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Bureau of Industry and Security, Commerce Pt. 748, Supp. 7

(C) The type of customs entry (warehouse merce for certification), U.S. International or consumption), entry number, and date of Import Certificates, and Delivery entry; and Verification Certificates, described in this (D) The number and date of the related supplement. (Applications the documents de- U.S. International Import Certificate. scribed in this supplement, are included (ii) BIS will, in applicable cases, notify the within the definition of export control docu- exporting government that a Delivery ments provided in part 772 of the EAR.) Refer Verification Certificate been issued. to § 764.3 of the EAR for more information. (c) Penalties and sanctions for violations. [61 FR 12812, Mar. 25, 1996, as amended at 61 The enforcement provisions of part 764 and FR 64285, Dec. 4, 1996; 62 FR 25463, May 9, Supplement No. 2 to part 736 of the EAR 1997; 73 FR 37, Jan. 2, 2008; 78 FR 13470, Feb. apply to transactions involving imports into 28, 2013] the U.S. covered by this supplement and to both foreign and U.S. parties involved in a SUPPLEMENT NO. 6 TO PART 748—AU- violation of this supplement. Any provisions THORITIES ISSUING IMPORT CERTIFI- of part 764 and Supplement No. 2 to part 736 of the EAR which, by their terms, relate to CATES UNDER THE FIREARMS CON- ‘‘exports’’ or ‘‘exports from the U.S.’’ are VENTION [RESERVED] also deemed to apply and extend to imports [Status of Convention as of April 13, 1999 had into the U.S., applications for U.S. Inter- not entered into force.] national Import Certificates (Forms BIS– 645P presented to U.S. Department of Com- [64 FR 17974, Apr. 13, 1999]

SUPPLEMENT NO. 7 TO PART 748—AUTHORIZATION VALIDATED END-USER (VEU): LIST OF VALIDATED END-USERS, RESPECTIVE ITEMS ELIGIBLE FOR EXPORT, REEXPORT AND TRANSFER, AND ELIGIBLE DESTINATIONS

FEDERAL REG- Country Validated end-user Eligible items (by ECCN) Eligible destination ISTER citation

Nothing in this Supplement shall be deemed to supersede other provisions in the EAR, including but not limited to § 748.15(c).

China (People’s Advanced Micro 3D002, 3D003, 3E001 (limited to AMD Technologies () Co., 75 FR 25763, Republic of). Devices China, ‘‘technology’’ for items classi- Ltd., No. 88, Su Tong Road, 5/10/10. Inc. fied under 3C002 and 3C004 , China 215021. 76 FR 2802, and ‘‘technology’’ for use dur- Advanced Micro Devices (Shang- 1/18/11. ing the International Tech- hai) Co., Ltd., Buildings 46, 47, 78 FR 3319, nology Roadmap for Semi- 48 & 49, River Front Harbor, 1/16/13. conductors (ITRS) process for Zhangjiang Hi-Tech Park, 1387 items classified under ECCNs Zhangdong Rd., , 3B001 and 3B002), 3E002 (lim- , China 201203. ited to ‘‘technology’’ for use AMD Technology Development during the ITRS process for () Co., Ltd., North and items classified under ECCNs South Buildings, 3B001 and 3B002), 3E003.e RaycomInfotech, Park Tower (limited to the ‘‘development’’ C, No. 2 Science Institute and ‘‘production’’ of integrated South Rd., Zhong Guan Cun, circuits for commercial applica- Haidian , Beijing, China tions), 4D001, 4D002 and 100190. 4E001 (limited to the ‘‘develop- AMD Products (China) Co. Ltd., ment’’ of products under ECCN North and South Buildings, 4A003). RaycomInfotech Park Tower C, No. 2 Science Institute South Rd., Zhong Guan Cun, Haidian District, Beijing, China 100190. Advanced Micro- 2B230, 3B001.c and 3B001.e Advanced Micro-Fabrication 78 FR 41293, Fabrication (items classified under ECCNs Equipment, Inc., China, 188 7/10/13. Equipment, Inc., 3B001.c and 3B001.e are lim- Taihua Road, Jinqiao Export China. ited to components and acces- Processing Zone (South Area), sories). Pudong, Shanghai 201201, China.

