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ICEP2009 International Conference on Electronics Packaging April 14(Tue) -16(Thu), 2009 Kyoto International Conference Center, Kyoto, Japan

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ICEP2009 International Conference on Electronics Packaging April 14(Tue) -16(Thu), 2009 Kyoto International Conference Center, Kyoto, Japan Advanced Program ICEP2009 International Conference on Electronics Packaging April 14(Tue) -16(Thu), 2009 Kyoto International Conference Center, Kyoto, Japan The International Conference on Electronics and 45 technical sessions which include 17 core sessions that focus on Packaging (ICEP), of 2009 will be held from April recent trends and new areas of technology. The technical sessions 14th to April 16th at the Kyoto Kokusaikaikan, (the include more than 170 technical papers regarding packaging Kyoto International Conference Center), in Kyoto, technologies such as SiP/PoP, 3D packaging, and TSV/WLP, as well as Japan. Automotive Electronics concerns and information on Materials and University/Plant tours are planned to various Process issues. More than 20 student posters will also be presented. The places including RITSUMEIKAN University’s Micro-system Center conference promises to be a great event with something for everyone. and SR Center, as well as the TORAY Engineering Co., Ltd., Individuals who come to the conference will learn practical and (Equipment), SONY Mobile Display Corporation (LTPS; Low- profitable information and be able to participate in open discussions and Temperature Poly-Silicon), OMRON Corporation Electronic face-to face communication. Components Company Micro-devices (MEMS), and KYOCERA SLC We, the organization committee, are going to change the conference’s Technologies Corporation (PWB). These tours are planned on April focus to address what new paradigm shift is necessary in order to face 17th and are free of charge. Because the number of participants is current situations. We are looking forward to welcoming you to the limited, advanced registration is required. (early registration will be conference. given priority) Optional tours around Kyoto City are also available for a “Join us and let’s discuss JISSO together.”, “Let’s challenge for global reasonable fee. solutions.” and “Yes, we can!” The main focus of the ICEP2009 is “Collaboration”. The conference will focus on the collaboration between Science, Engineering and Technology as well as collaboration between other different technologies. Hideyuki Nishida The conference’s technical program will include three guest speakers ICEP2009 General Chairperson Kyoto International Conference Center Access Sponsored by: Karasuma Line “Kyoto sta.” to “Kokusaikaikan sta.” Japan Institute of Electronics Packaging (JIEP) about 20 minutes. IEEE CPMT Society Japan Chapter From the 4th exit, 5 minutes on foot. Contact: Secretariat of ICEP 2009 JIEP, 3-12-2 Nishiogi-kita, Suginami-ku Tokyo 167-0042, Japan http://www.jiep.or.jp/icep/ April 14 ICEP2009 Advanced Program Room A Room B1 Room B2 Room K 09:00 [14K-1] Energy / Environment 1. The IP Landscape for Photovoltaics C.E.Bauer, R.A.Fillion, H.J.Neuhaus (TechLead) (10:00) (10:00) (10:00) /USA [14A-1] High Performance Flip-Chip [14B1-1] Embedded Substrate Ⅰ [14B2-1] Optoelectronics Ⅰ 2. Developing Direct Methanol Fuel Cell from Packaging 1. WLP-IC Embedded Multi-layer Polyimide Wiring 1. Adaptive Quad 10-Gbps Optical I/O Module for Basic Research Results; Process View 1. Packaging Technologies for High Performance Board