Intel's Tiger Lake 11Th Gen Core I7-1185G7 Review and Deep Dive
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
Intel® Architecture Instruction Set Extensions and Future Features Programming Reference
Intel® Architecture Instruction Set Extensions and Future Features Programming Reference 319433-037 MAY 2019 Intel technologies features and benefits depend on system configuration and may require enabled hardware, software, or service activation. Learn more at intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifica- tions. Current characterized errata are available on request. This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Intel does not guarantee the availability of these interfaces in any future product. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1- 800-548-4725, or by visiting http://www.intel.com/design/literature.htm. Intel, the Intel logo, Intel Deep Learning Boost, Intel DL Boost, Intel Atom, Intel Core, Intel SpeedStep, MMX, Pentium, VTune, and Xeon are trademarks of Intel Corporation in the U.S. -
GPU Developments 2018
GPU Developments 2018 2018 GPU Developments 2018 © Copyright Jon Peddie Research 2019. All rights reserved. Reproduction in whole or in part is prohibited without written permission from Jon Peddie Research. This report is the property of Jon Peddie Research (JPR) and made available to a restricted number of clients only upon these terms and conditions. Agreement not to copy or disclose. This report and all future reports or other materials provided by JPR pursuant to this subscription (collectively, “Reports”) are protected by: (i) federal copyright, pursuant to the Copyright Act of 1976; and (ii) the nondisclosure provisions set forth immediately following. License, exclusive use, and agreement not to disclose. Reports are the trade secret property exclusively of JPR and are made available to a restricted number of clients, for their exclusive use and only upon the following terms and conditions. JPR grants site-wide license to read and utilize the information in the Reports, exclusively to the initial subscriber to the Reports, its subsidiaries, divisions, and employees (collectively, “Subscriber”). The Reports shall, at all times, be treated by Subscriber as proprietary and confidential documents, for internal use only. Subscriber agrees that it will not reproduce for or share any of the material in the Reports (“Material”) with any entity or individual other than Subscriber (“Shared Third Party”) (collectively, “Share” or “Sharing”), without the advance written permission of JPR. Subscriber shall be liable for any breach of this agreement and shall be subject to cancellation of its subscription to Reports. Without limiting this liability, Subscriber shall be liable for any damages suffered by JPR as a result of any Sharing of any Material, without advance written permission of JPR. -
2021 Proxy Statement
2021 Proxy Statement Notice of Annual Stockholders’ Meeting Investor Engagement To see how we responded to your Who We Met With feedback, see page 41. Total Contacted Total Engaged Director Engaged 50.4% 39.5% 29.7% O/S O/S O/S Intel’s outstanding shares (o/s) caculated as of September 30,2020 We are proud of our long-standing and robust investor engagement program. Our integrated outreach team, led by our Investor Relations group, Corporate Responsibility office, Human Resources office, and Corporate Secretary office, engages proactively with our stockholders, maintaining a two-way, year-round governance calendar as shown in this graphic. During 2020, our engagement program addressed our executive compensation program, corporate governance best practices, our Board’s operation and experience, and our commitment to addressing environmental and social responsibility issues that are critical to our business. Through direct participation in our engagement efforts and through briefings from our engagement teams, our directors are able to monitor developments in corporate governance and social responsibility and benefit from our stockholders’ perspectives on these topics. In consultation with our Board, we seek to thoughtfully adopt and apply developing practices in a manner that best supports our business and our culture. Summer Winter Review annual meeting Incorporate input results to determine from investor meetings Annual appropriate next into annual meeting planning steps, and prioritize and enhance governance Stockholders’ post annual meeting and compensation investor engagement practices and disclosures Meeting focus areas when warranted Fall Spring Hold post- Conduct pre-annual annual meeting meeting investor meetings investor meetings to solicit feedback and report to the to answer questions and Board, Compensation understand investor Committee, and Corporate views on proxy Governance and Nominating matters Committee Additional detail on specific topics and initiatives we have adopted is discussed under “Investor Engagement” on page 40. -