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FEDERAL REG- Country Validated end-user Eligible items (by ECCN) Eligible destination ISTER citation

Applied Materials These Items Authorized for those * Applied Materials South East 72 FR 59164, (China), Inc. Applied Materials Destinations Asia Pte. Ltd., Shanghai Depot, 10/19/07. Identified by one asterisk (*): c/o Shanghai Applied Materials 74 FR 19382, 2B006.b, 2B230, 2B350.g.3, Technical Service Center, No. 4/29/09. 2B350.i, 3B001.a, 3B001.b, 2667, Zuchongzhi Road, 75 FR 27185, 3B001.c, 3B001.e, 3B001.f, Shanghai, China 201203. 5/14/10. 3C001, 3C002, 3D002 (limited * Applied Materials South East 77 FR 10953, to ‘‘software’’ specially de- Asia Pte. Ltd., Beijing Depot, c/ 2/24/12. signed for the ‘‘use’’ of stored o Beijing Applied Materials program controlled items clas- Technical Service Center, No. sified under ECCN 3B001). 1 North Sheng Street, BDA, Beijing, China 100176. * Applied Materials South East Asia Pte. Ltd., Depot, c/o Sinotrans Jiangsu Fuchang Lo- gistics Co., Ltd., 1 Xi Road, Wuxi Export Processing Zone, Wuxi, Jiangsu, China 214028. Applied Materials South East Asia Pte. Ltd., Depot, c/ o Wuhan Optics Valley Import & Export Co., Ltd., No. 101 Guanggu Road, East Lake High-Tec Development Zone, Wuhan, , China 430074. Applied Materials (China), Inc., Shanghai Depot, No. 2667, Zuchongzhi Road, Shanghai, China 201203. * Applied Materials (China), Inc., Beijing Depot, No. 1 North Di Sheng Street, BDA, Beijing, China 100176. These Items Authorized for the ** Applied Materials (Xi’an) Ltd., Applied Materials Destination No. 28 Xin Xi Ave., Xi’an High Identified by two asterisks (**): Tech Park, Export Processing 2B006.b, 2B230, 2B350.g.3, Zone, Xi’an, , China 2B350.i, 3B001.a, 3B001.b, 710075. 3B001.c, 3B001.e, 3B001.f, 3C001, 3C002, 3D002 (limited to ‘‘software’’ specially de- signed for the ‘‘use’’ of stored program controlled items clas- sified under ECCN 3B001), and 3E001 (limited to ‘‘technology’’ according to the General Tech- nology Note for the ‘‘develop- ment’’ or ‘‘production’’ of items controlled by ECCN 3B001). Boeing 1B001.f, 1D001 (limited to ‘‘soft- Boeing Tianjin Composites Co. 72 FR 59164, Composites Co. ware’’ specially designed or Ltd., No. 4–388 Heibei Road, 10/19/07. Ltd. modified for the ‘‘use’’ of equip- Tanggu Tianjin, China. 74 FR 19382, ment controlled by 1B001.f), 4/29/09. 2B001.b.2 (limited to machine 77FR 10953, tools with accuracies no better 2/24/12. than (i.e., not less than) 13 mi- 77 FR 40258, crons), 2D001 (limited to ‘‘soft- 7/9/12. ware,’’ other than that con- trolled by 2D002, specially de- signed or modified for the ‘‘use’’ of equipment controlled by 2B001.b.2), and 2D002 (lim- ited to ‘‘software’’ for electronic devices, even when residing in an electronic device or system, enabling such devices or sys- tems to function as a ‘‘numer- ical control’’ unit, capable of co- ordinating simultaneously more than 4 axes for ‘‘contouring control’’ controlled by 2B001.b.2).

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FEDERAL REG- Country Validated end-user Eligible items (by ECCN) Eligible destination ISTER citation