Power-Minimized Interconnection A.Suominen1, R.Jokinen2, M.Fonsell2, Computing System (Session Invite) S.Okude (Fujikura)/Japan R.Kuribayashi, I.Hatakeyama, D.Inami, T.Hino, A.Tuominen1 (1University of Turku, 2Turku J.Inasaka (NEC)/Japan T.Sugimoto, K.Kurata (NEC)/Japan University of Applied Sciences) /Finland 2. Development of Embedded Passive / Active 2. Spatial/Transient Thermal Resistance for High Devices Technology for Simultaneous Pressing 2. Low-Loss, Chip-Based Optical Interconnects on 3. Developing Direct Methanol Fuel Cell from Performance FC Packages (Session Invite) Process Waveguide-Integrated SLC Basic Research Results; Technical Aspects 1 1 1 2 2 1 2 K.Yazawa (SONY)/Japan H.Kamiya (DENSO)/Japan S.Nakagawa , H.Numata , Y.Taira , K.Kobayashi , R.Jokinen , A.Suominen , M.Fonsell , K.Terada2, M.Fukui2 (1IBM, 2Kyocera SLC A.Tuominen1, (1University of Turku, 2Turku 3. Facing Issues for Next Generation High Density 3. IMB Technology for Embedded Active and Technologies)/Japan, University of Applied Sciences)/Finland Passive Components in SiP, SiB and Single IC Build Up Package Fabrication and the 3. Embedded Micromirror Fabricated by Using 4. Innovative Jisso Structure by Skeleton Circuit Package Applications Alternative Solutions (Session Invite) Liquid Immersion Exposure for Thin Film Optical Structure S.Koyama (Shinko Electric Industries)/Japan R.Tuominen, T.Waris, J.Mettovaara (Imbera H.Hayashi (The University of Tokyo) /Japan Electronics)/Finland Interconnects K.Shimizu, T.Muranishi, J.Inoue, K.Nishio, (10:40) 4. Power Integrity Optimization for a High- K.Kintaka, Y.Awatsuji, S.Ura (Kyoto Institute of performance Microprocessor in Low-cost Technology)/Japan (10:50) Systems [14K-2] Lead Free / Environment 11:15 S.Suminaga, H.Mori, T.Nishio (IBM Japan) /Japan 1. Effect of Mn Addition on Properties of Sn-Ag- Cu-In Quaternary Lead-free Solder Alloy 11:25 (11:40) [14B1-2] Embedded Substrate Ⅱ [14B2-2] Optoelectronics Ⅱ A.-M.Yu1, J.-K.Kim1, J.-H.Lee2, M.-S.Kim3 (1Korea 1. Feasibility Study of Designing RF Band-pass 1. Multimode Polymer Optical Waveguide with Institute of Industrial Technology, 2Seoul National Filters Using Embedded Passives Technique Graded-Index Rectangular Cores for Optical University of Technology, 3Inha University)/Korea on Organic Substrate Printed Circuit Broad K.-C.Chin (Industrial Technology Research T.Kosugi (Keio University)/Japan 2. Inhibition of Cracking in Cu6Sn5 Intermetallic Institute)/Taiwan Compounds at Sn-Cu Lead-Free Solders and 2. Reflowable Surface Mount Optical Encoder Cu Substrate Interfaces 1 2 1 2. Experimental Study of High Speed J.Hane, Y.Kuroda, H.Fujita, T.Ito, I.Komazaki, K.Nogita , S.Suenaga , S.D.McDonald , 1 1 2 1 Transmission Performance of Substrate with E.Yamamoto (Olympus)/Japan H.Tsukamoto , J.Read , T.Nishimura ( The 2 Embedded Active Device University of Queensland, Nihon Superior) M.Tanaka (Dai Nippon Printing)/Japan 3. Reliability Improvement of Optical Devices by /Australia, Japan Using Newly Developed Highly Moisture 3. Impact Strength of Sn-Cu (-Ni) Lead-Free Solder 3. Fabrication of Thin-Film Capacitors Using Durable Optical Adhesives Ball Grid Arrays Placed on Cu Substrates Aerosol CVD for High Performance Ceramic S.Mitachi (Tokyo University of Technology) H.Tsukamoto1, T.Nishimura2, S.Suenaga2, Package Applications /Japan S.D.McDonald1, J.Read1, K. Nogita1 (1The S.Wang, A.Hattori, Y.Ozeki, W.Zhang, H.Ogawa University of Queensland, 2Nihon Superior) (Noda Screen)/Japan /Australia, Japan 4. Microstructure and Mechnical Properties of Sn- Bi