DOCSLIB.ORG

Power-Management Architecture of the Intel Microarchitecture Code-Named Sandy Bridge

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Power-Management Architecture of the Intel Microarchitecture Code-Named Sandy Bridge See discussions, stats, and author profiles for this publication at: https://www.researchgate.net/publication/241637649 Power-Management Architecture of the Intel Microarchitecture Code-Named Sandy Bridge Article in IEEE Micro · March 2012 DOI: 10.1109/MM.2012.12 CITATIONS READS 107 126 5 authors, including: Effi Rotem Alon Naveh Intel Technion - Israel Institute of Technology 31 PUBLICATIONS 232 CITATIONS 14 PUBLICATIONS 248 CITATIONS SEE PROFILE SEE PROFILE All content following this page was uploaded by Effi Rotem on 01 May 2016. The user has requested enhancement of the downloaded file. All in-text references underlined in blue are added to the original document and are linked to publications on ResearchGate, letting you access and read them immediately. [3B2-9] mmi2012020020.3d 12/3/012 14:20 Page 20 .......................................................................................................................................................................................................................... POWER-MANAGEMENT ARCHITECTURE OF THE INTEL MICROARCHITECTURE CODE-NAMED SANDY BRIDGE .......................................................................................................................................................................................................................... MODERN MICROPROCESSORS ARE EVOLVING INTO SYSTEM-ON-A-CHIP DESIGNS WITH HIGH INTEGRATION LEVELS, CATERING TO EVER-SHRINKING FORM FACTORS.PORTABILITY WITHOUT COMPROMISING PERFORMANCE IS A DRIVING MARKET NEED.AN ARCHITEC- TURAL APPROACH THAT’S ADAPTIVE TO AND COGNIZANT OF WORKLOAD BEHAVIOR AND PLATFORM PHYSICAL CONSTRAINTS IS INDISPENSABLE TO MEETING THESE PERFORMANCE AND EFFICIENCY GOALS.THIS ARTICLE DESCRIBES POWER-MANAGEMENT INNOVATIONS INTRODUCED ON INTEL’S SANDY BRIDGE MICROPROCESSOR. ......Continuous advances in process multithreading capabilities and improved technology let designers integrate an ever- power management and energy efficiency. increasing number of transistors onto a single We also introduced several architectural die. This increased transistor density has en- changes, most notably the 256-bit Advanced abled system-on-a-chip (SoC) functionality Vector Extension (AVX). by integrating graphics engines, memory con- In addition, we moved the processor graph- Efraim Rotem trollers, and other platform components into ics from the chip set or discrete graphics onto modern CPU dies. The Sandy Bridge client the lead CPU process technology, resulting in Alon Naveh CPU contains just over 1 billion transistors, much higher transistor counts, lower power, and the Sandy Bridge server contains up to and higher frequencies. We also significantly Doron Rajwan 3 times as many on a single monolithic die. improved the internal microarchitecture of The second-generation Sandy Bridge core the processor graphics and media, resulting Avinash Ananthakrishnan processor has five main domains: Intel archi- in much higher-performance execution units tecture cores, a ring interconnect, a shared and high-performance media functionality. Eliezer Weissmann last-level cache (LLC), a system agent, and The ring interconnect and LLC architec- processor graphics. Figure 1 describes the ture provide high modularity and feature- Intel Sandy Bridge die. rich general-purpose, graphics, media, and system integration. Sandy Bridge redesign The transistor count increase and integra- We significantly redesigned Sandy Bridge tion of platform components into a mono- from the previous generation, providing lithic die, together with the increase in core increased instruction-level parallelism and frequency, introduce demanding power and .............................................................. 20 Published by the IEEE Computer Society 0272-1732/12/$31.00 c 2012 IEEE [3B2-9] mmi2012020020.3d 12/3/012 14:20 Page 21 energy challenges to modern computers. Be- cause computer systems’ power and thermal envelopes aren’t increasing, addressing these challenges requires a highly energy-efficient design. Sandy Bridge power management builds on the existing SpeedStep and Turbo Boost technologies significantly increasing performance and energy efficiency. Sandy Bridge’s power-management features provide the maximum performance possible within the package and system physical constraints when needed, while consuming very low power and energy when full performance isn’t needed. Furthermore, we expanded Figure 1. The Sandy Bridge die photo. the power-management features implemented in previous generations of Intel CPUs on Sandy Bridge to give the rest of the SoC power budgeting and prioritization capabilities. DMI PCI Express Power-management architecture Voltage System agent The Package Control Unit (PCU) is regulator SVID IMC the brain behind the Sandy Bridge power- Embedded PECI PCU management features. The power-management controller Display architecture is highlighted over the block Core PMA LLC diagram in Figure 2. The PCU resides in Core LLC the system agent and is a combination of dedi- Core LLC cated hardware state machines and an inte- grated microcontroller. A power-management Core LLC link connects the PCU to different cores Processor graphics and functional blocks on the die via power- management agents (PMAs). PMAs collect te- lemetry information such as power consump- Figure 2. Sandy Bridge’s power-management tion and junction temperature, and perform architecture. Sandy Bridge block diagram control functions such as P-state and C-state showing the major functional blocks and transitions. The PCU communicates to the ex- the power-management control blocks ternal voltage regulator and embedded control- and interconnect. The platform