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RZ Family Microprocessors Brochure
RZ FAMILY Renesas Microprocessor 2018.10 THE NEXT-GENERATION PROCESSOR TO MEET THE NEEDS OF THE SMART SOCIETY HAS ARRIVED. achine In M te n r a f a m c u e H ntr wo Co ol Net rk CONTENTS RZ/A SERIES ___________________________________________ 04 RZ/G SERIES ___________________________________________ 10 RZ/T SERIES ___________________________________________ 16 RZ/N SERIES ___________________________________________ 22 RZ SPECIFICATIONS ______________________________________ 28 PACKAGE LINEUP _______________________________________ 38 02-03 The utilization of intelligent technology is advancing in all aspects of our lives, including electric household appliances, industrial equipment, building management, power grids, and transportation. The cloud-connected “smart society” is coming ever closer to realization. Microcontrollers are now expected to provide powerful capabilities not available previously, such as high-performance and energy-efficient control combined with interoperation with IT networks, support for human-machine interfaces, and more. To meet the demands of this new age, Renesas has drawn on its unmatched expertise in microcontrollers to create the RZ family of embedded processors. The lineup of these “next-generation processors that are as easy to use as conventional microcontrollers” to meet different customer requirements. The Zenith of the Renesas micro As embedded processors to help build the next generation of advanced products, the RZ family offers features not available elsewhere and brings new value to customer applications. -
V850 Series Development Environment Pamphlet
To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. 2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. 3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. 4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. -
Palmice3 V850 Apr
Product Summary PALMiCE3 V850 Apr. 1, 2014 (1/1) JTAG emulator PALMiCE3 V850 PALMiCE3 V850 is a JTAG emulator that incorporates on-chip debugging function in Renesas Electronics-made V850. It supports USB2.0 (High-speed) as the host interface, and the Vbus which requires no power supply. Furthermore, PALMiCE3 V850 has a palm-sized, light and compact body, providing excellent portability to support you with debugging. As for the debugger, it surely incorporates CSIDE, which provides a user-friendly debugging environment. CSIDE supports not only high-level language debugging of a range of C languages but also a wide range of debugging environments by optional debug libraries. Support for SuperH family and H8S/H8SX family are also available with optional CSIDEs. ■ Supports V850 ■ Real-time watcher feature (Optional) ■ Supports USB2.0(High-speed), allowing high-speed ■ Simulated I/O feature processing ■ Allows access to memory and I/O during break ■ A palm-sized, compact body ■ Supports debugging on on-chip/external flash memories ■ Requires no power supply with Vbus support Main Specifications Supporting model HUDI141(JTAG) model Supported CPUs *1 V850E2/MN4, V850E2/ML4 JTAG clock Can be set freely in 1MHz increments between 1MHz and 25MHz. Voltage 1.65V - 5.5V (Follows target) Measures by sampling and shows the results with accuracy of 50mV Target I/F Voltage measurement and precision showing 2 decimal places. Connector 14-pin MIL connector Supports referencing/editing of register and downloading to memory during break. Register, memory, I/O operation It supports referencing/editing of memory and I/O even during execution of the user program. -
Renesas MCU M16C Family (R32C/M32C/M16C/R8C)
