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610456 Confidentiality D7.9 Review of Industry trends – Competitive analysis Project No: 610456 D7.9 Review of Industry trends – Competitive analysis February 28th, 2017 Abstract: This deliverable provides an update on the competitive analysis performed by the EUROSERVER consortium. As of the time of writing, it is clear that it has not been easy to commercialise ARM-based micro-servers, and many large companies have been unable to bring a viable solution to market. The remaining providers that already have or intend to launch server-ready products are Qualcomm and Cavium. The decision by Fujitsu and RIKEN to base the Post-K supercomputer on the ARM architecture is a positive development. Document Manager: John Thomson (Editor) Authors AFFILIATION John Thomson OnApp Ltd. (ONAPP) Paul Carpenter Barcelona Supercomputing Center (BSC) Manolis Katevenis, Iakovos Mavroidis FORTH Denis Dutoit CEA Internal Reviewers Per Stenstrom CHALMERS Isabelle Dor CEA Document Id N°: Version: 0.7 Date: 28/2/2017 Filename: Euroserver_D7.9_v0.7.docx Confidentiality This document is public and was produced by EUROSERVER contractors. Some of the graphics and information belongs to third-parties and this information is highlighted where appropriate. The commercial use of any information contained in this document may require a license from the proprietor of that information. Page 1 of 23 This document is Public, and was produced under the EUROSERVER project (EC contract 610456). D7.9 Review of Industry trends – Competitive analysis The EUROSERVER Consortium consists of the following partners: Participant organisation names short name Country Participant no. 1 Commissariat à l’énergie atomique et aux énergies CEA France alternatives 2 STMicroelectronics Grenoble 2 SAS STGNB 2 SAS France 3 STMicroelectronics Crolles 2 SAS STM CROLLES France 4 STMicroelectronics S.A STMICROELE France CTRONICS 5 ARM Limited ARM United Kingdom 6 Eurotech SPA EUROTECH Italy 7 Technische Universitaet Dresden TUD Germany 8 Barcelona Supercomputing Center BSC Spain 9 Foundation for Research and Technology Hellas FORTH Greece 10 Chalmers Tekniska Hoegskola AB CHALMERS Sweden 11 ONAPP Limited ONAPP Gibraltar LiMITED 12 NEAT SRL NEAT Italy The information in this document is provided “as is” and no guarantee or warranty is given that the information is fit for any particular purpose. The user thereof uses the information at its sole risk and liability. Revision history Version Author Notes 0.1 John Thomson Preparation of the D7.9 document 0.2 Paul Carpenter Corrections and modifications to text 0.5 John Thomson Prepared for review 0.6 D. Dutoit, I. Mavroidis, M. European projects Katevenis 0.7 John Thomson Implementing review comments Page 2 of 23 This document is Public, and was produced under the EUROSERVER project (EC contract 610456). D7.9 Review of Industry trends – Competitive analysis Contents 1. Introduction .................................................................................................................................. 4 2. Competitive Analysis .................................................................................................................... 5 Changes in the market ..................................................................................................................... 6 The remaining challengers ............................................................................................................. 11 Other hardware improvements over the course of EUROSERVER ................................................ 14 Intel ................................................................................................................................................ 15 Comparison of Intel, ARM and NVidia ........................................................................................... 18 Green500 ....................................................................................................................................... 21 European Projects investigating micro-servers / energy efficient compute ..................................... 22 ExaNeSt .......................................................................................................................................... 22 ExaNoDe ......................................................................................................................................... 22 EcoScale ......................................................................................................................................... 23 EuroEXA ......................................................................................................................................... 