Issue 122 Fall/Winter 2013
Committed to Providing Members with Technical Information Neededto Stay Ahead in the PCM Industry.
This Journal contains the technical papers and presentations from the Fall International Conference held in Seattle, Washington, USA.
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As a member you know that there are many benefits to belonging to PCMI. We publish numerous technical documents, this journal and a membership directory, conduct two conferences each year, and provide technical assistance, networking opportunities, mentoring, business referrals, and access to new research.
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Issue 122 Fall/Winter 2013 PCMI Journal Page 2 photo chemical machining institute
Photo Chemical Machining Institute The PCMI Journal is the official publication of the Photo Chemical Machining Institute. Its purpose Officers and Directors is to serve the needs of the PCMI members: to keep them up-to- date on activities of the PCMI and President Joe Beck, Capital Sourcing, LLC to provide technical information Vice President Bill Fox, Conard Corporation on the industry. To make the PCMI Journal as valuable as Treasurer Eric Kemperman, Etchform possible, we ask that members Secretary Philip Greiner, Photofabrication Engineering Inc. contribute technical articles and newsworthy items, including new material on state of-the-art photo Board of Directors Emeritus Prof. David Allen, Cranfield University chemical machining – equipment, Sean Dooley, Northwest Etch Technology, Inc. techniques, etc. Jan Kilen, HP Etch AB & ParaTech Coating We also accept articles that have Harrie Knol, Stork Veco B.V. appeared in other publications if Mike Lynch, United Western Enterprises, Inc. they are relevant to our members. Anthony Marrett, Precision Micro All material should be forwarded electronically in jpeg format to Mike Soble, Chemcut Corporation [email protected]. Marc Veale, PVS Technologies
Advertising is accepted for both the PCMI Journal and the annual PCMI Active Past Presidents Dick Beaupre, ChemArt Co. Directory. Paolo Iellici, Chemical Machining SpA J. Kirk Lauver, Chemcut Corporation For information concerning ad deadlines, formats, sizes and rates Charles Lehrer, Photofabrication Engineering, Inc. contact the PCMI Office: Hugh McCallion, Senior Member Chet Poplaski, Newcut, Inc. PCMI 11 Robert Toner Blvd., #234 Carl Whinery, Senior Member North Attleboro, MA 02763 Jerry Williams, United Western Enterprises Phone: (508) 385-0085 Heimeran Von Stauffenberg, Metaq GmbH Fax: (508) 232-6005 [email protected] www.pcmi.org
Issue 122 Fall/Winter 2013 PCMI Journal Page 3 Table of Contents
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Letter from Joe Beck, PCMI President------6 PCMI Journal Advertisers Letter from Catherine Flaherty, PCMI Executive Director------7 Company Page Calendar of Events------8 PCMI Member Get Member ------2 www.pcmi.org Welcome New Members | People In the News ------9 508-385-0085
New England PCMI Chapter Dinner Meeting Invite------10 Chemcut Corporation------181 www.chemcut.net International Fall Conference Photos------11 - 12 800-CHEMCUT
SCHMID Group|Gebr. SCHMID GmbH.-----184 International Fall Conference Technical Presentations------13 - 181 www.schmid-group.com 49 7441 538-494 PCMI 2014 Advertising Opportunities------182
PVS Technologies------183 www.pvstechnologies.com
Issue 122 Fall/Winter 2013 PCMI Journal Page 4 Table of Contents Technical Presentations Fall 2013 Conference photo chemical machining institute
Technical Presentations
Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK------13-37
LDI Systems Frank Bell | Aiscent Technologies, Inc. | US------38-51
Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US ------52-88
Laser Cutting Jeff Klein | Tacoma Steel | US------89-97
Titanium Etching, Chapter II Randy Markle | Chemcut | US ------98-119
New Product and Services Showcase Heather McCrabb | Faraday Technology, Inc. | US------120-126
Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US------127-156
Human Resources Interactive Ideas Exchange | How to Motivate, Train and Educate Mat Simpkins | United Western Enterprises | US------157-161
Workforce Safety Kris Stanford | NW Etch------162-165
How to Optimize Dry Film Adhesion to Various Metal Surfaces Bill Wilson | DuPont Electronic Technologies | US------166-180
Issue 122 Fall/Winter 2013 PCMI Journal Page 5 Letter From the President photo chemical machining institute
Hello PCMI Members,
In the following pages you will find the presentations given at the Fall International Conference, which was held in Seattle, Washington from October 5 – 10, 2013. The presentations were a collection of technical papers and interactive information exchanges all designed to provide attendees with a wide range of educational experiences.
Our conference sponsors made it possible for PCMI to conduct these outstanding presentations, as well as the networking events. I want to take this opportunity to thank the fall meeting sponsors. Their contribution to the conference is appreciated. The conference sponsors include: Joe Beck Northwest Etch Technology, Inc., Platinum Sponsor Chemcut Corporation, Gold Sponsor Phibro-Tech, Inc., Silver Sponsor Advanced Metal Etching, Bronze Sponsor Form Factor Design, Bronze Sponsor Magnesium Elektron, Bronze Sponsor
Special thanks are also due to the PCMI Fall Conference Committee for their hard work. They included:
Emeritus Prof. David Allen, Cranfield University Philip Greiner, Photofabrication Engineering, Inc. Glenn Dooley, Northwest Etch Technology, Inc. Sean Dooley, Northwest Etch Technology, Inc. Mike Lynch, United Western Enterprises, Inc. Mat Simpkins, United Western Enterprises, Inc.
We are now planning the Spring 2014 Conference to be held in Switzerland. Our host for the Spring Conference is CMT Rickenbach SA and we are working with Damian von Rickenbach and the Conference Committee to ensure that the technical sessions give you the information you need to stay current with new technologies and innovations in the pcm industry.
