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Power Devices for Automotive Applications - Reviews of Technologies for Low Power Dissipation and High Review Ruggedness - Tsutomu Uesugi

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Power Devices for Automotive Applications - Reviews of Technologies for Low Power Dissipation and High Review Ruggedness - Tsutomu Uesugi 1 Power Devices for Automotive Applications - Reviews of Technologies for Low Power Dissipation and High Review Ruggedness - Tsutomu Uesugi Abstract Electronics technology is indispensable for converts the DC voltage of the battery into AC improving automotive performance. Especially, voltage. Therefore, the power devices that have in electric vehicles (EV) and hybrid electric low power dissipation and high ruggedness are vehicles (HEV), electric systems are the heart of definitely required in order to realize a reduced the automobile. Power devices are one of the cost of the automotive systems. In this paper, I most important components of car electronics review the characteristics of the power devices systems and they are applied to many systems, for that are used in automotive applications, and the example, oil-pressure valve control of the ABS technologies that realize the low power system, and motor control of the power windows dissipation and high ruggedness. or inverter system of an electric vehicle that Power device, Automobile, EV, HEV, Low power dissipation, High ruggedness, Keywords Power transistor, Power MOSFET, IGBT, BSIT, Trench, Buried structure, Module technology, Intelligent technology, New material, SiC, GaN 1. Introduction accessories, and also convert the battery's DC voltage into AC voltage in inverter systems. As the term "car electronics" indicates, electronics This paper discusses the state of the art and future has become an essential technology for improving outlook for power devices which serve as the back- the performance and functionality of automobiles. bone of car electronics, with a particular emphasis Particularly in electric vehicles, the use of a motor on low power dissipation and high ruggedness. drive employing a power device means that 2. Types of power devices and their characteristics electronic devices are no longer auxiliary equipment, but have assumed the status of primary equipment. The voltages that power devices handle widely One reason that electronics have come to occupy a vary, from around twenty volts for mobile terminals critical position where they are used widely in on- that are powered by the battery to the several board equipment is the evolution and development kilovolts required by electrical generation and 1) of power devices for automotive applications. transmission systems, and the optimum devices are Power devices, which are semiconductor selected and used according to the voltage capacity. switching devices, are used in numerous car Figure 1 summarizes the breakdown voltage electronics systems. They control hydraulic valves required of power devices by automotive systems, in the anti-lock braking system (ABS), gasoline as well as the maximum values of the electrical injection valves in the electronic fuel injection (EFI) current they can handle (the maximum rated current). systems, and motors for power windows and other With the 12-volt battery systems most commonly R&D Review of Toyota CRDL Vol. 35 No. 2 ( 2000.6 ) 2 used in automobiles today, a power MOSFET with a transistor (BSIT) is used for systems which lay in 60-volt breakdown voltage is used for the ABS and the mid-range between these two applications. power window system. In contrast, the 288-volt This section provides an overview of the structures system used in electric vehicles is the domain of the and characteristics of these power devices. insulated gate bipolar transistor (IGBT), which has a 2. 1 Power transistor breakdown voltage of 600 volts. A bipolar power Figure 2(a) shows an example of the cross- transistor or a bipolar mode static induction sectional structure of a power transistor. In a power transistor, holes are injected from the base to the collector, and electrons flow from the emitter to the 200 Power IGBT EV collector in proportion to the hole injection. Due to the MOSFET conductivity modulation effect, which increases the 30 Power effective carrier concentration, the resistance of the window device decreases in proportion to the hole injection. 