Accurate Throughput Prediction of Basic Blocks on Recent Intel Microarchitectures
Accurate Throughput Prediction of Basic Blocks on Recent Intel Microarchitectures Andreas Abel and Jan Reineke Saarland University Saarland Informatics Campus Saarbrücken, Germany abel, [email protected] ABSTRACT been shown to be relatively low; Chen et al. [12] found that Tools to predict the throughput of basic blocks on a spe- the average error of previous tools compared to measurements cific microarchitecture are useful to optimize software per- is between 9% and 36%. formance and to build optimizing compilers. In recent work, We have identified two main reasons that contribute to several such tools have been proposed. However, the accuracy these discrepancies between measurements and predictions: of their predictions has been shown to be relatively low. (1) the microarchitectural models of previous tools are not In this paper, we identify the most important factors for detailed enough; (2) evaluations were partly based on un- these inaccuracies. To a significant degree these inaccura- suitable benchmarks, and biased and inaccurate throughput cies are due to elements and parameters of the pipelines of measurements. In this paper, we address both of these issues. recent CPUs that are not taken into account by previous tools. In the first part, we develop a pipeline model that is signif- A primary reason for this is that the necessary details are icantly more detailed than those of previous tools. It is appli- often undocumented. In this paper, we build more precise cable to all Intel Core microarchitectures released in the last models of relevant components by reverse engineering us- decade; the differences between these microarchitectures can ing microbenchmarks. -
Broadwell Skylake Next Gen* NEW Intel NEW Intel NEW Intel Microarchitecture Microarchitecture Microarchitecture
15 лет доступности IOTG is extending the product availability for IOTG roadmap products from a minimum of 7 years to a minimum of 15 years when both processor and chipset are on 22nm and newer process technologies. - Xeon Scalable (w/ chipsets) - E3-12xx/15xx v5 and later (w/ chipsets) - 6th gen Core and later (w/ chipsets) - Bay Trail (E3800) and later products (Braswell, N3xxx) - Atom C2xxx (Rangeley) and later - Не включает в себя Xeon-D (7 лет) и E5-26xx v4 (7 лет) 2 IOTG Product Availability Life-Cycle 15 year product availability will start with the following products: Product Discontinuance • Intel® Xeon® Processor Scalable Family codenamed Skylake-SP and later with associated chipsets Notification (PDN)† • Intel® Xeon® E3-12xx/15xx v5 series (Skylake) and later with associated chipsets • 6th Gen Intel® Core™ processor family (Skylake) and later (includes Intel® Pentium® and Celeron® processors) with PDNs will typically be issued no later associated chipsets than 13.5 years after component • Intel Pentium processor N3700 (Braswell) and later and Intel Celeron processors N3xxx (Braswell) and J1900/N2xxx family introduction date. PDNs are (Bay Trail) and later published at https://qdms.intel.com/ • Intel® Atom® processor C2xxx (Rangeley) and E3800 family (Bay Trail) and late Last 7 year product availability Time Last Last Order Ship Last 15 year product availability Time Last Last Order Ship L-1 L L+1 L+2 L+3 L+4 L+5 L+6 L+7 L+8 L+9 L+10 L+11 L+12 L+13 L+14 L+15 Years Introduction of component family † Intel may support this extended manufacturing using reasonably Last Time Order/Ship Periods Component family introduction dates are feasible means deemed by Intel to be appropriate. -
HP Z2 Tower G4 Workstation
QuickSpecs HP Z2 Tower G4 Workstation Overview HP Z2 Tower G4 Workstation 1. Power Button 6. Optional SD Card Reader 2. Headphone/Microphone 7. External 5.25’’ bay 3. 1 USB 3.0 port 4. 1 USB 3.0 Battery Charging Port 5. (Optional) 1 USB 3.1 Gen2 Type-C™ Battery Charging Port c05987463 —DA 16215 – Worldwide — Version 23 — January 5, 2021 Page 1 QuickSpecs HP Z2 Tower G4 Workstation Overview 1. 1 Audio Line In, 1 Audio Line Out, 2. 2 DisplayPortTM (DP 1.2) output from Intel® UHD graphics (available on selected processors only) 3. Optional Serial Port 4. 1 flex IO module for 2nd LAN/VGA/HDMI/DP/ USB-C 3.1 Gen2 Charging Port with Alt mode /Thunderbolt™ 3.0 (Thunderbolt™ requires x4 PCIe Add in card) 5. RJ-45 to integrated GBe 6. 2 USB 2.0 7. 4 USB 3.0 8. Optional WLAN/BT Antenna c05987463 —DA 16215 – Worldwide — Version 23 — January 5, 2021 Page 2 QuickSpecs HP Z2 Tower G4 Workstation Overview Form Factor Minitower Operating Systems Preinstalled: • Windows 10 Home* • Windows 10 Pro* • Windows 10 Pro (National Academic License)* • Windows 10 Pro for Workstations – HP recommends Windows 10 Pro * • HP Linux®-ready Supported: • Red Hat® Enterprise Linux® Workstation (1 year paper license available; Preinstall not available) * Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is automatically updated, which is always enabled. ISP fees may apply and additional requirements may apply over time for updates. -
