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Wafer-Level Vacuum Packaging of Smart Sensors sensors Review Wafer-Level Vacuum Packaging of Smart Sensors Allan Hilton * and Dorota S. Temple Electronics and Applied Physics Division, RTI International, Research Triangle Park, NC 27709, USA; [email protected] * Correspondence: [email protected]; Tel.: +1-919-248-1453 Academic Editor: Vittorio M. N. Passaro Received: 16 August 2016; Accepted: 18 October 2016; Published: 31 October 2016 Abstract: The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS) integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology. Keywords: wafer-level vacuum packaging; hermetic packaging; wafer-to-wafer bonding; smart sensors; microelectromechanical (MEMS); eutectic bonding; solid-liquid interdiffusion (SLID) bonding; metal-metal bonding; thin-film getter; AuSn; CuSn; AuSi; AlGe; AuIn 1. Introduction Miniaturized semiconductor sensors are at the heart of the next wave of interconnectivity—the transition from the “Internet of People” to the Internet of Things (IoT). To realize the full potential of IoT, sensor fabrication methods must continue to reduce the size, weight, power, and cost (SWaP-C) of the sensor component and system. The same trend needs to apply to sensor packaging, which currently accounts for as much as 80% of the overall cost and form factor. To make IoT a reality, the industry needs to adopt packaging methods that reduce SWaP-C. Many of semiconductor sensors, especially those in the category of microelectromechanical systems (MEMS), require a vacuum environment to achieve the desired sensitivity. In this group are inertial sensors, thermal imagers, pressure sensors, and resonance devices. The vacuum environment is typically established soon after the sensor fabrication to protect the sensor during downstream assembly. To reduce SWaP-C, vacuum packaging has shifted from serial, die-level approaches to massively parallel, wafer-level vacuum packaging (WLVP). In a WLVP process, a wafer containing a semiconductor sensor die (i.e., device wafer) is bonded under vacuum to a passive lid wafer or to another device wafer containing part of the sensor architecture. Smart sensors form when sensor elements are closely integrated with silicon (Si) integrated circuits (ICs). These readout ICs (ROICs) provide device bias, signal amplification, and other signal Sensors 2016, 16, 1819; doi:10.3390/s16111819 www.mdpi.com/journal/sensors Sensors 2016, 16, 1819 2 of 33 Sensors 2016, 16, 1819 2 of 34 processingwere realized functions. by connecting Originally, discrete WLVPs MEMS included chips only to discrete ROIC sensorchips devices,through andthe smartpackage sensors or board were realizedsubstrate. by This connecting approach discrete, depicted MEMS in Figure chips to1a, ROIC is commonly chips through referred the to package as multi or-chip board integra substrate.tion Thisand approach,has many depicteddifferent in embodiments Figure1a, is commonly in both two referred-dimensional to as multi-chip (2D) and integration three-dimensional and has many (3D) differentformats. Figure embodiments 1b shows in the both WLVP two-dimensional process flow (2D) for the and case three-dimensional where the complementary (3D) formats. metal Figure-oxide1b showssemiconductor the WLVP (CMOS) process IC flow and for sensor the case elements where are the interconnected complementary d metal-oxideirectly, without semiconductor the use of (CMOS)routing layers IC and in sensor the package elements or board, are interconnected in a construct directly, referred without to as a system the use-on of- routingchip (So layersC). in the package or board, in a construct referred to as a system-on-chip (SoC). Figure 1. (a) Examples of multi-chip architecture in which vacuum-packaged microelectromechanical Figure 1. (a) Examples of multi-chip architecture in which vacuum-packaged microelectromechanical systems (MEMS) sensors are connected to complementary metal-oxide semiconductor (CMOS) systems (MEMS) sensors are connected to complementary metal-oxide semiconductor (CMOS) integrated circuits (ICs) through the package substrate. Includes both two-dimensional (2D) and three-dimensionalintegrated circuits (3D)(ICs) integration through the examples; package (substrate.b) Example Includes of system-on-chip both two-dimensional (SoC) architecture (2D) and in whichthree-dimensional wafer-level vacuum (3D) integration packaging examples; (WLVP) is (b used) Example to place of MEMS system and-on CMOS-chip (S inoC) the architecture same package. in Photographwhich wafe ofr-level 2D multi-chip vacuum packagepackaging reprinted (WLVP with) is permissionused to place from MEMS Colibrys and Ltd, CMOS (Yverdon-les in the Bains,same Switzerland).package. Photograph Scanning of electron 2D mu microscopelti-chip package (SEM) reprinted image of with STMicroelectronics permission from three-axis Colibrys MEMS Ltd, accelerometer(Yverdon-les Bains, reprinted Switzerland with permission). Scanning from electron Chipworks microscope [1]. (SEM) image of STMicroelectronics three-axis MEMS accelerometer reprinted with permission from Chipworks [1]. The SoC approach is required for large-format pixelated devices such as micro-mirrors and The SoC approach is required for large-format pixelated devices such as micro-mirrors and imaging arrays. By monolithically integrating sensor arrays with CMOS ICs, one can achieve a imaging arrays. By monolithically integrating sensor arrays with CMOS ICs, one can achieve a pixel-level interconnect density. When compared to the discrete multi-chip packaging approach, pixel-level interconnect density. When compared to the discrete multi-chip packaging approach, SoC SoC is typically more complex but leads to reduced parasitics, smaller footprints, higher interconnect is typically more complex but leads to reduced parasitics, smaller footprints, higher interconnect densities, and lower package costs. Although SoC is still primarily implemented in pixelated devices, densities, and lower package costs. Although SoC is still primarily implemented in pixelated devices, some mature, high-volume microphones, pressure sensors, and inertial sensors are shifting from some mature, high-volume microphones, pressure sensors, and inertial sensors are shifting from multi-chip to SoC embodiments to reduce SWaP-C [2]. multi-chip to SoC embodiments to reduce SWaP-C [2]. This fusion of MEMS and CMOS ICs at the chip level creates new challenges for the WLVP process. This fusion of MEMS and CMOS ICs at the chip level creates new challenges for the WLVP These challenges result from the requirement of thermal, chemical, and mechanical compatibility of the process. These challenges result from the requirement of thermal, chemical, and mechanical WLVP process with not only the sensing element but also the CMOS ICs. Several WLVP approaches compatibility of the WLVP process with not only the sensing element but also the CMOS ICs. Several have been developed to address these challenges. In this paper, we review progress in the development WLVP approaches have been developed to address these challenges. In this paper, we review of WLVP, discussing techniques that have been reported for the deposition of seals, wafer-to-wafer progress in the development of WLVP, discussing techniques that have been reported for the deposition of seals, wafer-to-wafer bonding, and getter deposition and activation, and we compare the different approaches in the context of device requirements. Although a number of comprehensive Sensors 2016, 16, 1819 3 of 33 bonding,Sensors and 2016 getter, 16, 1819 deposition and activation, and we compare the different approaches in the context3 of 34 of device requirements. Although a number of comprehensive papers have been published on the papers have been published on the related topics of CMOS and MEMS integration [2–6], wafer-level related topics of CMOS and MEMS integration [2–6], wafer-level packaging (WLP) of MEMS [5–12], packaging (WLP) of MEMS [5–12], and WLVP of MEMS [10,13–16], no review has addressed the and WLVP of MEMS [10,13–16], no review has addressed the WLVP of SoC smart sensors. In the cases WLVP of SoC smart sensors. In the cases where topical overlap exists, more recent and/or more wheredetailed topical information overlap exists, is provided. more recent and/or more detailed information
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