CSMC Tech- 1C350.c.3, 1C350.c.11, 2B230.a, CSMC Technologies Fab 1 Co., 76 FR 2802, nologies Cor- 2B230.b, 2B350.f, 2B350.g, Ltd., 14 Liangxi Road, Wuxi, 1/18/11. poration. 2B350.h, 3B001.e. Jiangsu 214061, China. 76 FR 37634, 3B001.h (except for multilayer CSMC Technologies Fab 2 Co., 6/28/11. masks with a phase shift layer Ltd., 8 Xinzhou Rd. Wuxi Na- 77 FR 10953, designed to produce ‘‘space tional New Hi-Tech Industrial 2/24/12. qualified’’ semiconductor de- Development Zone, Wuxi, 78 FR 23472, vices), 3C002.a, and 3C004. Jiangsu 214028, China. 4/19/13. 78 FR 78 FR 32984, 6/3/ 13. Intel Semicon- These items authorized for the *Intel Semiconductor () 78 FR 54754, ductor (Dalian) Intel destination identified by Ltd., No. 109 Huai He Road 9–6–13. Ltd. one asterisk (*): East, Dalian Economic and 1A004, 1C006.d, 2A226, 2A292, Technology Development Area, 2B006.b, 2B230, 2B231, Dalian, Liao Ning , 2B350, 3A233.a, 3B001 (ex- 116600, China. cept for multilayer masks with a phase shift layer designed to produce ‘‘space qualified’’ semiconductor devices), 3C002, 3E002 (excluding de- velopment and production tech- nology specific to digital signal processors and digital array processors and further limited to ‘‘technology’’ based on the international technology road- map for semiconductors (ITRS)), and 4E001(limited to technology for computer prod- ucts or components not ex- ceeding an adjusted peak per- formance (APP) level of 12.0 weighted teraflops). These items authorized for the ** Intel Semiconductor (Dalian) Intel destination identified by Ltd., c/o Dalian Kintetsu Logis- two asterisks (**): tics Co., Ltd, Dayaowan Bond- 1A004, 1C006.d, 2A226, 2A292, ed Port No. 6 Road W4 Unit 2B006.b, 2B230, 2B231, A1, Dalian Economic and 2B350, 3A233.a, 3B001 (ex- Technology Development Area, cept for multilayer masks with a Dalian, Liao Ning Province, phase shift layer designed to 116601, China. produce ‘‘space qualified’’ semiconductor devices), and 3C002.

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FEDERAL REG- Country Validated end-user Eligible items (by ECCN) Eligible destination ISTER citation

Lam Research These Items Authorized for those * Lam Research International Sarl 75 FR 62462, Service Co., Ltd. Lam’s Destinations Identified (Lam Shanghai Warehouse), c/ 10/12/10. by a single asterisk (*): o HMG Supply Chain (Shang- 77 FR 10953, 2B230, 2B350.c, 2B350.d, hai) Co., Ltd., No. 3869, 2/24/12. 2B350.g, 2B350.h, 2B350.i, Longdong Avenue, Pudong 78 FR 3319, 3B001.c and 3B001.e (items New District, Shanghai, China 1/16/13. classified under ECCNs 201203. 78 FR 54752, 3B001.c and 3B001.e * Lam Research International Sarl 9/6/13. arelimited to ‘‘specially de- (Lam Shanghai Warehouse; 79 FR 71016, signed’’ components and ac- WGQ Bonded Warehouse), c/o 12/1/14. cessories), 3D001 (limited to HMG Supply Chain (Shanghai) ‘‘software’’ (excluding source Co., Ltd., No. 55, Fei la Road, code) ‘‘specially designed’’ for Waigaoqiao Free Zone, the ‘‘development’’ or ‘‘produc- Pudong New Area, Shanghai, tion’’ of equipment controlled China 200131. by ECCN 3B001), 3D002 (lim- * Lam Research International Sarl ited to ‘‘software’’ (excluding (Lam Beijing Warehouse), c/o source code) ‘‘specially de- Beijing Lam Electronics Tech signed’’ for the ‘‘use’’ of equip- Center, 1 Building, No. 28, ment controlled by ECCN Jinghai Second Road, BDA, 3B001), and 3E001 (limited to Beijing, China 100176. ‘‘technology’’ according to the * Lam Research International Sarl General Technology Note for (Wuxi EPZ Bonded Ware- the ‘‘development’’ of equip- house), c/o HMG WHL Logistic ment controlled by ECCN (Wuxi) Co., Ltd., 1st Fl, Area 4, 3B001). No. 1, Plot J3, No. 5 Gaolang East Road, Export Processing Zone, Wuxi, China 214028. * Lam Research International Sarl (Lam Beijing Warehouse), c/o HMG Hi-tech Logistics (Beijing) Co., Ltd., Building 3, No. 9 Ke Chuang Er Street, Beijing Eco- nomic Technological Develop- ment Area, Beijing, China 100176. * Lam Research International Sarl (Wuhan TSS), c/o HMG Wuhan Logistic Co., Ltd., 1st-2nd Floor, Area B, No. 5 Building, Hua Shi Er Road, East- lake Hi-Tech Development Zone, Wuhan, Hubei Province, China 430223. * Lam Research International Sarl (Lam Shanghai Warehouse Operator), c/o Shanghai Well- win Logistics Co., Ltd., No. 2667 Zuchongzhi Road, Pudong New District, Shang- hai, China. * Lam Research International Sarl (Lam Beijing Warehouse), c/o China International Electronic Service Company, 1 Building, No. 28, Jinghai Second Road, BDA, Beijing, China 100176. * Lam Research International Sarl (Lam Beijing Warehouse), c/o Beijing STE International Logis- tics Co., Ltd., Building 3, No. 9 Ke Chuang Er Street, Beijing Economic & Technological De- velopment Area, Beijing, China 100176. *Lam Research International Sarl (Lam Dalian Warehouse), c/o JD Logistics Dalian bonded lo- gistic Co., Ltd., No. 1 Public Warehouse, Dalian Bonded Lo- gistics Zone, Dalian, China 116600.

