www.ieiworld.com 1 Warehouse Management ● Warehouse ● Multimedia Control Center ● Order Entry PDA Information System ● Vehicle ● Diagnostics Mobile ■ United States United Corp. USA IEI Technology 91768 Pomona, CA 138 University Parkway, http://www.usa.ieiworld.com ● Information Security ● Network Storage ● Building Security Control ● Blade Servers Security Headquarters Corp. IEI Technology No. 29, Zhongxing Rd., Xizhi Dist., City 221, Taiwan New Taipei http://www.ieiworld.com ■ ● Kiosk ● Digital Signage ● Outdoor Displays Infotainment ■ About IEI-2013-V10 ● Image Processing ● Instrumentation Processors ● Database Servers ● Diagnostics Medical ■ China IEI Technology (Shanghai) Co., Ltd. IEI Technology 515, Shen Fu Rd., Xin Zuang Industrial China Develop Zone, Shanghai, 201108, http://www.ieiworld.com.cn

● Police and Security ● Guidance & Control Systems ● Communications Control ● Fire Control

Military ■ ● Factory Automation ● Guidance & Control Systems ● Communications Control ● Environmental Monitoring Automation IEI and IEI Worldwide and IEI IEI

■ IEI Product Applications IEI Technology Corp., a leading industrial computing service provider, integrates computing platforms and customization services. IEI supplies IEI services. platforms and customization integrates computing service provider, industrial computing Corp., a leading Technology IEI OEM/ODM supporting to addition in applications, customer various for peripherals and systems boards, computer industrial of hundreds their market advance beyond IEI helps customers product development, time and accelerating design reducing customers’ services. By more and over 400 products passing through management quality assurance system, team, effective has an innovative R&D competition. IEI time-to-market services all over the world. order to provide customers with the fastest than 100 distributors in About IEI-2013-V10

IEI Quality Assurance

Best-in-Class Design and Service and Design Best-in-Class ● Mobile PCs for police car video recording applications services ● Networking platforms for VPN and load balance capture for surveillance applications ● Video Design Global service

Custom engineering Custom 1. All IEI embedded industrial products have been rigorously tested in the quality assurance and has mind, IEI the customer with peace of provide To headquarters. IEI compliance laboratory at quality assurance and compliance the invested over two million dollars into developing of state compliance and assurance quality different ten through put are products IEI facilities. testing harsh operational ensure our embedded to industrial products can withstand a variety of tests environments. assurance and compliance testing comprehensive quality our of benefits customer Direct procedures include: ● High quality products and customer peace of mind ● Maximum product durability ● Long term product reliability ● Less downtime due to failed components ■ IEI's R&D team has years of experience in designing and developing professional software, hardware, mechanical and system integration. Our and field IPC line in the product every nearly covers experience extensive guarantee a services. We enables us to provide outstanding OEM/ODM and research The experience. development successful and timely product our to products successful bringing on focused is IEI at team development clients. Successful projects include: ■ in distributors 100 over of network global a has IEI worldwide. customers to services localized prompt, offers IEI provider, IPC leading a As America to provide service and achieve quick response fast inquiries time. From new sales to ongoing technical support, Asia and North Europe, localization is backed by our strong technical and logisticalIEI's strategy forged strong relationships support team. Having with our distributors, their support expertise and technical knowledge of IEI products are readily accessible customers to IEI worldwide. has IEI warehouses in services and global logistics support. hardware, software, customer-driven comprehensive system integration which offer Shanghai and the US ■ IEI has extended its system assembly line to provide solutions needs.that Ourbest assemblyfit lines customers’ and logistics services have the variety of customer specifications and requirements. flexibility to fulfill a wide through global management and provide the highest quality service devote themselvesto staffs all IEI industry, the IPC Being the top brand in advanced technology.

www.ieiworld.com 2 www.ieiworld.com 3 NIPPON Neo Thermo TVS-700 Vibration Testing Vibration Safety Testing Power Consumption Testing PCIE-Q670 heatsink A heat A sink's contact area must be perfectly flat. thinner a of use the allows area contact flat A layer of thermal compound that reduces the and thermal resistance between the heat sink the heat source. IEI heat sinks are designed for efficient thermal transfer from the heat source to the fins. IEI new close flatness technology Perfect flatness of the contact area with Perfect flatness of the contact area with ESD Testing ESD Testing 2. 4. Good thermal transfer within the Thermal Testing 20mm Better temperature control guarantees more Better temperature control in the long run. reliable system operation IEI P/N:34000-000357-RS WAFER-PV-D5251 Drop Testing Temperature Testing Temperature About IEI-2013-V10 IP IP 65 Testing WAFER-OT-Z650 For good thermal transfer, the pressure the pressure For good thermal transfer, between the heat sink and the heat source provide clips sink heat IEI be high. must increased pressure at the heat sink's contact area and are easy to install. IEI heat sinks allow air to flow easily and rapidly through the cooler and reach all the cooling fins.This feature is important for heat sinks with many thin fins. 3. Good mounting method 1. Good aerodynamics KINO-QM670

All New HeatDesign All New Sink Reliability Always Matters Reliability Thermal Testing

IEI features Heat sink Testing results Testing ■

4. Comprehensive quality assurance tests are performed on all IEI products throughout the product development the in initiated are tests assurance Quality cycle. research and development phase of a product and continued all the way to the manufacturing phase. product the throughout testing assurance Quality are products IEI that ensures cycle development industrial the in performance stable provide to able environments they are used. 3. IEI SBCs operate with minimum difference in surface temperatures on in surface temperatures minimum IEI SBCs operate with difference separate sections of the board. Better temperature control guarantees system operation. more reliable long term ■ 2. Infrared thermography detects infrared energy emitted from an object, converts distribution. an image of the temperature and displays it in to a temperature, Heat sink design and selection are critical. Heat sink performance depends on many variables including air resistance contact board, the other heat conduction paths through components and the strength of the heat sink, the of immediate vicinity the temperature and air flow rate in a cooler surface, among other things. and the radiation path from the heat sink to is attached to between the heat sink and the component it Heat sinks can also have a significant effect on electromagneticA heat fields. sink that works well in one application may be virtually useless in another.

COM VGA www.ieiworld.com 1 x One Key Recovery CD 1 x Enclosure heatsink 1 x Mini jumper pack 1 x Utility CD 1 x QIG 2 x PCIe Mini slots Dual PCIe GbE 2 x USB Description VGA/dual DDR3, D2550 1.86GHz, Atom™ ® with SBC 3.5” Audio, RoHS 3Gb/s, dual GbE, USB 2.0, SATA LVDS, Atom™ N2600 1.6 GHz, DDR3, VGA/dual 3.5” SBC with Intel® Audio, RoHS 3Gb/s, dual GbE, USB 2.0, SATA LVDS, Atom™ N2800 1.86GHz, DDR3, VGA/ 3.5" SBC with Intel® Audio, RoHS (by 3Gb/s, dual GbE, USB 2.0, SATA dual LVDS, project support, MOQ 100pcs / lot) Dual-port USB cable RS-422/485 cable, 200mm (Unit: mm) Solder Side D2550/N2600 3.5” SBC with Intel® D2550/N2600 Atom™ Processor, DDR3, VGA/Dual Dual LVDS, GbE, 3Gb/s, USB 2.0, SATA RoHS and Audio Power input NM10 (1.35V) memory DDR3 800/1066 MHz 1. 3.5” form factor with Intel® Atom™ D2550/N2600 dual-core processor supporting DDR3/DDR3L Atom™ D2550/N2600 dual-core processor supporting DDR3/DDR3L 1. 3.5” form factor with Intel® power AT/ATX 2. 12V only single voltage design for 3. Open frame heatsink thermal design for fanless solutions with dual display support 4. Flexible VGA, 18/24-bit LVDS four COM and audio 3Gb/s, one mSATA, 5. Complete I/O: six USB, two SATA 6. IEI One Key Recovery solution allows you to create rapid OS backup and recovery 1 x WAFER-CV-D25501/N26001 single board computer 1 x WAFER-CV-D25501/N26001 (P/N: 32801-000201-100-RS) with 5V output cable 2 x SATA 1 x RS-232 cable (P/N: 32205-002700-100-RS) Audio cable (P/N: 32000-072100-RS) 1 x 1 x KB/MS cable (P/N: 32000-023800-RS) 1 x Power cable (P/N: 32100-087100-RS) 1 x Screw set for PCIe Mini card Part No. WAFER-CV-D25501-R10 WAFER-CV-N26001-R10 WAFER-CV-N28001-R10 32001-008600-100-RS 32205-003800-100-RS Ordering Information Packing List Features Dimensions

4 x USB 5V SATA power 3Gb/s 2 x SATA 5V SATA power KB/MS mSATA

RS-422/485 GbE D25501 N26001 Embedded Board Audio I/F WAFER-CV-D25501/N26001-2013-V10 2 x RS-232 EMI / RF Chamber DIO

Inverter2

SATA 3Gb/s SATA LVDS1

LVDS2

Hi-Speed USB USB 1 x 6-pin wafer for PS/2 KB/MS 3Gb/s with 5V power connector 2 x SATA CERTIFIED

Inverter1

Dual DDR3 1.35V Display Single-channel 18-bit LVDS by N2600, resolution support up to 1366x768 @60Hz Single-channel 18-bit LVDS resolution converter, to LVDS DP supports 24-bit dual-channel by CH7511B LVDS2 support up to 1920x1200 for D2550, 1600x1200 for N2600/N2800 5% ~ 95%, non-condensing Intel® dual core Atom™ D2550 1.86GHz processor Intel® dual core Atom™ N2600 1.6GHz processor Intel® dual core Atom™ N2800 1.86GHz processor (optional) Intel® dual core Intel® NM10 UEFI BIOS 1 x 1066MHz DDR3 SO-DIMM supporting up to 4GB (for D2550 and N2800) 1 x 800MHz DDR3 SO-DIMM supporting up to 2GB (for N2600) 3650 at 640MHz graphics core speed (for N2550 and N2800) GMA 3600 at 400MHz graphics core speed (for N2600) GMA Dual display supported (up to 1920 x 1200 @60Hz) 1 x VGA connector may not driver limitation, the monitor connected to the VGA (Due to Intel GMA have signal to it or become extended desktop after restarting from the graphics driver solve this problem, press the Ctrl+Alt+F1 hotkey to switch the primary To installation. mode.) screen to CRT integrated in the D2550/N2600 LVDS1 by D2550, resolution support up to 1440x900 @60Hz Single-channel 24-bit LVDS controllers Dual GbE by Realtek RTL8111E 1 x RS-422/485 3 x RS-232 6 x USB 2.0 Fintek F81866 8-bit digital I/O (4-bit input, 4-bit output) SSD storage 1 x Full-size PCIe Mini card slot supporting mSATA 1 x Half-size PCIe Mini card slot ALC662 HD audio codec Realtek Software programmable supports 1~255 sec. system reset support AT/ATX 12V only, 1 x 3-pin CPU fan connector 1 x 3-pin system fan connector -20°C ~ 70°C with force air for D2550 processor -20°C ~ 60°C with free air, -20°C ~ 75°C with force air for N2600/N2800 processor -20°C ~ 70°C with free air, [email protected] (Intel® D2550 1.86GHz CPU with 1GB DDR3 1066MHz memory) [email protected] (Intel® N2600 1.6GHz CPU with 1GB DDR3 1066MHz memory) [email protected] Operating Humidity 250g 600g/NW: GW: Weight: CPU Chipset BIOS Memory Graphics Display Output Ethernet I/O Interfaces Super IO Digital I/O Expansions Audio Timer Watchdog Power Supply Fan Connector (smart fan support) Power Consumption Operating Temperature Fanless WA FER- CV- Atom™ Dual Core 12V DC input Specifications Single Board Computer [email protected] (Intel® D2550 1.86GHz CPU with 1GB DDR3 1066MHz memory) (Intel® D2550 1.86GHz [email protected] [email protected] (Intel® N2600 1.6GHz CPU with 1GB DDR3 1066MHz memory) (Intel® N2600 1.6GHz [email protected] Power Consumption ● Metal sheet punch, laser cutting, folding and welding ● Liquid painting Semi-anechoic Room About IEI-2013-V10 A Unit 32 402 9.0b Score DirectX Color Pixel Windows® 7 3D Mark 2001 Install OS: 256M (+12V) 10minutes in 25°C EMI Chamber GMA 3650 GMA 1920 x 1200 1.53A

Flexibility Customization ServiceFlexibility Product Compliance Testing Product Compliance Real-Time Power Consumption Test Consumption Power Real-Time

VGA Type VGA

Resolution Ampere VGA Memory VGA Test Sample Test Meeting stringent power budgets is essential for attaining system performance and cost goals. Low power enables higher clock frequency, higher clock frequency, Low power enables goals. cost performance and system attaining for is essential power budgets Meeting stringent Complete tests. consumption power have passed strict products All IEI costs. reduced operational noise margins and better higher reliability, on the product datasheets. details are listed power consumption

● Sheet metal shell manufacturing ● Sheet metal component processing 7.

6. develop time-to-market products applications order to 400 products used in a wide variety of and environments worldwide. has more than In IEI that comply with safety, EMC certification and environmental directives acrossthe globe,IEI hasthree 3745 and semi-anechoic new IEC 651 class 0 level semi-anechoic EMI chamber and room can perform ISO room. IEI's an EMI/RF chamber, certification-compliant labs including and are essential to help ensure the safety of our products as well as reducing costs These labs ISO 7779 standard acoustics experiments. improving the quality of our products and services. 5.

www.ieiworld.com 4 www.ieiworld.com 5 Q7 iQ7- US15W Q7 PM- PM- 945GSE PC 104 PV-D5251

New Products in Red CPU Module COM ICE-QM871 Express ICE-QM770 ICE-GM45A ICE-945GSE PM-LX ICE-PV-D5251 PC 104 ICE-CV-D25501 ICE-CV-D25502 PM-LX2 IQ7-xxx PM-xxxx ICE-xxxx IEM-xxxx IMB-xxxx WSB-xxxx IMBA-xxxx KINO-xxxx IOWA-xxxx IOWA-xxxx NOVA-xxxx PCISA-xxxx PICOe-xxxx ROCKY-xxxx WAFER-xxxx IEM- Product Name Product ETX 945GSE EPIC NANO-xxxx EPIC Q7

iQ7-DB-MITX PCIE-xxxx (Graphic Grade) (Graphic PCIE-xxxx SPCIE-xxxx (Server Grade) (Server SPCIE-xxxx WAFER- COM Express COM 945GSELVDS2 WAFER-945GSE 3.5” WAFER 3.5” WAFER-OT-Z650 WAFER-945GSE2 WAFER-PV-D5251 WAFER-PV-D5252 WAFER-PV-D5253 WAFER-CV-D25501 WAFER-NM701-847 WAFER-CV-D25502

ETX IEM-LX NANO-9452 NANO-HM651 NANO-HM650 NANO-QM871 NANO-QM770 NANO-QM57A NANO-945GSE EPIC NANO NANO-945GSE2 NANO-PV-D5251 NANO-PV-D5252 NANO-CV-D25501 NANO-CV-D25502

Embedded Board Embedded WAFER-LX NOVA-HM551 WAFER-LX2 NOVA-945GSE 3.5” WAFER 3.5” 5.25” NOVA 5.25” NOVA-PV-D5251

Pure-ISA PCIISA + PCIISA +

PCIPCI-E + PCIPCI-E +

Type 2, 6 andType Type 10 Type Mini ITXMini KINO-G410 KINO-AH611 KINO-AH612 KINO-AQ670 KINO-DH610 KINO-AQ870 KINO-HM551 KINO-QM670 KINO-QM770 KINO-QM57A KINO-945GSE KINO-DQM871 NANO-LX eKINO-945GSE KINO-PV-D5252 KINO-PV-D5253 KINO-CV-D25501 KINO-PVN-D5251 KINO-CVR-D25502 EPIC NANO ETX 2.8 Non-SATA, ETX 3.0 SATA ATX Micro Micro IMB-H610 IMB-Q670 IMB-G41A IMB-Q770 IMB-Q354 IMB-C2160 IMB-C2060

