REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
3D Time-of-Flight Module in Meizu 17 Pro The first 3D ToF camera from Samsung with Lumentum’s VCSEL
SP20571 - IMAGING report by Taha AYARI Laboratory analysis by Youssef EL GMILI November 2020 - Sample
22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 1 Table of Contents
Overview / Introduction 4 Manufacturing Process 79 o Executive Summary o Global Overview o Reverse Costing Methodology o NIR Sensor Die Front-End Process & Fabrication Unit Company Profile 11 o NIR VCSEL Process Flow & Fabrication Unit o VCSEL Driver Die Front-End Process & Fabrication Unit Market Analysis 15 Cost Analysis 92 Physical Analysis 19 o Summary of the Cost Analysis o Summary of the Physical Analysis o Yields Explanation & Hypotheses o 3D Sensing System Assembly o NIR Camera Module ✓ Module Views ✓ Pixel Array, BSI & Optical Front-End Cost ✓ Module Opening ✓ NIR ToF Image Sensor Wafer & Die Cost ✓ System Cross-Section o Flood Illuminator Module o NIR Camera Module ✓ NIR VCSEL Front-End Cost ✓ Module Views & Dimensions ✓ NIR VCSEL Probe Test, Thinning & Dicing ✓ Module Cross-Section ✓ NIR VCSEL Die Wafer Cost o NIR CMOS Image Sensor ✓ Component Cost ✓ Die Overview & Dimensions o VCSEL Driver ✓ Die Process ✓ Front-End Cost ✓ Die Cross-Section ✓ Probe Test, Thinning & Dicing ✓ Die Process Characteristics ✓ Die Cost o Flood Illuminator ✓ Module Views & Dimensions o ToF Module ✓ Module Cross-Section ✓ Complete Module Cost ✓ Complete Module Price o NIR VCSEL Die ✓ Die Views & Dimensions Technical and Cost Comparison 121 ✓ Die Process o Meizu 17 Pro vs. Galaxy Note10+ vs iPad Pro ✓ Die Cross-Section Feedbacks 126 ✓ Die Process Characteristics SystemPlus Consulting Services 128 o VCSEL Driver Die ✓ Views & Dimensions ✓ Delayering & Main Blocs ✓ Die Process ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 2 Meizu 17 Pro - Overview
Overview / Introduction o Executive Summary o Reverse Costing Methodology o Glossary o Meizu’s ToF module
Company Profile
Market Analysis Dimensions Physical Analysis o Height: 160 mm o Width: 77.2 mm Manufacturing Process Flow o Thickness: 8.5 mm
Cost Analysis Weight Technical & Cost Comparison o 219 g
Feedbacks
Related Reports
About System Plus
Meizu 17 pro- Overview
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 3 Meizu 17 Pro - Overview
Overview / Introduction o Executive Summary o Reverse Costing Methodology o Glossary o Meizu’s ToF module
Company Profile
Market Analysis UltraWide camera module RGB main camera module Telephoto camera module Physical Analysis
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus ToF module
Meizu 17 Pro - Rear optical block ©2020 by System Plus Consulting
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 4 Summary of the Physical Analysis Overview / Introduction
Company Profile
Market Analysis
Physical Analysis o Summary of the Physical Analysis o ToF Module Disassembly o NIR Camera Module o NIR CIS Die o Flood illuminator o NIR VCSEL Die o VCSEL Driver Die
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 5 ToF Module Disassembly Overview / Introduction
Company Profile Flood illuminator NIR camera Market Analysis
Physical Analysis o Summary of the Physical Analysis o ToF Module Disassembly o NIR Camera Module o NIR CIS Die o Flood illuminator o NIR VCSEL Die o VCSEL Driver Die
Manufacturing Process Flow Module tilted view – Optical View ©2020 by System Plus Consulting
Cost Analysis
Technical & Cost Comparison Metal enclosure Feedbacks
Related Reports
About System Plus
Module opening – Optical View ©2020 by System Plus Consulting
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 6 ToF Module Cross-section Overview / Introduction
Company Profile
Market Analysis
Physical Analysis o Summary of the Physical Analysis o ToF Module Disassembly o NIR Camera Module o NIR CIS Die o Flood illuminator o NIR VCSEL Die o VCSEL Driver Die
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 7 Image Sensor Die – Cross-Section – Lenses Overview / Introduction
Company Profile
Market Analysis
Physical Analysis o Summary of the Physical Analysis o ToF Module Disassembly o NIR Camera Module o NIR CIS Die o Flood illuminator o NIR VCSEL Die o VCSEL Driver Die
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 8 VCSEL Die Cross-section Overview / Introduction
Company Profile
Market Analysis