2008.01 Renesas MCU M16C Family (R32C/M32C/M16C/R8C) www.renesas.com World’s No. 1* Flash MCUs !! index Roadmap Total shipments of Rewriting possible during operation, and CPU Architecture World’s No. 1 1,000,000,000 units!! World’s No. 1 program/erase cycles increased to 100,000! E2dataFlash substantially improves the functionality and performance of data Flash MCUs Thanks to strong demand, total flash MCU Flash MCUs flash, allowing data to be rewritten independently while the MCU is operating. Concepts Proof No. 1 shipments reached the 1 billion mark in March 2007. Proof No. 4 Guaranteed program/erase cycles have been increased to 100,000, and data Renesas flash MCUs are used in a wide range of save times are two orders of magnitude faster than external E2PROM. consumer, industrial and automotive applications. (E2dataFlash: E2PROM emulation data flash memory) Product Lineup Development Tools No. 1 lineup of flash MCUs with 40µsec./byte high-speed flash World’s No. 1 over 300 products in 30 series!! World’s No. 1 programming!! Development Flash MCUs Flash MCUs Tools from Divided into high-end, middle, and low-end classes, Flash MCU technology supports high-speed Renesas Partners Proof No. 2 the flash MCU lineup is built on the most advanced Proof No. 5 programming at a rate of 512KB every 20 seconds technology. Flexible support is provided for (total time required for reprogramming, including Middleware/ increasingly large and complex software. erasing and programming). Demo Sets Functions/ Application Fields Memory Capacity High-speed flash memory supporting Comprehensive support and World’s No. -
OVP Presentation
OpenOpen VirtualVirtual PlatformsPlatforms (OVP)(OVP) AnAn IntroductionIntroduction andand OverviewOverview [email protected] Dec 2011 Page 1 © 2011 Imperas, Open Virtual Platforms, www.OVPworld.org, v1211 TheThe growinggrowing challengechallenge SW content of electronic products grows dramatically Millions and millions lines code In 2007 SW dev costs exceeds HW design costs for SoC ICs Examining the economics of building next-generation mobile handsets with Linux By: Bill Weinber, Jun. 14, 2005 11:00 AM, linux.sys-con.com and the software needs to run faster and faster to provide more and more functionality Source: Xilinx Page 3 © 2011 Imperas, Open Virtual Platforms, www.OVPworld.org, v1211 TheThe realreal solutionsolution isis MultiMulti--CoreCore “Von Neumann is a poor use of scaling – all the energy is going on the communication between the processor and the memory. Its much better to use 20 microprocessors running at 100MHz than one at 2GHz” Hugo de Man, IMEC Early movers have been building multi-core standard processors And more and more System on Chips (SoCs) and Platform chips are becoming multicore Page 4 © 2011 Imperas, Open Virtual Platforms, www.OVPworld.org, v1211 ProcessorProcessor countcount predictedpredicted toto increaseincrease dramaticallydramatically Source: ITRS 2006 Update ITRS 2006 Source: Engine DPE: Data Processing Page 5 © 2011 Imperas, Open Virtual Platforms, www.OVPworld.org, v1211 EmbeddedEmbedded SoftwareSoftware forfor MPSoCsMPSoCs:: AnAn extremeextreme challenge!challenge! “30 to 50 per cent of R&D budgets are spent on software, and the cost is rising 20 per cent a year. The software effort overtakes the hardware effort at 130nm.” Jack Browne, MIPS Technologies “Some say we are at a crisis stage with the software side overwhelming the hardware side. -
RZ Family Microprocessors Brochure
RZ FAMILY MICROPROCESSORS 64-Bit & 32-Bit Arm-based high-end MPUs 2021.07 THE NEXT-GENERATION PROCESSOR TO MEET THE NEEDS OF THE SMART SOCIETY HAS ARRIVED. achine In M te n r a f a m c u e H ntr wo Co ol Net rk CONTENTS RZ/V SERIES ___________________________________________ 04 RZ/G SERIES ___________________________________________ 08 RZ/A SERIES ___________________________________________ 16 RZ/T SERIES ___________________________________________ 22 RZ/N SERIES ___________________________________________ 30 PACKAGE LINEUP _______________________________________ 35 02-03 The utilization of intelligent technology is advancing in all aspects of our lives, including electric household appliances, industrial equipment, building management, power grids, and transportation. The cloud-connected “smart society” is coming ever closer to realization. Microcontrollers are now expected to provide powerful capabilities not available previously, such as high-performance and energy-efficient control combined with interoperation with IT networks, support for human-machine interfaces, and more. To meet the demands of this new age, Renesas has drawn on its unmatched expertise in microcontrollers to create the RZ family of embedded processors. The lineup of these “next-generation processors that are as easy to use as conventional microcontrollers” to meet different customer requirements. The Zenith of the Renesas micro As embedded processors to help build the next generation of advanced products, the RZ family offers features not available elsewhere and -