COM Express COM Specifications 5.25” NOVA 5.25” Main Board Main ATX IMBA-9454 IMBA-H610 IMBA-G410 IMBA-Q670 IMBA-Q454 IMBA-Q770 IMBA-C2060 IMBA-C2160 IMBA-XQ354 IMBA-C604EP IMBA-C604EN IMBA-G412ISA ICE-DB-T6R / ICE-DB-T6 / ICE-DB-9S About IEI-2013-V10 EATX Board Server Server Mini ITXMini ISA 3.5" ATX ETX EPIC 5.25" Qseven Mini-ITX Micro ATX PCI PICMG 1.0 PICMG 1.3 PICMG Com Express Com PC104/PCI 104 Main Board Main PCI/ISA PCISA-9652 PCISA-945GSE PCISA-PV-D5251 Half-Size PCI/ ISA IOWA-LX PICOe-B650 Half-Size PICOe-HM650 PICOe-GM45A PICOe-945GSE PCIExpress PICOe-PV-D5251 WSB-9454 WSB-H610 WSB-G41A WSB-Q354 ETX WSB-945GSE PICMG 1.0 WSB-PV-D5251 IEM-DB-7S Full Size Full Full Size Full PCIE-H610 PCIE-Q670 PCIE-Q350 PCIE-Q57A PCIE-G41A2 SPCIE-C2160 SPCIE-C2060 PICMG 1.3 SPCIE-5100DX Product Line Product Motherboard Full-Size SBC Half-Size SBC Embedded SBC Embedded H61 B65 Q77 Q57 Q87 Q35 Q67 Q45 G41/

G45/ ICH7 LX C216 C206 C604 Z650/ NM10 SM35 NM70 N270/ HM55 D525/ HM65 QM77 QM57 QM87 QM67 945G/ 945G/ ICH10 5100P GM45/ GM45/ ICH7M ICH8M ICH9M D2550/ US15W ICH7(R) Chipset 945GSE ICH8M-E (ICH10R) GME965/ 945GME/ 945GME/ Total Platform Solutions Total Chipset

Server Desktop Mobile Atom Segment AMD Solutions Base Board Solutions

Intel® Solutions Intel® even main chipset platform, or form factor, needs. Customers can easily select products by Innovation fulfills many different Meet market demands with our large selection of products. provider. IEI SBC Products Products IEI SBC VGA No VGA PCI Express (Gen 2) added to : DDR3L DDR3L DT/WS ● DDR3/[email protected][email protected] MBL ● ECC options LAN Intel® FDI PCH: Q87, QM87 2C None No ECC usages ULT (on MCP) ULT (8-Series ULT) BGA 1166 (MCP) 1166 BGA DDR3L up to 1600 DDR3L DMI ULT: 15W (CPU+PCH) ULT: Connected Capabilities Up to 4M, Unified cache ULT DX11.1, OCL1.2, OGL 3.2 OCL1.2, OGL DX11.1, Flex I/O (USB/ PCIe/ SATA) Up to GT3 4th Gen. 2 Core Processor Graphics GT1, GT2, GT3 4th Generation 1-Chip Platform LVDS & Legacy PCI Removed, LVDS 4th Gen Intel® Core™ Processor Enhanced Connectivity Delivering new Flexible I/O (USB/SATA/PCIe) Intel® Wireless and Gbe solutions Digital Display Supporting additional TDP options on Embedded options on Embedded TDP Supporting additional mobile H-Series New low power Desktop SKUs (35/45W) long life roadmap (ECC option) Power & Efficiency Platform with 15W "CPU+PCH" New U-Series (ULT) for Power efficient TDP SATA (Gen3) SATA PCI Express (Gen 3) USB 3.0/ USB 2.0 up to 1600 BIOS/ DDR3L (MB) DDR3L (MB) DDR3L DDR3/L (DT) DDR3/L (DT) DDR3/L up to 1600 [email protected] 4C, 2C TA/USB) on PCH TA/USB) LGA, BGA (8-Series) Q87, QM87 Up to 8M Unified cache QM87: DDR3L DX11.1, OCL1.2, OGL 3.2 OCL1.2, OGL DX11.1, Q87: 95W/65W, 45W/35W Q87: 95W/65W, Flex I/O (USB/ PCIe/ SATA) QM87: 47W/37W/35W/25W Up to GT2 Processor Graphics GT1, GT2 LVDS and Legacy PCI Removed LVDS x16 (2x8, 1x8+2x4 on QM87, C226) 4th Gen. 4/2 Core Q87, QM87, C226 4th Generation 2-Chip Platforms Q87, C226: DDR3/ About IEI-2013-V10 Enriched Security & Responsiveness Enriched Security encryption, Secure experience through better FW protection and malware detection AES Instructions for faster and better Encryption New Faster boot/resume and Great responsiveness DDR3 (DT) DDR3 (DT) DDR3/L (MB) DDR3/L (MB) DDR3/L PGA 4C, 2C ® Core™ Processor

(7-Series)

LGA, BGA , LGA, BGA Q77, QM77, C216 Q77, C216: 95W/65W Up to 8M, Unified cache DX11, OCL1.1, OGL 3.1 OCL1.1, OGL DX11, QM77: 45W/35W/25W/17W Q77, C216: DDR3 up to 1600 Processor Graphics GT1/GT2 Up to GT2 QM77: DDR3/DDR3L up to 1600 QM77: DDR3/DDR3L x16 (2x8, 1x8+2x4 on QM77, C216) 3rd Gen. 4/2 Core Q77, QM77, C216 3rd Generation 2-Chip Platforms High performance

over 3rd Gen. Intel® Core™ ULV ULV over 3rd Gen. Intel® Core™ (AS3D) not present on Ultra platform » Note: VGA thermal solutions » 95W-35W TDPs (embedded SKU's targeting down to 25W) » 47W-25W TDP » 15W Package » Auto-Stereoscopic 3D » 3 Independent Displays Security AES instructions, additional Platform Intel® U-Series GT3, projecting 24% enhanced graphics U-Series GT3, projecting 24% performance processors for Improved 2.0 architecture & instructions AVX New media processing Enhanced Graphics / Media Breakthrough Performance Breakthrough Architecture delivers CPU, Graphics, and Media Performance for all market segments Projecting up to 13% CPU performance over 3rd Gen. Processor ● Digital display repartition & VGA support via Lynx Point support via Lynx ● Digital display repartition & VGA VGA DP, ● Up to 3 independent displays: HDMI 1.4, DVI, 2-chip platforms: Socket type (LGA) ● 4th Gen. Desktop & Workstation CPU (BGA) ● 4th Gen. Mobile 2-chip platform: On-board BGA) 1-chip platform: SoC (MCP, ● New Mobile low power "U-Series" ULT ● Significant 3D and media performance increase gen on gen and auto-stereoscopic 3D ● Significant 3D and media performance increase ● Improved up to 13% CPU performance ● Enables new U-Series platforms ● Graphics up to GT3 on U-Series (ULT) FMA) and new 2.0 (256b Integer, AVX Intel® ● New instructions & Security capabilities by on CPU, Flex I/O (PCI-E/SA ● High performance I/O: PCI-Express Gen3 IEI 4th GenerationIEI Intel Solution Packages PCIe Gfx Port Memory I/O and Gfx Graphics PCH Cache CPU TDP CPU Cores 2013: 2-chip and 1-chip Platforms processor graphics with DX11.1 & OCL1.2 & Intel® processor graphics with DX11.1 New 4th Generation Intel  Intel 4th Gen. vs 3rd Gen. Platforms Embedded 4th Generation Platform Overview Embedded 4th Generation 4th Generation Processor Platform Core Processor Intel  4th Generation

www.ieiworld.com 6 www.ieiworld.com 7 No No No Yes Power External WAFER-ULT KINO-DQM871 25% space PCIe® Bus PCIe/104™ DVI VGA LVDS HDMI Smaller cooler saving Outpu Models Stackable PCIeConnector Pure board w/o any jumper KINO-AQ87 NANO-QM871 Model DP-DVI-R10 DP-VGA-R10 DP-HDMI-R10 DP-LVDS-R10 By Button By Switch 1 4 X UDIMMs LPC iDP converter card converter iDP with bracket PCIe mini card slot Expand the I/O devices like wifi module or SSD Special CPU cooler mechanism Special CPU cooler mechanism IEI provide many expanded PCIe mini card slots with mSATA SSD PCIe mini card slots with mSATA IEI provide many expanded support IEI made much memory capacities in PICMG 1.3 CPU card by in PICMG 1.3 CPU memory capacities IEI made much cooler space saving occupied Four DIMMs Four Card CPU Full-size in mSATA ■ ■ By Application 2 SATA Easy Installation for Chassis 2 About IEI-2013-V10 USB 3.0 Flexibility programmable 2 Special Fn-key Jumper-less PCIe x4 By CMOS setting Protection 4 PCIe x1 IO Enhance component protection are higher than The height of stiffeners other components 1 SMB Rich GPIO Rich I/O provider IC Stiffener iDP 2 USB 2.0 PEIC Stable power provider Flexible Display Output Function NO jumper pin header IEI considered the PCBA banded symptoms especially symptoms especially banded the PCBA IEI considered IEI uses the However, Full-size CPU card. happened in than products much stronger bars to let the stiffener before ones. IEI designed many features via configuration under embedded under configuration via features many designed IEI GPIO, PEI and so on. controller like Jumper-less, IEI provide the iDP connector on 8-series products. The iDP can drive many kind of display specification by using IEI iDP converter card can drive many kind of display specification by using IEI iDP The iDP connector on 8-series products. IEI provide the iDP like VGA, HDMI, DVI-D and LVDS. IEI considered the business damage by loss jumper cap IEI considered the business damage by loss Type 2 Built-in Embedded Controller Feature iDP DisplayPort) (IEI Internal IEI Jumper-less Stiffener Bars Stiffener IEI provide the highly level specification of PCIe/104 standard for multiple PCIe/104 IEI provide the highly level specification of rich and signals PCIe speed high support slot PCIe/104 composite The card. add-on I/O by the type 2 design. ■ ■ ■ ■ PCIe/104 Type 2 slot Type PCIe/104 Board information provider ■ Power Sequence Innovative IEI Features in 8-Series Models 8-Series in Features IEI  Innovative display display independant independent Intel® Active Management USB 3.0 ports Support three Support three Integrated four Technology 8.0 Technology generation Latest generation Latest compatibility Intel® HD Graphics Graphics Intel® HD with DX* 11 support with11 DX* Superior platformSuperior scalability and cross Dual-channel DDR3 USB 3.0 USB 2.0 1.1 DP HDMI

IMC Latest generation Latest Audio IO features for the next generation of Ports embedded systems of technologies and and technologies of

Display LLC LLC LLC LLC

DMI SMBus ● Drop-in compatible with SNB ● Drop-in compatible with gain over Sandy Bridge ● Up to 20% performance over SNB; faster media processing ● >30% 3D graphics performance ● Up to three independent displays 8.0 AMT with Intel® ● Proactive management of embedded devices PCIe Gen3 and USB 3.0 ● Improved IO bandwidth and flexibility with

DMI LPC Ivy Bridge

FDI SPI Panther Point i7/i5/i3 Processors Chipsets& i7/i5/i3 Core Core Core Core About IEI-2013-V10 Processor Graphics ® System Agent Display PCIe I/O 2.0 3.0 Latest generation Latest outstanding visual outstanding visual graphics, media and and media graphics, computing experience display features deliver LAN PHY Three independent display supported under Win 7 only 10/100/1000 PCIe Gen3; up to 20 lanes Intel® 7 Series chipset based platforms enable new platform capabilities

Storage process and power efficiency between performance 22nm delivers balance balance delivers 22nm Intel® Rapid CPU supportCPU Power Aware

Sandy BridgeSandy 3rd Generation Intel Generation 3rd Built on 22nm Technology 11 Technology Ivy Bridge and Interrupt Routing for power savings power for Ivy Bridge: 3rd Generation Intel® Core™ Processor Core™ Intel® Ivy Generation 3rd Bridge: Ivy Bridge: Workstation (C2160) / Desktop (Q77) / Mobile (QM77) Overview / Mobile (QM77) / Desktop (Q77) (C2160) Ivy Workstation Bridge: ■ Ivy Bridge Platform  Ivy Bridge ■

www.ieiworld.com 8 www.ieiworld.com 9 10 No 7.0 Yes Yes 2 11 HM65 1.1 3.1 2.0 ME8 1600 1x Gen 3 6 Series Intel® QM67/ Ivy Bridge Ivy DMI x4 (5GT/s) Mobile OnlyMobile VGA VGA DX11/OCL1.1 Intel® AMT 7 USB 2.0 Display Device Device Device Device USB 2.0 USB 3.0 USB 3.0 USB 2.0 Mobile DVI-I/Dual HDMI DVI-I/Dual HDMI DVI-I/Dual HDMI DVI-I/Dual HDMI/LVDS 11 8.0 Yes Yes Yes 480Mbps 3.0 - 2 No Intel® QM77 3.0 10.1 ME8 DMI x4 (5GT/s) 1333 Gen 2 2.0/ DX10.1 7 Series Intel® AMT 8 Sandy Bridge Sandy v v v v v v 10 No 7.0 Yes Yes Intel® Ethernet Intel® Q67/B65 NG OK ! OK ! OK ! Intel® C206/ DMI x4 (5GT/s) 3.0 3 11 1.1 3.1 ME8 1600 Gen 3 2.0/ USB 2.0 Cable USB 2.0 Cable USB 3.0 Cable USB 3.0 Cable 7 Series Ivy Bridge Ivy Mobile OnlyMobile DX11/OCL1.1 Intel® AMT 8 Super Speed v v v v v v 11

8.0 Yes Yes Yes Q77 Workstation / Desktop Intel® C216/ 5Gbps DMI x4 (5GT/s) USB 3.0 10x - 2 SATA 6Gb/sSATA & USB 3.0 No 2.0 3.0 10.1 ME7 1333 Gen 2 DX10.1 6 Series Intel® AMT 7 Host Host Host Host Sandy Bridge Sandy 2 3 1 USB 3.0 USB 2.0 USB 2.0 USB 3.0 PCI USB 3.0 Storage Storage DMI Gen 2 Integrated Integrated Intel® AMT Technology SATA 6Gb/s SATA Features Intel® Rapid Rapid Intel® Chipset (PCH) Chipset cable combination 2.0 vs. USB 3.0 IVB & SNB Chipset Key Feature Comparison Feature IVB Key SNB & Chipset Chipset Features Chipset Graphics Support Graphics ■ ■ v v PCIe DDR3 DDR3L DirectX Chipset PCIe Mini Card OpenCL OpenGL Graphics Firmware Processor Intel® AMT USB SupportUSB About IEI-2013-V10 3 1.1 3.1 Yes Yes Best 2 1 5Gbps 12Mbps 1.5Mbps 480Mbps Independent Display Support Display Independent Data Rate CPU/GPU PCIe x1 3rd Generation3rd Existing signals Existing signals for USB 2.0 2 1 2 1 1 OCL 1.1) 3 independentOCL 1.1) displays Intel® HD Graphics 11, DX (Gen 7, PCIe x4 USB 3.0 connectors are colored USB 3.0 connectors are distinction blue on the interior for

Ivy Bridge

Speed Processor Full Speed Low Speed 2 High Speed 1.1 No 3.0 1 1 1 Yes CPU Good Super High Speed PCIe x16 Upgradable 2nd Generation 2nd 10.1) 2 independent displays independent 2 10.1) 2 (1 x share with x8 signal) x8 with share x (1 2 2 (1 x share with x8 signal) x8 with share x (1 2 Intel® HD Graphics (Gen 6, DX LGA 1155 LGA USB 2.0 USB 3.0 eDP Generation USB 1.0/1.1 USB 1.0/1.1 HTML5 OpenGL Features Platform Graphics DirectX 11 IMB-Q770 IMB-C2160 OpenCL 1.1 IMBA-Q770 IMBA-C2160 KINO-QM770 NANO-QM770 LGA1155 socket is backward LGA1155 Display Support Support Display Video Playability IEI List Check Solutions SNB IVB vs Cross Compatibility SVB vs. IVB SVB vs. Graphics Comparison Growing demand for faster data transfer transfer data faster for demand Growing USB 3.0 & 2.0 connector definition connector & 2.0 USB 3.0 Newly added signals for USB 3.0 Independent Digital Independent Digital compatible with SNB/IVB processors ■ ■ ■ ■ ■