power- ler that perform system power-management management components and the associated functions. The PCU runs firmware that con- platform interconnect are also shown. stantly collects power and thermal informa- tion, communicates with the system, and performs various power-management func- tions and optimization algorithms. independent power plane, whose voltage and Sandy Bridge’s package implements two frequency can be varied independently. It independent variable power planes. One can also be turned off completely when the shared power plane feeds all CPU cores, the graphics are inactive. Additional fixed power ring, and the LLC. Embedded power gates planes control the system agent and I/O. turn each core on and off individually. The The Sandy Bridge power management LLC’s power gates can turn on or off portions maximizes the user experience under multi- of the cache in shallow package sleep states or ple constraints. The user experience has the all of the cache in deeper sleep states. All the following attributes: cores and the ring share the same clock and perform dynamic voltage and frequency scal- throughput performance, ing together. The graphics processor has an responsiveness (burst performance), .................................................................... MARCH/APRIL 2012 21 [3B2-9] mmi2012020020.3d 12/3/012 14:20 Page 22 ............................................................................................................................................................................................... HOT CHIPS same time at worst-case conditions.1 In 45 most cases, the CPU is running a less- 40 35 demanding application and the Intel Turbo 30 Boost technology uses this power headroom 25 to extract higher performance when possi- 20 ble.2,3 Sandy Bridge’s power performance Power (W) 15 control is performed primarily through 10 dynamic voltage and frequency scaling 5 (DVFS). When the operating system identi- 0 0 50 100 150 200 250 fies a need for high performance, it issues a Time (s) high P-state request. Whenever power and thermal headroom exist, the PCU increases CPU–predicted CPU–actual PG–predicted PG–actual the voltage and frequency to the highest Package–predicted Package–actual point that is lower than or equal to the oper- ating system request, that still meets all phys- Figure 3. Power meter: predicted and actual power of the CPU, processor ical constraints. Sandy Bridge implements graphics, and total package. The figure shows a power snapshot of architectural power meters. It collects a set combined CPU and graphics workload. The chart presents the actual of architectural events from each Intel archi- measured power and the architectural power meter reporting for the IA tecture core, the processor graphics, and I/O, core, processor graphics, and total package. The actual and reported and combines them with energy weights to power correlate accurately. predict the package’s active power consump- tion. Leakage information is coded into the die and is scaled with operating conditions such as voltage and temperature to provide CPU and graphics performance, the package’s total power consumption. battery life and energy bills, and The system uses architectural power predic- ergonomics (acoustic noise, heat, and tor output, which is also exposed externally so on). to software, to decide the amount of turbo To meet user preferences, the power- upside available for the current workload management algorithms optimize around (turbo upside is available higher frequency the following physical constraints: that the CPU can go up to and use for higher performance).4,5 The architectural power silicon capabilities, including voltage, predictor provides a consistent turbo behavior frequency and power characteristics; while minimizing the die-to-die variations system thermomechanical
Load more

Recommended publications
  • Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance
    White Paper Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance Ofri Wechsler Intel Fellow, Mobility Group Director, Mobility Microprocessor Architecture Intel Corporation White Paper Inside Intel®Core™ Microarchitecture Introduction Introduction 2 The Intel® Core™ microarchitecture is a new foundation for Intel®Core™ Microarchitecture Design Goals 3 Intel® architecture-based desktop, mobile, and mainstream server multi-core processors. This state-of-the-art multi-core optimized Delivering Energy-Efficient Performance 4 and power-efficient microarchitecture is designed to deliver Intel®Core™ Microarchitecture Innovations 5 increased performance and performance-per-watt—thus increasing Intel® Wide Dynamic Execution 6 overall energy efficiency. This new microarchitecture extends the energy efficient philosophy first delivered in Intel's mobile Intel® Intelligent Power Capability 8 microarchitecture found in the Intel® Pentium® M processor, and Intel® Advanced Smart Cache 8 greatly enhances it with many new and leading edge microar- Intel® Smart Memory Access 9 chitectural innovations as well as existing Intel NetBurst® microarchitecture features. What’s more, it incorporates many Intel® Advanced Digital Media Boost 10 new and significant innovations designed to optimize the Intel®Core™ Microarchitecture and Software 11 power, performance, and scalability of multi-core processors. Summary 12 The Intel Core microarchitecture shows Intel’s continued Learn More 12 innovation by delivering both greater energy efficiency Author Biographies 12 and compute capability required for the new workloads and usage models now making their way across computing. With its higher performance and low power, the new Intel Core microarchitecture will be the basis for many new solutions and form factors. In the home, these include higher performing, ultra-quiet, sleek and low-power computer designs, and new advances in more sophisticated, user-friendly entertainment systems.
