USOO81022O2B2

(12) United States Patent (10) Patent No.: US 8,102.202 B2 Wurth (45) Date of Patent: Jan. 24, 2012

(54) MODEM UNIT AND MOBILE (56) References Cited COMMUNICATION UNIT U.S. PATENT DOCUMENTS (75) Inventor: Bernd Wurth, Landsberg am Lech (DE) 5.335,276 A * 8/1994 Thompson et al...... 380.266 5,638,540 A * 6/1997 T13,300 (73) Assignee: Innon Technologies AG, Neubiberg 5,974,5285,809,432 A * 10/19999/1998 YamashitaTsai et al...... 455,575..1 (DE) 6,380,031 B1 4/2002 Mehrad et al. 7,162,279 B2 * 1/2007 Gupta ...... 455,574 (*) Notice: Subject to any disclaimer, the term of this 7.281,144 B2 * 10/2007 Banginwar et al. T13,320

patent is extended or adjusted under 35 73s E: 33 S.aSC halk OWSKI ki etalca. ... 229. U.S.C. 154(b) by 739 days. 2002/0083432 A1* 6/2002 Souissi et al...... 717/178 2008/0104428 A1* 5/2008 Nafziger et al...... T13,300 (21) Appl. No.: 12/190,183 * cited by examiner (22) Filed: Aug. 12, 2008 Primary Examiner — David Mis (74) Attorney, Agent, or Firm — Eschweiler & Associates, (65) Prior Publication Data LLC US 2010/00401 24 A1 Feb. 18, 2010 (57) ABSTRACT (51) Int. Cl. A modem unit includes a first semiconductor die that includes H04L27/00 (2006.01) ARASE (52) U.S. Cl...... ".------329/311; 332/106; 375/222 on a first semiconductor die. The first semiconductor die also (58) Field of Classification Search ...... 329/300, includes a unit and an embedded flash 329/304,311: 332/100, 103, 106; 375/222, memory. 375/259 See application file for complete search history. 22 Claims, 6 Drawing Sheets

10 U.S. Patent Jan. 24, 2012 Sheet 1 of 6 US 8,102.202 B2

FIG. 1

RF BASEBAND TRANSCEIVER UNIT UNIT

U.S. Patent Jan. 24, 2012 Sheet 2 of 6 US 8,102.202 B2

100

10

FIG. 3 U.S. Patent Jan. 24, 2012 Sheet 3 of 6 US 8,102.202 B2

A1 200

SECOND MEMORY UNIT

BASEBAND UNIT

FIRST MEMORY UNIT

FIG. 4 U.S. Patent Jan. 24, 2012 Sheet 4 of 6 US 8,102.202 B2

MEMORY UNIT

APPLICATION UNIT

FIG. 5 U.S. Patent Jan. 24, 2012 Sheet 5 of 6 US 8,102.202 B2

------1------422 MEMORY UNIT 421 423 RF APPLICATION TRANSCEIVER BASEBAND UNIT UNIT

415

POWER 411.1 - 411 MANAGEMENT UNIT 411.2 MEMORY 424 U.S. Patent Jan. 24, 2012 Sheet 6 of 6 US 8,102.202 B2

