ICEP2009 International Conference on Electronics Packaging April 14(Tue) -16(Thu), 2009 Kyoto International Conference Center, Kyoto, Japan
Advanced Program ICEP2009 International Conference on Electronics Packaging April 14(Tue) -16(Thu), 2009 Kyoto International Conference Center, Kyoto, Japan The International Conference on Electronics and 45 technical sessions which include 17 core sessions that focus on Packaging (ICEP), of 2009 will be held from April recent trends and new areas of technology. The technical sessions 14th to April 16th at the Kyoto Kokusaikaikan, (the include more than 170 technical papers regarding packaging Kyoto International Conference Center), in Kyoto, technologies such as SiP/PoP, 3D packaging, and TSV/WLP, as well as Japan. Automotive Electronics concerns and information on Materials and University/Plant tours are planned to various Process issues. More than 20 student posters will also be presented. The places including RITSUMEIKAN University’s Micro-system Center conference promises to be a great event with something for everyone. and SR Center, as well as the TORAY Engineering Co., Ltd., Individuals who come to the conference will learn practical and (Equipment), SONY Mobile Display Corporation (LTPS; Low- profitable information and be able to participate in open discussions and Temperature Poly-Silicon), OMRON Corporation Electronic face-to face communication. Components Company Micro-devices (MEMS), and KYOCERA SLC We, the organization committee, are going to change the conference’s Technologies Corporation (PWB). These tours are planned on April focus to address what new paradigm shift is necessary in order to face 17th and are free of charge. Because the number of participants is current situations. We are looking forward to welcoming you to the limited, advanced registration is required. (early registration will be conference.
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