Wireless Display Adaptor for Intel® Console Application . 5.1 multi-channel audio Technology Wirelessly transmit content ® Microsoft® Windows® no cable required BIOS ─ Embedded Controller Sub-system Intel® Smart Connect Technology Applet Technology Intel® Smart Connect / OEM GUI Technology Intel® Smart Connect Service Driver Technology Intel® Smart Connect offline content for synchronizing when network connection present. offline content for synchronizing when network resolution display ─ and HDCP over the air. ● Smart Connect UEFI BIOS driver module ● Intel® WLAN NIC with NetDetect software must store ● 3rd party software needed, and desktop applications ● Allows users to extend their computer screen to their high Allows users to extend ● high resolution, ● Supports up to 1080p Intel® Smart GUI (cont.) Connect Intel® Intel® Smart Intel® Connect Requirements Intel® WiDi Features Intel® ■ ■ ■ About IEI-2013-V10 Display

Wireless Display Adaptor for Intel®

The application looks for updates automatically or in a short time The application looks for updates automatically period (e.g., every 10 minutes) when connected to a network. Email, social media, and cloud apps are always updated and available at power on when Auto-on for quick data pull at low power state and auto-off complete. Fast forward to futurethe forward with Fast Intel Computer

● Auto Sync with Cloud ● ● Data Ready ● Smart System Energy Management ● Intel® Mobile Core™ i processors with Intel® HD Graphics ● Intel® Mobile Core™ i processors with Intel® ● Intel® wireless pre-loaded on the PC) ● Intel® WiDi v3.x or above version (software ● Intel® ME firmware with MEI driver installed ● Microsoft® Windows® 7/8 OS Intel® Smart GUI Connect Intel® Intel® Smart Features Connect Intel® Intel® WiDi Intel® Requirements ■ ■

With Intel® Smart Connect Technology, Technology, Connect Smart Intel® With social and apps, favorite email, your networks are automatically updated even the system is in sleep state. Intel® Smart Connect ■

With Intel® WiDi, user can play all of the personal or online content on content online or personal the of all play can user WiDi, Intel® With connection. a big screen with a simple Intel® WiDiIntel®

www.ieiworld.com 10 www.ieiworld.com 11 SSD

SATA 2/3 SATA N/A N/A N/A N/A N/A Intel® WiDi Intel® WiDi seconds. Controller SATA AHCI SATA Intel® Mobile Core™ i CPU & Intel® Centrino wireless module Fast Resume DRAM controller PCH Quick access to content within five to content within five Quick access Fast resume from SSD to memory. from SSD to memory. Fast resume AHCI I/F Required Module Rapid Start SSD recommended Intel® Smart Connect the amount of RAM BIOS customization required ● Rapid Start Technology UEFI BIOS driver module ● Rapid Start Technology ● PCH with Intel ® ME8.0 or above version be large or equal to ● The volume of corresponding SSD must ● Microsoft® Windows® 7/8 OS Intel® Centrino wireless module Intel® Rapid Start Technology GUI Start Rapid Technology Intel® Intel® Rapid Intel® Start Requirements BIOS ■ ■ Power Saving Start Rapid Intel® Technolog About IEI-2013-V10 S3 N/A N/A System suspended at near zero power. System suspended Intel® Rapid Start OS (S0) SSD Zero BIOS customization required State Power DRAM Resume SSD or small flash module, Combo PCH (Sandy Bridge platform or above) OS (S0) SSD Zero State Power DRAM Suspend Fast Standby S3

active OS memory content to disk and places platform in S4 active OS memory content to disk and places of OS. from disk and executes quick S3 resume path » Upon power button pressed, BIOS restores memory image » Upon power button pressed, BIOS restores » RTC timer or Critical Battery Event triggers BIOS to save timer or Critical Battery Event triggers BIOS to » RTC DRAM and SATA SSD. DRAM and SATA The system goes into standby mode goes into standby mode The system quickly. Opened apps and web pages apps and web Opened quickly. are quickly saved from DRAM to SDD. are quickly saved from

Start ● Longer battery life (S4 power state) ● Quicker access to Internet, data and applications ● Works around a basic principle of moving data between system around a basic principle of moving data between ● Works Rapid Intel® Chipset Storage BIOS supported 3rd party software supported Intel® Feature Dependencies Feature Intel® Intel® Rapid Start Rapid Features Intel® Technolog ■

Intel® Rapid Start Rapid Intel® Technology and battery life. seconds, saving time to fully operation in just from zero power can bring the computer user RST, With Intel®

EBC-3000 ECN-680A

Model Name (15”, 17” LCD) (15”, (15”, 17” LCD) (15”, AFL2-1XA-H61 PPC-51X0A-H61 WIDS-51XA-H61 AFL2-W15B-H61 (15”, 17”, 19” 17”, LCD) (15”, (15”, 19”, 21.5" 19”, Wide(15”, LCD) Al 192 + 33.4 45W 3000 50000 Two Ball

CF-1156C-RS 90 x 90 x 33mm LGA1155/LGA1156 Intel® H61 Embedded System H61 Panel PC Embedded Chassis 90 x 90 x 33mm, CCL, RoHS TANK-820 H61 Express Chipset Core™ i5/i3/Pentium®/® Core™ KINO-AH612 CPU, 45W, chassis 1U compatible, Cost-Optimized performance Panel PC Form Factor Low Cooler power LGA1155/LGA1156 kit for Intel® Desktop Core™ CPU Cooler 35W Desktop CPU Desktop 35W ™ Low power cooler for 1U chassis Material Weight (g) Weight

Description Model Name Model Demensions 35W TDP Bearing Type CPU Solution CPU Socket SolutionSocket Capability (Watt) Fan Speed (RPM) Intel® Core™ Noise Level (dBA) Core IOPS-H61 Life Expectancy (hrs) Life Model Name IDS-H61-R10 TANK-820-H61 ECN-680A-H61 ECN-680A-H61 ® 35W TDP CPU Intel® Core™ 35W TDP Power-Optimized performance 35W CPU Core™ i5/i3 TDP 35W 35W 35W 35W 35W 35W ECO H61 About IEI-2013-V10 1M 2M 3M 3M 3M 1.5M 2 H61 Embedded System Form Factor Smart cache CO Embedded System Embedded 2.7G 2.6G 2.3G 1.6GHz 1.6GHz 2.0GHz Clock speed Clock 35W TDP Intel® Core™ IMB-H612 IMB-H610 WSB-H610 PCIE-H610 IMBA-H610 IMBA-H610 KINO-AH611 KINO-AH611 G460 G440 KINO-AH612 KINO-AH612 Model Name KINO-DH610 KINO-DH610 G530T G630T i3-2120T CPU No. i5-2390T RACK-1150G Dual Dual Dual Dual 35W Intel® Core™ processors Core AFL2-W15B-H61 Single

+ 45% UP Power Saving H61 CPU Boards

Brand Core i3 Core i5 Core Celeron Pentium ATX *IEI recommended low power processors (long-term support) (long-term processors power low recommended *IEI Mini ITX Micro ATX PICMG 1.0 PICMG 1.3 Industrial Panel PC Form Factor Rackmount Chassis

WSB-H610 Low Power Desktop 35 CPU with H61 Chipset with H61 CPU 35 Desktop Power Low AFL2-15A-H61 Power-Optimized Performance Power-Optimized - Intel IEI & Power-Optimized Cost-Optimized Performance Platforms Scalable Socket  Fanless embedded systems with low power desktop processors are a leading-edge technology with an eco-friendly design that provides one of performance and energy-efficient computing. the most flexible solutions for a smaller carbon footprint. It‘s the best balance between In IEI's roadmap, the Intel® Core™ 35W desktop processors and Intel® H61 chipset are applied to CPU boards, embedded chassis, industrial systems. Panel PCs & embedded  are mobile solutions systems which adopt embedded Traditional Mobile issues. thermal avoiding while power low as design to easier power. low and high-performance be to designed were solutions than expensive more are chipsets and CPU mobile Unfortunately, their desktop counterparts. 35W desktop CPU and a advantages from utilizes these two Now IEI Intel® H61 chipset to provide power-optimized and cost-optimized performance platforms.

www.ieiworld.com 12 www.ieiworld.com 13

LVDS    1 GHz 650MHz Graphics Intel® HD

Desktop 35W Intel® Celeron® Celeron® Intel® Processor G530TProcessor Intel® High (2M Cache, 2.00 GHz) 6   DDR3-1333 MHz DDR3-1333 MHz Definition Audio Definition 1 DIMM/Channel 1 DIMM/Channel  12 4/2 6 PCI Express 2.0 2 / 1 4 Serial ATA Ports; ATA 4 Serial eSATA Port Disable eSATA HM65 Mobile AHCI only

PGA988B, BGA1023 1 x 16, 2 x 8, 4 1 x 8 + 2 x 5 Gb/s each x1    HDMI/DP/eDP, DVI/VGA/ HDMI/DP/eDP, 650MHz 950 MHz Graphics Intel® HD Mobile 35W DMI 4 Gb/s Processor B810 Processor Intel® Celeron® Celeron® Intel® Mobile Celeron® V.S. Desktop Celeron® Desktop V.S. Celeron® Mobile (2M Cache, 1.60 GHz) SPI Graphics Chipset Processor Express Intel® H61 Processors Intel® Core™ and BIOS Support Intel® ME Firmware ™ i3    Intel® FDI 1.1 GHz 650MHz Graphics Intel® HD exach 6   Desktop 35W  10 Intel® Pentium® 5 Gb/s 4/0 480 Mbps N/A Processor G630T H61 2 / 1 16 lanes 1 x 16 (3M Cache, 2.30 GHz) LGA 1155 Desktop Value Desktop HDMI/DP/eDP, DVI/VGA HDMI/DP/eDP, SM Bus    1.1 GHz 650MHz Intel® HD Desktop 35W Graphics 2000Graphics Graphics Intel® Core™ i3- 2120T Processor Processor 2120T (3MCache, 2.60 GHz) PCI Express 2.0 Intel® Integrated 10/100/1000 MAC

PCIe x1 ™ i3 V.S. Desktop Pentium® & Core Intel® Gigabit LAN Connect Digital Display: HDMI, DVI, DisplayPort (inclduding eDP), Lossless digital audio 10 Hi-Speed USB 2.0 Ports; Dual EHCI; USB Port Disable    650MHz 1.05 GHz 1.05 Intel® HD 8 Mobile Core Mobile    12 Mobile 35W 6/1 About IEI-2013-V10 B65 2 / 2 Graphics 3000 Graphics Intel® Core™ i3- 2330E Processor 1 x 16 Desktop LGA 1155 (3M Cache, 2.20 GHz) AHCI only

™ i5 HDMI/DP/eDP, DVI/VGA HDMI/DP/eDP,    1.1 GHz 650MHz Intel® HD Desktop 35W Graphics 2000Graphics Intel® Core™ i5- 2390T Processor2390T generation Intel® Core™ (3M Cache, 2.70 GHz) rd

& 3 nd ™ i5 V.S. Desktop Core processor + H61 Express Chipset Express + H61 processor    ™ 1.3 GHz 650MHz Intel® HD Supports 2 processor family with Intel® Turbo Boost processor, Pentium® Intel® 2.0, Technology processor. Celeron® Intel® and High-speed storage interface supporting up to ports.four SATA Offers up to for 5 GT/s fast access to peripheral devices and networking with up to eight PCI Express2.0 x1 ports, configurable as x2 and x4 designs. motherboard on depending Built-in Visuals support. Integrated Audio Codec supports dual stream HDMI & DP audio. 10. Technology Storage Rapid Intel® Integrated Gigabit Ethernet MAC. Mobile 35W Graphics 3000 Graphics Intel® Core™ i5- 2520M Processor 2520M Mobile Core Mobile (3M Cache, 2.50 GHz) ● Dual independent display ● Supports HDMI 1.4, DisplayPort 1.1, eDP, DVI, VGA DisplayPort 1.1, eDP, ● Supports HDMI 1.4, OGL3.0 ● Supports DX 10.1 and ● Supports H.264, MPEG2 encode and streaming content decode ● Supports H.264, MPEG2, or VC1 DVD, Blu-ray Decode ● Dual Video

™ rd ® Core and 3 and Features and benefits of H61 nd Frequency Frequency Technology Technology Product Name Product Graphics Base Graphics Model Graphics Intel® 3D InTru™ Intel® 6 series chipset SKU comparison (Embedded) SKU comparison chipset 6 series Intel® Intel® Core 35W desktop CPU performance comparison and mapping and comparison performance CPU desktop 35W Desktop PC platforms based on the Intel® H61 Express Chipset and 2nd generation Intel® Core™ processor family, including Intel® Intel® including family, processor Core™ Intel® and 2nd generation Chipset H61 Express Intel® on the based platforms PC Desktop package, deliver new technologies and innovating and other Intel® processorsCore™ i7 and Intel® Core™ i5 processors in the LGA1155 capabilities for all consumers. platform for everyday computing needs. The Intel® H61 Express Chipset enables a balanced Scalability performance cost-optimized for platforms Interface FDI) (Intel® Legacy PCI. SATA PortsSATA (3Gb/s / 6Gb/s) Intel® HD 3000/2000 Graphics Support Graphics 3000/2000 HD Intel® USB 2.0 Ports PCI Express 2.0 (5 GT/s) PCI Express Configurations Express PCI Memory Ch/DIMM per Ch Graphics Output Graphics Intel® Rapid Storage Technology 10 Technology Storage Rapid Intel® Segment Chipset Intel® Active Management Technology 7.0 Technology Management Intel® Active Processor Support Processor Intel® Clear Video HD Intel® Flexible Display Graphics Max Dynamic generation Intel Support for 2 processor family processor Serial 3Gb/s (SATA) ATA PCI Express 2.0 Interface Others  ■  Intel® HD Graphics  Nurture Slot Server Slot Supportive Ecosystems 5100 Evolve & Policies E5xxx, L5xxx, 51xx L5xxx, ® E5xxx, Standards Product Supply Product PICMG: SPCIE-5100DX DDR2 667MHz up to 32GB 2012~2013 Premium Server Premium Security Stronger Better, Faster Better, Rackmount & Tower Solutions Tower Rackmount & Improve Security Assurance Continually 2011 0 6 20 C206 Enterprise Server Enterprise Storage ServerStorage Deliver Product Security uATX: IMB-C2060 ATX: IMBA-C2060 Innovation PICMG: SPCIE-C2060 DDR3 1333MHz up to 32GB ™ i3-2120, Cleron® G540 Server Boards w/High Density Server Boards w/High Density Memory Capabilities 2010 Premium Server Premium C216 ® E3-12xx, E3-12xxV2, Core Sever Boards uATX: IMB-C2160 ATX: IMBA-C2160 Xeon DDR3 1600MHz up to 32GB About IEI-2013-V10

Workstation CPU bandwidth improvement Higher memory bandwidth socket LGA1356 & LGA2011 Primarily targeted for Entry 2S and Premium 1S servers Up to 8 cores/20MB cache (TXT) Technology Executed Trusted Enhanced AES new instructions Enhanced Execute Disable (XD) Multi-threads Multi-cores ● ● ● ● ● ● ● ● ● ● Communication & Mail Server C604 IMBA-C604EN ® E5-26xx, E5-24xx 6 (IMBA-C604EP) 4 (IMBA-C604EN) 4 40 (IMBA-C604EP) 40 24 (IMBA-C604EN) 24 ATX: IMBA-C604EP ATX: 2008 Xeon DDR3 1600MHz 256GB to up Application ServerApplication Server Grade CPU Card & Passive Backplane ® CPU

2006

Slot Server Slot IEI Industrial Server Industrial IEI

Security Technologies Performance Xeon

SATA RAIDSATA Ports (0, 10, 5) 1, Memory CPU PCIe Lanes SAS RAID Ports (0, 10) 1, Server Board Processor