Physical Analysis o Summary of the Physical Analysis o ToF Module Disassembly o NIR Camera Module o NIR CIS Die o Flood illuminator o NIR VCSEL Die o VCSEL Driver Die
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 9 VCSEL Driver Die - Logic Circuit Overview / Introduction
Company Profile
Market Analysis
Physical Analysis o Summary of the Physical Analysis o ToF Module Disassembly o NIR Camera Module o NIR CIS Die o Flood illuminator o NIR VCSEL Die o VCSEL Driver Die
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 10 Pixel Array & DSP Circuit Process Flow
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis
Manufacturing Process Flow o Global Overview o NIR Sensor Die Front-End Process & Fabrication Unit o NIR VCSEL Process Flow & Fabrication Unit o VCSEL Driver Die Front-End Process & Fabrication Unit
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 11 NIR VCSEL Wafer Process Flow 1/2
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis
Manufacturing Process Flow o Global Overview o NIR Sensor Die Front-End Process & Fabrication Unit o NIR VCSEL Process Flow & Fabrication Unit o VCSEL Driver Die Front-End Process & Fabrication Unit
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 12 Complete Module Cost
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis
Manufacturing Process Flow
Cost Analysis o Summary of the Cost Analysis o Yields Explanation & Hypotheses o NIR Camera Module Cost o Flood Illuminator Module Cost o VCSEL Driver IC o ToF Module
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 13 Meizu vs. Samsung vs. Apple – NIR ToF Image Sensor Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparison o Meizu 17 Pro vs. Galaxy Note10+ vs iPad Pro
Feedbacks
Related Reports
About System Plus
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 14 Meizu vs. Samsung vs. Apple – NIR VCSEL Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparison o Meizu 17 Pro vs. Galaxy Note10+ vs iPad Pro
Feedbacks
Related Reports
About System Plus
Pictures at scale
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 15 Related Reports
Overview / Introduction REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT Company Profile & Supply Chain IMAGING IMAGING Market Analysis • Samsung Galaxy Note 10+ 3D Time of Flight Depth • 3D Imaging & Sensing 2020 Sensing Camera Module • Physical Analysis Status of CMOS Image Sensor Industry 2020 • iPad Pro LiDAR Module • CMOS Camera Module Industry for Consumer & Automotive • Sony’s 3D Time-of-Flight Sensing Solution in the Huawei Manufacturing Process Flow 2020 P30 pro • CMOS Image Sensor Quarterly Market Monitor Cost Analysis • Sony’s 3D Time-of-Flight Depth Sensing Camera Module • Huawei’s 3D Depth Sensing System, 3D Camera, Flood Feedbacks Illuminator and DOT projector in the Mate 20 Pro • STMicroelectronics’ Near Infrared Camera Sensor in the Related Reports Apple iPhone X • Apple iPhone X – Infrared Dot Projector About System Plus
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 16 COMPANY SERVICES
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 17 Business Model - Fields of Expertise
Overview / Introduction
Company Profile & Supply Chain
Market Analysis Physical Analysis Custom Analyses Manufacturing Process Flow (>130 analyses per year)
Cost Analysis Feedbacks Reports Related Reports (>60 reports per year) About System Plus o Company Services o Contacts Costing Tools
Trainings
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 18 Contact
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis FRANKFURT/MAIN Europe Sales Office
Manufacturing Process Flow NANTES LYON KOREA Headquarters YOLE HQ YOLE Cost Analysis CORNELIUS TOKYO YOLE Inc. YOLE KK Feedbacks GREATER CHINA YOLE Related Reports
About System Plus o Company Services o Contacts
Headquarters Europe Sales Office America Sales Office Asia Sales Office 22 bd Benoni Goullin Lizzie LEVENEZ Steve LAFERRIERE Takashi ONOZAWA 44200 Nantes Frankfurt am Main WESTERN US Tokyo FRANCE GERMANY T : +1 310 600 8267 JAPAN +33 2 40 18 09 16 +49 151 23 54 41 82 [email protected] T : +81 804 371 4887 [email protected] [email protected] [email protected] Chris YOUMAN EASTERN US & CANADA Mavis WANG T : +1 919 607 9839 TAIWAN www.systemplus.fr [email protected] T :+886 979 336 809 CN: +8613661566824 [email protected]
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 19