Other Spring Conference Committee members include David Allen from Cranfield University, Philip Greiner from Photofabrication Engineering, Inc., and Harrie Knol from Veco B.V. We are all open to ideas so if you have a suggestion for a topic or presentation for the spring conference, please let me know. We would also welcome your participation in the Spring Conference Committee.
In closing let me wish you happy hoildays and the best for 2014.
Best Regards,
Joe Beck, Capital Sourcing, LLC PCMI President [email protected]
Issue 122 Fall/Winter 2013 PCMI Journal Page 6 Letter From the Executive Director
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Hello PCMI Members,
We are pleased to present the Fall/Winter Journal, which includes the presentations from the Fall 2013 International Technical Conference, which was held at the Alexis Hotel in Seattle, Washington, US.
Special thanks are due to NW Etch, PCMI’s Fall Conference hosts. The Dooley Family including Sean, Glenn, John and Sonja were very gracious hosts. We thank the NW Etch team for the tour of their facility, for hosting the lunch and for coordinating, networking and social events that allowed the Catherine Flaherty conference attendees to see and experience the best of Seattle.
We are now getting ready for the spring technical conference to be held in Neuchâtel, Switzerland from May 24 – 29, 2014.
In the coming months PCMI will also host a California Chapter Lunch Meeting and a New England Chapter dinner. Plans are also underway to coordinate a networking program in Asia.
The New England Chapter Dinner will be held January 16, 2014. During the meeting Rob Willington from Swiftcurrent Strategies will make a presentation to help PCMI members use social media more effectively to increase sales. This meeting will be held at the Holiday Inn Mansfield/Foxboro from 5:30 pm – 8:30 pm. To register online click here.
The California Chapter Lunch Meeting will be held on March 5, 2014. The Asian Chapter event is still in development.
This fall PCMI will also host a Southern California Chapter lunch meeting. The event will be held at Luminarias Restaurant in Monterey Park, CA on Wednesday, September 11, 2014. The event will feature an environmental reports and regulations update from Anil Rana, with VACCO Industries.
The event will be sponsored by Phibro-Tech. If you are interested in attending the Chapter Meeting please contact Mat Simpkins at United Western Enterprises.
PCMI continues to make every effort to provide you with opportunities to network, learn and grow. We appreciate your membership and hope that you will find this Journal informative, educational and of value to your business.
I look forward to seeing you at one or more of PCMI upcoming events.
Best Regards,
Catherine Flaherty Executive Director [email protected]
Issue 122 Fall/Winter 2013 PCMI Journal Page 7 Calendar of Events
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January 16, 2014
PCMI New England Chapter Dinner Meeting Using Social Media Effectively | Digital Content Marketing
Presented by: Rob Willington, Partner, Swiftcurrent Strategies
Holiday Inn Mansfield/Foxboro 5:30 pm – 8:30 pm
Click here to register online
Click here to download an invitation and registration form ______
March 5, 2014
California Chapter Lunch Meeting Dry Film Imaging Including Laser Direct Imaging
Presented by: Tritek Circuit Products Luminarias Restaurant 500 W. Ramona Blvd., Monterey Park, CA More details coming soon! ______
May 24 – 29, 2014
Spring Conference La Chaux-de-Fonds, Switzerland More details coming soon!
Issue 122 Fall/Winter 2013 PCMI Journal Page 8 Welcome New Members People in the News photo chemical machining institute
Welcome New Members
DuPont Electronics & Communications Faraday Technology, Inc. 14 TW Alexander Drive 315 Huls Drive Research Triangle Park, NC 27709 Clayton, OH 45315 UNITED STATES Phone: (919) 248-5407 Phone: (937) 836-7749 Fax: (919) 248-5132 Fax: (937) 836-9498 www.dupont.com www.faradaytechnology.com Bill Wilson, Sr. Technical Specialist Heather McCrabb, Principal Scientist [email protected] [email protected] Equipment manufacturer Common Metals, Contract R&D, Exotic UNITED STATES Metals, Plating Three acknowledgements for DSc UNITED STATES recognition on 6th June 2013 My family
Mekoprint Chemigraphics Mercurvej 1-3 DK-9530 Stovring, Denmark Phone: (459) 936-5600 My friends in Fax: (459) 936-5603 www.mekoprint.dk Stefan Kowalski, Business Unit Manager [email protected] In June, David Allen recieved the higher doctoral degree of DSc from Cranfield University for his Chemical Milling, CNC Punching, Hard Tool thesis entitled “Contributions to Photochemical Punching/Stamping,Reel packaging, Machining and Photoelectroforming.” Engineering/Construction DENMARK Congratulations David!
Issue 122 Fall/Winter 2013 PCMI Journal Page 9 New England Chapter Dinner
photo chemical machining institute
The New England PCMI Chapter is pleased to invite you to attend a dinner meeting on Thursday, Fees (US $) January 16, 2014. PCMI Members $35.00
Using Social Media Effectively | Digital Content Non-Members $70.00 Marketing Sponsorship $300.00 Presented by: Rob Willington, Partner, Swiftcurrent Strategies ______
Holiday Inn Mansfield/Foxboro Quick Links 5:30 pm - 8:30 pm Online registration During this presentation you will review the digital tools and Cathy Flaherty networks that your company should be using to promote itself and increase traffic to your website. You will review some best Victoria Ranko practices for expanding your database and techniques to increase sales awareness for your business, products and services. 508-385-0085 Members and nonmembers are invited to attend. For members the dinner will give you the chance to reconnect with friends. ______For future PCMI members, the meeting will give you a chance to network with colleagues and find out what is happening and what is relevant to the pcm industry today. Click here to read more about Rob Willington and PCMI Sponsorship is Good for Your Business Swiftcurrent Strategies.