    [Show full text]
  • Microcode Revision Guidance August 31, 2019 MCU Recommendations
    microcode revision guidance August 31, 2019 MCU Recommendations Section 1 – Planned microcode updates • Provides details on Intel microcode updates currently planned or available and corresponding to Intel-SA-00233 published June 18, 2019. • Changes from prior revision(s) will be highlighted in yellow. Section 2 – No planned microcode updates • Products for which Intel does not plan to release microcode updates. This includes products previously identified as such. LEGEND: Production Status: • Planned – Intel is planning on releasing a MCU at a future date. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment.
    [Show full text]
  • POWER-AWARE MICROARCHITECTURE: Design and Modeling Challenges for Next-Generation Microprocessors
    POWER-AWARE MICROARCHITECTURE: Design and Modeling Challenges for Next-Generation Microprocessors THE ABILITY TO ESTIMATE POWER CONSUMPTION DURING EARLY-STAGE DEFINITION AND TRADE-OFF STUDIES IS A KEY NEW METHODOLOGY ENHANCEMENT. OPPORTUNITIES FOR SAVING POWER CAN BE EXPOSED VIA MICROARCHITECTURE-LEVEL MODELING, PARTICULARLY THROUGH CLOCK- GATING AND DYNAMIC ADAPTATION. Power dissipation limits have Thus far, most of the work done in the area David M. Brooks emerged as a major constraint in the design of high-level power estimation has been focused of microprocessors. At the low end of the per- at the register-transfer-level (RTL) description Pradip Bose formance spectrum, namely in the world of in the processor design flow. Only recently have handheld and portable devices or systems, we seen a surge of interest in estimating power Stanley E. Schuster power has always dominated over perfor- at the microarchitecture definition stage, and mance (execution time) as the primary design specific work on power-efficient microarchi- Hans Jacobson issue. Battery life and system cost constraints tecture design has been reported.2-8 drive the design team to consider power over Here, we describe the approach of using Prabhakar N. Kudva performance in such a scenario. energy-enabled performance simulators in Increasingly, however, power is also a key early design. We examine some of the emerg- Alper Buyuktosunoglu design issue in the workstation and server mar- ing paradigms in processor design and com- kets (see Gowan et al.)1 In this high-end arena ment on their inherent power-performance John-David Wellman the increasing microarchitectural complexities, characteristics. clock frequencies, and die sizes push the chip- Victor Zyuban level—and hence the system-level—power Power-performance efficiency consumption to such levels that traditionally See the “Power-performance fundamentals” Manish Gupta air-cooled multiprocessor server boxes may box.