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FEDERAL REG- Country Validated end-user Eligible items (by ECCN) Eligible destination ISTER citation

*Lam Research International Sarl (Lam Xi’an Warehouse), c/o VR International Logistics (Xi’an) Co., Ltd., No. 28 Infor- mation Road, EPZ B Zone, Xian New District, Xian, China 710119. * Lam Research International Sarl (Wuxi Bonded Warehouse for CIQ inspection), c/o SinoTrans Jiangsu Fuchang Logistics Co., Ltd., No. 1 Xiqin Road, Area A, Export Processing Zone, New District, Wuxi, China 214028. These Items Authorized for those ** Lam Research Service Co., Lam’s Destinations Identified Ltd., 1st Floor, Area C, Hua by two asterisks (**): Science & Technology 2B230, 2B350.c, 2B350.d, Park, 177 Bi Bo Road, 2B350.g, 2B350.h, 2B350.i, Zhangjiang Hi-Tech Park, 3B001.c and 3B001.e (items Pudong, Shanghai, China classified under ECCNs 201203. 3B001.c and 3B001.e ** Lam Research Service Co., arelimited to ‘‘specially de- Ltd. Beijing Branch, 6th Floor, signed’’ components and ac- Building 52, No. 2, Jingyuan cessories), 3D001 (limited to North Street, Beijing Economic ‘‘software’’ (excluding source & Technological Development code) ‘‘specially designed’’ for Area, Beijing, China 100176. the ‘‘development’’ or ‘‘produc- ** Lam Research Service Co., tion’’ of equipment controlled Ltd., Wuxi Representative Of- by ECCN 3B001), fice, Room 302, Building 6, 3D002(limited to ‘‘software’’ International Park, (excluding source code) ‘‘spe- No. 89 Xing Chuang Si Road, cially designed’’for the ‘‘use’’ of Wuxi New District, Wuxi, equipment controlled by ECCN Jiangsu, China 214028. 3B001), and 3E001 (limited to ** Lam Research Service Co., ‘‘technology’’ according to the Ltd., Wuhan Representative Of- General Technology Note for fice, Room 302, Guanggu Soft- the ‘‘development’’ or ‘‘produc- ware Park, Building E4, No. 1 tion’’ (limited to those stages Guanshan Road, Donghu De- that support integration, assem- velopment Zone, Wuhan, Hubei bly (mounting), inspection, test- Province, China 430074. ing, and quality assurance) of ** Lam Research Service Co., equipment controlled by ECCN Ltd. (Lam Dalian Representa- 3B001). tive Office), c/o Intel Semicon- ductor (Dalian) Ltd., No. 109 Huaihe Road East, Dalian Eco- nomic & Technical Develop- ment Area, Dalian, China 116600. ** Lam Research Service (Shang- hai) Co., Ltd. Xi’an Branch, Room 602, Building G, Wangzuo Xiandai City, 35 Tangyan Road, Gaoxin District, Xi’an, China, 710065 Samsung China 1C350.c.3, 1C350.d.7, 2B230, Samsung China Semiconductor 78 FR 41291, Semiconductor 2B350.d.2, 2B350.g.3, Co. Ltd., No. 1999, North 7/10/13. Co. Ltd 2B350.i.3, 3A233, 3B001.a.1, Xiaohe Road, Xi’an, China 78 FR 69535, 3B001.b, 3B001.c, 3B001.e, 710119. 11/20/13. 3B001.f, 3B001.h, 3C002, 79 FR 30715, 3C004, 3D002, and 3E001 5/29/14. (limited to ‘‘technology’’ for items classified under 3C002 and 3C004 and ‘‘technology’’ for use consistent with the International Technology Road- map for Semiconductors proc- ess for items classified under ECCNs 3B001 and 3B002).