PCMI sponsors support the Institute efforts to service and provide benefits to the photo chemical machining industry through education, publications, technical information and assistance, networking, mentoring, business referrals and industry trends; As a dinner meeting sponsor you will:
• Have the opportunity to promote your company’s products or services during the dinner at a tabletop display; • Gain access to key photo chemical machining industry leaders at one time and in one place; • Have your company name on the PCMI website front page, linked to your company website; • Obtain special recognition during the dinner in the marketing materials and in the Program Booklet.
Issue 122 Fall/Winter 2013 PCMI Journal Page 10 International Fall Conference Seattle, Washington | US | October 5 - 10, 2013 photo chemical machining institute
Special Thanks Click here for more photos of the 2013 Fall Conference 2013 Fall Conference Sponsors Platinum
Gold
PCMI conference attendees pose before the TIllicum Native Cruise.
Silver
Bronze
On left Michael Lynch from United Western Enterprises with Eric Kemperman from Etchform BV. Bronze
Bronze
On left, Sean Dooley from NW Etch and Harrie Knol from Vecco with Frank Bell and Dr. Wenhai Lui from Aiscent Technologies, Inc.
Issue 122 Fall/Winter 2013 PCMI Journal Page 11 International Fall Conference Seattle, Washington | US | October 5 - 10, 2013 photo chemical machining institute
Randy Markle from Chemcut gave a Titanium Etching presentation. His session was first rate and he entertained the conference with his “golf” hat and Hawaiian Shirt. Mary and Phil Greiner from Photofabrication Engineering, Inc. (PEl).
From left, Jerry Williams and Shirley Nerdrum, United On left, Peter Engel from Newcut, Inc. with Western Enterprises, Inc; Randy Markle, Chemcut David Marquis from ChemArt Company. Corporation; Sylvain Lacroix, L. S. Starrett; Gary Ng, Tecford Etchem Ltd; and Peter Engel, Newcut, Inc. with John Dooley giving a tour of his company, NW Etch.
On left, Carl Whinery, formerly with NW Etch, John Dooley, PCMI Conference attendees during the technical NW Etch and Chet Poplaski, PCMI Retired Member. presentations.
Issue 122 Fall/Winter 2013 PCMI Journal Page 12 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK
photo chemical machining institute
David Allen Cranfield University | UK
Presentation: Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave?
Emeritus Professor David Allen started his career as a chemist (BSc, 1968) and moved into photochemistry research (PhD, 1972) while studying at Cardiff University. Following post-doctoral research at Warwick University and imaging technology development in industry, David joined Cranfield University in 1976.
David was appointed as a Technical Liaison Member to the Photo Chemical Machining Institute (PCMI) in 1981. He is currently on the Board of Directors of PCMI. David became Professor of Microengineering at Cranfield University in 1998 and was elected as a Fellow of The International Academy for Production Engineering in 2006. David has published:
• the only PCM book written in English: The Principles and Practice of Photochemical Machining and Photoetching • three book chapters on non-conventional machining • seven confidential industrial PCM consortium reports and • more than 180 journal and conference papers.
David retired in 2011 and he now carries out consultancy and staff training in photochemical machining companies across the world. In June of this year, David recieved the higher doctoral degree of DSc from Cranfield University for his thesis entitled “Contributions to Photochemical Machining and Photoelectroforming.”
Please click here for the electronic version of Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave?
Sustainable ferric chloride etchant: cradle-to-cradle or cradle-to-grave? The Alexis Hotel Seattle, USA 7th October 2013
Emeritus Professor David Allen BSc, PhD, DSc Cranfield University, UK © D.M. Allen [email protected]
Issue 122 Fall/Winter 2013 PCMI Journal Page 13 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University11/25/13 | UK photo chemical machining institute
LCA: Life Cycle Analysis/Assessment
Definitions: • LCA; a technique to assess environmental impacts associated with all the stages of a product’s life from cradle-to-grave (i.e. from raw materials extraction through materials processing, manufacture, distribution, use, repair and maintenance, and disposal or recycling). • Cradle-to-cradle is a specific kind of cradle-to-grave assessment, where the end-of-life disposal step for the product is a recycling process. From the recycling process originate new, identical or different products.
LCA of ferric chloride – the “birth”
• The purest ferric chloride is made from Reagent Grade iron and Burner Grade hydrochloric acid (HCl). • The acid is prepared by burning excess chlorine in hydrogen:
Cl2 + H2 → 2HCl • The acid is reacted with the iron to form ferrous chloride which is then oxidised to ferric chloride by reaction with chlorine gas:
2HCl + Fe → FeCl2 + H2 2FeCl2 + Cl2 → 2FeCl3 • Ferric chloride of a lower purity can be made from steel and a secondary source hydrochloric acid.
Issue 122 Fall/Winter 2013 PCMI Journal Page 14 2 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK 11/25/13 photo chemical machining institute
FeCl3 etchants are versatile and used in manufacturing to etch a wide range of metals and alloys:
• Aluminium and its alloys; Alfenol (12-16% Al-Fe) • Copper and its alloys; brass, phosphor bronze and lead-frame alloys • Carbon steels • Ferrous alloys; stainless steels (containing Cr and Ni) and Kovar (containing Ni and Co) • Molybdenum (very slow) • Nickel and its alloys; Alloy 42, HyMu, Invar, Monel, Mumetal, Nimonics • Tin
Etching of these materials will produce spent (waste) ferric chloride etchant
Disposal of waste ferric chloride etchant is now becoming costly! Whilst training staff at a commercial PCM company, I made the statement: “Some PCM companies pay more to dispose of waste ferric chloride than they do to purchase fresh ferric chloride!” I was challenged to prove that statement and that necessitated some research leading to the following:
Issue 122 Fall/Winter 2013 PCMI Journal Page 15 3 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK 11/25/13 photo chemical machining institute
Costs of disposal of waste ferric chloride compared to its purchase price on 4th March 2013 Key: Country % of disposal cost compared to Lowest purchase price value Italy 104.0 Highest Germany 66.7 Value Denmark 81.5 Sweden 106.4 Switzerland 53.8 UK 24.9 USA 66.4 USA 146.8 USA 13.4
Average 73.8
Disposal of waste ferric chloride etchant has become costly!