Eutectic Solder S.Sakuyama (Fujitsu Laboratories)/Japan (12:30) 12:40 12:40 Lunch time Lunch time Lunch time Lunch time Poster Session Poster Session Poster Session Poster Session 13:40 Japanese Noh Drama (Room A) 13:55 Welcome Ceremony & Awarding Ceremony ICEP2008 14:25 (Room A) 14:25 Invited Speeches (Room A) 1. Packaging Technology Roadmap - An IBM Perspective Peter Brofman (IBM) 2. Memory Packaging Strategy with Sophisticated Technology Takayuki Watanabe (Akita Elpida Memory) 3. Photovoltaic as An Energy Solution Tetsuroh Muramatsu (Sharp) 17:35 18:00 Welcome Reception (Banquet Hall “Swan”) 20:00 April 15 ICEP2009 Advanced Program Room A Room B1 Room B2 Room K 09:00 [15A-1] Advanced Packaging Ⅰ [15B1-1] Embedded Substrate Ⅲ [15B2-1] Interconnections Ⅰ [15K-1] Electrical Solutions Ⅰ 1. A Reliability Test on PBGA Packaging Through 1. Novel Approach in Design and Test of 1. Effect of the Formation of the Intermetallic 1. Effects of Uni-axial Mechanical Stress on the Piezoresistive Stress Sensor Embedded Capacitors in Organic-based Commpounds between a Tin Bump and an Scattering Parameters of Metal-oxide- C.H.Liu1, H.Chung1, D.W.Yang1, K.F.Tseng2, Substrate for Highly Compact RF Systems-in- Electroplated Copper Thin Film on Both semiconductor Field Effect Transistors B.J.Lwo1 (1National Defense University, 2Chin- Package Devices Mechanical and Electrical Properties of the Y.Han1, M.Koganemaru2, T.Ikeda3, N.Miyazaki3, Min Institute of Technology)/Taiwan C.Romero, J.Lim, Y.H.Yoon, T.Kim, S.Yi Jointed Structures Y.Kiyotaka4, W.Choi4, H.Tomokage4 (1Fukuoka (Samsung Electro Mechanics)/Korea S.Jeong, K.Suzuki, H.Miura (Tohoku University) Industry Science & Technology Foundation, 2. Evaluation of the Effect of Packaging Process /Japan 2Fukuoka Industrial Technology Center, 3Kyoto Parameters on Semiconductor Devices with 2. Electrodeposition of High-k Titania Thin Films University, 4Fukuoka University)/Japan Low-k Conductive Layers for Embedded Capacitors 2. Comparison of Thermal Fatigue Life of SAC 1 2 1 T. Yamada , M.Masumoto , O.Horiuchi , B.K.Roy, J.Cho (State University of New York Solder Joints and SnPb Solder Joints with 2. Bandwidth Simulation for High Speed Memory 2 1 H.Tomokage ( Fukuoka Industry, Science & Binghamton)/USA Various Stress Ranges C.-P.Chen, J.-H.Cheng, W.-J.Fan, N.-C.Lin, 2 Technology Foundation, Fukuoka S.W.R.Lee, C.Yang, Y.S.Chan (Hong Kong University T.-F.Su (Powertech Technology)/Taiwan University)/Japan 3. The Nanotransfer Technology of the PZT of Science and Technology)/Hong Kong 3. The Solder Blister Control for Lead Frame Capacitor for the Application of Embedded 3. Thermomigration in Eutectic SnPb Solder Joint 3. Preliminary Study and Design of CMOS Diode Packages Substrate Y.Tao1, Q.Cheng1, G,-R.Tang1, B.Wang1, B.An1, for Electrostatic Discharge Protection J.W.Chen1, S.Lee1, B.Appelt2, A.Tseng2 S.Makino, M.Ichiki, R.Maeda, T.Suga (The F.-S.Wu1, Y.-P.Wu1,2 (1Huazhong University of N.F.Muhammad, A.Ibrahim, A.R.Ahmad, (1Advanced Semiconductor Enginrrring, University of Tokyo, AIST, JST-CREST)/Japan Science and Technology, 2Wuhan National M.R.Yahya (Telekom Research & Development) 2ASE(US))/Taiwan, USA (10:15) Laboratory for Optoelectronics)/China /Malaysia 4. First Generation of Stretchable No-Light (10:25) 4. Concave Shape in Gold-Solder Interconnection 4Electrical Characterization of Micro Spring Emitting Display Based on Stretchable [15B1-2] LED System Probe Card for Wafer Level Testing Electronic Technologies for Textile Application 1.
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