REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT 3D Time-of-Flight Module in Meizu 17 Pro The first 3D ToF camera from Samsung with Lumentum’s VCSEL SP20571 - IMAGING report by Taha AYARI Laboratory analysis by Youssef EL GMILI November 2020 - Sample 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 1 Table of Contents Overview / Introduction 4 Manufacturing Process 79 o Executive Summary o Global Overview o Reverse Costing Methodology o NIR Sensor Die Front-End Process & Fabrication Unit Company Profile 11 o NIR VCSEL Process Flow & Fabrication Unit o VCSEL Driver Die Front-End Process & Fabrication Unit Market Analysis 15 Cost Analysis 92 Physical Analysis 19 o Summary of the Cost Analysis o Summary of the Physical Analysis o Yields Explanation & Hypotheses o 3D Sensing System Assembly o NIR Camera Module ✓ Module Views ✓ Pixel Array, BSI & Optical Front-End Cost ✓ Module Opening ✓ NIR ToF Image Sensor Wafer & Die Cost ✓ System Cross-Section o Flood Illuminator Module o NIR Camera Module ✓ NIR VCSEL Front-End Cost ✓ Module Views & Dimensions ✓ NIR VCSEL Probe Test, Thinning & Dicing ✓ Module Cross-Section ✓ NIR VCSEL Die Wafer Cost o NIR CMOS Image Sensor ✓ Component Cost ✓ Die Overview & Dimensions o VCSEL Driver ✓ Die Process ✓ Front-End Cost ✓ Die Cross-Section ✓ Probe Test, Thinning & Dicing ✓ Die Process Characteristics ✓ Die Cost o Flood Illuminator ✓ Module Views & Dimensions o ToF Module ✓ Module Cross-Section ✓ Complete Module Cost ✓ Complete Module Price o NIR VCSEL Die ✓ Die Views & Dimensions Technical and Cost Comparison 121 ✓ Die Process o Meizu 17 Pro vs. Galaxy Note10+ vs iPad Pro ✓ Die Cross-Section Feedbacks 126 ✓ Die Process Characteristics SystemPlus Consulting Services 128 o VCSEL Driver Die ✓ Views & Dimensions ✓ Delayering & Main Blocs ✓ Die Process ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 2 Meizu 17 Pro - Overview Overview / Introduction o Executive Summary o Reverse Costing Methodology o Glossary o Meizu’s ToF module Company Profile Market Analysis Dimensions Physical Analysis o Height: 160 mm o Width: 77.2 mm Manufacturing Process Flow o Thickness: 8.5 mm Cost Analysis Weight Technical & Cost Comparison o 219 g Feedbacks Related Reports About System Plus Meizu 17 pro- Overview ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 3 Meizu 17 Pro - Overview Overview / Introduction o Executive Summary o Reverse Costing Methodology o Glossary o Meizu’s ToF module Company Profile Market Analysis UltraWide camera module RGB main camera module Telephoto camera module Physical Analysis Manufacturing Process Flow Cost Analysis Technical & Cost Comparison Feedbacks Related Reports About System Plus ToF module Meizu 17 Pro - Rear optical block ©2020 by System Plus Consulting ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 4 Summary of the Physical Analysis Overview / Introduction Company Profile Market Analysis Physical Analysis o Summary of the Physical Analysis o ToF Module Disassembly o NIR Camera Module o NIR CIS Die o Flood illuminator o NIR VCSEL Die o VCSEL Driver Die Manufacturing Process Flow Cost Analysis Technical & Cost Comparison Feedbacks Related Reports About System Plus ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 5 ToF Module Disassembly Overview / Introduction Company Profile Flood illuminator NIR camera Market Analysis Physical Analysis o Summary of the Physical Analysis o ToF Module Disassembly o NIR Camera Module o NIR CIS Die o Flood illuminator o NIR VCSEL Die o VCSEL Driver Die Manufacturing Process Flow Module tilted view – Optical View ©2020 by System Plus Consulting Cost Analysis Technical & Cost Comparison Metal enclosure Feedbacks Related Reports About System Plus Module opening – Optical View ©2020 by System Plus Consulting ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 6 ToF Module Cross-section Overview / Introduction Company Profile Market Analysis Physical Analysis o Summary of the Physical Analysis o ToF Module Disassembly o NIR Camera Module o NIR CIS Die o Flood illuminator o NIR VCSEL Die o VCSEL Driver Die Manufacturing Process Flow Cost Analysis Technical & Cost Comparison Feedbacks Related Reports About System Plus ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 7 Image Sensor Die – Cross-Section – Lenses Overview / Introduction Company Profile Market Analysis