PCM companies need: • to reduce the purchasing of fresh ferric chloride and • to reduce spent etchant disposal as waste to landfill.
Etchant recycling via etchant regeneration allows this!
What has been the past practice in commercial PCM?
Issue 122 Fall/Winter 2013 PCMI Journal Page 16 4 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University11/25/13 | UK photo chemical machining institute
The fate of waste ferric chloride etchant (D.M. Allen and L.T. Ler, Journal of Environmental Monitoring,1998)
Waste Ferric Chloride Etchant
Liquid Solid
Reclaim/ Contractor Contractor Reclaim/ Recycle (18.0%) (12.8%) Recycle (59.0%) (10.2%)
Landfill (30.8%)
The fate of waste ferric chloride etchant (D.M. Allen and L.T. Ler, Journal of Environmental Monitoring,1998)
Waste Ferric Chloride Etchant
The best Liquid Solid option for PCM
Reclaim/ Contractor Contractor Reclaim/ Recycle (18.0%) (12.8%) Recycle (59.0%) (10.2%)
Landfill (30.8%)
Issue 122 Fall/Winter 2013 PCMI Journal Page 17 5 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University11/25/13 | UK photo chemical machining institute
The fate of waste ferric chloride etchant (D.M. Allen and L.T. Ler, Journal of Environmental Monitoring,1998)
Waste Ferric Chloride Etchant
The best Liquid Solid option for PCM
Reclaim/ Contractor Contractor Reclaim/ Recycle (18.0%) (12.8%) Recycle (59.0%) (10.2%)
The solid waste can be a useful feedstock in smelting processes for metal production. Landfill (30.8%)
The fate of waste ferric chloride etchant (D.M. Allen and L.T. Ler, Journal of Environmental Monitoring,1998)
Waste Ferric Chloride Etchant
The best in-house Liquid Solid option for PCM
Reclaim/ Contractor Contractor Reclaim/ Recycle (18.0%) (12.8%) Recycle (59.0%) (10.2%)
Ores are The solid waste can be oxides too! a useful feedstock in smelting processes for metal production. Landfill (30.8%)
Issue 122 Fall/Winter 2013 PCMI Journal Page 18 6 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University11/25/13 | UK photo chemical machining institute
The fate of waste ferric chloride etchant (D.M. Allen and L.T. Ler, Journal of Environmental Monitoring,1998)
Waste Ferric Chloride Etchant
The best Liquid Solid option for PCM
Reclaim/ Contractor Contractor Reclaim/ Recycle (18.0%) (12.8%) Recycle (59.0%) (10.2%)
Ores are The solid waste can be Mixed with lime in USA to oxides too! a useful feedstock in convert to insoluble oxide smelting processes and converted to insoluble for metal production. sulphide in UK. This prevents Landfill (30.8%) leaching of the heavy metals into rainwater/groundwater.
The chemistry of FeCl3 etching (1)
In the etching of metals 1. Metal is dissolved by oxidation, e.g. Fe + oxidising agent (etchant) → soluble ferrous (Fe2+) salt + reduced etchant
2. The oxidising agent is usually ferric chloride Ferric chloride → Ferrous chloride
Issue 122 Fall/Winter 2013 PCMI Journal Page 19 7 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University11/25/13 | UK photo chemical machining institute
The chemistry of FeCl3 etching (2) Chemically: Fe → Fe2+ + 2e- (metal oxidation) 2Fe3+ + 2e- → 2Fe2+ (reduction of the ferric chloride etchant) Adding the above two equations: Fe + 2Fe3+ → 3Fe2+ (overall reaction)
Or, simply, Fe + 2FeCl3 → 3FeCl2
How does the ferric ion arrive at the metal surface to etch it?
• The ion needs to diffuse through the bulk solution and pass through a surface layer to react with the metal
• After etching, the ion then has to diffuse away from the surface so that fresh ions can come to the surface for the reaction to continue.
• The etching mechanism is therefore diffusion controlled and the rate of diffusion is dependent on the viscosity of the ferric chloride.
Issue 122 Fall/Winter 2013 PCMI Journal Page 20 8 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK 11/25/13 photo chemical machining institute
For diffusion-controlled kinetics:
d[M ] ADC − = dt S where –d[M]/dt is the rate of dissolution of metal (mmol s-1), A is the surface area of metal exposed to the etchant (cm2), D is the diffusion coefficient (cm2 s-1), C is the concentration of etchant (mol l-1) and S is the diffusion layer thickness (cm).
According to the equation:
• Increasing concentration of ferric chloride will increase etch rate.
d[M ] ADC − = dt S
• Q. Does it? • Experiments show that this is not always the case!
Issue 122 Fall/Winter 2013 PCMI Journal Page 21 9 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University11/25/13 | UK photo chemical machining institute
Diffusion controls the maximum dissolution/etch rate achievable
Why does the graph peak?
• When the concentration of ferric chloride increases, the viscosity of the etchant also increases!
• If the viscosity of the etchant increases then this slows the diffusion of the ferric ion to the metal surface. {Analogy: not easy to swim in treacle!}
• The balance between D and C controls the shape of the Dissolution rate v. [FeCl3] graph.
Issue 122 Fall/Winter 2013 PCMI Journal Page 22 10 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK 11/25/13 photo chemical machining institute
Consider the effects of etchant concentration on etch rate
• Remember that from an operator’s viewpoint we wish to keep etch rate constant so that conveyor speed can be kept constant for a specific metal thickness.
Etchant regeneration allows this!
It is essential to monitor FeCl3 etchants –if you cannot measure then you cannot control!