STORE DATA IN FIRST MEMORY UNIT

FABRICATE MODEM UNIT

STORE OPERATION PROGRAMIN SECOND MEMORY UNIT

FABRICATE APPLICATION UNIT

FIG 7 US 8, 102,202 B2 1. 2 MODEMUNT AND MOBILE other implementations as may be desired and advantageous COMMUNICATION UNIT for any given or particular application. Furthermore, to the extent that the terms “include”, “have”, “with', or other vari FIELD OF THE INVENTION ants thereof are used in either the detailed description or the claims, such terms are intended to be inclusive in a manner This invention relates to a modem unit, a mobile commu similar to the term “comprise'. The terms “coupled and nication unit, and a method for producing a mobile commu “connected, along with derivatives may be used. It should be nication unit. understood that these terms may be used to indicate that two elements cooperate or interact with each other regardless BACKGROUND OF THE INVENTION 10 whether they are in direct physical or electrical contact, or they are not in direct contact with each other. Also, the term A mobile communication unit may comprise a modem “exemplary is merely meant as an example, rather than the (modulator/demodulator) unit, which encodes information best or optimal. and modulates a signal to be transmitted, and also demodu Referring to FIG. 1, there is shown a schematic block lates a received signal and decodes information contained 15 diagram of a modem unit according to an embodiment. The therein. By use of a modem unit a signal is produced that can modem unit 10 comprises a semiconductor die 1 comprising be transmitted easily and a received signal can be decoded to a power management unit or power Supply unit 2 and an reproduce the original information. Modems can be imple embedded flash memory 3. The power management unit 2 is mented not only in mobile communication units but also in responsible for the supply of electrical power to the sub-units other communication units like stationary communication and sections of the modem unit 10. units, data processing units, personal computers or the like. According to an embodiment of the modem unit 10 of FIG. Modem units can comprise memory units like Volatile and 1, the semiconductor die 1 with the power management unit 2 non-volatile memories for storing different kinds of informa and the embedded flash memory 3 can be housed in a package tion or data therein. like, for example, a mold package. The package may com 25 prise outer electrical contact elements connected to contact BRIEF DESCRIPTION OF THE DRAWINGS elements of the power management unit 2 and the embedded flash memory 3, the outer electrical contact elements being, Aspects of the invention are made more evident by way of for example, in the form of pins or flat contact pads (“lands'). example in the following detailed description of embodi According to one embodiment of the modem unit 10 of ments when read in conjunction with the attached drawing 30 FIG. 1, the power management unit 2 and the embedded flash figures. memory 3 can be electrically connected with each other by FIG. 1 schematically illustrates a block diagram of a electrical connection elements integrated on the semiconduc modem unit according to an embodiment; tor die 1. FIG. 2 schematically illustrates a block diagram of a According to one embodiment of the modem unit 10 of modem unit according to an embodiment; 35 FIG. 1, the modem unit 10 further comprises a baseband unit FIG. 3 schematically illustrates a block diagram of a or baseband processor which can be electrically coupled to mobile communication unit according to an embodiment; the power management unit 2. In one embodiment the base FIG. 4 schematically illustrates a block diagram of a band unit can be fabricated on another semiconductor die mobile communication unit according to an embodiment; which can be packaged in its own package or which can be FIG. 5 schematically illustrates a block diagram of a 40 integrated with the semiconductor die 1 in one package. mobile communication unit according to an embodiment; According to a further embodiment, the modem unit 10 may FIG. 6 schematically illustrates a block diagram of a further comprise a frequency (RF) transceiver unit elec mobile communication unit according to an embodiment; and trically coupled to the baseband unit. In one embodiment the FIG. 7 illustrates a flow diagram of a method for producing radio frequency transceiver unit can be fabricated on another a mobile communication unit according to an embodiment. 