Wafer-To-Wafer Permanent Bonding

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Wafer Bonding Comparison Permanent Bonding – Physical analysis and Cost Overview MEMS, Imaging, LED, Packaging report by Audrey LAHRACH November 2018 – Sample

Overview / Introduction 5 o Thermo-compression Bonding o Executive Summary o MEMS RF o Reverse Costing Methodology o MEMS Inertial Sensor Permanent Wafer Bonding Technology 9 Physical Comparison 140 Permanent Wafer Bonding Definition and Process Description 13 o Without intermediate layer Cost Comparison 164 o Fusion Bonding o CMOS Image Sensor Feedbacks 168 o MEMS Inertial Sensor SystemPlus Consulting services 170 o Cu-Cu/Oxide Hybrid Bonding o CMOS Image Sensor o Anodic Bonding o MEMS Pressure Sensor o With intermediate layer o Glass Frit o MEMS Pressure Sensor o MEMS Inertial Sensor o Adhesive Bonding o MEMS Micro-mirror o Eutectic Bonding o MEMS Inertial Sensor o Microbolometer o LED

Overview / Introduction o Executive Summary This comparative review has been conducted to provide insights into the structures, processes and costs of the main o Reverse Costing Methodology permanent wafer bonding technologies. o Glossary

Wafer Bonding Technology Among these technologies, we have identified two main groups. One, bonding wafers without intermediate layers, includes Wafer Bonding Definition and fusion, copper-copper hybrid and anodic bonding approaches. The second group involves bonding wafers with intermediate Process Description layers using an insulator like a glass frit, or a metal in eutectic and thermocompression approaches. In this report, we show examples of each wafer bonding approach in different applications. We analyze and compare each wafer bonding process type Physical Comparison to show the benefit in terms of cost and space used.

Cost Comparison

Related Reports By switching from glass frit bonding to metal bonding thermo-compression, a manufacturer could reduce component area by up to 30%, reclaiming lost space around the active surface and cutting cost. However, some bonding technologies are currently About System Plus used only in some market segments. For example, hybrid copper-copper bonding is only used in CIS and glass frit technology is found only in products in automotive and some consumer MEMS applications.

In the comparison, we have analyzed each component’s wafer bonding process, including component dimensions, cost and manufacturing approach. We provide an overview of technology costs and manufacturer choices by application and range. We offer buyers and device manufacturers a unique possibility of understanding permanent wafer bonding technology, evolution, and comparing process costs.

Overview / Introduction  Permanent Wafer Bonding: Wafer Bonding Technology . Wafer bonding consists of joining two wafers surfaces with or without an intermediary layer, depending on the bonding Wafer Bonding Definition and technology. Process Description  Direct bonding is the process of bonding without an intermediate layer: Physical Comparison

Cost Comparison

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 Indirect bonding is the process of bonding with an intermediate layer:

Overview / Introduction Fusion Wafer Bonding Technology bonding/direct or Wafer Bonding Definition and molecular bonding Process Description Direct Bonding Physical Comparison Cu-Cu/oxide hybrid Without bonding at RT intermediate layer Cost Comparison

Related Reports Anodic bonding About System Plus Wafer Bonding Technologies Glass frit bonding Insulating interlayer Adhesive bonding Indirect Bonding With intermediate layer Eutectic Bonding

Metal bonding Thermo- compression

Overview / Introduction

Wafer Bonding Technology

Wafer Bonding Definition and Process Description

o Without intermediate layer o Fusion bonding o Anodic bonding o With intermediate layer o Insulating interlayer o Glass frit bonding o Adhesive bonding o Metal Bonding o Cu-Cu/oxide hybrid bonding o Eutectic Bonding o Thermo- compression

Physical Comparison

Cost Comparison

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Overview / Introduction ASIC Wafer Bonding Technology

Wafer Bonding Definition and Fusion Process Description bonding

o Without intermediate layer o Fusion bonding Photo MEMS o Anodic bonding rotation Sensor o With intermediate layer (180°) o Insulating interlayer Resin o Glass frit bonding Resin o Adhesive bonding MEMS o Metal Bonding Cap IC Substrate (Si) o Cu-Cu/oxide hybrid TSV via Middle bonding Fusion o Eutectic Bonding Bonding MEMS Cap (Si) o Thermo- xxxx xxxx compression IC Metal Layers MEMS Sensor (Si) xxxx Physical Comparison xxxx xxxx xxxx TSV MEMS Cap (Si) Cost Comparison xxxxx xxxxx

Related Reports Solder RDL MEMS Sensor Ball (Si) About System Plus Fusion Bonding Oxide CMOS and Metal Layers Package Cross-Section – SEM View IC Substrate (Si)

Overview / Introduction

Wafer Bonding Technology • Front-End Process: o Substrate: x-inch (xxxmm) Silicon wafer Wafer Bonding Definition and Process Description o Process type: xxxxxxxx o o Without intermediate layer Metal layers: x (xxxx) o Fusion bonding o Special features: DRIE, fusion & xxxxx bondings + o Anodic bonding o With intermediate layer TSV xxxxxx in MEMS Cap o Insulating interlayer o Glass frit bonding o Lithography steps: xx o Adhesive bonding o MEMS Area: xxxmm² o Metal Bonding o Cu-Cu/oxide hybrid bonding o Eutectic Bonding o Thermo- compression