Variables include • Temperature (should be constant) • Baumé (specific gravity) • Free-acid (HCl) content • Oxidation-reduction potential (ORP) • Dissolved metal content • Additives (if applicable)
Issue 122 Fall/Winter 2013 PCMI Journal Page 23
11 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK 11/25/13 photo chemical machining institute
Environmental impact of etching
• For the dissolution of metals, etchant must be consumed. • For the dissolution of ferrous materials in ferric chloride solution, the stoichiometry of the relationship is:
2FeCl3 + Fe → 3FeCl2 • This relationship cannot be changed.
• However we can chemically convert FeCl2 to FeCl3 and this is known as etchant regeneration.
Regenerating new ferric chloride etchant from waste ferrous chloride solution with
Cl2
2FeCl3 + Fe → 3FeCl2
↓ 1½Cl2
3FeCl3 + 1½Fe → 4½FeCl2
↓ 2¼Cl2
4½FeCl3 + 2¼Fe
→ 6¾FeCl2
↓ 3⅜Cl2
6¾FeCl3 + 3⅜Fe → 10⅛FeCl2 etc.
Issue 122 Fall/Winter 2013 PCMI Journal Page 24
12 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK 11/25/13 photo chemical machining institute
Ferric chloride regeneration relies on conversion of useless byproducts to useful etchant
2Fe3+
3Fe3+
4.5Fe3+
6.75Fe3+
???
Increasing ferric chloride utilisation by regeneration
Number of % utilisation of Volume of ferric chloride regenerations of ferric chloride (litres) required to dissolve ferric chloride 1 tonne of iron 0 100.0 10,620
1 250.0 4,240
2 475.0 2,230
3 812.5 1,310
4 1318.8 806
Issue 122 Fall/Winter 2013 PCMI Journal Page 25
13 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK 11/25/13 photo chemical machining institute
Etchant regeneration increases process efficiency
• Need to purchase minimum ferric chloride • Need to maximise the amount of metal etched with ferric chloride purchased • Can increase efficiency by etchant regeneration
How to measure etching efficiency
Audits of invoices will reveal: • Amount of ferric chloride purchased
• Quantity of metal etched and
• The efficiency of the etching can be calculated from the ratio of weight of metal etched to the volume of ferric chloride consumed.
Issue 122 Fall/Winter 2013 PCMI Journal Page 26
14 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK 11/25/13 photo chemical machining institute
Efficiency of the metal dissolution
• My calculations indicate that average industrial usage is < 20% if the solution is not regenerated.
• This is due to the etchant being slowed down by the drop in [Fe3+].
• The problem of trying to maintain a fast etch rate also leads to the need for etchant regeneration.
Environmental impact of PCM is reduced by etchant regeneration
Least efficient
Effect of Etchant Regeneration
Most efficient
Issue 122 Fall/Winter 2013 PCMI Journal Page 27
15 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK 11/25/13 photo chemical machining institute
Etching changes the composition of the etchant
As
2FeCl3 + Fe ⇒ 3FeCl2
[Fe3+] ⇓ and [Fe2+] ⇑ so that etch rate ⇓. For AUTOMATION we need constant etch rate and therefore ETCHANT REGENERATION is important technically as well as environmentally.
For regeneration we need to use strong oxidising agents
We have said that the overall etching reaction is: Fe + 2Fe3+ → 3Fe2+ Now we need Fe2+ → Fe3+ (Oxidation)
This can be achieved in many different ways using different oxidising agents/systems
Issue 122 Fall/Winter 2013 PCMI Journal Page 28
16 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK 11/25/13 photo chemical machining institute
We need to use strong oxidising agents to convert Fe2+ to Fe3+
• Such strong oxidising agents include: • Gaseous chlorine • Sodium chlorate and hydrochloric acid solutions • Gaseous ozone and hydrochloric acid solutions Electrolytic anodisation can also be utilised and weaker oxidising agents such as: • Gaseous oxygen and • Air from the atmosphere have also been used.
Cradle-to-cradle regeneration of ferric chloride etchants – the perfect system when etching iron and carbon steels!
BEAC Process
Chlorine gas
Ozonolysis Electrolysis
Note the production of byproducts in the process
Issue 122 Fall/Winter 2013 PCMI Journal Page 29 17 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK 11/25/13 photo chemical machining institute
But which regeneration process is the most economic now?
The most economic process depends on quantity of material etched
Environmental aspects of etchant regeneration
Method of regeneration Environmental/ Health & Safety aspects
Chlorine gas Hazardous material [short term exposure (10 minutes) limit of 3ppm] requiring bulk storage
Sodium chlorate and Sodium chlorate solution can evaporate and then Hydrochloric acid pose a fire hazard when in contact with organic material
Electrolysis Large currents required. Generation of flammable hydrogen gas. Hydrogen releases are environmentally undesirable.
Ozone Hazardous material (short term exposure limit of 0.3ppm) but only generated when required. Explosive in concentrations > 20%.
Issue 122 Fall/Winter 2013 PCMI Journal Page 30
18 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK 11/25/13 photo chemical machining institute
Method 5: Environment-friendly regeneration with oxygen and/or air
An IBM patent and Cranfield publications exist if further details are required. 2+ + 3+ Overall: 4Fe + O2 + 4H → 4Fe + 2H2O
Etching
2FeCl3 + Fe 3FeCl2 3HCl + ¾O Regeneration 2
3FeCl3 + 1½H2O
Drawbacks of oxygen (air) regeneration include:
• Slow oxidation. This limits the quantity of metal that can be dissolved in any particular time period in one etching machine. The [Fe2+] builds up in solution as it cannot be converted to [Fe3+] fast enough to maintain the required [Fe3+]/[Fe2+] balance required for constant etch rate and ORP. • Possible material specificity, as the method is untested for materials other than AISI 430 ferritic stainless steel at < 500kg per annum
Issue 122 Fall/Winter 2013 PCMI Journal Page 31
19 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK 11/25/13 photo chemical machining institute
Spent ferric chloride etchant regeneration efficiency depends on etched metal/alloy composition
• When etching iron or carbon steels, excess etchant can be pumped off from the etching machine sump and stored for use at a later date, or even sold.