    [Show full text]
  • The Von Neumann Computer Model 5/30/17, 10:03 PM
    The von Neumann Computer Model 5/30/17, 10:03 PM CIS-77 Home http://www.c-jump.com/CIS77/CIS77syllabus.htm The von Neumann Computer Model 1. The von Neumann Computer Model 2. Components of the Von Neumann Model 3. Communication Between Memory and Processing Unit 4. CPU data-path 5. Memory Operations 6. Understanding the MAR and the MDR 7. Understanding the MAR and the MDR, Cont. 8. ALU, the Processing Unit 9. ALU and the Word Length 10. Control Unit 11. Control Unit, Cont. 12. Input/Output 13. Input/Output Ports 14. Input/Output Address Space 15. Console Input/Output in Protected Memory Mode 16. Instruction Processing 17. Instruction Components 18. Why Learn Intel x86 ISA ? 19. Design of the x86 CPU Instruction Set 20. CPU Instruction Set 21. History of IBM PC 22. Early x86 Processor Family 23. 8086 and 8088 CPU 24. 80186 CPU 25. 80286 CPU 26. 80386 CPU 27. 80386 CPU, Cont. 28. 80486 CPU 29. Pentium (Intel 80586) 30. Pentium Pro 31. Pentium II 32. Itanium processor 1. The von Neumann Computer Model Von Neumann computer systems contain three main building blocks: The following block diagram shows major relationship between CPU components: the central processing unit (CPU), memory, and input/output devices (I/O). These three components are connected together using the system bus. The most prominent items within the CPU are the registers: they can be manipulated directly by a computer program. http://www.c-jump.com/CIS77/CPU/VonNeumann/lecture.html Page 1 of 15 IPR2017-01532 FanDuel, et al.
    [Show full text]
  • Power Management 24
    Power Management 24 The embedded Pentium® processor family implements Intel’s System Management Mode (SMM) architecture. This chapter describes the hardware interface to SMM and Clock Control. 24.1 Power Management Features • System Management Interrupt can be delivered through the SMI# signal or through the local APIC using the SMI# message, which enhances the SMI interface, and provides for SMI delivery in APIC-based Pentium processor dual processing systems. • In dual processing systems, SMIACT# from the bus master (MRM) behaves differently than in uniprocessor systems. If the LRM processor is the processor in SMM mode, SMIACT# will be inactive and remain so until that processor becomes the MRM. • The Pentium processor is capable of supporting an SMM I/O instruction restart. This feature is automatically disabled following RESET. To enable the I/O instruction restart feature, set bit 9 of the TR12 register to “1”. • The Pentium processor default SMM revision identifier has a value of 2 when the SMM I/O instruction restart feature is enabled. • SMI# is NOT recognized by the processor in the shutdown state. 24.2 System Management Interrupt Processing The system interrupts the normal program execution and invokes SMM by generating a System Management Interrupt (SMI#) to the processor. The processor will service the SMI# by executing the following sequence. See Figure 24-1. 1. Wait for all pending bus cycles to complete and EWBE# to go active. 2. The processor asserts the SMIACT# signal while in SMM indicating to the system that it should enable the SMRAM. 3. The processor saves its state (context) to SMRAM, starting at address location SMBASE + 0FFFFH, proceeding downward in a stack-like fashion.
    [Show full text]
  • Power Management Using FPGA Architectural Features Abu Eghan, Principal Engineer Xilinx Inc
    Power Management Using FPGA Architectural Features Abu Eghan, Principal Engineer Xilinx Inc. Agenda • Introduction – Impact of Technology Node Adoption – Programmability & FPGA Expanding Application Space – Review of FPGA Power characteristics • Areas for power consideration – Architecture Features, Silicon design & Fabrication – now and future – Power & Package choices – Software & Implementation of Features – The end-user choices & Enablers • Thermal Management – Enabling tools • Summary Slide 2 2008 MEPTEC Symposium “The Heat is On” Abu Eghan, Xilinx Inc Technology Node Adoption in FPGA • New Tech. node Adoption & level of integration: – Opportunities – at 90nm, 65nm and beyond. FPGAs at leading edge of node adoption. • More Programmable logic Arrays • Higher clock speeds capability and higher performance • Increased adoption of Embedded Blocks: Processors, SERDES, BRAMs, DCM, Xtreme