Materials Physics 10-19-2014 Pre-breakdown Arcing and Electrostatic Discharge in Dielectrics under High DC Electric Field Stress Allen Andersen Utah State University JR Dennison Utah State Univesity Follow this and additional works at: https://digitalcommons.usu.edu/mp_conf Part of the Condensed Matter Physics Commons Recommended Citation Allen Andersen and JR Dennison, “Pre-breakdown Arcing and Electrostatic Discharge in Dielectrics under High DC Electric Field Stress,” Proceedings of the 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena—(CEIDP 2014), (Des Moines, IO, October 19-22, 2014), 4 pp.. This Article is brought to you for free and open access by the Materials Physics at DigitalCommons@USU. It has been accepted for inclusion in Conference Proceedings by an authorized administrator of DigitalCommons@USU. For more information, please contact [email protected]. Proceedings of the 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena—(CEIDP Pre-breakdown Arcing and Electrostatic Discharge in Dielectrics under High DC Electric Field Stress Allen Andersen and JR Dennison Materials Physics Group Utah State University 4415 Old Main Hill, Logan, UT 84322 USA Abstract— Highly disordered insulating materials exposed to model characterizes electrical aging in terms of recoverable high electric fields will, over time, degrade and fail, potentially defects that can be thermally annealed and irrecoverable causing catastrophic damage to devices. Step-up to electrostatic defects with higher energies such as bond breaking. We use discharge (ESD) tests were performed for two common polymer this model to make a statistical comparison of our arcing and dielectrics, low density polyethylene and polyimide.
    [Show full text]
  • SAFETY STANDARD for HYDROGEN and HYDROGEN SYSTEMS Guidelines for Hydrogen System Design, Materials Selection, Operations, Storage, and Transportation
    NSS 1740.16 National Aeronautics and Space Administration SAFETY STANDARD FOR HYDROGEN AND HYDROGEN SYSTEMS Guidelines for Hydrogen System Design, Materials Selection, Operations, Storage, and Transportation Office of Safety and Mission Assurance Washington, DC 20546 PREFACE This safety standard establishes a uniform Agency process for hydrogen system design, materials selection, operation, storage, and transportation. This standard contains minimum guidelines applicable to NASA Headquarters and all NASA Field Centers. Centers are encouraged to assess their individual programs and develop additional requirements as needed. “Shalls” and “musts” denote requirements mandated in other documents and in widespread use in the aerospace industry. This standard is issued in loose-leaf form and will be revised by change pages. Comments and questions concerning the contents of this publication should be referred to the National Aeronautics and Space Administration Headquarters, Director, Safety and Risk Management Division, Office of the Associate for Safety and Mission Assurance, Washington, DC 20546. Frederick D. Gregory Effective Date: Feb.12, 1997 Associate Administrator for Safety and Mission Assurance i ACKNOWLEDGMENTS The NASA Hydrogen Safety Handbook originally was prepared by Paul M. Ordin, Consulting Engineer, with the support of the Planning Research Corporation. The support of the NASA Hydrogen-Oxygen Safety Standards Review Committee in providing technical monitoring of the standard is acknowledged. The committee included the following members: William J. Brown (Chairman) NASA Lewis Research Center Cleveland, OH Harold Beeson NASA Johnson Space Center White Sands Test Facility Las Cruces, NM Mike Pedley NASA Johnson Space Center Houston, TX Dennis Griffin NASA Marshall Space Flight Center Alabama Coleman J. Bryan NASA Kennedy Space Center Florida Wayne A.
    [Show full text]
  • Explosive Safety with Regards to Electrostatic Discharge Francis Martinez
    University of New Mexico UNM Digital Repository Electrical and Computer Engineering ETDs Engineering ETDs 7-12-2014 Explosive Safety with Regards to Electrostatic Discharge Francis Martinez Follow this and additional works at: https://digitalrepository.unm.edu/ece_etds Recommended Citation Martinez, Francis. "Explosive Safety with Regards to Electrostatic Discharge." (2014). https://digitalrepository.unm.edu/ece_etds/ 172 This Thesis is brought to you for free and open access by the Engineering ETDs at UNM Digital Repository. It has been accepted for inclusion in Electrical and Computer Engineering ETDs by an authorized administrator of UNM Digital Repository. For more information, please contact [email protected]. Francis J. Martinez Candidate Electrical and Computer Engineering Department This thesis is approved, and it is acceptable in quality and form for publication: Approved by the Thesis Committee: Dr. Christos Christodoulou , Chairperson Dr. Mark Gilmore Dr. Youssef Tawk i EXPLOSIVE SAFETY WITH REGARDS TO ELECTROSTATIC DISCHARGE by FRANCIS J. MARTINEZ B.S. ELECTRICAL ENGINEERING NEW MEXICO INSTITUTE OF MINING AND TECHNOLOGY 2001 THESIS Submitted in Partial Fulfillment of the Requirements for the Degree of Master of Science In Electrical Engineering The University of New Mexico Albuquerque, New Mexico May 2014 ii Dedication To my beautiful and amazing wife, Alicia, and our perfect daughter, Isabella Alessandra and to our unborn child who we are excited to meet and the one that we never got to meet. This was done out of love for all of you. iii Acknowledgements Approximately 6 years ago, I met Dr. Christos Christodoulou on a collaborative project we were working on. He invited me to explore getting my Master’s in EE and he told me to call him whenever I decided to do it.