Chipset IEI Industrial Server Industrial Overview IEI

Chassis & Power Supply About IEI ServerAbout now is IEI years. for cards add-in functional and systems industrial boards, embedded including solutions intelligent providing been has IEI expansion cards, computing, various and high-efficiency high-performance by integrating server platforms on designing industrial focusing standard providing also but products, customized for capabilities ODM/OEM offering only not is IEI lifespan. product long and design rugged manufactory automation, server baseboards and server barebones for your applications communication like surveillance infrastructure, security, etc. storage, military simulator,

www.ieiworld.com 14 www.ieiworld.com 15 Core Core Core Core PHY PCIe PCIe I/O Cache Latency Reduces PCIe Gen2 8x1 2 3 2 2 6 4 2 With DDIO Core Core Core Core 8 / 20M LGA1356 IMBA-C604EN 48GB w/ UDIMMs 96GB w/ RDIMMs 192GB w/ LRDIMMs PCIe Root Gen2 GbE MAC

DIMMs

PCI

CPU cache I/O direct to I/O LPC Xeon® Increases

Performance processor SPI Core Core Core Core 4 4 2 8 4 2 SMBus

N/A PCIe PCIe 8 / 20M Cache LGA2011 GPIO IMBA-C604EP 64GB w/ UDIMMs Core Core Core Core 128GB w/ RDIMMs 256GB w/ LRDIMMs SATA/SAS Without DDIO Power System Reduces USB C604 (Patsburg-B) PCH Accelerate local I/O by reducing I/O memory access Accelerate local I/O by reducing I/O memory DDIO Workflow Chart DDIO & Benefit Workflow DIMMs ■ ME RTC WDT HPET Timers DIMMs Socket USB 3.0 PCI slots SAS 3Gb/s SAS About IEI-2013-V10 SATA 3Gb/s SATA SATA 6GB/s SATA PCIe x8 slots Cores / Cache Max Memory (GB) DMI IEI Romley Server Board

2.30 2.0GHz With DDIO With Xeon E5-2620 Xeon I/O Performance IA Cores IA PCIe 8 GT/s 1.00 3.3GHz Xeon 5680 Xeon DDR3 IMBA-C604EN/EP

DDR3 DDR3 DDR3 DDR3

I/O Performance or LGA1356) (LGA2011 LR DIMMs

» Intel® Ethernet, PCIe I/O devices » Intel® Xeon® E5-26xx or E5-24xx processors » PCIe lanes on the CPU » Speeds up processor data transfer Accelerates inbound & outbound flows » » Up to 8 Cores/20MB Cache » Up to 8 Cores/20MB 2T/Core » SMT w/ECC/RAS » DDR3/L » 192GB to 256GB » 24/40 PCIe Gen 3 lanes » LGA1356 or LGA2011 and VT-d » VT-x » 8 x1 PCIe Gen2 » 14 USB 2.0 2x6Gb/s) (4x3Gb/s, » 6 SATA » 4 SAS (3Gb/s) for I/O performance I/O for Romley Platform Ingredients Processors (E5-26xx or E5-24xx) Processors Sockets LGA Virtualization C604 (Patsburg-B) PCH (Transactions/Sec) Up to 1600MHz

Up to 3 DIMM/CH ● Romley I/O architecture that leverages Intel® Integrated I/O ● Romley I/O architecture that leverages Intel® socket ● Reduces memory accesses from I/O on local ● ● ● ● 230% improvement improvement 230% DDIO: Innovation of I/O Access Technology Access I/O of DDIO: Innovation RDIMMs, UDIMMs, Two Chip Solution - IMBA-C604EN/EP Chip Two

Intel® Data Direct I/O Technology (DDIO) Intel® Data Direct I/O Technology ■

Romley Platform Overview Romley ■ LAN Port Serial Port by RJ-45 port Combo IPMI and LAN IMBA-C604EP supportsupport IPMI 2.0 IMBA-C604EP ● Host Management ● Power Management ● Storage Management LAN » Ability to send and receive IPMI messages directly to BMC via messages directly to send and receive IPMI Ability » » Via PET (Platform Event Trap/ SNMP trap) SNMP Trap/ (Platform Event PET » Via » BIOS event Event » Hardware Health Monitor » System Operation Event » System/CPU temperature » Fan speeds » Voltage » Chassis Intrusion » Power Supply Failed » FRU (Field Replaceable Unit) ● IPMI over LAN ● IPMI over ● LAN Alerting ● LAN ● Event Log ● OS Platform Independent ● Hardware Health Monitor IPMI Features 2.0 IPMI BMC ■ ● Server Management ● VM & Infrastructure Management ● Client Management Cross Platform and OS independent and Platform Cross Out-Of-Band (OOB): Out-Of-Band (OOB): ■ About IEI-2013-V10 Management Console Over LAN Voltage Management Temperature Hardware Log

IEI Servers w/IPMI Chassis

Intrusion over LAN connections and power state regardless of system health SOL-Serial redirection over LAN SOL-Serial in a remote environment of servers and systems Management their servers and systems, managers to manage Allows IT with existing IPMI v1.0/1.5 commands Backward compatible Fan Speed ● ● ● ● Interface) 2.0 Overview 2.0 Interface) Power Control IPMI (Intelligent Platform Management Management Platform IPMI (Intelligent

IPMI Out-Of-Band Monitoring and ManagementIPMI Out-Of-Band Monitoring

IPMI in IEI Intelligent Platforms IEI Intelligent in IPMI ■

www.ieiworld.com 16 www.ieiworld.com 17 Tank-720 + Power Control Power Alert Management Set Email Alerting Purging Historical Data Alert management BIOS Update Management User and Group Management Remote Control Management Access Authentication Device User Management Power Management Remote Control Management Serial Over LAN Configuration LED Identification Device Access Authentication ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● iEZman efficiency. compared with manual inventory tracking. of the server power state and operating system state. of the server power state Decreases server downtime and minimizes IT service time. and minimizes IT Decreases server downtime accounting costs, Increases speed and accuracy with reduced Out-Of-Band (OOB) remote management of servers regardless Out-Of-Band (OOB) remote service IT increases and visits helpdesk IT reduces Significantly is used to monitor hypervisor based virtual servers as a pluggable ● ● ● ● Intel® AMT About IEI-2013-V10 Discovery Health Monitoring Monitoring Performance Log Event Virtual hard disk management Device Discovery Server Summary Sensor Monitoring Power Management Event Log Management Device Discovery Server Summary Sensor Monitoring FRU Information Event Log Management Alert management Network Management XMS-Hyper-V Management is management solution to monitor the health of remote operating XMS In-Band Management is management solution to monitor the health systems as a pluggable component of MegaRAC® XMS. ● ● ● ● ● component of MegaRAC® XMS, installable in Linux and Windows operating system. ● ● ● ● ● is an Out- of-Band Management solution offered to monitor and manage remote BMC to monitor and manage remote XMS-SX is an Out- of-Band Management solution offered as the of MegaRAC® XMS. S stands for Server, and IPMI devices as a pluggable component performance of the BMC devices. plug-in monitors and reports the health and ● ● ● ● ● ● ● IMBA-C604EP + IPMI web UI

of the server power state and operating system state.. of the server power state critical services.

Out-Of-Band (OOB) remote management of servers regardless Out-Of-Band (OOB) remote Secured IPMI/BMC connections. for multiple vendors' IPMI data. generic standard A deployments. Support from mini to large-scale infrastructures. for IT Cost effective power management. More effective they impact Proactively respond to hardware problems before The IPMI 2.0 protocol allows ITs to easily monitor and control servers located in different places. Companies can reduce human resources to easily monitor and control in different servers located protocol allows The IPMI 2.0 ITs fields. in sever application IPMI 2.0 protocol is used The and repair. with inspection and costs associated ● ● ● ● ● ● ● IPMI 2.0 XMS Virtual Management System XMS In-Band Management XMS Management of-Band Out- Server management protocol for PC monitoring and remote control control remote and PC monitoring for protocol Server management ■ ■

Server Management ■ 5 5 via BP (type) Flexible Slots

N/A uATX 1 6 6 3 2 10 10 10 IMB-C2160 (port) COMs IPMI & iKVM CPU 288W Others Memory 2 2 4 4 2 2 (port) 1.35V DDR3 Green Solution USB 3.0 20nm-class 8GB USB 3.0 4 (2+2) 6 (2+4) 6 (2+4) 6 (2+4) 6 (2+4) 6 (2+4) 6 (2+4) 6 (0+6) 5% Savings ATX SATA portSATA (6GB/s+3Gb/s) IMBA-C2160 IMBA-C604EP IMBA-C604EN 17% Savings 2 2 3 1 PCI

(slot) System Power Savings CPU 1 (0+1) 303W Others Memory PCIe x1 slot (Gen3+Gen2) 1.5V DDR3 Current Solution 20nm-class 8GB C216 C604 Chipset IEI server boards with DDR3L solution list IEI server boards technology 2 (1+1) 2 (1+1) 1 (0+1) 2 (0+1) 1 (0+1) ● PCIe Gen 3 with 8GT/s Direct I/O (DDIO) ● DATA support ● DDR3L 6Gb/s ● SATA 3Gb/s ● SAS 2.0 / SATA Integrated I/O Integrated PCIe x4 slot (Gen3+Gen2) ■ 2 (0+2) 2 (0+2) 2 (0+2) 2 (0+2) 4 (4+0) 3 (3+0) PCIe x8 slot (Gen3+Gen2) About IEI-2013-V10

24 20 20 40 (lane) PCIe Gen3 SATA 6Gb/s SATA SATA 3Gb/s SATA 59.2W 17% Savings (Condition: IEI IMBA-C604EP Server Board with 32GB Memory ) (Condition: IEI IMBA-C604EP 1.35V DDR3 Green Solution 30nm-class 4GB Energy Saving ApplicationEnergy Saving (per unit) 1333 (IC) Z9s 1.35V AST1300 AST2300 External GPU * Condition: IMPT @ DDR3 4GB SODIM * Condition: IMPT 4 4 SAS (port) SAS 3Gb/s vs. DDR3L (1.35V) 20% Savings DDIO DDIO DDIO Intel® 1333 1.5V Memory Power Savings IMPT: Intel® Memory Power Tool Intel® Memory Power IMPT: iKVM RJ-45 IPMI 2.0 COMBO 71.2W DDR3 (1.5V) 1.5V DDR3 Current Solution 30nm-class 4GB

Power (W)

(CIM) Platform IMB-C2160 IMB-C2060 SAS/ SATA RAID SAS/ SATA Optimized performance exceptional & energy saving IMBA-C2160 IMBA-C2060 IMBA-C604EP ● RAID On Load ● RAID 0/1/10/5 ● SAS expander support ● SGPIO alerts ● SMART ● System Management IMBA-C604EN SPCIE-C2060 SPCIE-5100DX ■ IEI innovative products have full server functionality for your purchasing strategy. IEI innovative products have full server functionality IEI Server Feature Check List

Green Memory: Low Voltage DDR3 (DDR3L) DDR3 Green Voltage Memory: Low ■ Memory plays a critical role in maximizing server soefficiency, it is extremely important to determine the optimal type of memory DDR3L which delivers better bandwidth, consumes significantly less power than DDR2 and operates with voltages as low as This 1.35V. option provides the ratio on the market. efficiency best performance-to-power

www.ieiworld.com 18 www.ieiworld.com 19 ~8 GB/s ~16 GB/s ~32 GB/s for x16 link Total bandwidth SAS 3Gb/s Only Configuration 2 Configuration SATA 3Gb/sSATA Only with SATA IMBA-C604EN 2U (RAID speed: 3Gb/s) (RAID speed: 3Gb/s) 510W Compatibility 3.5” x 8 SAS Backwards SAS Backwards ISRA-C604EN2 ~1 GB/s ~250 MB/s ~500 MB/s N/A Bandwidth per Single 192GB lane per direction per lane 6 DIMMs 6 Dual LANDual SNB-EN ATA IMBA-C604EP PATA Configuration 2 Configuration SATA SATA 6Gb/sSATA Only (RAID speed: 6Gb/s) E5-24xx & E5-24xxV2 2 Gbps Why IEI 4 Gbps 4 Gbps 8 RAID function 1U bandwidth SAS SCSI SCSI Interconnect Interconnect 500W 3.5” x 4 ISRA-C604EN1 PCI Express bandwidth rate Raw bit 2.5 GT/s Configuration 1 Configuration 8.0 GT/s 5.0 GT/s ISRA-C604EP2 / ISRA-C604EN2 Serial (RAID speed: 3Gb/s) SAS & SATA RAID function Table SAS & SATA RAID Parallel It’s Not Available for the combinate SAS as andSATA SATA 3Gb/s 6Gb/sSATA + SATA PCIe PCIe1.x PCIe 3.0 PCIe PCIe 2.x Mode Mode System System architecture SAS RAID SATA RAIDSATA Installation 2U 510W 3.5” x 8 Providing the compatible products by each generation Reducing customers’ development time and cost does by fully technical support form IEI Providing the long term support to improve customers’ products value Providing the system stable operation under critical temperature even in no air condition environment Preventing the system infulence by the violent vibration over 0.5G situation applications existing customers’ interfaces for legacy the Providing ISRA-C604EP2 ISRA-C604EP1 / ISRA-C604EN1 5GT/s 8GT/s About IEI-2013-V10 Yes Single 256GB No N/A 8 DIMMs 8 Dual LANDual SNB-EP 2~3 years 0.25 ~ 0.5G 10°C ~ 35°C Consumer Medium to Low E5-26xx E5-26xxV2 & » Parallel SCSI for SCSI interface » Parallel SCSI interface Attached SCSI for SAS » Serial 1U 500W ● SCSI 3.5” x 4 ISRA-C604EP1 1G IEI Yes High 5~7 years

0°C ~ 40°C

PCIe 3.0 PCIe 01010101010101 PCIe 2.0

01010101010 01010101010101 Serial ports/ PCI slots Type Slots Watts Max. Size Size LAN HDDs Family IPMI 2.0 Processor Model Name Model Features

PSU Memory » Parallel ATA for PATA interface for PATA ATA » Parallel interface for SATA ATA » Serial PCIe 3.0 Graphic Card PCIe 3.0 Devices Longevity ControlVersion Anti-shock Industrial Interface Support Technical Operating Temperature Temperature Operating 40G/ 56G Ethernet Card

● 1U/2U rackmount barebone ● Highly density memory capacities drive ● 4/8-bay hot-swap 3.5” SAS/SATA ● IPMI & iKVM (optional) server board ● UP Powerful Ethernet card and high performance graphic card can reach maximum speed via PCI Express 3.0 at 8 GT/s maximum speed via PCI Express 3.0 at and high performance graphic card can reach Powerful Ethernet card SAS 2.0 (3Gb/s) not only supports SATA and SAS interface, it's it's SAS interface, and SATA supports only not (3Gb/s) 2.0 SAS also compatible with SAS RAID functions. It can be configured to 0/1/5/10 while system do the SAS RAID RAID function as RAID mode installation. ● ATA 1. 1U and 2U rackmount barebone are within the server boards including 4-bay or 8-bay for storage applications. 1. 1U and 2U rackmount barebone are within cost-efficient computing model. The universal processor type is recommended for 2. Barebone Spec. Features Highlight Features Advantage of IEI’s barebone solutions barebone IEI’s of Advantage Total Barebone Solutions Total Breaking the PCI Express bandwidth bottleneck Breaking bottleneck Express PCI the bandwidth SAS as SATA interface and RAID and interface function SAS as SATA Hard drive interface interface Hard drive ■ ■ ■ ■ Barebone Solution