45 semiconductor die which can be packaged in its own package. The radio frequency transceiver unit can also be fabricated DETAILED DESCRIPTION OF THE INVENTION together with the baseband unit on a single (monolithic) semi conductor die. This semiconductor die can be packaged in its In the following, one or more aspects and embodiments of own package or it can be packaged together with the semi the invention are described with reference to the drawings, 50 conductor die 1 in one single package. These embodiments wherein like reference numerals are generally utilized to refer will be explained in more detail further below in connection to like elements throughout. In the following description, for with FIG. 6. purposes of explanation, numerous specific details are set According to one embodiment of the modem unit 10 of forth in order to provide a thorough understanding of one or FIG. 1, in the embedded flash memory 3 one or more of more aspects of embodiments of the invention. It may be 55 calibration data, network parameters, security data and debug evident, however, to one skilled in the art that one or more data are stored. As will be explained further below, the aspects of the embodiment of the invention may be practiced modem unit 10 can be part of a mobile communication unit. with a lesser degree of these specific details. In other During production of the mobile communication unit, cali instances, known structures and devices are shown in block bration data like, for example, radio frequency calibration diagram form in order to facilitate describing one or more 60 data are generated which can be stored in the embedded flash aspects of the embodiments of the invention. The following memory 3. Moreover, during operation of the mobile com description is therefore not to be taken in a limiting sense, and munication unit, security data, debug information and param the scope of the invention is defined by the appended claims. eters of the communication network are generated and peri In addition, while a particular feature or aspect of an odically updated, wherein those parameters can also be stored embodiment may be disclosed with respect to only one of 65 in the embedded flash memory 3. several implementations. Such features or aspects may be According to one embodiment of the modem unit 10 of combined with one or more other features or aspects of the FIG. 1, the power management unit 2 and the embedded flash US 8, 102,202 B2 3 4 memory 3 can be processed on the semiconductor die 1 by a (MP3 player, etc.) or address book functions. The mobile CMOS technology like, for example, a 130 nm communication unit 100 can thus consist of or be comprised CMOS process technology. of a so-called Smartphone. According to one embodiment of the modem unit 10 of According to one embodiment of the mobile communica FIG. 1, the modem unit 10 further comprises a baseband unit 5 tion unit 100 of FIG. 3, the modem unit 10 further comprises which comprises a (CPU), wherein an a baseband unit like a baseband processor, the baseband unit operation program of the central processing unit is not stored comprising a central processing unit (CPU). According to a in the embedded flash memory 3. Instead the operation pro further embodiment thereof, in case that the mobile commu gram of the central processing unit can be stored elsewhere nication unit 100 comprises an application unit, the applica like, for example, in a further unit which is electrically 10 tion unit comprises a memory unit containing an operation coupled to the modem unit 10, as will be explained in greater program for the operation of the central processing unit of the detail below. baseband unit. The memory unit can, for example, comprise Referring to FIG. 2, there is shown a schematic block a non-volatile memory like, for example, a flash memory like diagram of a modem unit according to an embodiment. The aNOR flash memory or a NAND flash memory. The memory modem unit 20 comprises a semiconductor die 1 comprising 15 unit may in addition comprise a volatile memory like, for a power management unit 2 and an embedded flash memory example, a RAM. 3. The semiconductor die 1 with the power management unit According to one embodiment of the mobile communica 2 and the embedded flash memory 3 is electrically coupled to tion 100 of FIG. 3, in the embedded flash memory 3 one or a baseband unit 4 like a baseband processor. The electrical more of calibration data, like RF calibration data, network connection between the semiconductor die 1 and the base parameters of the communication network used by the mobile band unit 4, in one embodiment, can be comprised of one or communication unit, security data and debug data are stored. several uni-directional electrical connection lines, each one It is to be noted that embodiments of the mobile commu for transmitting signals and messages in one direction, nication unit 100 of FIG. 3 can be provided based on the respectively. In principle it is also possible to provide a bi embodiments of the modem unit presented above in connec directional electrical connection line, in particular one single 25 tion with FIGS. 1 and 2. bi-directional electrical connection line as the electrical con Referring to FIG. 4, there is shown a schematic diagram of nection between the semiconductor die 1 and the baseband a mobile communication unit according to one embodiment. unit 4. The mobile communication unit 200 comprises a modemunit The modem unit 20 of FIG. 2 further comprises a radio 30 comprising a baseband unit 31, said baseband unit 31 frequency (RF) transceiver unit 5 which is electrically 30 comprising a central processing unit (CPU) 31.1, and a first coupled to the baseband unit 4. The electrical connection memory unit 32 storing one or more of calibration data, between the baseband unit 4 and the radio frequency trans network parameters, security data and debug data, and the ceiver unit 5 can also be comprised of one or several uni mobile communication unit 200 further comprising an appli directional electrical connection