29064 L902 Di
THATTHE TOUT UNTUTUN US AUTO20180011173A1 CON UNUNTUK DI MO ANTHI (19 ) United States (12 ) Patent Application Publication ( 10) Pub . No. : US 2018 / 0011173 A1 Newman ( 43 ) Pub . Date : Jan . 11 , 2018 ( 54 ) LOW -PROFILE IMAGING SYSTEM WITH GOIS 17 /89 (2006 .01 ) ENHANCED VIEWING ANGLES B6OR 11 / 00 (2006 .01 ) (52 ) U .S . CI. ( 71) Applicant : NextEV USA , Inc. , San Jose , CA (US ) CPC .. GOIS 7 /4816 ( 2013 .01 ) ; GOIS 17 / 936 (2013 .01 ) ; GOIS 17 /89 (2013 . 01 ) ; B60R 11 /04 ( 72 ) Inventor: Austin L . Newman , San Jose, CA (US ) (2013 .01 ) ; B62D 39/ 00 ( 2013 .01 ) ; B60R ( 21 ) Appl. No .: 15 / 394 ,402 2011/ 004 ( 2013. 01 ) ( 22 ) Filed : Dec . 29 , 2016 (57 ) ABSTRACT Related U . S . Application Data Methods, devices , and systems of a light imaging and ranging system are provided . In particular, the imaging and (60 ) Provisional application No. 62 / 359 , 563 , filed on Jul. ranging system includes a LIDAR sensor and a low -profile 7 , 2016 , provisional application No . 62 /378 , 348 , filed optics assembly having a reflective element with a continu on Aug . 23 , 2016 , provisional application No . 62 / 403 , ous and uninterrupted reflective surface surrounding a 273 , filed on Oct. 3 , 2016 , provisional application No . periphery of a LIDAR sensor in a light path of the LIDAR 62 /424 , 976 , filed on Nov. 21, 2016 . sensor. The reflective element is positioned at a distance offset from the periphery of the LIDAR sensor and directs Publication Classification light emitted by the LIDAR sensor to a second reflective ( 51 ) Int . Ci. element that is substantially similar in shape and size as the GOIS 7 / 481 ( 2006 .01 ) reflective element. -
V850E2S User's Manual: Architecture
User’s Manual User’s V850E2S 32 User’s Manual: Architecture RENESAS MCU V850E2S Microprocessor Core All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by Renesas Electronics Corp. without notice. Please review the latest information published by Renesas Electronics Corp. through various means, including the Renesas Electronics Corp. website (http://www.renesas.com). www.renesas.com Rev.1.00 May, 2014 Notice 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 2. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 3. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. 4. -
New Measurement Concepts for Internal ECU Signals Enable High
High-speed Measurements for Electric and Hybrid Vehicles New Measurement Concepts Enable High Data Rates and Frequent Sampling Times In the development of electric and hybrid vehicles, in particular, the requirements for instrumentation used to measure internal ECU signals are very high. Nonetheless, measurement data rates of up to 30 Mbyte/s and the necessary sampling rates of 100 kHz can be achieved with the latest generations of microcontrollers and an intelligent measuring instrumen- tation solution. The ECU’s CPU is not loaded here. The drives of electric or hybrid vehicles are generally con- pins and the POD is 10 cm. Communication between the trolled by pulse-width modulation (PWM) signals. The ad- measuring instrumentation module and the test PC is over vantage of PWM technology is that it incurs very low power XCP on Ethernet in accordance with the MCD-1 XCP stan- losses at power switches, because they only need to be dard from ASAM. The physical connection is made by a operated in two operating states: fully conducting or fully standard CAT-5 Ethernet cable. Essentially, two different blocking. The frequency of the PMW signals typically lies in measurement methods are distinguished: the “RAM copy the 10 – 20 kHz range, and in exceptional cases up to method” and the “data trace method.” They are presented 100 kHz. Maximum sampling rates of only 1 kHz are achiev- in this article, together with their advantages and disad- able for internal ECU signals when XCP – a widely used vantages, based on current microcontrollers and new standardized measurement and calibration protocol for ve- microcontrollers that will be available soon. -