• If, however, ferrous material contains high percentages of alloying elements (e.g. chromium, nickel etc.), regeneration is much less efficient and chlorination can then only be regarded as a rejuvenator, i.e. cradle-to-grave.
Byproducts build-up can affect quality of etch
• The build-up of nickel as [Ni2+] in ferric chloride etchant can affect the surface finish of the half-etch. This shows itself, for example, in a rough etch of Invar (64% Fe, 36% Ni) when [Ni2+] exceeds 10-15g/l. • Furthermore, when regenerating, the [Ni2+] remains in solution so that its concentration can only be reduced to acceptable levels by bleeding off some of the etchant and diluting with fresh ferric chloride. • This process leads spent ferric chloride to the “grave”. • Wouldn’t it be great if the [Ni2+] could be removed or, even better, recycled as a valuable byproduct?
Issue 122 Fall/Winter 2013 PCMI Journal Page 32 20 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK 11/25/13 photo chemical machining institute
Resurrection from “grave” to “cradle”: Methods investigated for the removal of dissolved metals from spent ferric chloride etchant
• Electrodialysis • Solvent extraction • Ion exchange • Cementation • Extractive precipitation
Electrodialysis
• Work on this process has been reported by D.M. Allen and H.J.A. White, Nickel extraction from ferric chloride etchant, PCMI Journal, 57/58, 15 and 18-25, (Summer/ Fall 1994). • It involves electroplating of Ni at the cathode and re- oxidising ferrous ions to ferric ions at the anode; the two electrodes being separated by a cation-permeable membrane. Unfortunately, iron deposits preferentially to nickel (anomalous co-deposition), reducing the value of the electroplated material. Whilst technically feasible, the process was not viable economically.
Issue 122 Fall/Winter 2013 PCMI Journal Page 33
21 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK photo chemical machining institute
Issue 122 Fall/Winter 2013 PCMI Journal Page 34 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK 11/25/13 photo chemical machining institute
Solvent extraction research continued
University research has been carried out at Kansai University, Japan where 2-hexanal oxime (EHO) was used as the extractant : • Murakami et al, Recovery of Ni from wasted etching solution of lead frame, Shigen-to-sozai, 114, 57-61, (1998) (in Japanese) Later research from Thailand included: • D. Loveless, Nickel extraction from waste etching liquor from electronic lead frame manufacturing, Khon Kaen University Journal, 27, 1-9, (Jan- Mar 2000)(in English) • Solvent extraction of nickel with EHO in kerosene and from Mokpo National University, Korea:
• M.S. Lee and K.J. Lee, Separation of iron and nickel from a spent FeCl3 etching solution by solvent extraction, Hydrometallurgy, 80, 163-169, (2005) (in English) • Stripping out Fe with Alamine336 in toluene. • Conclusion: 99% separation of Fe from Ni by extraction is possible.
Ion exchange – difficult when the [Fe3+ ] and other metal ions exceed [Ni2+] and they have similar chemical characteristics
Transition metal elements
Issue 122 Fall/Winter 2013 PCMI Journal Page 35 23 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University | UK 11/25/13 photo chemical machining institute
Cementation (reductive precipitation)
Ni2+ + Fe → Ni + Fe2+ E = 0.19v
but the competing reaction below also occurs:
+ 2+ Ni + 2H → Ni + H2 E = 0.25v
Therefore the cementation is only effective at pH ≥5 and at reaction temperatures above 90°C.
Extractive precipitation (XP)
• G. Zhao and H.W. Richardson, An efficient method for nickel removal from iron chloride solutions, PCMI Journal, 84, 5-14 (March 2002) with patent pending. • Process comprises three XP Technology steps:
1. FeCl3 reduction by cementation; 2. extraction of nickel and other metals;
3. chlorination to oxidise FeCl2 back to FeCl3 • 10 years on: but are we faced with prohibitive costs? • Note from D. Clark, PCMI Journal 120, 19, (Fall/ Winter 2012) “Purification at Phibro-Tech (filter out zinc, chrome and nickel) - Not economically feasible.”
Issue 122 Fall/Winter 2013 PCMI Journal Page 36 24 Sustainable Ferric Chloride Etchant: cradle-to-cradle or cradle-to-grave? David Allen | Cranfield University 11/25/13 | UK photo chemical machining institute
2+ But what about [Cu ] build-up in FeCl3?
• Cu2+ build-up in etching stainless steels is also problematic – ref D.M. Allen and M-L. Li, Etching AISI 316 stainless steel with aqueous ferric chloride – hydrochloric acid solutions, PCMI Journal, 33, 4-8 (1988) • If your main product line comprises copper-based materials then it may be more economic and environmentally desirable to convert to etching with cupric chloride! • However, to make this process economically feasible, regeneration of the etchant must be carried out or the process will be prohibitively expensive.
Conclusions • PCM requires an economically viable method to remove dissolved metals such as nickel, chromium and copper from spent ferric chloride etchant. Has that method now been found for Ni but not used?
• FeCl3 cradle-to-cradle LCA is strictly only applicable to the PCM of iron and carbon steels.
• FeCl3 cradle-to-grave LCA is solely due to our inability to extract dissolved metal ions economically. • However, the economic cost model will change with time and as disposal/landfill costs rise, affordable extraction technology will become increasingly viable as further financial instruments are applied to change current industrial practice.
Issue 122 Fall/Winter 2013 PCMI Journal Page 37 25 LDI Systems Frank Bell | Aiscent Technologies, Inc. | US
photo chemical machining institute
Frank Bell Aiscent Technologies, Inc. | US
Presentation: LDI Systems
Frank Bell is the North America Sales Representative for Aiscent Technologies, Inc. Prior to this Frank was the Sales Manager for Miva Technology GmBh.