23 Page 3 of 23 This document is Public, and was produced under the EUROSERVER project (EC contract 610456). D7.9 Review of Industry trends – Competitive analysis 1. Introduction This deliverable provides an update on the competitive analysis performed by the EUROSERVER consortium for the DATE’16 paper publication.1 Since that time, there have been many developments in the market, which have been captured in this document. The EUROSERVER project had originally intended to build a hardware prototype that integrated four chiplets, each with two quad-core Cortex- A53 clusters, which would have resulted in a 32-core, low-power micro-server solution. Given reasons that have been detailed in other project deliverables this has not been possible in the scope of the project. Reviewing other industrial solutions it is clear that in general it has not been easy to commercialise ARM-based micro-servers, and many large companies have been unable to bring a viable solution to market. Qualcomm and Cavium are the main players still active in the ARM-based server market. In addition, Fujitsu will supply ARM-based HPC chips for the Japanese Post-K supercomputer at RIKEN, a development that may “trickle down” in some ways to the server space. Where ARM-based solutions have not generally entered the market, the need for low-power solutions has resulted in Intel having had time to develop power-efficient x86-based hardware. The other large winner of the delayed entry of power-efficient computing solutions has been the co-accelerator market, where NVidia and Intel have launched CUDA and Xeon Phi solutions, respectively. 1 Manolis Marazakis , John Goodacre, Didier Fuin, Paul Carpenter, John Thomson, Emil Matus, Antimo Bruno, Per Stenstrom, Jerome Martin, Yves Durand and Isabelle Dor. EUROSERVER: Share-Anything Scale-Out Micro- Server Design. Design, Automation and Test in Europe (DATE), 2016. Page 4 of 23 This document is Public, and was produced under the EUROSERVER project (EC contract 610456). D7.9 Review of Industry trends – Competitive analysis 2. Competitive Analysis As part of the DATE’16 paper, the EUROSERVER consortium analysed the competitive ARM based solutions. The table with some corrections based on information not available at the time of the original publication is included below in Table 1. At the time the DATE’16 paper was prepared there were at least seven other vendors intending to build ARM-based solutions for the server market, other than the ARM Juno reference platform and the EUROSERVER proposed platform. As is discussed in the rest of this document, many of the vendors have either changed the target market for their devices or pulled out completely. Regarding power efficiency it is also important to note that the silicon fabrication technology has a large bearing on the power utilised by the System on Chip (SoC) solutions. Intel has complete control from design, through to fabrication plants and so have used fabrication technologies beyond the reach of most of these vendors to lower the power envelope Table 1: ARM-based server solutions # Chip- to- Compan Locati Silicon Chip Memory Product Cor Core Type I/O support chip Status y on Tech power support es support Dual-core USB 2.0, Other 2x channel Yes, A72 + quad- I/O in IOFPGA: JUNO TSMC DDR3L TLX400, ARM UK 6 core A53 + N/A 10/100 Eth, PCIe Available SoC 28HPM 32-bit total BW 0.7 quad-core not functional 1600 Gbps Mali-T624 (r1) 4x HMC FPGA I/F, 4x10 Yes, EURO- HW Pro- FDSOI 33W Proto Mar Europe 32 A53 links: GB/s towards Unimem, SERVER totype 28nm max. 2017 4x60GB/s FPGA (I/O) RDMA TSMC 6x 10G Eth, PCIe LS1043 32-bit Sampling Freescale U.S.A 28nm 4 A53 8W Gen2, USB3, No A DDR3L/4 Q1 2015 HPM SATA3 TSMC 8x 10G Eth, PCIe LS2085 30W 2x 64-bit Freescale U.S.A 28nm 8 A57 Gen3, USB3, No Q3 2015 A TDP DDR4 HPM SATA3 TSMC ARMv8 Broadco Yes, Vulcan U.S.A 16nm 32 custom DDR4 PCIe 2H 2016 2 m coherent FinFET (Vulcan) Thunder GF 24 ~125 10/40/100G Eth, CCPI Dual ARMv8 4x 72-bit Cavium X U.S.A 28nm to W SATA3, PCIe Socket Available custom DDR3/4 CN88xx HKMG 48 TDP Gen3 NUMA 130W 10/25/40/50/100 CCPI Dual Thunder 14nm ARMv8 6x 72-bit Cavium U.S.A 54 ? GbE, SATA3, Socket 2H 2017 X2 FinFET custom DDR4 PCIe Gen3 NUMA Applied X- TSMC ARMv8 4x 10G Eth, 6x U.S.A 8 40W DDR3 No Available Micro Gene1 40nm custom PCIe, SATA Applied X- TSMC ARMv8 4x PCIe Gen3, Sampling U.S.A 16 25W? RoCE Micro Gene2 28nm custom DDR3L/4 1/10Gbe, SATA3 H1 2016 Applied X- ARMv8 U.S.A TSMC 32 8x DDR4 42x PCI G3 Micro Gene3 custom Sampling 16nm 2 As discussed later, this has been discontinued Page 5 of 23 This document is Public, and was produced under the EUROSERVER project (EC contract 610456). D7.9 Review of Industry trends – Competitive analysis # Chip- to- Compan Locati Silicon Chip Memory Product Cor Core Type I/O support chip Status y on Tech power support es support FinFET 1Q 2017 3 GF 2x 10G
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