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FEDERAL REG- Country Validated end-user Eligible items (by ECCN) Eligible destination ISTER citation

Semiconductor 1C350.c.3, 1C350.d.7, 2B006.b.1, Semiconductor Manufacturing 72 FR 59164, Manufacturing 2B230, 2B350.d.2, 2B350.d.3, International (Shanghai) Cor- 10/19/07. International 2B350.g.3, 2B350.i.3, 3A233, poration, 18 Zhang Jiang Rd., 75 FR 67029, Corporation. 3B001.a, 3B001.b, 3B001.c, Pudong New Area, Shanghai, 11/1/10. 3B001.e, 3B001.f, 3C001, China 201203. 77 FR 10953, 3C002, 3C003, 3C004, 5B002, Semiconductor Manufacturing 2/24/12. and 5E002 (limited to ‘‘tech- International (Tianjin) Corpora- 78 FR 69535, nology’’ according to the Gen- tion, 19 Xing Hua Avenue, Xi 11/20/13. eral Technology Note for the Qing Economic Development 79 FR 30715, ‘‘production’’ of integrated cir- Area, Tianjin, China 300385. 5/29/14. cuits controlled by ECCN Semiconductor Manufacturing 79 FR 34222, 5A002 that have been classi- International (Beijing) Corpora- 6/16/14. fied by BIS as eligible for - tion, No. 18 Wen Chang Road, cense Exception ENC under Beijing Economic-Technological paragraph (b)(2) or (b)(3) of Development Area, Beijing, Section 740.17 of the EAR, or China 100176. classified by BIS as a mass Semiconductor Manufacturing market item under paragraph International () Cor- (b)(3) of Section 742.15 of the poration, Qier Road, Export EAR). Processing Zone, Pingshan New Area, Shenzhen, China 518118. Semiconductor Manufacturing (Beijing) Corpora- tion, No. 18 Wen Chang Road, Building 9, Beijing Economic- Technological Development Area, Beijing, China 100176. Shanghai Huahong 1C350.c.3, 1C350.d.7, 2B230, Shanghai Huahong Grace Semi- 78 FR 78 FR Grace Semicon- 2B350.d.2, 2B350.g.3, conductor Manufacturing Cor- 32984, 6/3/ ductor Manufac- 2B350.i.4, 3B001.a.1, 3B001.b, poration—HFab 2, 668 13. turing Corpora- 3B001.c, 3B001.e, 3B001.f, Guoshoujing Road, Zhangjiang tion. 3B001.h, 3C002, 3C004, Hi-Tech Park, Shanghai 5B002, and 5E002 (limited to 201203 China. production technology for inte- Shanghai Huahong Grace Semi- grated circuits controlled by conductor Manufacturing Cor- ECCNs 5A002 or 5A992 that poration—HFab 1, 1188 have been successfully re- Chuanqiao Road, Pudong, viewed under the encryption re- Shanghai 201206 China. view process specified in Sec- Shanghai Huahong Grace Semi- tions 740.17(b)(2) or conductor Manufacturing Cor- 740.17(b)(3) and 742.15 of the poration—GFab1, 1399 EAR). Zuchongzhi Road, Zhangjiang Hi-Tech Park, Shanghai 201203 China. SK hynix Semicon- 3B001.a, 3B001.b, 3B001.c, SK hynix Semiconductor (China) 75 FR 62462, ductor (China) 3B001.e, and 3B001.f. Ltd., Lot K7, Wuxi High-tech 10/12/10. Ltd. Zone, Comprehensive Bonded 77 FR Zone, Wuxi New District, 40258, 7/9/ Jiangsu Province, China 12. 78 FR 214028. 3319, 1/16/ 13. 78 FR 69537, 11/ 20/2013. SK hynix Semicon- 3B001.a, 3B001.b, 3B001.c, SK hynix Semiconductor (Wuxi) 75 FR 62462, ductor (Wuxi) Ltd. 3B001.e, and 3B001.f. Ltd., Lot K7–1, Wuxi High-tech 10/12/10. Zone, Comprehensive Bonded 77 FR Zone, Wuxi New District, 40258, 7/9/ Jiangsu Province, China 12. 78 FR 214028. 3319, 1/16/ 13. 78 FR 69537, 11/ 20/2013.