Frank has also been the Owner/President of Omni Circuit Supply and Prime Circuit Supply, the Technical Sales Director and Partial Owner for Nationwide Circuit Products and Photosensitive Materials Researcher for Arkwright/TWT Laboratories.
Frank was a Zoology Major at the University of Rhode Island.
Please click here for the electronic version of the LDI Systems Presentation.
Single-‐side and Double-‐side Laser Direct Imaging Technologies and Their Applica:on in Photo-‐chemical Machining Area
Aiscent Tech Oct. 2013
Issue 122 Fall/Winter 2013 PCMI Journal Page 38 LDI Systems Frank Bell | Aiscent Technologies, Inc.11/27/13 | US photo chemical machining institute
Contents
1. Photochemical machining 2. LDI for PCB and PCM 3. ALDI technology from AiscentTech
Photochemical Machining (PCM) • PCM process is favorable for fabricaDon of high precision metal parts with complex, plan view geometry or with large arrays of variable aperture profiles with thickness under < 2mm . • Major application for : – integrated circuit lead frames – disk drive suspension head assemblies – Shadow mask – fine screens, sieves and meshes, shims, washers, laminations, optical shutters and light chopper discs, scales, filters, EMC/RFI enclosures (folded boxes), cutting blades and hybrid circuit pack lids.
Review paper: Allen, D.M. , Photochemical Machining: from ‘manufacturing’s best kept secret’ to a $6 billion per annum, rapid , manufacturing process 2004
Issue 122 Fall/Winter 2013 PCMI Journal Page 39 1 LDI Systems Frank Bell | Aiscent Technologies, Inc.11/27/13 | US photo chemical machining institute
Samples of PCM parts
OLED shadow mask Disk head suspension IC leadframes 50um open slot
Shadow mask shims OpDcal encoder OpDcal shuQer paQerns
PCM processing
CAD data design
Phototool making
OpDcal exposure
Photoresist coaDng Develop; Metal etching
Metal preparaDon Photoresist stripping
Issue 122 Fall/Winter 2013 PCMI Journal Page 40 2 LDI Systems Frank Bell | Aiscent Technologies, Inc. 11/27/13| US photo chemical machining institute
PCM vs. others methods Comparing to tradi>onal:
Wire electro-‐discharge Stamping Laser cuXng Water jet cuXng machining (EDM), PCM gives: Super-‐fine and precise feature shape and size down to 10um Low stress burr free low cost for large panel size upto 1300x1500mm and complex paQerns
Similarity between PCM and PCB PCM PCB OpDcal exposure Photoresist Photoresist Metal processing Etching/electroforming Etching/electroplaDng Material Virtually all metal or alloy Copper , or Aluminium with thickness 0.01 to 2 mm Thickness: 0.01 to 0.2mm
Laser direct imaging – The advanced imaging technology for PCB can be used directly into PCM process
Issue 122 Fall/Winter 2013 PCMI Journal Page 41 3 LDI Systems Frank Bell | Aiscent Technologies, Inc.11/27/13 | US photo chemical machining institute
LDI process Without making phototools, designed paQerns are exposed directly on photoresist by LDI. Giving more precise feature size, smoother side-‐edge, and fast turn-‐around.
CAD data design
Substrate OpDcal exposure
Photoresist coaDng Develop; Metal etching
Metal preparaDon Photoresist stripping
Two types of LDI technologies
Single beam Raster scanning DMD 2-‐D scanning
Substrate
• Width limited by opDcal aperture • MulD-‐beam scanning simultaneously • Single spot raster scan • MulD-‐engine array for scalable large area • Spot size limited • CompaDbility with various light source • Sub-‐micron spot size capability
Issue 122 Fall/Winter 2013 PCMI Journal Page 42 4 LDI Systems Frank Bell | Aiscent Technologies, Inc. |11/27/13 US photo chemical machining institute
ALDI technologies Advanced Laser Dynamic Imaging technologies by Aiscent Tech
1. Patented DlDng scan 2. Super-‐fine resoluDon and fast throughput with patented micro-‐ lens imaging system for 3. OpDcal engine array 4. Patented double-‐side LDI exposure system
Key Technologies & products
�nalog �i�e ��posure �esult� Conven&onal Digital Projec&on ALDI Technologies
�rasing Sa� �dge ��e�t�
Superior spatial resolution and smooth line edges�
Issue 122 Fall/Winter 2013 PCMI Journal Page 43 5 LDI Systems Frank Bell | Aiscent Technologies, Inc.11/27/13 | US photo chemical machining institute
Key Technologies & products
�eading �dge �ec�nologies in �ptical �ngine �esign�� Micro-‐‑‒lens optics gives super-‐‑‒fine spot size and large i�aging field size��
�oint �rra�� �ilt-‐‑‒�can�
Key Technologies & products
Micro Lens Array DGB FPGA FPGA DMD
XGA: 1024 x 768 pixels
Optical spots by MLSFA
MLSFA
Spot size = 2.6um @ XGA 1:1 Micro Mirrors XGA: 13.68um
Issue 122 Fall/Winter 2013 PCMI Journal Page 44 6 LDI Systems Frank Bell | Aiscent Technologies, Inc. | US 11/27/13 photo chemical machining institute
Key Technologies & products
�ulti�le ���i�es �o��e�t�
DMD Lens Unit 1
MLSFA
Lens Unit 2
Stage Scanning
Key Technologies & products
patent pending World First Double-‐‑‒sided LDI System�
-‐‑‒ both sides of substrate are being imaged simultaneously� -‐‑‒ eliminates top and bottom registration problem� -‐‑‒ high throughput on standard resist� -‐‑‒ increase throughput for high quality ��� manufacturing and �� substrate� ��-‐‑‒ �� um for ���� ��-‐‑‒ � um for ��� �� substrate�
Double-‐‑‒sided Im��i�� �e����ism�
Issue 122 Fall/Winter 2013 PCMI Journal Page 45
7 LDI Systems Frank Bell | Aiscent Technologies, Inc. | US 11/27/13 photo chemical machining institute
Key Technologies & products !