PCI Express Applications 3.0 ■

SAS & SATA Compatibility & SATA SAS ■ V V V USB 3.0

Audio V V V HD 2 SATA 32nm Q2' 12 microSD D2550: 10W D2550: N2800: 6.5W N2600: 3.5W DX9, OGL 3.0 N2600: 1.6GHz for D2550/N2800 (4G max.) D2550: 1.86GHz D2550: N2800: 1.86GHz Intel® NM10: 1.5W Up to 1080p decode Gfx @ 400 MHz (N2600) MPEG2, h.264, VC-1/WMV9 V V V V V V Gfx @ 640MHz (D2550/N2800) mSATA DDR3 800MHz for N2600 (2G max.) Cedar Trail (D2550/N2800/N2600) Trail Cedar DDR3 1066 Codec LAN LVDS/ eDP LVDS/ DP/HDMI VGA PCIe x 4 (Woodinville) LAN: 82552V Dual PCIe mini PCIe Dual Dual PCIe mini PCIe Dual PCI / PCIe mini PCIe / PCI Expansion slot Expansion PCI-104+ /PCIe mini PCI-104+ PCI-104+ / PCIe mini PCIe / PCI-104+ 45nm 45nm Q1' 10 D525: 13W D425: 10W ICH8M: 2W ICH8M: N455: 6.5W DX9, OGL 1.5 N455: 1.66GHz N455: SPI D525/D425: 1.8GHz x4 DMI for Cedarview-D x2 DMI for Cedarview-M Gfx @ 200 MHz (N455) Discrete 3rd part 3rd Discrete decoder DDR2/3 up to 667 for N455 Gfx @ 400MHz (D525/D425) Pine Trail (D525/D425/N455) 800 MHz D525/D425 (4G max.) 12V 12V 32nm NM10 9~28V 9~28V 9~28V Chipset ATX power Power input Power SIO DX9 Graphics DDR3 Memory Dual Core CPU About IEI-2013-V10 Cedarview Processor ™ Hi-Speed USB CERTIFIED LVDS + VGA LVDS 8 ports 4 x PCI Express* 45nm 45nm Q2' 08 MPEG2 LVDS + VGA LVDS + HDMI LVDS + VGA LVDS + HDMI N270: 2.5W VGA + HDMI ICH7M: 1.9W ICH7M: DX9, OGL 1.4 N270: 1.6GHz 945GSE: 5.5W Gfx @ 133 MHz Display interface Display Navy Pier (N270) 18/24bits + VGA LVDS 18+48bits 18/24 bits VGA + Dual LVDS DDR2 400/533MHz (2G max.) 18+48bits 18+48bits card PCIe Mini Bluetooth Model Wi-Fi / Wimax / Launch Memory Process CPU TDP

Graphics 3rd Generation3rd Introduction Atom ™ Intel® Video Decode Video KINO-CV-D25501 NANO-CV-D25501 NANO-CV-D25502 DDR3 SO-DIMM 1 Channel 2 DIMMs KINO-CVR-D25502 CPU TDP (3.5/6.5/10W) & Average Power lower than Pine Trail (6.5/10/13W) Trail Power lower than Pine Average (3.5/6.5/10W) & TDP CPU options two digital ports for extra LVDS/HDMI/VGA Display Options include with two HD video support times Improved Graphics Two 1066MHz DDR3 Faster memory up to support HD Decode with Blu-Ray WAFER-CV-D25501 WAFER-CV-D25502

Chipset/ PCH TDP ● ● ● ● ● 2012 New Atom Dual Core Platform Core Dual Atom New 2012 Processor Frequency Processor IEI CV features matrix table IEI features CV Block diagram Specification comparison Benefits ■ ■ ■

■ Low Power Dual Core Cedarview Power Low 

www.ieiworld.com 20 www.ieiworld.com 21 mSATA storage mSATA B WiFi module NANO-QM770 OR NANO-CV-D25502 KINO-CVR-D25502 WAFER-CV-D25502 with USB 2.0 device Adaptor input Backward compatible B. 4-pin DIN Digital SATA signal SATA switch USB/ PCIe signal A KINO-QM770 KINO-CV-D25501 NANO-CV-D25501 WAFER-CV-D25501

PCIe mini card mSATA support list mSATA connector IEI offers two DC input options without an extra power module two DC input options IEI offers USB 3.0 interface delivers 5Gbps data transfer rate backwards backwards rate transfer data delivers 5Gbps interface USB 3.0 with USB 2.0 devices compatible ■ High speed USB 3.0 High USB speed 3.0 Wide range 9~28VDC input on board board on input 9~28VDC Wide range A. 2x2-pin DC power ■ ■ WiFi SSD Storage About IEI-2013-V10 HDMI

mSATA 1080P

SATA 3Gb/s SATA Full HD 600 MB/ sec PCIe Mini slot Pin 23/25 -- TX+ / TX- Pin 31/33 -- RX- / RX+ By mSATA digitalBy mSATA switch support 24-bit dual channel LVDS Item Form Factor Form Pin definition Transfer Protocol Transfer

Data Transfer Rate (Max.)

Compatible with PCIe Mini pin out ~ 50 feet LCD/Plasma Display Display LCD/Plasma IEI Cedartrail Solutions Feature Upgrade Feature Solutions IEI Cedartrail HDMI supports up to 1080p and 5.7”~42” LCD panel supported by 5.7”~42” LCD panel up to 1080p and HDMI supports signage market for the digital dual channel LVDS on-board 24-bits Mini-SATA, or mSATA, is a low-profile interface connector that enables or mSATA, Mini-SATA, small form-factor drives integration in (SATA) ATA enhanced Serial roughly the size of a business card, such as solid state disks (SSDs). Gb/s, 3.0 and Gb/s 1.5 of rates transfer data supports mSATA providing compact integration and high performance in a wide variety laptops, netbooks, and other used in ultraportable HDDs and SSDs of mobile devices. the same International Organization (SATA-IO), ATA The Serial 3Gb/s SATA 1.5Gb/s, SATA organization responsible for the SATA, 6Gb/s and specifications,SATA released specification thein mSATA of variety a from available now are drives mSATA 2009. September manufacturers. B. Bootable microSD design the delivers flash The SLC microSD card with reliable most and performance outstanding excellent endurance A. Flexible PCIe Mini card Solution SSD or wireless device connection Support mSATA mSATA introduction introduction mSATA Industrial storage option storage Industrial

Complete display interface supported display interface Complete

Industrial Storage Solution ■ ■  ■ RAID Public Cloud Secured content VM Surveillance record NAS Retail APP LAN Operation data Management data Fleet Mgt. Remote & Schedule Management ● QNAP intelligent and reliable storage system. ● QNAP NAS , or use Qfile to stream multimedia contents on the NAS and play on Cloud Enterprise NAS Public Cloud Enterprise Reliable Storage Industrial Control Tailor-made Apps Robust Networking Intelligent Management About IEI-2013-V10 Mgt. Production 3G/WiFi DASH IPMI Mgt. Medical AT&T iAMT

IOT Cloud Solution Cloud IOT Public Cloud AT&T

AirPlay-enabled devices. » Fleet Management, retail management, Medical application …etc. » online albums, backup to the cloud, surveillance, download center ● 3rd party customized apps for vertical applications:

● Install-on-demand apps in the App Center fulfill your diverse needs: ● Install-on-demand apps in the App Center & QPKG Development Platform Development App Center & QPKG

Effective Remote Solution Design Effective Remote Remote Management Solution Effective design the IEI + QNAP on IPMI & DASH). ● IEI industrial level remote management (based Effective NAS QNAP Internet by of Powered Cloud (IOT) Things and privacy. features support more management could solutions IOT

www.ieiworld.com 22 www.ieiworld.com 23

Protection Trusted Boot ● Trusted ● System Center Endpoint ● Windows Defender ● BitLocker ● VPN/SSL ● Commitment to the Market ● Genuine Software Partnership ● Trusted ● Support Lifecycle Tools ● Powerful Developer 8 Pro Fixed Features, Express Development, Windows Desktop Compatibility Windows® Embedded Windows® Embedded Family Performance ● Management Access ● Identify and & Cloud Integration ● IT ● Servicing ● Remote Access ● Multi Touch ● Internet Explorer ● Engineered for Apps ● Windows 8 ● Desktop Apps XP Pro: MB 128 RAM; 1.5 GB Hard Drive Vista: 1 GB RAM; 40 GB Hard Drive Windows 1GB RAM 7: (32Bit) 2GB RAM (64Bit), 16GB Hard Drive Windows 8: 1GB RAM (32Bit) 2GB RAM (64Bit), 16GB Hard Drive XP Pro: 300 MHz 32-bit (x86) Vista: 1 GHz 32-bit (x86) or 64-bit (x64) processor Windows 1GHz 32Bit 7: (x86) or 64-Bit (x64) processor Windows 8: 1GHz 32Bit (x86) or 64-Bit (x64) processor Via Third Party Plug in No Existent or Customized Win 32 Applications or Win64 Applications (on 64Bit editions of Vista and Windows 7)

for Embedded Systems Embedded for Professional XP Full XP Professional Channels Embedded 2016/12/31 Yes Total Recovery (Include Driver)‏ AP,OS,

8 Standard 8 Windows® Embedded 8 Standard Applications 8 Standard Embedded Windows®

Windows® Embedded Windows® Unified Write Filter ● Unified ● Gesture Filter ● Custom Branding ● App Launcher ● Modular Tools Pro ● OEM and IT ● Power Management ● Low Power Hardware ● NFC ● Mobile Broadband ● Networking ■

Reduced Footprint 12,000 Individual Components 560MB at smallest x86 x64 Via Third Party Plug in withYes, Windows Embedded 2011 Manager Device Full Win 32 Application compatibility ® Microsoft Windows

Flexibility, Source Level Control, Flexibility, Multiple CPU Architectures

2. About IEI-2013-V10 App Locker 8 Industry8 Side Loading Direct Access Branch Cache Windows® Embedded Windows®

Optimized for Point of Service Devices x86 x64 Via Third Party Plug in withYes, Windows Embedded 2011 Manager Device Written for Windows API and .NET framework Consumer Media Portable

Thin Client Multi Touch

Custom Branding Unified Write Filter Unified Compact 7 Internet Explorer 10 Medical Remote Desktop Protocol Windows 8 & Desktop Apps Windows 8 & Desktop Windows® Embedded Windows®

XP Professional XP Full XP Professional PC OEM 2009/1/31 No Only OS Recovery

700 components700 ARM MIPS SH4 x86 32-bit Native Real-Time Support No Customized Win 32 Applications 500KB at smallest Linux Embedded

Industrial MUI Automation Office

BitLocker Windows® Embedded 8 Standard Embedded Windows® IEI Linux Embedded Microsoft Windows Embedded CategoryMicrosoft Windows and Support Open Source Linux Embedded Automation

Group Policy Complete Embedded OS Support OS Embedded Complete IEIembedded systems offer customer the turnkey OS solutionto reduce OSplatform design products, therefore, computing industrial innovative efforts and offering leading consistently the customers on focuses development product IEI andaccelerate the product time tomarket. IEI supports Linux Embedded and the complete range of Microsoft Windows Embedded solutions tosupport the embedded optionally computing includes market. the licensed This embedded OS and , the CD pack containingall necessary manuals. user and SDK (Software Development Kit) materials

Connected Standby Telematics meet the needs of Intelligent Systems Intelligent of needs the meet Modular version of Windows® 8 enhanced to to 8 enhanced Windows® of Modular version Windows 8 Experience

OEM/End-user Enabled Features Single feature rich SKU to meet needs of industry specific devices ● Key Windows 8 Pro functionality plus Embedded specific technologies ● End user enabled features are dormant in OEM image ● End Users must activate features through additional License with Microsoft Gesture / Keyboard Filters Function Type Authorization Life Cycle (end date) Support Technical CD Recovery On-device ROM On-device Processors Supported OS Real-Time Device Embedded Management SupportApplication

■ 4.

3. 1. (Desktop DMTF

Network DASH 1.1 KVM Support iEZman KVM (Desktop and mobile Architecture Architecture (Desktop and mobile Independent Network Access Technology Active Management ● Intel® Addition of DASH 1.1 with Management Task Force) standard which standard which Force) Task Management requirements implementation the outlines Architecture for of the Desktop and Mobile System Hardware. for System Hardware) is a DASH

1. Inventory assets regardless of power state. 1. Inventory assets regardless 2. Save energy cost with scheduled power management. alerts. 3. Reduce unplanned system downtime by proactive 4. Reduce administrator’s on-site visit. up to date. 5. Keep remote/local systems and applications                  AMT 7.0/8.0 AMT C216/Q77/QM77 C206/Q67/QM67 Sandy/Ivy Bridge Bridge Sandy/Ivy Processors (2011/2012) Processors Chipset schedule Proactive alert                 AMT 6.0 Q57/QM57 Automatically boot by About IEI-2013-V10 Processors (2010) Processors Clarkdale & Arrandale Arrandale & Clarkdale Patch Security and Manageability ● Manageability Engine (ME) Memory ● Non-Volatile AMT) (Intel® Technology Active Management ● Intel® Power control management               Q45 AMT 5.0 Intel® Core™ 2 Processor (2008) Processor Group management asset tracking              Device hardware GM45 AMT 4.0 Intel® Core™ 2 Processor (2008) Processor access Remote ● Intel® Core™ i5 processor ● Intel® Core™ i7 processor

Processor

AMT enabled AMT devices search remote control management. control remote IEI computers, and supportsIntel® Active Management Technology (Intel® AMT) users. which for job easy is and built simple a server management turns iEZman in chipset. the Intel® Technology vPro™ ● IEI iEZman API is available for 3rd ISV and System Integrators. ● IEI iEZman supports Microsoft® Windows® platform and provides one-glance graphical user interface for local and ● IEI iEZman is a compact server management tool that provides essential control and management capabilityfor IEI Easy ManagerIEI (iEZman)

Boot ControlBoot Power State Management State Power HW Inventory SW InventorySW HW AlertingHW Serial Over LAN Over Serial IDE Redirect IDE Agent Presence Agent System Defense Filters Defense System ME Wake on LAN Remote Configuration Remote Access Monitor Operation Monitor Access Fast Call for Help, Remote and Maintenance, Scheduled Remote Alerts from outside corporate firewall via Wired LAN Enhanced system defense filters KVM Redirection IPV6 and SHA-2 support withDASH 1.1 KVM Support Intel® AMT Version Intel® AMT Intel® Product Name

Chipset Intel® AMT Feature List

iEZman activate Intel® vPro™ Technology iEZman comply Intel® Active Management Active iEZman comply Intel® Technology

Improve managing and securing networked computing resources. Improve managing and securing networked off. Inventory assets, even while systems are powered (OOB) management capability. Upgrade/Repair systems using out-of-band on or off. Push software updates while system is powered Remotely Discover, Recover, Protect and Manage Protect Server Systems Recover, Discover, Remotely

www.ieiworld.com 24 www.ieiworld.com 25 KVM Remote Control Alarm Clock Embedded Embedded ECN-780-Q67 TANK-720-Q67 TANK-700-QM67

Computing Solution Computing Console iEZman Management KVM Redirection management Remote asset management Out-of-Band system Power management Remote diagnosis and repair » » » » » IMB-Q770 IMB-C2160 IMBA-Q770 ICE-QM770 IMBA-C2160 KINO-QM770 NANO-QM770 Group Management Sort remote PCs into groups for easy monitoring and control KVM Remote Control (optional) Allow a remote system to control the keyboard, video and mouse with a secure password *VNC license is required Intel® AMT 7.0/8.0 Intel® AMT Patch Management Alert and Event OS Agent Hardware Over Network Management Industrial Computing Solution Computing Industrial IMB-Q670 PCIE-Q670 IMB-C2060 IMBA-Q670 IMBA-C2060 KINO-AQ670 KINO-QM670 SPCIE-C2060 Remote Access Group Management Client EBC-3680 Embedded Embedded Intel® AMT Intel® ECN-581A-QM57 Computing Solution Computing Remote Access Boot the remote PC from a local CD-ROM, floppy drive or ISO image. Or boot into the BIOS Alarm Clock Sets an alarm to wake the system even under unconnected status Desktop/Notebook Desktop/Notebook Intel® AMT 6.0 About IEI-2013-V10 Industrial Industrial PCIE-Q57A KINO-QM57A NANO-QM57A Power Management Schedule Power Management Computing Solution Computing IEI Easy Manager allows a remote user, such as a IT personnel, remotely control and perform to such as a IT Easy ManagerIEI allows a remote user, can manage all functions You administrative tasks through a graphical user interface in Windows. through this single interface. Embedded Embedded TANK-GM45A Computing Solution Computing Alert and Events Issues an alert when the system encounters an issue Schedule Power Management Schedule the system(s) to wake from a sleep at a particular time state or turn off Intel® AMT 5.0 Industrial Industrial IMBA-Q454 Computing Solution Computing

Industrial Industrial IMB-Q354 PCIE-Q350

IMBA-XQ354 User Friendly Interface Friendly User Integrate VNC® on Windows Interface Windows on VNC® Integrate Intel® AMT 4.0 Computing Solution Computing * Require Intel® Core™ i5 processor or Intel® Core™ i7 processor for Intel® KVM remote control management.

