Spectrolab's Optoelectronic Products Division Offers Foundry Services

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Spectrolab's Optoelectronic Products Division Offers Foundry Services pectrolab’s Optoelectronic Products Division offers foundry services Sfor epitaxial wafer growth by MOVPE, wafer fabrication, and compo- nent packaging. MOVPE epi growth foundry services include InGaAs/ InP (PIN & APD) sensor wafers, GaInP/GaAs heterojunction bipolar transistor (HBT) wafers and waveguide modulator, laser diode wafers on GaAs and InP substrates. Spectrolab possesses one of the largest MOVPE facilities in North America with state-of-the-art produc- tion reactors. Furthermore, Spectrolab offers wafer-fabrication services for InP- and GaAs-based devices as well as packaging for sensors and lasers. Our manufacturing processes use statistical process control with six-sigma targets to meet and exceed customer specifications. Spectro- lab’s goal is to become a leading MOVPE wafer and wafer fabrication foundry services provider for optoelectronic products. With our commit- ment to high quality, short lead times, and aggressive pricing, we are confident our products will meet and exceed customers’ expectations. Spectrolab Inc., a Boeing Company, founded in 1958, is a world-leading manufacturer of space-qualified photovoltaic solar cells, panels, arrays and solar simulation systems. Epi-Wafer Foundry & Fabrication Services Spectrolab's MOVPE foundry offers InP and GaAs-based epitaxial wafers for PIN and APD photodetectors, light-emitting and light-guiding photonic devices, GaInP/GaAs HBT devices, and solar cell structures on wafer sizes up to 6". The growth facility is supported by a state-of-the-art characterization facility for material and device evalua- tion. Spectrolab also offers wafer processing foundry services for Ge, InP and GaAs-based devices up to 4”. Epi on 4” InP Wafer Spectrolab's high-throughput MOVPE manufacturing infrastructure allows for high- volume and low-cost production. Additionally, internal device fabrication capability via the use of quick-lot processing for process monitoring and control facilitates high yields. Spectrolab also provides custom development services for unique applications. InGaAs/InP PIN & APD Photodetector Foundry Spectrolab offers InGaAs P-I-N & APD photodetector device dies for the telecommunication markets. Device dies are characterized for dark current, capacitance, responsivity, speed and reliability with excellent high-temperature dark current performance. High reliability planar structures. AR coating and SiNx passivated structures. 2.5 Gb/s, 10 Gb/s and higher speed device designs available. Active area sizes: 40 µm, 75 µm, 200 µm and 300 µm. Custom sizes and designs available upon request High quality epitaxial InGaAs PIN and Avalanche photodiode device structures grown on InP substrates by MOVPE. Photograph of 75 µm Typical device die characteristics: low dark current, low capacitance and Device Dies high quantum efficiency. Germanium Photodetectors On January 14, 2002, Spectrolab announced low-cost monitor photodetectors for fiber-optic communication applications. The germanium-based component offers cost savings over conventional indium gallium arsenide-based monitoring photodetectors without sacrificing performance. A cost-saving germanium-based photodetector designed for use as a monitor photode- tector in fiber-optic telecommunication systems is commercially available from Spectro- lab. This germanium photodetector offers excellent performance and potential cost savings of approximately 50 percent over indium gallium arsenide (InGaAs) monitor photodiodes. Call Spectrolab for more details. 4” Ge Photodetector Wafer GaInP/ GaAs Heterojunction Bipolar Transistor (HBT) Epi-Wafers Spectrolab offers GaInP/GaAs HBT wafers up to 6” diameter, grown on semi-insulating GaAs substrates. High- throughput MOVPE growth foundry services, quick-lot device processing, complete device parametric testing, and material evaluation manufacturing infrastructure have been developed to provide wafers with fast turn-around time and delivery, meeting tight specifications. Spectrolab offers flexible device design and will work with customers to achieve the best possible structure to meet and exceed requirements. Light Emitting and Light Guiding Photonic Products Telecom Laser Diode and Waveguide Materials and Processing: Spectrolab offers capability for growing complex heterostructures on both GaAs and InP crystals as well as heterostructures specifically for waveguides and basic Fabry-Perot LDs. Spectrolab offers a full range of light-emitting and light-guiding photonic products – from laser diodes (LD) to semiconductor waveguides. These components and assemblies will become available in the near future. TO Cans and Butterfly Packages Foundry Services Spectrolab operates a world-class packaging facility for assembly and test. Our packaging team will work with you to custom design photodetectors and laser fiber packages to meet your specific needs. We have the capability to inspect and test the package during and after assembly to meet the Telcordia standards. Furthermore, Spectrolab has state-of-the-art modeling tools and the expertise to perform thermal, mechanical, vibration and optical analysis. March 2002.
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