DSP, Ethernet MAC etc – Impact – general and may not be unique to FPGA • Increased need to manage leakage current and static power • Heat flux (watts/cm2) trend is generally up and can be non-uniform. • Potentially higher dynamic power as transistor counts soar. • Power Challenges -- Shared with Industry – Reliability limitation & lower operating temperatures – Performance & Cost Trade-offs – Lower thermal budgets – Battery Life expectancy challenges Slide 3 2008 MEPTEC Symposium “The Heat is On” Abu Eghan, Xilinx Inc FPGA-101: FPGA Terms • FPGA – Field Programmable Gate Arrays • Configurable Logic Blocks – used to implement a wide range of arbitrary digital
    [Show full text]
  • Hardware Architecture
    Hardware Architecture Components Computing Infrastructure Components Servers Clients LAN & WLAN Internet Connectivity Computation Software Storage Backup Integration is the Key ! Security Data Network Management Computer Today’s Computer Computer Model: Von Neumann Architecture Computer Model Input: keyboard, mouse, scanner, punch cards Processing: CPU executes the computer program Output: monitor, printer, fax machine Storage: hard drive, optical media, diskettes, magnetic tape Von Neumann architecture - Wiki Article (15 min YouTube Video) Components Computer Components Components Computer Components CPU Memory Hard Disk Mother Board CD/DVD Drives Adaptors Power Supply Display Keyboard Mouse Network Interface I/O ports CPU CPU CPU – Central Processing Unit (Microprocessor) consists of three parts: Control Unit • Execute programs/instructions: the machine language • Move data from one memory location to another • Communicate between other parts of a PC Arithmetic Logic Unit • Arithmetic operations: add, subtract, multiply, divide • Logic operations: and, or, xor • Floating point operations: real number manipulation Registers CPU Processor Architecture See How the CPU Works In One Lesson (20 min YouTube Video) CPU CPU CPU speed is influenced by several factors: Chip Manufacturing Technology: nm (2002: 130 nm, 2004: 90nm, 2006: 65 nm, 2008: 45nm, 2010:32nm, Latest is 22nm) Clock speed: Gigahertz (Typical : 2 – 3 GHz, Maximum 5.5 GHz) Front Side Bus: MHz (Typical: 1333MHz , 1666MHz) Word size : 32-bit or 64-bit word sizes Cache: Level 1 (64 KB per core), Level 2 (256 KB per core) caches on die. Now Level 3 (2 MB to 8 MB shared) cache also on die Instruction set size: X86 (CISC), RISC Microarchitecture: CPU Internal Architecture (Ivy Bridge, Haswell) Single Core/Multi Core Multi Threading Hyper Threading vs.
    [Show full text]
  • Clock Gating for Power Optimization in ASIC Design Cycle: Theory & Practice
    Clock Gating for Power Optimization in ASIC Design Cycle: Theory & Practice Jairam S, Madhusudan Rao, Jithendra Srinivas, Parimala Vishwanath, Udayakumar H, Jagdish Rao SoC Center of Excellence, Texas Instruments, India (sjairam, bgm-rao, jithendra, pari, uday, j-rao) @ti.com 1 AGENDA • Introduction • Combinational Clock Gating – State of the art – Open problems • Sequential Clock Gating – State of the art – Open problems • Clock Power Analysis and Estimation • Clock Gating In Design Flows JS/BGM – ISLPED08 2 AGENDA • Introduction • Combinational Clock Gating – State of the art – Open problems • Sequential Clock Gating – State of the art – Open problems • Clock Power Analysis and Estimation • Clock Gating In Design Flows JS/BGM – ISLPED08 3 Clock Gating Overview JS/BGM – ISLPED08 4 Clock Gating Overview • System level gating: Turn off entire block disabling all functionality. • Conditions for disabling identified by the designer JS/BGM – ISLPED08 4 Clock Gating Overview • System level gating: Turn off entire block disabling all functionality. • Conditions for disabling identified by the designer • Suspend clocks selectively • No change to functionality • Specific to circuit structure • Possible to automate gating at RTL or gate-level JS/BGM – ISLPED08 4 Clock Network Power JS/BGM – ISLPED08 5 Clock Network Power • Clock network power consists of JS/BGM – ISLPED08 5 Clock Network Power • Clock network power consists of – Clock Tree Buffer Power JS/BGM – ISLPED08 5 Clock Network Power • Clock network power consists of – Clock Tree Buffer
    [Show full text]
  • Multiprocessing Contents
    Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References .............................................