Renesas Microprocessor RZ Family
RZ FAMILY Renesas Microprocessor www.renesas.com 2017.07 01-02 THE NEXT-GENERATION PROCESSOR TO MEET THE NEEDS OF THE SMART SOCIETY HAS ARRIVED. The utilization of intelligent technology is advancing in all aspects of our lives, including electric household appliances, industrial equipment, building management, power grids, and transportation. The cloud-connected “smart society” is coming ever closer to realization. Microcontrollers are now expected to provide powerful capabilities not available previously, such as high-performance and energy-efficient control combined with interoperation with IT networks, support for human-machine interfaces, and more. To meet the demands of this new age, Renesas has drawn on its unmatched expertise in microcontrollers to create the new RZ family of embedded processors. The lineup of these “next-generation processors that are as easy to use as conventional microcontrollers” spans four product series to meet different customer requirements. The Zenith of the Renesas micro As embedded processors to help build the next generation of advanced products, the RZ family offers features not available elsewhere and brings new value achine In M te to customer applications. n r a f a m c u e H ¢ RZ Family Roadmap RZ/G1H Cortex®-A15x4 (1.4GHz) Cortex®-A7x4(780MHz) G6400, H.264 32bit×2ch DDR3-1600 RZ/G1M Cortex®-A15x2 (1.5GHz) RZ/G-next SGX544MP2, H.264 (T.B.D) 32bit×2ch DDR3L-1600 RZ/G1N Cortex®-A15x2 (1.5GHz) ntr wo SGX544MP2, H.264 Co ol Net rk 32bit×1ch DDR3L-1600 RZ/G series 3D Graphics RZ/G1E RZ/G1C Cortex®-A7x2 (1.0GHz) Cortex®-A7x2 (1.0GHz) HMI MPU SGX540, H.264 SGX531, H.264 32bit×1ch DDR3-1333 32bit×1ch DDR3-1000 RZ/A1H RZ/A-next Cortex®-A9(400MHz) RZ/A1LU Cortex®-A9(400MHz) 10MB, WXGA, 2D RZ/A1M 3MB, XGA, JPEG RZ/A series Cortex®-A9(400MHz) for HMI Apps. -
V850e/Ms1 , V850e/Ms2
User’s Manual V850E/MS1TM, V850E/MS2TM 32-Bit Single-Chip Microcontrollers Architecture V850E/MS1: V850E/MS2: µPD703100 µPD703130 µPD703100A µPD703101 µPD703101A µPD703102 µPD703102A µPD70F3102 µPD70F3102A Document No. U12197EJ6V0UM00 (6th edition) Date Published November 2002 N CP(K) 1996 Printed in Japan [MEMO] 2 User’s Manual U12197EJ6V0UM NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. -
RTEMS Development Roadmap
OAR RTEMS Roadmap 2012 Joel Sherrill, Ph.D. OAR Corporation September 2012 OAR RTEMS in a Nutshell • RTEMS is an embedded real-time O/S – deterministic performance and resource usage • RTEMS is free software – no restrictions or obligations placed on fielded applications • Supports open standards like POSIX • Available for 15+ CPU families and 150+ BSPs • Training and support services available http://www.rtems.org 2 OAR RTEMS Applications BMW Superbike Avenger Curiosity Solar Dynamics Observatory ARTEMIS Galileo IOV DAWN MRO/Electra Milkymist Avenger Planck TECHNIC 1 LISA ST-5 Pathfinder Proba-2 Herschel http://www.rtems.org Images Credit: NASA and ESA 3 OAR Outline of Remainder • Community Driven Focus • Development Activities • Wish List for Future Improvements • Active Release Branch Updates • OAR Support Subscriptions & Legacy Releases • Conclusion http://www.rtems.org 4 OAR Community Driven Focus • Without users, project has no reason to exist! • Users drive requirements – Please let us know what you need • Users provide or fund many improvements – Again those reflect your requirements • Most bug reports are from users RTEMS Evolves to Meet Your Needs http://www.rtems.org 5 RTEMS Project Participation In OAR Student Programs • Google Summer of Code (2008-2012) – Almost 40 students over the five years • Google Code-In (2010-2011) – High school students did ~200 tasks for RTEMS – Included only twenty FOSS projects • ESA Summer of Code In Space (2011-2012) – Small program with only twenty FOSS projects involved http://www.rtems.org