lines, each one for transmit cation unit 40 comprising a second memory unit 41 storing an ting signals and messages in one direction, respectively. In 35 operation program for the operation of the central processing principle it is also possible to provide a bi-directional electri unit 31.1. cal connection line as the electrical connection between the The modem unit 30 and the application unit 40 can be semiconductor die 1 and the baseband unit 4 between the electrically coupled to each other by one or several uni-direc baseband unit 4 and the radio frequency transceiver unit 5. tional electrical connection lines, each one for transmitting In one exemplary embodiment the modem unit 20 of FIG. 40 signals and messages in one direction, respectively. In prin 2 can be part of a mobile communication unit as will be ciple it is also possible to provide a bi-directional electrical outlined below in connection with further embodiments. connection line, in particular one single bi-directional elec According to one embodiment of the modem unit 20 of trical connection line as the electrical connection between the FIG. 2, RF calibration data which are generated during pro modem unit 30 and the application unit 40. duction of the modem unit 20 or at other times, in particular 45 According to one embodiment of the mobile communica the RF transceiver unit 5, can be stored in the embedded flash tion unit 200 of FIG. 4, the first memory unit 32 is a flash memory 3. Moreover, network parameters of the communi memory. cation network to be used with the mobile communication According to one embodiment of the mobile communica unit can also be stored in the embedded flash memory 3. tion unit 200 of FIG.4, the modem unit 30 comprises at least According to one embodiment of one of the modem units 50 a first semiconductor die, the first semiconductor die com 10 or 20 of FIGS. 1 and 2, the modemunit 10 or 20 in addition prising a power management unit and the first memory unit. includes a volatile memory like, for example, a RAM. According to a further embodiment thereof, the first memory Referring to FIG. 3, there is shown a schematic block unit can be an embedded flash memory and the power man diagram of a mobile communication unit according to one agement unit and the embedded flash memory are integrated embodiment. The mobile communication unit 100 comprises 55 on the first semiconductor die. According to a further embodi a modem unit 10 comprising a semiconductor die 1, wherein ment thereof, the baseband unit 31 can be fabricated on a the semiconductor die 1 comprises a power management unit second semiconductor die and the second semiconductor die 2 and an embedded flash memory 3. can be packaged together with the first semiconductor die According to one embodiment of the mobile communica within one package. According to a further embodiment tion unit 100 of FIG. 3, the mobile communication unit 100 60 thereof, the modem unit 30 further comprises a radio fre further comprises an application unit which is electrically quency (RF) transceiver unit. The radio frequency transceiver coupled to the modem unit 10. The application unit or appli unit can be fabricated on a third semiconductor die which can cation Sub-system can perform particular functions which are be packaged in its own package. The radio frequency trans not or at least not directly related to the mobile communica ceiver unit can also be fabricated together with the baseband tion functions of the mobile communication unit. These par 65 unit on the second semiconductor die. The second semicon ticular functions can, for example, be comprised of video ductor die can be packaged in its own package or it can be games control, photo-camera control, audio function control packaged together with the first semiconductor die 1 in one US 8, 102,202 B2 5 6 single package. These embodiments will be explained in lar one single bi-directional electrical connection line as the more detail further below in connection with FIG. 6. electrical connection between the baseband unit 412 and the Referring to FIG. 5, there is shown a schematic block RF transmission unit 414. diagram of a mobile communication unit according to one The application unit 420 comprises an application proces embodiment. The mobile communication unit 300 comprises sor 421 which is electrically connected to the baseband unit a modem unit 50 and an application unit 60 comprising a 412 of the modem unit 410 by means of the electrical con memory unit 61, said memory unit 61 being accessible by the nection 430. The application unit 420 further comprises a modem unit 50 and the application unit 60. memory unit 422 which is electrically connected to the appli The modem unit 50 and the application unit 60 can be cation processor 421 by means of one or several uni-direc 10 tional electrical connection lines as denoted with the refer electrically coupled with each other by use of one or several ence sign 423, wherein each one of the lines is for transmitting unidirectional electrical connection lines, each one for trans signals and messages in one direction, respectively. In prin mitting signals and messages in one direction, respectively. In ciple it is also possible to provide a bi-directional electrical principle it is also