IEI iEZman specializes on Intel® AMT out-of-band client client out-of-band AMT specializes on Intel® IEI iEZman remotely deploying capabilities include The efficient management. with or software problems diagnosing hardware an OS image, KVM solution controlling and the remote regardless computers power state. the OS or system iEZman Supported IEI Product Models Patch Management Apply patches to the remote PC

Power Management Control the power status of system for power on/off/reset IEI Easy Manager IEI iEZman combines all management functions in one simple all management functions in one simple IEI iEZman combines interface. and straight forward user ■ ■ (*VNC® License is required.) repair and maintenance with graphical Provides PC diagnosis, Keyboard/Video/Mouse/Storage of redirection through support management. (KVMS) to IT iEZman SupportsiEZman Products IEI OK 3 The system is infected by The system is infected by virus or has a blue screen 1 Alert Decrease downtime of system failure and enhance efficiency of system management. Supports Auto Supports One Key Restore + Remote KVM Recovery Mode! imaging procedures required. IEI Recovery Solution Advantages: IEI Recovery Solution or follow trivial ● No need to make recovery discs by yourself personnel No IT ● Simple steps to backup or restore the system. multi-menu ● Backup/Restore system easily through unique ● One key to make recovery disc ● One key to restore system Remote Troubleshooting Use the recovery tool to restore Use the recovery tool to restore your OS at the local site 2 OS Backup About IEI-2013-V10 One Key IEI Certified Sticker System recovery The IEI recovery CD is only for IEI products. A message will show to warn "you are an illegal an illegal are "you warn to will show message A products. IEI for only CD is recovery IEI The IEI the of BIOS detected through the protection is This products. non-IEI CD for using the user" if boards. Automatic/ Remote Partition 1 System back up/ System recovery Partition 2 Operating System Recovery Kit iei.gho (Factory Default) (User’s Image) iei_user.gho A hidden partition is a logical section of a disk which is not accessible to the operating system. After building hidden partition is a logical a disk which section of is not accessible to the operating system. A one partition for up proccess, the recovery set and execute one key recovery, and one key OS partitions for to protect confidential data or store backup of the system. key recovery will be hidden. It may be used

MBR

IEI's unique One Recovery Key solution allows you to recover and backup your operating system without complicated settings. One Recovery Key is bundled with every IEI SBC, embedded system, and all-in-one panel PC product. IEI One Key Recovery Solution Recovery One Key IEI

All migration tasks can be performed remotely from a a from remotely can be performed tasks All migration cost by reducing This saves central management console. physical visits. Benefits maintenanceRemote reduces the cost IT of infrastructure IEI Only Products Recovery Partition Recovery Suggestion: Over 4GB storage capacity ■

■ Recovery Tool for IEI Products Only IEI Products for Tool Recovery from and restore backup system do a full to users allows It 2.0. PE Windows using IEI by exclusively developed CD was recovery IEI The additional system backup and recovery tools. because it eliminates the need to buy Recovery keeps costs low, system failures. One Key

www.ieiworld.com 26 www.ieiworld.com 27 .gho) Standard 7 Restart client through LAN Windows® 7 Windows® Windows® Embedded Windows® Embedded Windows® XP Embedded Windows® XP Windows® Embedded TCO timerTCO counts down Windows® Embedded Standard 7 Standard Embedded Windows® Start SRFixMBR Supported OS List Windows® XPWindows® Windows® VistaWindows® Windows® 2000Windows® + Optional function, support by request. Client Operation System support Windows® XPWindows® Windows® VistaWindows® Windows® 2000Windows® Recovery Kit Installation Kit Recovery BSOD or system crash Optional function, support by request. Install setup from One Key Recover CD for client device to partitionto Recover image image Recover One Key Backup / Restore One Key Backup time-out TCO timer TCO ● One-Key Recovery your system to default setting (iei.gho) ● Factory restore: restore recover the last system configuration (iei_user ● Restore your last backup: ● One-Key Backup your can create You to the secure hidden partition. Backup your operating system your application programs set-ups. including own ghost image as “iei_user.gho” About IEI-2013-V10 Server requirement Auto reboot Auto Create Create Linux server with TFTP DHCP, and HTTP function Install utility from One Key Recover CD for server Partition When the system encounters a Blue Screen of Death (BSoD) of Death (BSoD) When the system encounters a Blue Screen want If , minutes 10 is setting [Default minutes 10 for hangs or auto recovery the contact us], please time setting change the to This automatically. image default factory the enables function continuous work. function shortens repair downtime, ensuring Windows® VistaWindows® Windows® CE 5.0 Windows® XP Embedded Windows® XP , 8.10 4. Ubuntu 7.10 6.10, 5.Debien 4.0, 5.0 11.2 10.3, SuSe 6. Into mode

recovery recovery Support OS List C: Windows® 7 Windows®

Standard OS Windows® XPWindows® OS PartitionOS Windows® CE 6.0 CE Windows®

Fix problems at your finger finger your at problems Fix key via hot tips Linux OS RedHat1. 9 2. RedHat RHEL- 5.4 3. Fedora 12 8, Core 10, 11, 7, Make sure to enable auto recovery function from BIOS after standard set up One key Recovery also provides key Recovery also provides One IT recovery function. a remote client maintain easily can professionals the When network. the device through system has a Blue Screen of Death (BSoD) or hangs for 10 minutes [Default want to change setting is 10 minutes , If us], contact setting please time the image can system factory default the be restored from server to ensure seamless workflow. Recover factoryRecover image C. Network: Remote recovery through LAN through recovery Remote Network: C.

B. Auto scheduling: Instant problem solving from auto recovery recovery auto from solving problem Instant scheduling: B. Auto

Rapid Recovery and Restoration Ensures Seamless Workflow Ensures Restoration and Workflow Seamless Recovery Rapid A. operation: Local By pressing F3, users can access the backup/ F3, users can access By pressing Recovery Key One easily. process recovery and migration process, simplifies the imaging system maintenance. increasing efficiency in Warning Signal Warning PWN/DC iSMM Library / DLL Save/Load Flexible user profile retrieval FAN#1~~ #N FAN#1~~ Fan Tachs iSMM IEI Products Only IEI Products Voltage Planes Voltage WDT free watch- Trouble dog timer testing iSMM Device Driver Hardware Monitor Controller User App API API provides a quick and easy tool for IEI developeing applications for your customers. CPU ThermDiode/Thermistor Advantages Know that your system is running within safe limits Know that your system as system instability or damage. Prevent disasters such Architecture Hardware User Model DIO Easy digital I/O configuration Kernel Model Functions About IEI-2013-V10 Real time voltage alarm Voltage IEI Exclusive Diagnosis SoftwareIEI Exclusive Fan Dynamic fan speed control

Full Graphical User Interface Real-time access system Efficient API functions

What Management System is the IEI Intelligent (iSMM)? Module IEI iSMM is a system health supervision API which utilizes sensor chips on IEI motherboards to keep track of system CPU temperatures, voltages, cooling fan speed, WDT and digital I/O set up status. By quickly capturing and reporting system health data, users can prevent disasterssuch as system instability or damage. IEI Intelligent System Management System Intelligent IEI Module Temp. CPU + System temperature monitoring a. Windows® XP b. Windows® Vista c. Windows® 7 installing iSMM Note: Please disable the UAC function before and Windows® 7. software under Windows® Vista iSMM supported super I/O: 1. Winbond W83627 2. Winbond W83697 3. ITE IT8712 4. ITE IT8718 5. ITE IT8783F 6. Fintek F81216D 7. Fintek F81865 8. SMSC SCH311x ● External and on-chip voltages data feedback ● External and on-chip data feedback ● CPU and system temperature feedback ● Cooling fan speed data Mode by PWM/On-Off/Automatic ● Cooling fan speed controlled signals by beeper and sound effect ● Warning test ● WDT ● Programmable digital I/O ● Save and load system health configurations Available operation system operation Available Available models Available Features ■ ■ ■

www.ieiworld.com 28 www.ieiworld.com 29 C216 C604 C604 C206/ Chipset AMT AMT 7.0 AMT 7.0 AMT 7.0 AMT 8.0 AMT Yellow means long-term support Yellow DDR3-800/1066 DDR3-800/1066 DDR3-800/1066 DDR3-800/1066 DDR3-800/1066 DDR3-800/1066 DDR3-1333/1600 DDR3-1066/1333 DDR3-800/1066/1333 DDR3-800/1066/1333 DDR3-800/1066/1333 DDR3-800/1066/1333 DDR3-800/1066/1333 DDR3-800/1066/1333 DDR3-800/1066/1333 DDR3-800/1066/1333 DDR3-800/1066/1333 DDR3-800/1066/1333 DDR3-800/1066/1333 DDR3-800/1066/1333/1600 DDR3-800/1066/1333/1600 DDR3-800/1066/1333/1600 DDR3-800/1066/1333/1600 DDR3-800/1066/1333/1600 DDR3-800/1066/1333/1600 DDR3-800/1066/1333/1600 DDR3-800/1066/1333/1600 DDR3-800/1066/1333/1600 DDR3-800/1066/1333/1600 DDR3-800/1066/1333/1600 DDR3-800/1066/1333/1600 DDR3-800/1066/1333/1600 DDR3-800/1066/1333/1600 DDR3-800/1066/1333/1600 DDR3-800/1066/1333/1600 DDR3-800/1066/1333/1600 Max Memory Speed (DDR3) ------2 GHz Speed 2.1 GHz 1.9 GHz Int. GFX 1.15 GHz 1.35 GHz 1.35 GHz 1.25 GHz 1.25 GHz 1.25 GHz 1.35 GHz 1.25 GHz 1.35 GHz TDP 17 W 20 W 70 W 95 W 80 W 80 W 80 W 80 W 95 W 95 W 70 W 60 W 80 W 95 W 95 W 95 W 87 W 95 W 95 W 95 W 95 W 95 W 77 W 77 W 95 W 45 W 95 W 95 W 77 W 69 W 69 W 69 W 95 W 80 W 69 W 95 W 95 W 60 W 69 W 95 W 45 W 80 W 60 W 95 W 95 W 80 W 95 W 80 W 115 W 115 W 115 W 130 W 135 W 130 W 130 W 130 W 130 W 8 MB 6 MB 8 MB 3 MB 5 MB 8 MB 8 MB 8 MB 8 MB 8 MB 3 MB 8 MB 8 MB 8 MB 8 MB 8 MB 8 MB 8 MB 8 MB 8 MB 8 MB 8 MB 8 MB 8 MB 15 MB 15 MB 15 MB 15 MB 10 MB 10 MB 12 MB 15 MB 15 MB 10 MB 15 MB 10 MB 16 MB 15 MB 15 MB 15 MB 15 MB 15 MB 10 MB 20 MB 10 MB 20 MB 20 MB 20 MB 20 MB 20 MB 20 MB Smart 20 MB 20 MB 20 MB 20 MB 20 MB 20 MB Cache Clock Clock 2 GHz 2 GHz 3 GHz 2 GHz 2 GHz 2 GHz Speed 3.1 GHz 3.1 GHz 2.1 GHz 3.1 GHz 1.8 GHz 1.8 GHz 2.7 GHz 1.8 GHz 2.7 GHz 1.9 GHz 1.8 GHz 1.8 GHz 2.4 GHz 2.3 GHz 3.2 GHz 3.7 GHz 2.2 GHz 2.5 GHz 3.3 GHz 2.6 GHz 2.9 GHz 2.4 GHz 2.4 GHz 2.9 GHz 2.9 GHz 2.4 GHz 2.6 GHz 2.2 GHz 2.2 GHz 2.4 GHz 3.6 GHz 2.3 GHz 3.4 GHz 3.6 GHz 3.4 GHz 2.2 GHz 3.3 GHz 2.5 GHz 3.4 GHz 2.3 GHz 3.5 GHz 3.5 GHz 3.4 GHz 3.5 GHz 2.4 GHz 3.3 GHz 3.3 GHz 3.2 GHz 2.2 GHz 2.2 GHz 3.2 GHz About IEI-2013-V10 E3-1225 E3-1220 E3-1230 E3-1275 E3-1270 E3-1245 E3-1240 E3-1280 E5-2470 E3-1235 E3-1290 E5-2670 E5-2637 E5-4617 E5-2620 E5-2420 E5-2407 E5-2603 E5-2630 E5-2667 E5-4610 E5-2650 E5-2609 E5-2403 E5-2640 E5-2450 E5-2643 E5-2665 E5-2430 E5-2440 E5-2680 E5-2660 E5-2690 E5-4607 E5-4620 E5-4603 E5-4650 E5-4640 CPU No. E3-1220L E5-1428L E3-1260L E5-2630L E5-2650L E5-2450L E5-2430L E5-4650L E3-1270V2 E3-1240V2 E3-1275V2 E3-1220V2 E3-1280V2 E3-1230V2 E3-1245V2 E3-1225V2 E3-1290V2 E3-1265LV2 E3-1220LV2 4/4 4/4 4/4 4/4 4/8 4/2 2/4 4/8 4/8 4/4 4/4 4/4 6/6 4/4 4/8 4/8 4/8 4/8 4/8 4/8 4/8 4/8 4/8 4/8 4/8 4/2 4/8 4/8 4/8 4/8 4/8 6/12 6/12 6/12 6/12 6/12 6/12 6/12 8/16 8/16 8/16 8/16 6/12 8/16 6/12 8/16 8/16 6/12 6/12 6/12 8/16 8/16 8/16 8/16 8/16 8/16 8/16 Core/ Threads

32nm 32nm 32nm 22nm Process Ivy Bridge Sandy Bridge Sandy Bridge Sandy Bridge

Brand Xeon® E5 Xeon® Xeon® E5 Xeon® Xeon® E3 Xeon® Xeon® E3 Xeon® Sandy Bridge-EP Sandy Bridge-EN

