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Zing Semiconductor Corporation Confidential Forecast for Global Semiconductor Market 300mm Wafer Development and Manufacturing in China Richard Chang – CEO, Zing Semiconductor 2016/11/9 1 Zing Semiconductor Corporation Confidential Forecast for Global Semiconductor Market Source: IBS Beginning in 2004, China surpassed the U.S. as the largest semiconductor market in the world. In 2010, Chinese demand for semiconductors accounted for half of the world total. In 2016, around 60%. In 2020, Chinese demand alone will be up to 70%. But even as the largest IC consumer, China has limited capacity for IC production. However, the Chinese government hopes that by 2025, the self-sufficiency rate of domestic IC can reach at least 50%. 2 Zing Semiconductor Corporation Confidential China Semiconductor Consumption vs. Supply from Domestic Suppliers SOURCE:IBS 3 Zing Semiconductor Corporation Confidential Forecast for the China Foundry Market Source: IBS In 2010 China's foundry market accounted for 7.8% of the world total. By 2025, it will increase to 26.4%. 4 Zing Semiconductor Corporation Confidential Global Silicon Wafer Market Outlook SEMI Forecast In 2009, 300mm silicon wafer became the mainstream market. It’s expected that in 2020, the demand on 300mm silicon wafer will account for more than 75% of the total. Most of the newly planned domestic foundries are 300mm wafer production lines. 5 Zing Semiconductor Corporation Confidential Global 300mm Silicon Wafer Supplier List Others SAS 2.2% 3.3% SunEdison 11.1% Shin-Etsu 27.8% Wacker Siltronic 12.2% LG Siltron 15.6% SUMCO Source: Gartner, Semi 27.8% 6 Zing Semiconductor Corporation Confidential Forecast: 300mm Wafer Demand Zing Semiconductor Corporation Confidential Eight In Operation 300mm Wafer Production Lines in China Monthly Production Company Location Type (300mm wafers) Samsung Xi’an 3D NAND 100,000 Intel Dalian 3D NAND, 3D 40,000 XPoint SK Hynix Wuxi DRAM 145,000 Huali Shanghai Foundry 35,000 SMIC Beijing 1 Foundry 36,000 SMIC Beijing 2 Foundry 18,000 SMIC Shanghai Foundry 15,000 XMC Wuhan NOR, NAND, 25,000 CMOS Source: CSF The total domestic demand for 300mm wafers currently is about 414k/month. 8 Zing Semiconductor Corporation Confidential Eight under Construction 300mm Wafer Production Line of China Monthly Company Location Type Production (300mm wafers) XMC Wuhan 3D NAND/DRAM 300,000 (2020) Global Foundries Chongqing Foundry 2017 Production Leadcore Xiamen Foundry Initial production of 6,000 wpm JHICC Jinjiang DRAM 60,000 (2018) Sino King Hefei DRAM 10,000 Jing He Hefei LCD Drivers Initial production of 40,000 wpm TSMC Nanjing Foundry 20,000 DeKeMa Huaian CIS, CMOS 20,000 By 2020, the total 300mm demand in China could exceed 1000k wpm. 9 ZingZing SemiconductorSemiconductor CorporationCorporation ConfidentialConfidential The Semiconductor Industry Value Chain 10 Zing Semiconductor Corporation Confidential 300mm Silicon Wafer Development History in China • In 1957, professor Lin Lanying, at the Chinese Academy of Sciences (CAS, 中国科学院）succeeded in growing the first mono-crystal germanium ingot in China by Czochralski (CZ) method; • In 1958, Dr. Lin successfully grew the first 50mm mono-crystal silicon ingot in China by CZ method; • In 1962, Dr. Lin designed and built the first domestic mono-crystalline furnace, and in the same year, grew the first Chinese gallium arsenide crystal. 11 Zing Semiconductor Corporation Confidential 300mm Silicon Wafer Development History in China • In 1980, Zhejiang University began the systematic study of nitrogen doping CZ silicon mono-crystal growing process and crystal characterization. • In 1998, the General Research Institute for Nonferrous Metals (GRINM, 北京有研 总院) successfully grew the first 300mm mono-crystal silicon ingot in China by CZ method; • In 2001, GRINM set up the Chinese first 200mm silicon wafer production line; • In 2010, Shanghai Simgui (新傲科技） announced the mass production of 200mm SOI/EPI wafers; • In 2011, Tianjin Zhonghuan Semiconductor (天津中环半导体) successfully grew the first Chinese 200mm silicon mono-crystal ingot by floating-zone (FZ) method. 12 Zing Semiconductor Corporation Confidential 300mm Silicon Wafer Development History in China • Until now, no Chinese 300mm silicon wafers have been qualified for semiconductor product application, but only used as dummy and/or test wafers. • But in October 2016, Zing Semiconductor Corporation (上海新昇半导体） successfully grew its first 300mm mono-crystal silicon ingot. On November 1, it began growth of its first ingot using the magnetic Czochralski (MCZ) method with high quality and high productivity (>430Kg). Zing has also begun pilot production of 300mm polished wafers and EPI wafers. • Zing Semiconductor Corporation has developed a privileged deuterium doping technology which can be used for crystal growth, wafer annealing, epitaxy and even for SOI wafer manufacturing. 13 Zing Semiconductor Corporation Confidential Zing’s first 300mm ingot 14 Zing Semiconductor Corporation Confidential Zing Semiconductor Corporation 15 Zing Semiconductor Corporation Confidential Zing Semiconductor Corporation Founded in June 2014 Address: 1000 Yunshui Road, Pudong New Area, Shanghai Total built-up area: 128,394m2 Total investment: RMB 6.8 Billion (Phase 1 – Phase 3) 46km Here we are! Zing Semiconductor Corporation Confidential Capacity and Technology Road Map 2021-2022 2019-2020 Phase 3 Technology Node：10nm 2017 Phase 2 and under Technology Node： Capacity: 600K 300mm 20nm~14nm wafers per month Capacity： 300K 300mm wafers per Phase 1 month Technology Node：28nm Capacity：150K 300mm wafers per month Zing Semiconductor Corporation Confidential System and Product Certification Plan 2015 2016 2017 Certification\ Time 11 12 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12 ISO 9001:2015 ISO 14001:2004 2016/11 OHSAS 18001:2007 2016/12 2017/03 ISO/TS16949:2009 2017/09 ZingZing SemiconductorSemiconductor CorporationCorporation ConfidentialConfidential Zing Semiconductor – Your source for 300mm wafers in China Richard Chang [email protected] www.zingsemi.com 19 Zing Semiconductor Corporation Confidential.
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