possible to provide a bi-directional electri connection line, in particular one single bi-directional elec cal connection line, in particular one single bi-directional 15 trical connection line as the electrical connection between the electrical connection line as the electrical connection memory unit 422 and the application processor 421. The between the modem unit 50 and the application unit 60. memory unit 422 can comprise a non-volatile memory like, According to one embodiment of the mobile communica for example, a flash memory like a NAND flash memory or a tion unit 300 of FIG. 5, the modem unit 50 comprises a NOR flash memory or a PCM (phase change memory), and it baseband unit, wherein the baseband unit comprises a central can further comprise a volatile memory like, for example, an processing unit (CPU), wherein an operation program for SDRAM memory. The memory unit 422, in one particular operating the central processing unit is stored in the memory example, the non-volatile memory, stores the operation pro unit 61. gram of the central processing unit 412.1 of the baseband unit According to an embodiment of the mobile communica 412 of the modem unit 410. The embedded flash memory tion unit 300 of FIG. 5, the modem unit 50 comprises a first 25 411.2 of the combined power management and storage unit semiconductor die comprising a power management unit and 411 of the modem unit 410 stores one or more of radio an embedded flash memory. According to a further embodi frequency calibration data, network parameters, security data ment thereof, one or more of calibration data, network param and debug data of the communication network. The applica eters, security data and debug data are stored in the embedded tion unit 420 further comprises an application power manage flash memory. According to another embodiment the modem 30 ment unit 424. unit 50 further comprises a baseband unit which may also be In one embodiment of the combined power management arranged or integrated on the semiconductor die. and storage unit 411, the embedded flash memory 411.2 is Referring to FIG. 6, there is shown a schematic block integrated together with the power management unit 411.1 on diagram of a mobile communication unit according to one one semiconductor die as made possible by process technolo embodiment. The mobile communication unit 400 comprises 35 gies such as, for example, a 130 nm CMOS technology which a modem unit or modem Sub-system 410 and an application combines high-voltage and high-current Support with digital unit or application sub-system 420. The modem unit 410 and (130 nm) and low-density non-volatile memory properties. the application unit 420 are electrically coupled to each other One advantage of the mobile communication unit 400 of by means of one or several uni-directional electrical connec FIG. 6 is that the modem unit 410 never needs to access the tion lines, each one for transmitting signals and messages in 40 flash memory unit (“system flash”) of the memory unit 422 of one direction, respectively. In principle it is also possible to the application unit 420 after the boot sequence of the central provide a bi-directional electrical connection line, in particu processing unit 412.1 of the baseband unit 412 has been lar one single bi-directional electrical connection line as the completed. The flash memory unit of the memory unit 422 electrical connection between the modem unit 410 and the contains the operation program of the central processing unit application unit 420. The modem unit 410 comprises a com 45 412.1 of the baseband unit 412 and it can be accessed via bined power management and storage unit 411. The power driver Software running on the central processing unit of the management and storage unit 411 is comprised of a first application processor 421. Therefore only at the beginning, semiconductor die comprising a power management unit i.e. during a boot period the baseband unit 412 will access to 411.1 and an embedded flash memory 411.2. The modemunit the flash memory unit of the memory unit 422 via the appli 410 further comprises a baseband unit 412 which is electri 50 cation processor 421 in order to copy the operation program cally coupled to the power management and storage unit 411 of its central processing unit 412.1, as stored in the flash by means of one or several uni-directional electrical connec memory unit of the memory unit 422, to a Volatile memory tion lines as denoted with the reference sign 413, wherein (RAM) that is comprised in the modem unit 410 or that is each one of the lines is for transmitting signals and messages comprised in the memory unit 422. in one direction, respectively. In principle it is also possible to 55 A further advantage of the mobile communication unit 400 provide a bi-directional electrical connection line, in particu of FIG. 6 is that radio frequency calibration data can be stored lar one single bi-directional electrical connection line as the locally in the power management and storage unit 411, i.e. in electrical connection between the baseband unit 412 and the the embedded flash memory 411.2 contained therein. This power management and storage unit 411. The baseband unit means that during production of the modem unit 410, radio 412 comprises a central