CPU and Chipset Matrix Chipset and CPU ® Intel Table LGA1155 LGA2011 LGA1356

CPU SocketCPU Server E5/ Workstation E3 CPU List E3 CPU Server E5/ Workstation Chipset Chipset Q87/H81 Q77/Q67/B65/H61 ------AMT AMT AMT 7.0 AMT 7.0 AMT 7.0 AMT 7.0 AMT 7.0 AMT 9.0 AMT 8.0 AMT AMT 8.0 AMT AMT 8.0 AMT AMT 8.0 AMT Yellow means long-term support Yellow CPU List CPU CPU List ® ® *B65/H61 chipset doesn’t support Intel® AMT feature *B65/H61 chipset doesn’t support Intel® Memory Types DDR3-1333/1600 DDR3-1333/1600 DDR3-1066/1333 DDR3-1066/1333 DDR3-1333/1600 DDR3-1333/1600 DDR3-1066/1333 Max Memory Speed (DDR3) 4600 Model Speed 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz Int. GFX 1.15 GHz 1.15 GHz 1.15 GHz 1.15 GHz 1.15 GHz 1.15 GHz 1.15 GHz 1.15 GHz Graphics 1.15 GHz 1.15 GHz 1.05 GHz 1.05 1.05 GHz 1.05 1.05 GHz 1.05 1.25 GHz 1.25 GHz 1.35 GHz 1.35 GHz 1.05 GHz 1.05 1.35 GHz 1.35 GHz 1.05 GHz 1.05 1.05 GHz 1.05 GHz 1.05 1.05 GHz 1.05 Intel® HD Graphics Graphics /Celeron /Celeron ® ® TDP TDP 77 W 77 W 77 W 35 W 65 W 65 W 77 W 65 W 65 W 77 W 45 W 65 W 45 W 77 W 65 W 77 W 77 W 45 W 65 W 65 W 45 W 69 W 65 W 65 W 95 W 95 W 65 W 45 W 35 W 65 W 95 W 35 W 65 W 95 W 65 W 95 W 95 W 35 W 95 W 95 W 95 W 65 W 95 W 95 W 95 W 95 W 95 W 95 W 95 W 95 W 65 W 35 W 35 W 95 W 55 W 65 W 65 W 55 W 35 W 65 W 55 W 35 W 65 W 65 W IEI recommed low power processors 3 MB 6 MB 6 MB 6 MB 6 MB 6 MB 6 MB 6 MB 6 MB 6 MB 6 MB 6 MB 6 MB 6 MB 6 MB 6 MB 8 MB 6 MB 6 MB 8 MB 6 MB 6 MB 6 MB 8 MB 6 MB 8 MB 6 MB 6 MB 8 MB 6 MB 8 MB 8 MB 8 MB 6 MB 6 MB 6 MB 3 MB 6 MB 8 MB 8 MB 6 MB 4 MB 6 MB 8 MB 8 MB 8 MB 6 MB 6 MB 6 MB 6 MB 6 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB Smart Smart Cache Cache About IEI-2013-V10 Clock Clock Clock Clock 3 GHz 3 GHz 2 GHz 3 GHz 3 GHz Speed Speed 3.1 GHz 3.1 GHz 3.1 GHz 3.1 GHz 3.1 GHz 3.1 GHz 3.1 GHz 3.1 GHz 3.1 GHz 3.1 GHz 3.1 GHz 2.7 GHz 2.7 GHz 2.7 GHz 2.7 GHz 2.9 GHz 2.9 GHz 2.9 GHz 3.4 GHz 3.4 GHz 3.4 GHz 3.4 GHz 3.3 GHz 3.4 GHz 3.3 GHz 3.4 GHz 3.4 GHz 3.3 GHz 3.4 GHz 3.4 GHz 2.8 GHz 2.3 GHz 2.9 GHz 2.9 GHz 3.5 GHz 3.5 GHz 2.5 GHz 2.5 GHz 2.3 GHz 2.8 GHz 3.5 GHz 2.3 GHz 2.5 GHz 2.9 GHz 2.5 GHz 2.9 GHz 3.4 GHz 2.6 GHz 2.8 GHz 3.2 GHz 2.5 GHz 3.3 GHz 3.2 GHz 2.8 GHz 3.3 GHz 3.3 GHz 3.4 GHz 3.2 GHz 3.3 GHz i7-3770 i7-4770 i3-2125 i7-2600 i3-2120 i5-2310 i3-2102 i3-2130 i3-2105 i3-2100 i5-3470 i5-2320 i3-3240 i5-3570 i5-2400 i3-3225 i5-2500 i3-3220 i5-2300 i5-4670 i5-4570 i5-3550 i5-3330 i5-3450 i5-4430 i7-3770T i7-4770T i7-4765T i3-2120T CPU No. CPU No. i7-3770S i3-2100T i7-3770K i7-2700K i7-4770S i7-4770K i5-3470T i7-2600S i3-3240T i7-2600K i5-3570T i3-3220T i5-2500T i5-2390T i5-4670T i5-4570T i5-3475S i5-3470S i5-2405S i5-3570S i5-2450P i5-2400S i5-3570K i5-2550K i5-2500S i5-2500K i5-2380P i5-4670S i5-4570S i5-3550S i5-3330S i5-4670K i5-3350P i5-3450S i5-4430S 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 4/4 2/4 4/8 4/8 4/8 4/8 4/8 4/8 4/8 4/8 4/8 4/8 4/8 2/4 4/8 2/4 4/8 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 Core/ Core/ Threads Threads

32nm 32nm 32nm 22nm 22nm 22nm 22nm 22nm Haswell Haswell Haswell Haswell Process Process Ivy Bridge Ivy Bridge Ivy Bridge Sandy Bridge Sandy Bridge Sandy Bridge Brand Brand Core™ i7 Core™ i7 Core™ i7 Core™ i5 Core™ i3 Core™ i3 Core™ i5 Core™ i5

LGA1150 LGA1155 CPU SocketCPU CPU SocketCPU

Desktop Core™ i7/i5/i3/Pentium Desktop Core™Desktop i7/i5/i3/Pentium

www.ieiworld.com 30 www.ieiworld.com 31 Q57 Chipset Q77/Q67/B65/H61 ------AMT AMT6.0 AMT6.0 AMT6.0 AMT6.0 Yellow means long-term support Yellow CPU List CPU DDR3-1333 DDR3-1066 ® *B65/H61 chipset doesn’t support Intel® AMT feature *B65/H61 chipset doesn’t support Intel® DDR3-1333/1600 DDR3-1066/1333 DDR3-1333/1600 Max Memory Speed (DDR3) ------1 GHz 1 GHz 1 GHz 1 GHz 1 GHz 1 GHz 1 GHz 1 GHz 1 GHz 1 GHz Speed 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 733MHz 733MHz 733MHz 733MHz 733MHz 733MHz 733MHz 733MHz 733MHz 533MHz 533MHz 900MHz Int. GFX 1.05 GHz 1.05 1.05 GHz 1.05 GHz 1.05 1.05 GHz 1.05 1.05 GHz 1.05 /Celeron ® TDP 73W 73W 73W 73W 73W 73W 73W 73W 73W 73W 73W 82W 82W 82W 87W 95W 95W 95W 95W 95W 95W 65 W 35 W 35 W 35 W 65 W 35 W 65 W 35 W 65 W 35 W 35 W 65 W 35 W 65 W 55 W 55 W 65 W 35 W 65 W 65 W 35 W 65 W 65 W 35 W 65 W 35 W 65 W 65 W 35 W 55 W IEI recommed low power processors 4M 4M 4M 4M 4M 4M 4M 4M 4M 4M 3M 3M 8M 8M 8M 8M 8M 8M 8M 8M 8M 2 MB 2 MB 1 MB 2 MB 2 MB 2 MB 2 MB 2 MB 2 MB 2 MB 2 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB Smart Cache 1.5 MB 1.5 MB About IEI-2013-V10 3.6G 2.4G 2.8G 2.8G 3.2G 3.2G 2.8G 3.2G 2.93G 2.93G 2.93G 2.93G 3.33G 3.46G 3.33G 3.33G 2.53G 2.66G 2.66G 3.06G Clock Clock 2 GHz 3 GHz Speed 2.933G 2.1 GHz 3.1 GHz 3.1 GHz 1.6 GHz 1.9 GHz 1.8 GHz 2.7 GHz 2.7 GHz 2.7 GHz 2.7 GHz 2.4 GHz 2.6 GHz 2.6 GHz 2.6 GHz 2.6 GHz 2.5 GHz 2.3 GHz 2.4 GHz 2.3 GHz 2.8 GHz 2.6 GHz 2.9 GHz 2.6 GHz 2.2 GHz 2.9 GHz 2.2 GHz 2.8 GHz 2.5 GHz G870 G620 G530 G555 G550 G632 G465 G622 G460 G540 G440 G630 G850 G640 G840 G860 G645 i7-870 i7-880 i7-860 i5-750 i5-760 i5-670 i5-661 i3-550 i3-530 i3-560 G1610 i3-540 i5-650 i5-680 i5-660 G1620 G2120 G6950 G6960 G620T G550T G530T G540T G630T G640T G860T G645T i7-875K i7-870S i7-860S i5-750S G1610T G2100T i5-665K CPU No. 1/1 1/2 1/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 2/2 Core/ Threads Dual CoreDual Quad Core

32nm 32nm 32nm 22nm 45nm 22nm Process Ivy Bridge Ivy Bridge Sandy Bridge Sandy Bridge Brand Core™ i3 Core™ i7 Core™ i5 Core™ i5 Celeron® Celeron® Pentium® Pentium® Pentium®

LGA1156 LGA1155

CPU SocketCPU Desktop Core™Desktop i7/i5/i3/Pentium 865G 945G 945G/ 945G/ 915GV 915GV 915GV 915GV/ Chipset G41/Q35/ Q45/G45/ Q965/945G Q965/945G Q965/945G 945G/3010/ 945G/3010/ Q965/ 945G/ NA NA TDP 84W 84W 84W 84W 84W 84W 84W 84W 84W 84W 84W 84W 84W 84W 84W 84W 86W 65W 86W 65W 35W 35W 35W 35W 95W 95W 95W 95W 95W 95W 95W 115W 115W 115W 115W 115W 115W 115W 115W 130W 130W 27W-31W 65W/86W 65W/86W 65W/86W 65W/86W 65W/86W 84W/115W 95W/130W 95W/130W 95W/130W 95W/130W L2 1M 4M 2M 2M 1MB 512K 512K 2X1M 2X1M Cache Yellow means long-term support Yellow 533 533 533 533 800 800 800 800 800 FSB 1066 3G 3G 3G 3G 3G 3G 1.6G 1.8G 3.4G 3.6G 3.4G 3.6G 3.4G 3.4G 3.6G 3.6G 3.6G 3.6G 3.0G 3.4G 2.8G 2.8G 3.8G 2.8G 2.8G 2.8G 2.8G 3.8G 3.8G 3.2G 3.2G 3.2G 3.2G 3.2G 3.2G 2.9G 3.2G Clock Clock 1.73G 3.73G 1.86G 3.46G 3.33G 2.66G 3.06G 2.00G 2.00G 2.20G Speed EX 511 517 515 519 516 915 No. 571 651 551 641 541 521 631 531 570 670 524 561 347 420 672 661 520 925 820 352 620 920 935 930 550 662 505 550 356 830 430 950 450 365 650 530 630 530 805 560 440 945 940 840 360 540 540 640 660 960 CPU Presler Prescott Conroe L Smithfield Cedar MillCedar Cedar MillCedar CPU Code Prescott2M Name Brand Brand Celeron Celeron Celeron Pentium 4 Celeron D Celeron Pentium D 65nm 65nm 65nm 65nm 90nm 90nm Process CPU Socket LGA775 LGA775

X48 G41 G41 G41 Q35 Q35 Q35 Q35 Chipset Q45/Q35 Q35/Q965 Prodcut with Q45/G45/G41/ Q45/G45/G41/ Q45/G45/G41/ Q45/G45/G41/ Q45/G45/G41/ Q45/G45/G41/ Q45/G45/G41/ Q45/G45/G41/ support E7400 Q45/Q35/G45/ Q45/Q35/G45/ Q45/Q35/G45/ iEi 945G/Q965 special BIOS to Q35/Q965/945G Q35/Q965/945G Q35/Q965/945G About IEI-2013-V10 TDP 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 65W 95W 65W 65W 65W 65W 65W 65W 65W 95W 95W 95W 95W 95W 95W 95W 95W/ 130W 130W 130W 130W 136W 130W L2 1M 1M 1M 1M 1M 1M 1M 1M 4M 4M 4M 4M 4M 4M 4M 4M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 4M 4M 2M 3M 3M 8M 8M 3M 3M 8M 8M 8M 6M 6M 6M 6M 6M 6M 6M 6M 12M 12M 12M 12M 12M 512K 512K 512K 512K Cache 800 800 800 800 800 FSB 1333 1333 1333 1333 1333 1066 1066 1066 1066 1066 1066 1600 2G 1.6G 1.6G 1.8G 1.8G 2.4G 2.4G 2.4G 2.6G 2.6G 2.4G 2.4G 3.0G 2.6G 3.0G 2.4G 2.0G 2.0G 2.8G 2.5G 2.2G 2.8G 3.0G 2.5G 3.0G 3.0G 2.2G 2.2G 2.5G 2.5G 3.2G 2.13G 2.13G 3.16G 1.86G 1.86G 2.93G 2.93G 2.93G Clock Clock 2.33G 2.33G 2.33G 2.53G 2.83G 2.66G 2.66G 3.33G 2.66G 2.66G 2.66G 2.83G 2.66G 2.66G 2.33G 2.66G 2.66G Speed E1200 E1400 E1500 E1600 E2140 E8190 E4700 E7400 E2180 E6750 E2160 E6700 E6420 E6320 E7500 E5200 E3200 E7200 E8200 E6550 E7300 E6850 E4500 E4300 E6650 E6540 E6500 E6300 X6800 E4600 E4400 E2220 E3300 E6300 E8500 E5300 E8300 E3400 E6400 E2200 E6600 E8400 E8600 Q6700 Q8200 Q9550 Q9450 Q9300 Q9650 Q8300 Q9400 Q6600 QX9770 QX6700 QX6850 QX9650 CPU No. Conroe Conroe Conroe Wolfdale Wolfdale Yorkfield Yorkfield Wolfdale Kenthfield Kenthfield CPU Code Quad Quad Name Brand Brand Core 2 Core 2 Core 2 Core 2 Celeron Celeron Celeron Celeron Extreme Extreme Dual CoreDual Dual CoreDual Dual CoreDual Dual CoreDual Pentium D Pentium D Core 2 Duo Core 2 Duo

65nm 65nm 45nm Process

CPU Socket

LGA775 Desktop LGA775 CPU List CPU LGA775 Desktop

www.ieiworld.com 32 www.ieiworld.com 33 QM87 Chipset Chipset QM57/HM55 QM77/QM67 QM77/QM67/HM65 AMT AMT 9.0 ------AMT AMT6.0 AMT6.0 AMT 7.0 AMT 7.0 AMT 7.0 AMT 7.0 AMT 7.0 AMT 7.0 AMT 7.0 AMT 7.0 AMT 7.0 AMT 7.0 AMT 7.0 AMT 7.0 AMT 8.0 AMT AMT 8.0 AMT AMT 8.0 AMT AMT 8.0 AMT AMT 8.0 AMT AMT 8.0 AMT AMT 8.0 AMT AMT 8.0 AMT AMT 8.0 AMT AMT 8.0 AMT 8.0 AMT Yellow means long-term support Yellow