    [Show full text]
  • Development and Modeling of High Temperature
    DEVELOPMENT AND MODELING OF HIGH TEMPERATURE POLYMERIC HEATER MAZIYAR BOLOURCHI Bachelor of Science in Chemistry City University of New York (York College) May 2001 Submitted in partial fulfillment of requirements for the degree MASTER OF SCIENCE IN CHEMICAL ENGINEERING at the CLEVELAND STATE UNIVERSITY December 2007 ACKNOWLEDGEMENTS First and foremost, I would like to thank Roger Avakian and Dr. Dave Jarus of PolyOne Corporation for their guidance, support and mentorship. Their technical advice was essential in the progression and completion of this project and has taught me many valuable lessons. I am grateful to have had the opportunity to work under their guidance and direction. I would also like to thank my graduate advisor Dr. Nolan B. Holland for accepting this work as my graduate thesis research in addition to the continual support (editorial and visiting). My thanks also go to Dr. Surendra N. Tewari and Dr. George P. Chatzimavroudis for their roles as graduate committee members. Many other thanks to my colleagues Dr. Grant Barber, Charles McDaniel, John Papadopoulos and Dan Nash for their continual support in helping with process, aid and figures used in thesis and thanks to John Hornickel, PolyOne attorney, Jim Isner and Coleen McFarland of Polymer Diagnostics (PDI) for their guidance, safety concerns and continual support. Last but certainly not least, I must thank my wife and parents whom have made this all possible. DEVELOPMENT AND MODELING OF A HIGH TEMPERATURE POLYMERIC HEATER MAZIYAR BOLOURCHI ABSTRACT Polymers are generally known for their excellent insulative properties. The addition of carbonaceous fillers such as carbon black and graphite within a polymer matrix can impart electrical and thermal properties making them good conductors.
    [Show full text]
  • Analysis and Design of Distributed ESD Protection Circuits for High
    1444 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 49, NO. 8, AUGUST 2002 Analysis and Design of Distributed ESD Protection Circuits for High-Speed Mixed-Signal and RF ICs Choshu Ito, Student Member, IEEE, Kaustav Banerjee, Member, IEEE, and Robert W. Dutton, Fellow, IEEE Abstract—Electrostatic discharge (ESD) protection devices can have an adverse effect on the performance of high-speed mixed- signal and RF circuits. This paper presents quantitative method- ologies to analyze the performance degradation of these circuits due to ESD protection. A detailed s-parameter-based analysis of these high-frequency systems illustrates the utility of the distributed ESD protection scheme and the impact of the parasitics associated with the protection devices. It is shown that a four-stage distributed ESD protection can be beneficial for frequencies up to 10 GHz. In addition, two generalized design optimization methodologies in- corporating coplanar waveguides are developed for the distributed structure to achieve a better impedance match over a broad fre- quency range (0–10 GHz). By using this optimized design, an ESD device with a parasitic capacitance of 200 fF attenuates the RF signal power by only 0.27 dB at 10 GHz. Furthermore, termina- Fig. 1. A simple ESD protection system example. The diodes shunt excess tion schemes are proposed to allow this analysis to be applicable to current applied to the signal pin toward VDD or GND to protect the core circuit. high-speed digital and mixed-signal systems. Index Terms—Broadband matching, coplanar waveguides, dis- tributed circuits, electrostatic discharge, high-speed mixed-signal or silicon controlled rectifiers (SCRs), but in all cases, these circuits, RF ICs, s-parameters, transmission lines.