processing unit 412.1. The modem 60 frequency calibration data can be stored on the modem Sub unit 410 further comprises a radio frequency transceiver unit system so that the modem unit 410 can be produced indepen 414 which is electrically connected to the baseband unit 412 dent from the production of the application unit 420. by means of one or several uni-directional electrical connec According to one embodiment it is one advantageous tion lines as denoted with the reference sign 415, wherein aspect of the mobile communication unit 400 of FIG. 6 that each one of the lines is for transmitting signals and messages 65 the modem unit's 410 code and non-volatile data (such as in one direction, respectively. In principle it is also possible to calibration data and network parameters) are partitioned provide a bi-directional electrical connection line, in particu between the flash memory 411.2 contained in the power man US 8, 102,202 B2 7 8 agement and storage unit 411 of the modem Sub-system 410 According to one embodiment of the method of FIG. 7, the and the memory unit 422 of the application sub-system 420, method further comprises fabricating a semiconductor die in particular the flash memory contained therein. comprising a power management unit and the first memory According to one embodiment shown in FIG. 6, the modem unit. unit 410 is comprised of a 2-chip-modem sub-system wherein According to one embodiment of the method of FIG. 7, the the term “chip has the meaning of a semiconductor package. method further comprises fabricating a semiconductor die The 2-chip-modem Sub-System comprises a first semicon comprising a power management unit, the first memory unit ductor package combining the baseband processor 412 and and the baseband unit. the power management and storage unit 411 containing the It is to be understood that the above description is intended embedded flash memory 411.2, and a second semiconductor 10 to be illustrative and not restrictive. The application is package containing the radio frequency transceiver unit 414. intended to cover any variations of the invention. The scope of In this embodiment each one of the power management and the invention includes any other embodiments and applica storage unit 411, the baseband processor 412 and the RF tions in which the above structures and methods may be used. transceiver unit 414 is fabricated on its own semiconductor The scope of the invention should therefore be determined die, respectively. 15 with reference to the appended claims along with the scope of According to one embodiment of the mobile communica equivalence to which Such claims are entitled. tion unit as shown in FIG. 6, the modem unit 410 is comprised It is emphasized that the abstract is provided to comply of a single-chip modem Sub-system comprising one single with 37 CFR. Section 1.72(b) requiring an abstract that will semiconductor package combining the baseband processor allow the reader to quickly ascertain the nature and gist of a 412, the radio frequency transceiver 414 and the power man technical disclosure. It is submitted with the understanding agement and storage unit 411 which contains the flash that it will not be used to interpret or limit the scope of memory 411.2. According to one embodiment thereof the meaning of the claims. baseband processor 412, the radio frequency transceiver 414 What is claimed is: and the power management and storage unit 411 are each 1. A modem unit, comprising fabricated on a separate semiconductor die. In another 25 a first semiconductor die comprising a power management embodiment the baseband processor 412 and the radio fre unit embodied in hardware and an embedded flash quency transceiver 414 are integrated together on a first semi memory. conductor die and the power management and storage unit 2. The modem unit according to claim 1, further compris 411 is integrated together with the flash memory 411.2 on a ing: second semiconductor die. 30 a baseband unit coupled to the power management unit. According to one embodiment of the mobile communica 3. The modem unit according to claim 2, wherein the tion unit of FIG. 6, the modem unit 410 is comprised of a baseband unit is arranged on a second semiconductor die. 3-chip-modem Sub-system including a first semiconductor 4. The modem unit according to claim 1, wherein in the package that combines the baseband processor 412 and the embedded flash memory one or more of calibration data, power management and storage unit 411 which contains the 35 network parameters, security data and debug data are stored. flash memory unit 411.2, a second semiconductor package 5. The modem unit according to claim 2, further compris comprising the radio frequency transceiver unit 414, and a ing: third semiconductor package comprising a random access a radio frequency unit coupled to the baseband unit. memory (RAM) for the following purpose. During boot time 6. The modem unit according to claim 5, wherein the radio of the central processing unit 412.1 of the baseband unit 412, 40 frequency unit is arranged on the second semiconductor die or the baseband unit 412 accesses the memory unit 422 of the on a third semiconductor die. application unit 420 via the application processor 421 by 7. A mobile communication