Memory Types DDR3-1333/1600 800 MHz 1333 MHz 1333 1066 MHz 1066 MHz DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3-1066/1333 DDR3/L 1333/1600 DDR3/L DDR3/L 1333/1600 DDR3/L DDR3-1066/1333/1600 DDR3-1066/1333/1600 DDR3-1066/1333/1600 DDR3-1066/1333/1600 DDR3-1066/1333/1600 DDR3-1066/1333/1600 DDR3-1066/1333/1600 DDR3/L/-RS 1333/1600 DDR3/L/-RS 1333/1600 DDR3/L/-RS 1333/1600 DDR3/L/-RS 1333/1600 DDR3/L/-RS 1333/1600 DDR3/L/-RS 1333/1600 DDR3/L/-RS 1333/1600 DDR3/L/-RS 1333/1600 DDR3/L/-RS 1333/1600 DDR3/L/-RS 1333/1600 DDR3/L/-RS 1333/1600 DDR3/L/-RS 1333/1600 DDR3/L/-RS 1333/1600 DDR3/L/-RS 1333/1600 DDR3/L/-RS 1333/1600 DDR3/L/-RS 1333/1600 *HM65/HM55 chipset doesn’t support Intel® AMT feature *HM65/HM55 chipset doesn’t support Intel® Max Memory Speed (DDR3) ------Graphics Model Graphics 1 GHz 1 GHz 1 GHz 1 GHz 1 GHz Speed 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.1 GHz 1.0 GHz 1.0 1.3 GHz 1.3 GHz 1.3 GHz 1.3 GHz 1.3 GHz 1.3 GHz 1.3 GHz 1.3 GHz 1.3 GHz 1.3 GHz 1.3 GHz 1.3 GHz 1.3 GHz 1.3 GHz 1.3 GHz 1.2 GHz 1.2 GHz 1.2 GHz 1.2 GHz 1.2 GHz 500MHz Int. GFX 950 MHz 950 MHz 1.15 GHz 1.15 GHz 1.15 GHz 1.15 GHz 1.05 GHz 1.05 1.05 GHz 1.05 GHz 1.05 1.25 GHz 1.25 GHz 1.35 GHz GHz 1.05 1.25 GHz Intel® HD Graphics 4600 Intel® HD Graphics 4400 TDP TDP 45W 45W 55W 55W 45W 45W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W 47 W 37 W 37 W 25 W 25 W 35 W 35 W 45 W 35 W 45 W 45 W 35 W 35 W 35 W 45 W 45 W 45 W 45 W 35 W 45 W 45 W 35 W 35 W 35 W 45 W 45 W 45 W 45 W 45 W 35 W 55 W 35 W 35 W 55 W 55 W 55 W 35 W 35 W 35 W 35 W 35 W 35 W 35 W 35 W 35 W 35 W 35 W 35 W 35 W 35 W 35 W 35 W 35 W 35 W 35 W 35 W CPU List CPU CPU List 4M 4M 2M 2M 8M 3M 3M 3M 3M 3M 3M 3M 8M 8M 8M 3M 3M 3M 3M 3M 3M 6M 6M 6 MB 2 MB 6 MB 6 MB 2 MB 2 MB 2 MB 8 MB 6 MB 6 MB 6 MB 6 MB 2 MB 2 MB 6 MB 8 MB 8 MB 6 MB 6 MB 4 MB 8 MB 6 MB 6 MB 2 MB 6 MB 8 MB 8 MB 8 MB 6 MB 4 MB 6 MB 8 MB 8 MB 4 MB 6 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB 3 MB cache cache Smart Smart 1.5 MB ® ® 1.6G 2.4G 2.4G 2.4G 2.0G 2.0G 2.8G 2.13G 2.13G 1.73G 1.73G 1.86G 1.86G Clock Clock Clock 2.53G 2.53G 2.53G 2.66G 2.66G 2.66G 2.66G 2.66G 2.26G 2.26G 3 GHz 2 GHz speed speed 2.1 GHz 3.1 GHz 2.1 GHz 3.1 GHz 2.1 GHz 1.7 GHz 2.1 GHz 1.7 GHz 1.6 GHz 1.6 GHz 1.6 GHz 1.5 GHz 1.9 GHz 1.8 GHz 2.7 GHz 2.7 GHz 2.7 GHz 2.7 GHz 2.7 GHz 2.6 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.5 GHz 2.3 GHz 2.9 GHz 2.6 GHz 2.9 GHz 2.4 GHz 2.8 GHz 2.8 GHz 2.3 GHz 2.5 GHz 2.3 GHz 2.5 GHz 2.3 GHz 2.8 GHz 2.5 GHz 2.4 GHz 2.4 GHz 2.5 GHz 2.2 GHz 2.4 GHz 2.4 GHz 2.5 GHz 2.5 GHz 2.5 GHz 2.3 GHz 2.3 GHz 2.2 GHz 2.2 GHz 2.2 GHz 2.2 GHz 2.2 GHz About IEI-2013-V10 B710 B815 B810 B720 B820 B830 B840 B800 P4500 P4600 i7-620M i7-640M i3-370M i3-350M i3-330M i5-520M i3-380M i3-390M i5-580M i5-560M i5-540M i5-450M i5-480M i5-430M i5-460M CPU No. CPU No. i5-2510E i3-4102E i3-4100E i3-2330E i3-3110M i7-2620M i3-2312M i5-4402E i5-2410M i7-3520M i7-2640M i3-2310M i5-4400E i3-3120M i3-2370M i5-3210M i3-2328M i5-2520M i5-2435M i7-920XM i5-2450M i3-2350M i3-2330M i5-2430M i7-940XM i5-2540M i5-3320M i7-740QM i5-3360M i7-720QM i7-820QM i7-840QM i7-2710QE i7-3610QE i7-4700EQ i7-2920XM i7-3920XM i7-2960XM i7-3940XM i7-3740QM i7-3612QM i7-2670QM i7-3610QM i5-3610ME i7-2720QM i7-2760QM i7-3720QM i7-2820QM i7-3632QM i7-2630QM i7-2860QM i7-3820QM i7-3630QM i7-3840QM PGA BGA PGA Type Type Package Package Package Package 1/1 1/1 4/8 4/8 2/4 4/8 4/8 4/8 4/8 2/4 4/8 4/8 4/8 4/8 4/8 4/8 4/8 2/4 4/8 4/8 4/8 2/4 4/8 4/8 4/8 4/8 4/8 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/2 2/2 2/2 2/2 2/2 2/2 Dual Quad Core/ Core/ Threads Threads

32nm 32nm 32nm 32nm 32nm 22nm 22nm 22nm 45nm 22nm 22nm Haswell Haswell Process Process Ivy Bridge Ivy Bridge Ivy Bridge Ivy Bridge Sandy Bridge Sandy Bridge Sandy Bridge Sandy Bridge Sandy Bridge Brand Brand Edition Edition Core i7 Core i3 Core i5 Celeron Core™ i7 Core™ i7 Core™ i7 Core™ i7 Core™ i7 Core™ i3 Core™ i5 Core™ i3 Core™ i3 Core™ i5 Core™ i5 Celeron® Extreme Edition Extreme Extreme Edition Extreme Core i7 Extreme

CPU CPU Socket Socket rPGA988B rPGA988B Socket988A FCBGA1168

Mobile Core™ i7/i5/i3/Celeron Mobile Core™ Mobile i7/i5/i3/Celeron GS45 GM45 GL40/ GM45/ Chipset GLE960 GLE960 GLE960 945GME GME965 GME965/ GME965/ GME965/ N/A 31W 31W 31W 31W 31W 31W 31W TDP 17W 17W 17W 17W 17W 10W 10W 10W 10W 10W 10W 10W 34W 34W 34W 34W 34W 34W 34W 44W 44W 35W 27W 35W 35W 35W 30W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W 5.5W 5.5W 5.5W L2 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 4M 4M 4M 4M 4M 2M 2M 4M 4M 4M 4M 2M 4M 4M 4M 2M 2M 2M 2M 2M 2M 2M 2M 2M 4M 2M 4M 2M 2M 2M 2M 2M 2M 3M 3M 512K 667 667 667 667 533 533 533 533 800 800 800 FSB (MHz) 1.6G 1.6G 1.4G 1.6G 1.6G 1.4G 1.5G 1.8G 1.0G 1.8G 1.5G 1.8G 1.3G 1.3G 1.2G 1.2G 1.2G 1.2G 1.2G 2.0G 2.6G 2.4G 2.0G 2.0G 2.0G 2.0G 2.6G 2.0G 2.0G 2.0G 2.0G 2.2G 2.8G 2.13G 2.16G 2.16G 2.16G 1.73G 1.73G 1.73G 1.83G 1.33G 1.46G 1.66G 1.33G 1.83G 1.66G 1.83G 1.06G 1.66G 1.86G 1.86G Clock Clock 2.33G 2.26G 2.00G Speed 575 570 573 550 550 530 585 560 540 BGA) BGA) BGA) BGA) L7400 T1700 (BGA) (BGA) (BGA) (BGA) (BGA) (BGA) (BGA) L7200 L7500 L7700 (PGA/ (PGA/ T2310 (PGA/ (PGA/ L7300 T5270 T5470 T7100 T7400 T1600 T5750 T5870 T2370 T5670 T5250 T5200 T2450 T7250 T5550 T3200 T7200 T5500 T2330 T7500 T7700 T5600 T7600 T5300 T5450 T5800 T2390 T7800 T7300 T3400 X7800 X7900 U7500 U7700 U7600 SU2300 SU3500 SU3300 ULV 743 ULV 723 ULV 722 CPU No. Size BGA BGA Package Package 35x35mm 35x35mm 35x35mm 35x35mm 35x35mm 35x35mm 35x35mm 35x35mm 22x22mm 22x22mm 22x22mm 22x22mm Merom Merom Merom Merom Merom Merom Penryn Reflash) Refresh) (Montevina) (Montevina) (Montevina) Code Name Code (Santa Rosa Rosa (Santa (Santa Rosa) (Santa Meron (Napa (Santa Rosa) (Santa (Santa Rosa) (Santa Core 2 Extreme Celeron M Celeron Core 2 Duo Core 2 Duo Core 2 Solo 2 Core Core MobileCore Core MobileCore Brand Name Brand Pentium Dual Dual Pentium Pentium Dual Dual Pentium Celeron Mobile Celeron 65nm 45nm 65nm

(HDI- Package Type Package 956pin) Socket Socket P Socket Socket M Socket GS45 GM45 Chipset GME965 GM45/5100 GM45/GL40 GM45/GL40/ N/A TDP 17W 17W 17W 17W 10W 10W 10W 28W 25W 44W 25W 25W 44W 25W 25W 25W 25W 25W 25W 25W 25W 25W 25W 25W 35W 35W 35W 35W 35W 35W 45W 35W 45W 45W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W 35W About IEI-2013-V10 L2 1M 1M 1M 1M 1M 1M 3M 3M 6M 2M 2M 6M 2M 2M 6M 6M 6M 6M 6M 3M 3M 3M 6M 6M 6M 6M 6M 3M 3M 6M 6M 3M 3M 6M 3M 3M 3M 6M 6M 3M 3M 6M 6M 6M 12M 12M 800 800 800 800 800 800 FSB 1066 1066 1066 (MHz) 2G 2.1G 2.1G 2.1G 1.6G 1.4G 1.6G 1.8G 1.2G 1.9G 2.6G 2.4G 2.4G 2.0G 2.8G 2.5G 2.0G 2.4G 2.8G 2.0G 2.0G 2.0G 2.8G 2.2G 2.2G 2.2G 2.2G 2.13G 2.13G 1.86G Clock Clock 2.93G 2.53G 2.53G 2.53G 2.66G 2.53G 2.53G 2.26G 2.66G 3.06G 3.06G 2.26G 2.66G 2.26G 2.26G 2.26G Speed 900 BGA) BGA) BGA) BGA) BGA) BGA) BGA) BGA) BGA) BGA) BGA) BGA) BGA) BGA) BGA) (BGA) T4200 (PGA/ (PGA/ (PGA/ (PGA/ (PGA/ (PGA/ (PGA/ (PGA/ (PGA/ (PGA/ (PGA/ (PGA/ (PGA/ (PGA/ (PGA/ T8100 T3100 T4300 T4400 T6670 P7450 P7375 P7570 P7370 X9100 T9300 T9550 T9550 T6500 T8300 T9500 T6400 T3300 P8700 T6600 T9400 T9400 T9800 T9800 P7550 P9700 T9600 T9900 P8800 P8400 X9000 P8600 P8600 P9500 P9500 P9600 Q9100 Q9000 SL9380 SL9300 SL9400 SL9600 SP9300 SP9400 SP9600 SU9300 SU9400 SU9600 QX9300 CPU No. Size BGA Package Package 35x35mm 35x35mm 35x35mm 22x22mm 22x22mm Penryn Penryn Penryn Penryn Penryn Reflash) (Montevina) (Montevina) (Montevina) (Montevina) Code Name Code (Santa Rosa Rosa (Santa Mobile Core 2 Core 2 Celeron Celeron Extreme Extreme Core 2 Duo Core 2 Duo Core 2 Duo Core MobileCore Core Quad 2 Brand Name Brand Pentium Dual Dual Pentium

45nm 45nm

(HDI- Package Type Package 956pin) Socket P Socket

Socket P Socket Mobile Socket P/M/479 CPU List CPU P/M/479 Socket Mobile

www.ieiworld.com 34 www.ieiworld.com 35 Chipset 852GME 852GME 915GME/ 915GME/ 855GME/ 855GME/ 855GME/ 855GME/ NA 5W 5W 5W 7W 7W 7W 7W 7W 7W 21W 21W 21W 21W 21W 21W 21W 21W 21W 21W TDP 12W 12W 12W 24W 10W 10W 22W 27W 7.5W 7.5W 5.5W 5.5W 5.5W 5.5W 24.5W 24.5W 24.5W 24.5W 24.5W 24.5W 24.5W 24.5W L2 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2MB 512K 512K 512K 512K 512K 512K 512K 512K 512K 400 400 400 FSB (MHz) 1G 1G 1.1G 1.1G 1.1G 2.1G 1.7G 1.7G 1.7G 1.6G 1.6G 1.4G 1.3G 1.4G 1.5G 1.8G 1.8G 1.0G 1.6G 1.6G 1.4G 1.3G 1.2G 1.0G 1.4G 1.6G 1.5G 1.3G 1.3G 1.5G 1.3G 1.5G 1.5G 1.2G 1.2G 1.5G 2.0G Clock Clock Speed Yellow means long-term support Yellow 800Mhz 900MhZ 900MhZ 900MhZ 600MHz NA NA NA NA NA NA 715 310 725 735 330 340 745A BGA) BGA) BGA) BGA) BGA) BGA) BGA) BGA) BGA) BGA) (BGA) (BGA) (BGA) (BGA) LV 718 LV 738 LV ULV 373 ULV ULV 333 ULV ULV 353ULV ULV 383ULV CPU No. NA (BGA) NA (BGA) NA (BGA) NA (BGA) NA (BGA) NA (BGA) 713 (BGA) 745 (PGA/ 753 (BGA) 758 (BGA) 778 (BGA) 723 (BGA) 370 (PGA/ 773 (BGA) 755 (PGA/ 733 (BGA) 765 (PGA/ 320 (PGA/320 705 (PGA/ 350 (PGA/ 380 (PGA/ 390 (PGA/ 360 (PGA/ Size 35x35m Package Package 35x35mm Banias Banias Dothan Code Name Code Celeron M Celeron Celeron M Celeron Pentium M Pentium M Brand Name Brand 90nm 130nm Note: 45nm Penryn Core 2 Extreme/Core 2 Quad core CPU support by project. 479 Socket Socket Package Type Package Chipset 915GME 945GME 945GME 9W 9W 6W 6W 6W 31W 31W 31W 31W 31W 31W 31W 31W 31W 31W 31W 31W 31W 31W 31W TDP 17W 15W 15W 10W 10W 10W 27W 27W 27W 30W 30W 27W 27W 27W 27W 27W 27W 27W 27W 27W 27W 5.5W 5.5W 5.5W 5.5W 5.5W About IEI-2013-V10 L2 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 2M 667 667 533 533 533 533 533 533 533 FSB (MHz) 2G 2G 1.6G 1.6G 1.6G 1.6G 1.6G 1.5G 1.2G 1.2G 1.2G 1.2G 1.2G 2.0G 2.0G 2.13G 2.16G 1.73G 1.73G 1.73G 1.73G 1.73G 1.73G 1.83G 1.83G 1.33G 1.33G 1.66G 1.66G 1.66G 1.83G 1.46G 1.66G 1.06G 1.06G 1.06G 1.86G 1.06G 1.86G 1.86G 1.86G 1.06G 1.86G Clock Clock 2.33G 2.26G Speed 930MHz 410 420 520 450 430 BGA) BGA) BGA) BGA) BGA) BGA) BGA) BGA) BGA) (BGA) (BGA) (BGA) (BGA) (BGA) (BGA) (BGA) (BGA) (BGA) T1250 (BGA) (BGA) (BGA) (BGA) T1350 (PGA/ (PGA/ T1400 T2130 T1300 L2400 L2500 L2300 T2700 T2450 T2400 T2250 T2350 T2050 T2500 T2080 T2300 T2600 T2060 U1400 U1300 U1500 U2100 U7700 U7500 U2400 U7600 U2500 U2200 T2300E ULV 423ULV ULV 523ULV ULV 530ULV ULV 443ULV CPU No. 740 (PGA/ 750 (PGA/ 770 (PGA/ 760 (PGA/ 780 (PGA/ 730 (PGA/ 440 (PGA/ Size Package Package 35x35mm 35x35mm 35x35mm 35x35mm 35x35mm 35x35mm 35x35mm 35x35mm (Napa (Napa Yonah Yonah Yonah Merom Merom Merom Dothan Reflash) Reflash) Reflash) Code Name Code (Santa Rosa Rosa (Santa (Santa Rosa Rosa (Santa Core Duo Core Solo Core Celeron M Celeron Celeron M Celeron Pentium M Core Duo 2 Core 2 Solo 2 Core Core MobileCore Brand Name Brand Pentium Dual Dual Pentium

65nm 65nm 65nm 90nm

479 Socket Socket Package Type Package Socket M Socket Socket M Socket

Socket M Socket Mobile Socket P/M/479 CPU List CPU P/M/479 Socket Mobile PCI & ISA half-size SBC & ISA PCI half-size SBC half-size PCI+PCIe ■ ■ About IEI-2013-V10 (mm) PICMG 1.0 full-size SBC full-size PICMG 1.0 PICMG 1.3 full-size SBC full-size 1.3 PICMG ■ ■

PCI half-size SBC half-size PCI ISA half-size SBC ISA half-size ■

■ IEI SBC Dimensions Dimensions SBC IEI

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