MindShare DRAM Quick Reference Guide (Rev 5a) DRAM Terms and Glossary Rev 5a DIMM Dual In-line Memory Module NF No Function, DNU, T 1T, 2T, 3T, etc. timing, By John Swindle, Precept Technologies, Inc. DM Data Mask connected on die as 1N, 2N, etc. Please report errors or additions to DNU Do Not Use, NF, connected on die OCD Off-Chip Driver tCK Time for one tick of CK
[email protected] DQ Data ODT On-Die Termination t JEDEC timing spec XXX XXX T JEDEC Temperature spec XXX 3DS 3 Dimensional Silicon or Stack DQS Data Strobe OTF On The Fly XXX DRAM Dynamic Random Access Memory PASR Partial Array Self Refresh TDQS Termination DQS, not RDQS ab, AB All Banks (LPDDRs), ECC Error Checking and Correcting pb per bank TSOP Thin Small Outline Package AP in PC DDRs eMMC Embedded Multi-Media Card TSV Through Silicon Via ACT Active aka Activate command PC3 DDR3, informally EMRS Extended Mode Register Set TUF Temperature Update Flag AL Additive Latency, 0 to 5 for DDR2, PC4 DDR4, informally command PCH Intel Platform Controller Hub UDIMM Unbuffered DIMM 0, CL-1, or CL-2 for DDR3 & 4, FBDIMM Fully-Buffered DIMM PDA Per-DRAM Addressability UDM Upper Data Mask RL = AL + CL + PL FBGA Fine-pitch BGA UDQS Upper Data Strobe AMB Advanced Memory Buffer PEC SMB Packet Error Checking GDDR Graphics DDR, UFS Universal Flash Storage AMBA Advanced Microcontroller Bus PHY Physical Layer not JEDEC DDR1, 2, 3 PL Parity Latency UFSA Universal Flash Storage Association Architecture HBM High Bandwidth Memory PLL Phase-Locked Loop UI Unit Interval, AP Auto Precharge, Precharge