Motherboards, Processors, and Memory
220-1001 COPYRIGHTED MATERIAL c01.indd 03/23/2019 Page 1 Chapter Motherboards, Processors, and Memory THE FOLLOWING COMPTIA A+ 220-1001 OBJECTIVES ARE COVERED IN THIS CHAPTER: ✓ 3.3 Given a scenario, install RAM types. ■ RAM types ■ SODIMM ■ DDR2 ■ DDR3 ■ DDR4 ■ Single channel ■ Dual channel ■ Triple channel ■ Error correcting ■ Parity vs. non-parity ✓ 3.5 Given a scenario, install and configure motherboards, CPUs, and add-on cards. ■ Motherboard form factor ■ ATX ■ mATX ■ ITX ■ mITX ■ Motherboard connectors types ■ PCI ■ PCIe ■ Riser card ■ Socket types c01.indd 03/23/2019 Page 3 ■ SATA ■ IDE ■ Front panel connector ■ Internal USB connector ■ BIOS/UEFI settings ■ Boot options ■ Firmware upgrades ■ Security settings ■ Interface configurations ■ Security ■ Passwords ■ Drive encryption ■ TPM ■ LoJack ■ Secure boot ■ CMOS battery ■ CPU features ■ Single-core ■ Multicore ■ Virtual technology ■ Hyperthreading ■ Speeds ■ Overclocking ■ Integrated GPU ■ Compatibility ■ AMD ■ Intel ■ Cooling mechanism ■ Fans ■ Heat sink ■ Liquid ■ Thermal paste c01.indd 03/23/2019 Page 4 A personal computer (PC) is a computing device made up of many distinct electronic components that all function together in order to accomplish some useful task, such as adding up the numbers in a spreadsheet or helping you to write a letter. Note that this defi nition describes a computer as having many distinct parts that work together. Most PCs today are modular. That is, they have components that can be removed and replaced with another component of the same function but with different specifi cations in order to improve performance. Each component has a specifi c function. Much of the computing industry today is focused on smaller devices, such as laptops, tablets, and smartphones. -
HP Probook 440 G8 Notebook PC
Проконсультироваться и купить данное оборудование вы можете в компании «АНД-Системс» адрес: 125480, г.Москва, ул.Туристская, д.33/1; site: https://andpro.ru тел: +7 (495) 545-4870 email: [email protected] QuickSpecs При обращении используйте промокод AND-PDF и получитеHP ProBook скидку. 440 G8 Notebook PC Overview HP ProBook 440 G8 Notebook PC Left 1. Internal Microphones (2) 6. Clickpad 2. Webcam LED (Optional) 7. USB 3.1 Gen 1 Powered Port 3. HD and IR Camera (Optional) 8. Ethernet Port (RJ-45) 4. Camera Shutter (Only available with webcam) 9. Nano Security Lock Slot (Lock sold separately) 5. IR Camera LED (Optional) Not all configuration components are available in all regions/countries. Page 1 c06907851 — DA16755 — Worldwide — Version 1 — October 28, 2020 HP ProBook 440 G8 Notebook PC QuickSpecs Overview Right 1. Power Button Key 6. HDMI Port (Cable not included) 2. Power Connector 7. Audio Combo Jack 3. USB Type-C® 3.1 Gen 2 (Alt Mode) 8. Micro SD Card Reader 4. USB 3.1 Gen 1 Charging Port 9. Touch Fingerprint Sensor (select models) 5. USB 3.1 Gen 1 Port Not all configuration components are available in all regions/countries. Page 2 c06907851 — DA16755 — Worldwide — Version 1 — October 28, 2020 HP ProBook 440 G8 Notebook PC QuickSpecs Overview At a Glance • A new compact design with lift-anywhere edge • Choice of 11th generation Intel® Core™ i7, i5 and i3 processors • Preinstalled with Windows 10 versions or FreeDOS • Optional NVIDIA GeForce MX450 discrete graphics with 2 GB GDDR5 video memory • Fast and upgradeable dual channel DDR4 -
Intel® Architecture Instruction Set Extensions and Future Features Programming Reference
Intel® Architecture Instruction Set Extensions and Future Features Programming Reference 319433-041 OCTOBER 2020 Intel technologies may require enabled hardware, software or service activation. No product or component can be absolutely secure. Your costs and results may vary. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. All product plans and roadmaps are subject to change without notice. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade. Code names are used by Intel to identify products, technologies, or services that are in development and not publicly available. These are not “commercial” names and not intended to function as trademarks. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be ob- tained by calling 1-800-548-4725, or by visiting http://www.intel.com/design/literature.htm. Copyright © 2020, Intel Corporation. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. -
Lecture Note 7. IA: History and Features