20 This in turn decreases the power dissipation of the ABS Power transistor device. Power transistors were among the first or BSIT 10 semiconductor power devices to be used for ECT IGNITOR PPS EFI automotive applications. Maximum absolute rating current ( A ) Maximum absolute rating 0 10 1 10 2 10 3 However, because the device is driven by the Breakdown voltage ( V ) injection of current, the drive circuit is complex, and the driving power dissipation is high. Also, the Fig. 1 Relation between maximum absolute current has a positive temperature coefficient, which rating current and breakdown voltage makes it easier to undergo thermal runaway for automotive applications. compared to other devices. For these reasons, power transistors have been replaced by the power + Source (N ) AAGate AAAA Emitter (N+) Base (P) A A Hole Electron AAABody (P) Electron Modulation Collector (N-) AAAADrift (N) Collector (N+) AAAADrain (N+) (a) Power transistor (b) Power MOSFET + + Emitter (N ) AAAGate Source (N ) AAAAA AAA Gate (P+) A A Hole AAA Electron AAAP base Electron Modulation Modulation AAAAN base AAAADrift (N) AAAACollector (P+) Hole AAAADrain (N+) (c) IGBT (d) BSIT Fig. 2 Cross-sectional view of power device, (a) power transistor, (b) power MOSFET, (c) IGBT, and (d) BSIT. Black arrows indicate electron flow and gray arrows indicate hole flow. R&D Review of Toyota CRDL Vol. 35 No. 2 ( 2000.6 ) 3 MOSFET for low-voltage applications of 100 volts current gain than that of the power transistor and has or less, and by the IGBT for high-voltage the advantage of being resistant to thermal runaway. applications of 400 volts or more. It can also reduce the ON-state voltage using the 2. 2 Power MOSFET conductivity modulation effect. However, its Figure 2(b) shows the cross-sectional structure of a driving dissipation is high, because it uses a current power MOSFET. This device is voltage-controlled driving method, so its scope of application is and easy to drive, and the ON-state current has a limited. However with the shift to higher-voltage negative temperature coefficient, so a power vehicle batteries in the near future, it is anticipated MOSFET has the advantage of being resistant to that the BSIT will be more widely used. thermal runaway. Also, unlike the bipolar transistor, 3. Improving the performance of power devices the power MOSFET is a unipolar device with a for automotive applications single carrier that contributes to the electrical conduction, so there is no minority carrier storage Low power dissipation and high ruggedness are and the speed is high. However, it also has no the two characteristics that are currently considered conductivity modulation effect to reduce the power most important for automotive power devices. This dissipation, and as the breakdown voltage increases, section discusses the state of the art and future the ON-state resistance abruptly increases in a ratio outlook for the technologies that provide these equal to the voltage capacity raised to the power of characteristics. 2.5, so the power MOSFET is mainly used as a low- 3. 1 Reducing power dissipation voltage device. Reducing the power dissipation per unit area has 2. 3 IGBT become the most important issue in power device Figure 2(c) shows the cross-sectional structure of research and development, because shrinking the an IGBT. The point that differs from Fig. 2(b) is chip area to satisfy the system requirements reduces that the substrate is not an N+ substrate, but a P+ the chip cost, which in turn reduces the total system substrate. This creates major differences in the cost. characteristics of the device. With an IGBT, the The micro-processing technology that was application of voltage to the gate causes electrons to developed for LSIs plays a major role in reducing inject from the emitter to the N base via channels the power dissipation of power devices. For that are formed in the P base, while holes are example, looking at the reduction of power injected in the same manner from the collector, dissipation in the power MOSFET, making the cell which is the P+ substrate, to the N base. This creates pitch smaller also reduces the ON-state resistance a conductivity modulation effect in the N base, in step by step (Fig. 3). This is due to the reduction in the same manner as with the power transistor, thereby significantly reducing the resistance of the device. That is to say, the IGBT can be called a 1.0 ) device that combines the advantages of simplicity of 2 drive due to the voltage-controlled device and low •mm 0.8 Ω power dissipation due to the conductivity 0.6 modulation effect. For that reason, the IGBT is used for the electric vehicle inverter systems, which 0.4 requires a high breakdown voltage of 600 volts or more, and is increasingly being used for some 0.2 Specific on-resistance ( Trench ignitor systems. 0 2. 4 BSIT 0 10 20 30 µ The cross-sectional structure of a BSIT is shown Cell pitch ( m ) in Fig. 2(d). The BSIT is a device that controls the potential between the gate and the drain by means of Fig. 3 Specific on-resistance of power MOSFETs versus unit cell pitch. The a minority carrier that injects from the gate. It also symbol of " " indicates the resistance controls the current. The BSIT achieves higher of the trench gate structure. R&D Review of Toyota CRDL Vol. 35 No. 2 ( 2000.6 ) 4 the channel resistance that is the main component of conductivity modulation effect in the N base and can the resistance in the power MOSFET. However, as reduce the resistance to the same level as that of a shown in Fig. 4(a), as the cell pitch is made smaller, thyristor, have been proposed in order to reduce and particularly as the gate is made smaller, the area resistance even further than the conventional trench through which current flows is narrowed by the IGBT.
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