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FEDERAL REG- Country Validated end-user Eligible items (by ECCN) Eligible destination ISTER citation

India ...... GE India Industrial 1C002.a.1, 1C002.a.2, GE India Technology Centre Pri- 74 FR 31620, Pvt Ltd.. 1C002.b.1.a, 1C002.b.1.b, vate Limited (GEITC), No. 122, 7/2/09. 1E001, 2E003.f, 9E003.a.1, EPIP, Phase II, Hoodi Village, 74 FR 68147, 9E003.a.2, 9E003.a.4, Whitefield Road, Bangalore 12/23/09. 9E003.a.5, 9E003.a.6, 560066, Karnataka, India. 77 FR 10953, 9E003.a.8, and 9E003.c. Bangalore Engineering Center 2/24/12. (BEC), c/o GE India Tech- nology Centre Private Limited (GEITC), No. 122, EPIP, Phase II, Hoodi Village, Whitefield Road, Bangalore 560066, Karnataka, India.

[78 FR 32984, June 3, 2013, as amended at 78 FR 41293, July 10, 2013; 78 FR 54754, Sept. 6, 2013; 78 FR 69537, Nov. 20, 2013; 79 FR 30715, May 29, 2014; 79 FR 32626, June 5, 2014; 79 FR 34222, June 16, 2014; 79 FR 71016, Dec. 1, 2014]

SUPPLEMENT NO. 8 TO PART 748—INFOR- ECCN for all items, classified to the subpara- MATION REQUIRED IN REQUESTS FOR graph level, as appropriate; technical param- VALIDATED END-USER (VEU) AU- eters for the items including performance specifications; and end-use description for THORIZATION the items. If BIS has previously classified VEU authorization applicants must pro- the item, the Commodity Classification vide to BIS certain information about the Automated Tracking System (CCATS) num- prospective validated end-user. This infor- ber may be provided in lieu of the informa- mation must be included in requests for au- tion listed in the foregoing provisions of this thorization submitted by prospective vali- paragraph. dated end-users, or exporters or reexporters (4) Provide the physical address(es) of the location(s) where the item(s) will be used, if who seek to have certain entities approved this address is different from the address of as validated end-users. BIS may, in the the prospective validated end-user provided course of its evaluation, request additional in paragraph (1) of this supplement. information. (5) If the prospective validated end-user Required Information for Validated End-User plans to reexport or transfer the item, speci- Authorization Requests fy the destination to which the items will be reexported or transferred. (1) Name of proposed VEU candidates, in- (6) Specify how the prospective validated cluding all names under which the candidate end-user’s record keeping system will allow conducts business; complete company phys- compliance with the recordkeeping require- ical address (simply listing a post office box ments set forth in § 748.15(e) of the EAR. De- is insufficient); telephone number; fax num- scribe the system that is in place to ensure ber; e-mail address; company Web site (if compliance with VEU requirements. available); and name of individual who (7) Include an original statement on letter- should be contacted if BIS has any questions. head of the prospective validated end-user, If the entity submitting the application is signed and dated by a person who has author- different from the prospective validated end- ity to legally bind the prospective validated user identified in the application, this infor- end-user, certifying that the end-user will mation must be submitted for both entities. comply with all VEU requirements. This If the candidate has multiple locations, all statement must include acknowledgement physical addresses located in the eligible that the prospective end-user: destination must be listed. (i) Has been informed of and understands (2) Provide an overview of the structure, that the item(s) it may receive as a vali- ownership and business of the prospective dated end-user will have been exported in ac- validated end-user. Include a description of cordance with the EAR and that use or diver- the entity, including type of business activ- sion of such items contrary to the EAR is ity, ownership, subsidiaries, and joint-ven- prohibited; ture projects, as well as an overview of any (ii) Understands and will abide by all au- business activity or corporate relationship thorization VEU end-use restrictions, includ- that the entity has with either government ing the requirement that items received or military organizations. under authorization VEU will only be used (3) List the items proposed for VEU au- for civil end-uses and may not be used for thorization approval and their intended end- any activities described in part 744 of the uses. Include a description of the items; the EAR;

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