System Programming Lecture Note 7. IA: History and Features October 30, 2020 Jongmoo Choi Dept. of Software Dankook University http://embedded.dankook.ac.kr/~choijm (Copyright © 2020 by Jongmoo Choi, All Rights Reserved. Distribution requires permission) Objectives Discuss Issues on ISA (Instruction Set Architecture) ü Opcode and operand addressing modes Apprehend how ISA affects system program ü Context switch, memory alignment, stack overflow protection Describe the history of IA (Intel Architecture) Grasp the key technologies in recent IA ü Pipeline and Moore’s law Refer to Chapter 3, 4 in the CSAPP and Intel SW Developer Manual 2 Issues on ISA (1/2) Consideration on ISA (Instruction Set Architecture) asm_sum: addl $1, %ecx movl -4(%ebx, %ebp, 4), %eax call func1 leave ü opcode issues § how many? (add vs. inc è RISC vs. CISC) § multi functions? (SISD vs. SIMD vs. MIMD …) ü operand issues § fixed vs. variable operands f bits n bits n bits n bits § fixed: how many? opcode operand 1 operand 2 operand 3 § operand addressing modes f bits n bits n bits ü performance issues opcode operand 1 operand 2 § pipeline f bits n bits § superscalar opcode operand 1 § multicore 3 Issues on ISA (2/2) Features of IA (Intel Architecture) ü Basically CISC (Complex Instruction Set Computing) § Variable length instruction § Variable number of operands (0~3) § Diverse operand addressing modes § Stack based function call § Supporting SIMD (Single Instruction Multiple Data) ü Try to take advantage of RISC (Reduced Instruction Set Computing) § Micro-operations -
EARNINGS Presentation Disclosures
Q2 2020 EARNINGS Presentation Disclosures This presentation contains non-GAAP financial measures. Earnings per share (EPS), gross margin, and operating margin are presented on a non- GAAP basis unless otherwise indicated, and this presentation also includes a non-GAAP free cash flow (FCF) measure. The Appendix provides a reconciliation of these measures to the most directly comparable GAAP financial measure. The non-GAAP financial measures disclosed by Intel should not be considered a substitute for, or superior to, the financial measures prepared in accordance with GAAP. Please refer to “Explanation of Non-GAAP Measures” in Intel's quarterly earnings release for a detailed explanation of the adjustments made to the comparable GAAP measures, the ways management uses the non-GAAP measures, and the reasons why management believes the non-GAAP measures provide investors with useful supplemental information. Statements in this presentation that refer to business outlook, future plans, and expectations are forward-looking statements that involve a number of risks and uncertainties. Words such as "anticipate," "expect," "intend," "goals," "plans," "believe," "seek," "estimate," "continue,“ “committed,” “on-track,” ”positioned,” “launching,” "may," "will," “would,” "should," “could,” and variations of such words and similar expressions are intended to identify such forward-looking statements. Statements that refer to or are based on estimates, forecasts, projections, uncertain events or assumptions, including statements relating to total addressable market (TAM) or market opportunity, future products and technology and the expected availability and benefits of such products and technology, including our 10nm and 7nm process technologies, products, and product designs, and anticipated trends in our businesses or the markets relevant to them, also identify forward-looking statements. -
Intel® Tiger Lake-UP3 Solution
Intel® Tiger Lake-UP3 Solution ® Intel Tiger Lake-UP3 Platform Overview Graphics Media, and Display Security and Manageability ● New Xe (Gen12) Gfx Engine with up to 96 Eus ● Intel® Total Memory Encryption (Intel® TME) ● 4 independent display units (4 x 4K or 2 x 8K) * Hardware based encryption to protect entire memory contents ● Image processing unit IPU6 from physical attacks * Up to 27MP image capture ● Intel® AES-NI * Up to 4K@60fps video performance * A new, hardware based AES-NI instruction set to protect * Support for 4 concurrent streams private keys from malware * VTIO and RGB-IR for facial recognitionn * Keys are no longer exposed and handlers are utilized to perform encrypt/decrypt operations ● Control-Flow Enforcement Technology AI Experience Enhanced Features ● Vector Neural Network Instruction (VNNI) improves ● Up to 4 cores inferencing workload performance ● In-Band ECC available ● Common industry wide AI frameworks optimized on Tiger ● PCIe 4.0 (off CPU complex), 12 HSIO lanes (off PCH complex) Lake architecture (via OpenVINO™) ● Improved Thunderbolt™ data performance ● Intel® Deep Learning Boost ● Integrated Type C subsystem with for USB4 compliance ● AI/DL Instruction Sets including VNNI and CV/AI applications ® Intel Tiger Lake-UP3 Platform Block Diagram eDP DDR4/LPDDR4x (2ch) www.ieiworld.com 2 DDI PCIe 4.0 (1x4) TIGER LAKE-UP3 USB 3.2 Gen2 Thunderbolt™ 3 USB 3.2 Gen1 Hi-Speed USB 2.0 PCIe 3.0 CERTIFIED USB ™ SATA 6Gb/s Intel® Wireless-AC TIGER LAKE Intel® LAN PHY 2.5GbE TSN MAC ® PCH-LP Intel About IEI-2021-V10 ®