Physical Analysis o Summary of the Physical Analysis o ToF Module Disassembly o NIR Camera Module o NIR CIS Die o Flood illuminator o NIR VCSEL Die o VCSEL Driver Die Manufacturing Process Flow Cost Analysis Technical & Cost Comparison Feedbacks Related Reports About System Plus ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 8 VCSEL Die Cross-section Overview / Introduction Company Profile Market Analysis Physical Analysis o Summary of the Physical Analysis o ToF Module Disassembly o NIR Camera Module o NIR CIS Die o Flood illuminator o NIR VCSEL Die o VCSEL Driver Die Manufacturing Process Flow Cost Analysis Technical & Cost Comparison Feedbacks Related Reports About System Plus ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 9 VCSEL Driver Die - Logic Circuit Overview / Introduction Company Profile Market Analysis Physical Analysis o Summary of the Physical Analysis o ToF Module Disassembly o NIR Camera Module o NIR CIS Die o Flood illuminator o NIR VCSEL Die o VCSEL Driver Die Manufacturing Process Flow Cost Analysis Technical & Cost Comparison Feedbacks Related Reports About System Plus ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 10 Pixel Array & DSP Circuit Process Flow Overview / Introduction Company Profile Market Analysis Physical Analysis Manufacturing Process Flow o Global Overview o NIR Sensor Die Front-End Process & Fabrication Unit o NIR VCSEL Process Flow & Fabrication Unit o VCSEL Driver Die Front-End Process & Fabrication Unit Cost Analysis Technical & Cost Comparison Feedbacks Related Reports About System Plus ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 11 NIR VCSEL Wafer Process Flow 1/2 Overview / Introduction Company Profile Market Analysis Physical Analysis Manufacturing Process Flow o Global Overview o NIR Sensor Die Front-End Process & Fabrication Unit o NIR VCSEL Process Flow & Fabrication Unit o VCSEL Driver Die Front-End Process & Fabrication Unit Cost Analysis Technical & Cost Comparison Feedbacks Related Reports About System Plus ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 12 Complete Module Cost Overview / Introduction Company Profile Market Analysis Physical Analysis Manufacturing Process Flow Cost Analysis o Summary of the Cost Analysis o Yields Explanation & Hypotheses o NIR Camera Module Cost o Flood Illuminator Module Cost o VCSEL Driver IC o ToF Module Technical & Cost Comparison Feedbacks Related Reports About System Plus ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 13 Meizu vs. Samsung vs. Apple – NIR ToF Image Sensor Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis Manufacturing Process Flow Cost Analysis Technical & Cost Comparison o Meizu 17 Pro vs. Galaxy Note10+ vs iPad Pro Feedbacks Related Reports About System Plus ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 14 Meizu vs. Samsung vs. Apple – NIR VCSEL Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis Manufacturing Process Flow Cost Analysis Technical & Cost Comparison o Meizu 17 Pro vs. Galaxy Note10+ vs iPad Pro Feedbacks Related Reports About System Plus Pictures at scale ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 15 Related Reports Overview / Introduction REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT Company Profile & Supply Chain IMAGING IMAGING Market Analysis • Samsung Galaxy Note 10+ 3D Time of Flight Depth • 3D Imaging & Sensing 2020 Sensing Camera Module • Physical Analysis Status of CMOS Image Sensor Industry 2020 • iPad Pro LiDAR Module • CMOS Camera Module Industry for Consumer & Automotive • Sony’s 3D Time-of-Flight Sensing Solution in the Huawei Manufacturing Process Flow 2020 P30 pro • CMOS Image Sensor Quarterly Market Monitor Cost Analysis • Sony’s 3D Time-of-Flight Depth Sensing Camera Module • Huawei’s 3D Depth Sensing System, 3D Camera, Flood Feedbacks Illuminator and DOT projector in the Mate 20 Pro • STMicroelectronics’ Near Infrared Camera Sensor in the Related Reports Apple iPhone X • Apple iPhone X – Infrared Dot Projector About System Plus ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 16 COMPANY SERVICES ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 17 Business Model - Fields of Expertise Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis Custom Analyses Manufacturing Process Flow (>130 analyses per year) Cost Analysis Feedbacks Reports