    [Show full text]
  • Demystifying Internet of Things Security Successful Iot Device/Edge and Platform Security Deployment — Sunil Cheruvu Anil Kumar Ned Smith David M
    Demystifying Internet of Things Security Successful IoT Device/Edge and Platform Security Deployment — Sunil Cheruvu Anil Kumar Ned Smith David M. Wheeler Demystifying Internet of Things Security Successful IoT Device/Edge and Platform Security Deployment Sunil Cheruvu Anil Kumar Ned Smith David M. Wheeler Demystifying Internet of Things Security: Successful IoT Device/Edge and Platform Security Deployment Sunil Cheruvu Anil Kumar Chandler, AZ, USA Chandler, AZ, USA Ned Smith David M. Wheeler Beaverton, OR, USA Gilbert, AZ, USA ISBN-13 (pbk): 978-1-4842-2895-1 ISBN-13 (electronic): 978-1-4842-2896-8 https://doi.org/10.1007/978-1-4842-2896-8 Copyright © 2020 by The Editor(s) (if applicable) and The Author(s) This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. Open Access This book is licensed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made. The images or other third party material in this book are included in the book’s Creative Commons license, unless indicated otherwise in a credit line to the material.
    [Show full text]
  • Microcontroller Serial Interfaces
    Microcontroller Serial Interfaces Dr. Francesco Conti [email protected] Microcontroller System Architecture Each MCU (micro-controller unit) is characterized by: • Microprocessor • 8,16,32 bit architecture • Usually “simple” in-order microarchitecture, no FPU Example: STM32F101 MCU Microcontroller System Architecture Each MCU (micro-controller unit) is characterized by: • Microprocessor • 8,16,32 bit architecture • Usually “simple” in-order microarchitecture, no FPU • Memory • RAM (from 512B to 256kB) • FLASH (from 512B to 1MB) Example: STM32F101 MCU Microcontroller System Architecture Each MCU (micro-controller unit) is characterized by: • Microprocessor • 8,16,32 bit architecture • Usually “simple” in-order microarchitecture, no FPU • Memory • RAM (from 512B to 256kB) • FLASH (from 512B to 1MB) • Peripherals • DMA • Timer • Interfaces • Digital Interfaces • Analog Timer DMAs Example: STM32F101 MCU Microcontroller System Architecture Each MCU (micro-controller unit) is characterized by: • Microprocessor • 8,16,32 bit architecture • Usually “simple” in-order microarchitecture, no FPU • Memory • RAM (from 512B to 256kB) • FLASH (from 512B to 1MB) • Peripherals • DMA • Timer • Interfaces • Digital • Analog • Interconnect Example: STM32F101 MCU • AHB system bus (ARM-based MCUs) • APB peripheral bus (ARM-based MCUs) Microcontroller System Architecture Each MCU (micro-controller unit) is characterized by: • Microprocessor • 8,16,32 bit architecture • Usually “simple” in-order microarchitecture, no FPU • Memory • RAM (from 512B to 256kB) • FLASH
    [Show full text]
  • Computer Architecture Techniques for Power-Efficiency
    MOCL005-FM MOCL005-FM.cls June 27, 2008 8:35 COMPUTER ARCHITECTURE TECHNIQUES FOR POWER-EFFICIENCY i MOCL005-FM MOCL005-FM.cls June 27, 2008 8:35 ii MOCL005-FM MOCL005-FM.cls June 27, 2008 8:35 iii Synthesis Lectures on Computer Architecture Editor Mark D. Hill, University of Wisconsin, Madison Synthesis Lectures on Computer Architecture publishes 50 to 150 page publications on topics pertaining to the science and art of designing, analyzing, selecting and interconnecting hardware components to create computers that meet functional, performance and cost goals. Computer Architecture Techniques for Power-Efficiency Stefanos Kaxiras and Margaret Martonosi 2008 Chip Mutiprocessor Architecture: Techniques to Improve Throughput and Latency Kunle Olukotun, Lance Hammond, James Laudon 2007 Transactional Memory James R. Larus, Ravi Rajwar 2007 Quantum Computing for Computer Architects Tzvetan S. Metodi, Frederic T. Chong 2006 MOCL005-FM MOCL005-FM.cls June 27, 2008 8:35 Copyright © 2008 by Morgan & Claypool All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or by any means—electronic, mechanical, photocopy, recording, or any other except for brief quotations in printed reviews, without the prior permission of the publisher. Computer Architecture Techniques for Power-Efficiency Stefanos Kaxiras and Margaret Martonosi www.morganclaypool.com ISBN: 9781598292084 paper ISBN: 9781598292091 ebook DOI: 10.2200/S00119ED1V01Y200805CAC004 A Publication in the Morgan & Claypool Publishers
    [Show full text]