Physical Comparison TSV MEMS Cap Cost Comparison

Related Reports MEMS Sensor Fusion About System Plus bonding

IC die

MEMS Accelerometer structure

Overview / Introduction Fusion Bonding Process Wafer Bonding Technology

Wafer Bonding Definition and Process Description

o Without intermediate layer o Fusion bonding o Anodic bonding o With intermediate layer • IC wafer o Insulating interlayer o Glass frit bonding MEMS on o Adhesive bonding o Metal Bonding CMOS o Cu-Cu/oxide hybrid bonding o Eutectic Bonding o Thermo- compression

Physical Comparison • Fusion bonding Cost Comparison MEMS on

Related Reports CMOS

About System Plus

Overview / Introduction MEMS Wafer Bonding Technology Cap

Wafer Bonding Definition and Process Description Pb Glass-frit

Physical Comparison

Cost Comparison

Related Reports MEMS Sensor About System Plus

MEMS Cap

Gold

MEMS Sensor

Au-Au Sealing Cross-Section Accelerometer with Gold Sealing ©2018 by System Plus Consulting ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Wafer to Wafer Permanent Bonding Comparison 2018 11 Glass frit bonding to Eutectic bonding

Overview / Introduction

Wafer Bonding Technology MEMS Wafer Bonding Definition and Cap Process Description Pb Glass-frit

Physical Comparison

Cost Comparison

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MEMS Cap

xxxxxx MEMS Sensor WLCSP 3-axis AlGe Accelerometer AlGe Sealing Cross section ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Wafer to Wafer Permanent Bonding Comparison 2018 12 COST COMPARISON

Overview / Introduction

Wafer Bonding Technology Front-End Wafer Bonding Definition and Process Description Clean Room Cost

Physical Comparison Equipment Cost Consumable Cost Cost Comparison Labor Cost Related Reports Wafer Bonding Cost

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Overview / Introduction

Wafer Bonding Technology

Wafer Bonding Definition and REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MARKETMARKET AND AND TECHNOLOGY TECHNOLOGY REPORTSREPORTS - YOLE DÉVELOPPEMENTDÉVELOPPEMENT Process Description PACKAGING ADVANCED PACKAGING Physical Comparison • MEMS Packaging: Reverse Technology Review • Bonding and Lithography Equipment Market for More than Moore Cost Comparison • MEMS Pressure Sensor Comparison 2018 Devices • Status of the MEMS Industry 2018 Related Reports • Equipment and Materials for 3D TSV Applications 2017 • Status of the CMOS Image Sensor Industry 2018 About System Plus • MEMS Packaging 2017

Overview / Introduction Wafer Bonding Technology Bonding and Lithography Equipment Market for More than Wafer Bonding Definition and Moore Devices – by Yole Développement Process Description

Physical Comparison More than Moore devices fueled by megatrend applications will

Cost Comparison strongly drive the growth of the lithography, permanent bonding, and temporary bonding and debonding equipment market. Related Reports

About System Plus KEY FEATURES OF THE REPORT • Wafer-to-Wafer (W2W) permanent bonding, lithography, temporary bonding and debonding tools for More than Moore (MtM) markets (advanced packaging, MEMS & sensors, CMOS Image Sensors (CIS), RF, LED and power applications) volume and value metrics forecasted for 2017–2023 > by MtM device > by technology type • Key technical insights into each equipment type covered, including trends, requirements and challenges • Competitive landscape and 2017 market shares for each bonding and lithography equipment manufacturer by MtM device • Technology roadmap for W2W permanent bonding, temporary bonding and debonding and lithography for each MtM device Bundle offer possible with the Wafer to Wafer Permanent Bonding Comparison 2018 report by System Plus Consulting, contact us for more information.

Overview / Introduction

Wafer Bonding Technology

Wafer Bonding Definition and Process Description

Physical Comparison Custom Analyses (>130 analyses per year) Cost Comparison

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Trainings

Overview / Introduction

Wafer Bonding Technology

Wafer Bonding Definition and Process Description FRANKFURT/MAIN Europe Sales Office Physical Comparison NANTES LYON KOREA Cost Comparison Headquarter YOLE HQ YOLE TOKYO PHOENIX YOLE KK Related Reports YOLE Inc.

GREATER CHINA About System Plus YOLE o Company services o Contact

Headquarters Europe Sales Office America Sales Office Asia Sales Office 22 bd Benoni Goullin Lizzie LEVENEZ Steve LAFERRIERE Takashi ONOZAWA 44200 Nantes Frankfurt am Main Phoenix, AZ Tokyo FRANCE GERMANY WESTERN US JAPAN +33 2 40 18 09 16 +49 151 23 54 41 82 T : +1 310 600 8267 T : +81 804 371 4887 [email protected] [email protected] [email protected] [email protected]

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