unit, comprising: copying code out the memory unit 422. The code can then be a modem unit comprising a first semiconductor die, the first copied to the RAM memory as arranged on the third semi semiconductor die comprising a power management conductor package of the modem unit 410 and the code can be 45 unit embodied in hardware and an embedded flash used for loading the operational program into the CPU. memory. Referring to FIG. 7, there is shown a flow diagram of one 8. The mobile communication unit according to claim 7. embodiment of a method for producing a mobile communi further comprising: cation unit. While the exemplary method is illustrated and an application unit coupled to the modem unit. described below as a series of acts or events, it will be appre 50 9. The mobile communication unit according to claim 8. ciated that the present invention is not limited by the illus wherein the modem unit comprises a baseband unit, the base trated ordering of such acts or events. For example, some acts band unit comprising a central processing unit. may occur in different orders and/or concurrently with other 10. The mobile communication unit according to claim 9. acts or events apart from those illustrated and/or described wherein the application unit comprises a memory unit con herein, in accordance with the invention. In addition, not all 55 taining an operation program comprising instructions for the illustrated Steps may be required to implement a methodology operation of the central processing unit. in accordance with the present invention. The method com 11. The mobile communication unit according to claim 7. prises storing one or more of calibration data, network param wherein in the embedded flash memory one or more of cali eters, security and debug data in a first memory unit at S1. The bration data, network parameters, security data and debug method further comprises fabricating a modem unit, wherein 60 data are stored. the modem unit comprises a first memory unit and a baseband 12. The mobile communication unit according to claim 9. unit, and wherein the baseband unit comprises a central pro wherein the baseband unit is arranged on a second semicon cessing unit at S2. The method still further comprises storing ductor die. an operation program for the operation of the central process 13. A mobile communication unit, comprising: ing unit in a second memory unit at S3, and fabricating an 65 a modem unit comprising a baseband unit, the baseband application unit, wherein the application unit comprises the unit comprising a central processing unit, and a first second memory unit. memory unit configured to store therein one or more of US 8, 102,202 B2 10 calibration data, network parameter, security data and wherein an operation program comprises instructions for debug data, wherein the modem unit resides on a first operating the central processing unit is stored in the memory semiconductor die, and wherein a power management unit. unit embodied in hardware and the first memory unit 19. The mobile communication unit according to claim 17, also resides on the first semiconductor die; and wherein one or more of calibration data, network parameters, an application unit comprising a second memory unit con security data and debug data are stored in the embedded flash figured to store therein an operation program for the memory. operation of the central processing unit. 20. The mobile communication unit according to claim 17, 14. The mobile communication unit according to claim 13, wherein the modem unit further comprises a baseband unit wherein the first memory unit comprises a flash memory. 10 arranged on a second semiconductor die. 15. The mobile communication unit according to claim 13, 21. A method for producing a mobile communication unit, wherein the baseband unit is arranged on a second semicon comprising: ductor die. storing one or more of calibration data, network param 16. The mobile communication unit according to claim 15, eters, security data and debug data in a first memory unit; further comprising: 15 fabricating a modem unit, wherein the modem unit com a radio frequency unit arranged on the second semiconduc prises the first memory unit and a power management tor die or on a third semiconductor die. unit embodied in hardware on a first semiconductor die, 17. A mobile communication unit, comprising: and a baseband unit, and wherein the baseband unit a modem unit, wherein the modem unit resides on a first comprises a central processing unit; semiconductor die, and wherein a power management storing an operation program for the operation of the cen unit embodied in hardware and an embedded flash tral processing unit in a second memory; and memory also resides on the first semiconductor die; and fabricating an application unit, wherein the application an application unit comprising a memory unit, wherein the unit comprises the second memory unit. memory unit is accessible by the modem unit and the 22. The method according to claim 21, further comprising: application unit. 25 fabricating a second semiconductor die comprising the 18. The mobile communication unit according to claim 17, baseband unit. wherein the modem unit comprises a baseband unit, wherein the baseband unit comprises a central processing unit,