    [Show full text]
  • The Space Weather Threat to Situational Awareness, Communications, and Positioning Systems
    The Space Weather Threat to Situational Awareness, Communications, and Positioning Systems The MIT Faculty has made this article openly available. Please share how this access benefits you. Your story matters. Citation Ferguson, Dale C., Simon Peter Worden, and Daniel E. Hastings. “The Space Weather Threat to Situational Awareness, Communications, and Positioning Systems.” IEEE Transactions on Plasma Science 43.9 (2015): 3086–3098. As Published http://dx.doi.org/10.1109/TPS.2015.2412775 Publisher Institute of Electrical and Electronics Engineers (IEEE) Version Original manuscript Citable link http://hdl.handle.net/1721.1/105805 Terms of Use Creative Commons Attribution-Noncommercial-Share Alike Detailed Terms http://creativecommons.org/licenses/by-nc-sa/4.0/ (Abstract No# 169) The Space Weather Threat to Situational Awareness, Communications, and Positioning Systems D.C. Ferguson, S.P. Worden, and D.E. Hastings Abstract— A recent space weather headline has cast doubt in It is rotating, but instead of rotating like a solid body, it the minds of some as to whether space weather is the source of differentially rotates – the rotation period is ~ 25 days at the spacecraft anomalies, and thus, whether it is important in the equator and ~30 days at the poles (average ~ 27 days). It has a design and operation of critical situational awareness, magnetic field caused by the dynamo effect. The differential communications, and positioning systems. In this paper, we rotation of the plasma (to which the magnetic field lines are reiterate the evidence for the importance of space weather, its role in producing spacecraft and ground anomalies, and the attached) twists and untwists the magnetic field lines making threat it poses to critical systems.
    [Show full text]
  • ESD ‐ Electrostatic Discharge
    ESD ‐ Electrostatic Discharge EPOW6860 –Project RPI 12/14‐2007 Martin Rodgaard What is ESD? • A charged body, which gets discharged • Arcs at high voltages • Triboelectrification – Friction between two different materials, at least one insulator • Properties of ESD – 100 to 35000 voltages – Up to 1000µ Jules of energy – 3000 ‐ 4000V to se, feel or hear it Why is ESD of concern? • Potential damage of semiconductive devices – The high voltages makes the layers or isolation between the layers breakdown – The energy is allocated faster than the material can dissipate it, and can make it melt ESD ‐ Human Body Model(HBM) • Charged human body • Modeled as a capacitor and a series resistor • Values specified in ESD standards – 100pF body capacitance – 1500Ω body resistance – 4000V – 0.4µC or 800µJ of energy ESD ‐ Machine Model(MM) • Charged machine body – Production machine, typically made of metal – Therefore no series resistance • Modeled as a capacitor and series inductor • Values specified in ESD standards – 200pF body capacitance – 750nH series inductance – 400V ESD ‐ Transmission Line Pulsing(TLP) • Charged transmission line • Typical values for testing – Grate Immunity to purposes parasitic components – 50Ω coaxial cable – And therefore a good tool – 90 ‐ 100 nF/m for ESD testing – 10m generating a pulse of • Basic circuit 100ns – Diode clamps any negative reflections, so the pulse doesn’t bounce back again – High quality switch – 50Ω coaxial cable – Charged trough 10MΩ resistor TLP ‐ Basic principle • Coaxial cable • Reflections TLP ‐
    [Show full text]
  • INTERNAL ELECTROSTATIC DISCHARGE ENVIRONMENT at JUPITER Henry B
    INTERNAL ELECTROSTATIC DISCHARGE ENVIRONMENT AT JUPITER Henry B. Garrett The Jet Propulsion Laboratory, California Institute of Technology, 4800 Oak Grove Dr., Pasadena, CA 91109 O: 818-354-2644; F: 818-393-4699; [email protected] Robin W. Evans Gibbel Corp., 2550 Honolulu Blvd., Montrose, CA 91020 ABSTRACT Although a fairly common occurrence in the Earth’s environment, internal electrostatic discharge (or IESD) is seldom discussed with regards to extraterrestrial space missions. The Voyager 1 flyby of Jupiter, however, clearly demonstrated the importance of this phenomena in the context of the jovian radiation belts—Voyager suffered 42 Power-On Resets that were ultimately attributed to IESD during passage through the jovian belts. As several missions are being considered for the jovian environment, it is appropriate to revisit the effects observed on Voyager and review what we now know of the jovian IESD environment. In particular, NASA is considering a mission to orbit the moon Europa for the purpose of a close-up look at this possibly oceanic moon to determine if it might harbor life. This presentation will review the previous IESD observations from Voyager 1 in the context of our new understanding of the jovian radiation belts based on Galileo data and present simple tools for estimating IESD at Jupiter. INTRODUCTION Although anomalies caused by internal electrostatic discharge (or IESD) are currently an important concern for Earth-based missions, IESD is not often considered as a hazard for interplanetary missions. During the Voyager 1 flyby of Jupiter, however, a number of anomalies were observed that were ultimately attributed to IESD.
    [Show full text]