)/)* $ &( &( %
)/)* $ &( '** (%!% (! ) &(&+ % #
ALDI Exposure Results
Exposure Result for High Resolu>on Narrow Line and Space
Issue 122 Fall/Winter 2013 PCMI Journal Page 46 8 LDI Systems Frank Bell | Aiscent Technologies, Inc.11/27/13 | US photo chemical machining institute
ALDI Exposure Results
ALDI Exposure Results
2 um Line and Space (45 degree direc&on against to scanning direc&on)
&) (,*!&%+$!% % ' !% ( !( *!&%
Issue 122 Fall/Winter 2013 PCMI Journal Page 47 9 LDI Systems Frank Bell | Aiscent Technologies, 11/27/13Inc. | US photo chemical machining institute
ALDI Exposure Results
SEM observa>on of 20um & 15um L/S paSerns
ALDI Exposure Results
SEM observa>on of exposure result on DFR
Issue 122 Fall/Winter 2013 PCMI Journal Page 48 10 LDI Systems Frank Bell | Aiscent Technologies, Inc.11/27/13 | US photo chemical machining institute
ALDI Exposure Results
SEM observa>on of 20um & 15um Holes/Projec>ons
ALDI Exposure Results
SEM observa>on of 30um, 20um & 15um Projec>ons
Issue 122 Fall/Winter 2013 PCMI Journal Page 49 11 LDI Systems Frank Bell | Aiscent Technologies, Inc. | US 11/27/13 photo chemical machining institute
ALDI Exposure Results
25um
20um
15um Sunburst 25um diff angle Reducing L/S
25um lines and pads Lines and pads Thick DFR
ALDI Exposure Results
Issue 122 Fall/Winter 2013 PCMI Journal Page 50 12 LDI Systems Frank Bell | Aiscent Technologies, Inc.11/27/13 | US photo chemical machining institute
ALDI Exposure Results
Thank You
www.aiscenttech.com [email protected]
Issue 122 Fall/Winter 2013 PCMI Journal Page 51 13 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US
photo chemical machining institute
Bill Bellows Aerojet Rocketdyne | US
Presentation: Insights From Mixed Model Management (on How to Manage Projects and not Tasks)
Bill Bellows is an Associate Fellow in the InThinking Network at Aerojet Rocketdyne in Canoga Park, California, where he is known for his efforts to provide insights to the advantages of thinking together, learning together, and working together. Audiences for his classes have also reached after-school program in elementary schools, graduate students at Northwestern University, as well as corporate, university, and public classes across the United Kingdom. Bill earned his BS, MS, and Ph.D. in Mechanical Engineering from Rensselaer Polytechnic Institute in Troy, NY.
Away from work, Bill serves as president of the In2:InThinking Network (www.in2in.org), and as a board member of the W. Edwards Deming Institute (www.deming.org), and the Volunteers of America – Los Angeles chapter (www.voala.org). He also serves on the editorial board of the Lean Management Journal (www.leanmj.com).
Please click here for the electronic version of Insights From Mixed Model Management.
Insights from Mixed Model Management (on How to Manage Projects and not Tasks)
Presented by Bill Bellows
Associate Fellow InThinking Network Aerojet Rocketdyne Email: [email protected], Cell: 818-519-8209
Photo Chemical Machining Institute World Conference October 8, 2013
Issue 122 Fall/Winter 2013 PCMI Journal Page 52 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Tank Engines
Tank Engines and Rocket Engines
Issue 122 Fall/Winter 2013 PCMI Journal Page 53 Replacing the screwdriver Pilot holes Hole saw Drywall installation Concrete
Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US Replacing the screwdriver photo chemical machining institutePilot holes Hole saw Drywall installation Concrete
Product / Program / Project
As Conceived
Product / Program / Project
As Conceived
The top 5 uses: 1. Replacing the screwdriver 2. Pilot holes 3. Hole saw 4. Drywall installation 5. Concrete
Issue 122 Fall/Winter 2013 PCMI Journal Page 54 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Product / Program / Project
As Conceived As Managed
Abstract What if every professional firefighter in the world followed their country’s firefighting orders? Would there ever be another firefighting injury? Or, in a manufacturing plant, what if standard planning and processes were followed by every operator, to the letter; would defect-free parts be produced time and again? The planning model of interchangeable parts, with major contribution often given to Honore Blanc, who resided in France in the late 1700's, offers such a vision, with an outcome of products, processes, and services that "work" (as planned), including zero fire fighting fatalities. The American System of Manufacturing followed shortly thereafter when Thomas Jefferson's implementation vision was shared with Eli Whitney, leading to the first-ever contract with the US Congress for a product made with interchangeable parts…..
Issue 122 Fall/Winter 2013 PCMI Journal Page 55 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Abstract ….Make that perfectly interchangeable parts, including those who fabricate them and those who fight fires.
The simple design model of interchangeable parts, defined as a Macro System Model, is founded upon a set of assumptions that will be highlighted in this presentation. As a fitting complement, a second model, the Micro System Model, will be shared in a presentation that reveals explanations for all too frequent consternation and problems, let alone the failed solutions. Such are the realities when products and services are created by processes without an understanding of the significant difference a Macro and a Micro System Model. Mixed Model Management offers the ability to use both models to their full advantage and, thereby, reduce problems and increase profits.
Agenda • Models • Quiz • Modes of Thinking • Purposeful Resource Management • Opportunities to Act • Opportunities to Think
Issue 122 Fall/Winter 2013 PCMI Journal Page 56 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Models Several years ago, Linda LoRe, CEO of Frederick's of Hollywood, shared a story of speaking with MBA students about Frederick's and their strategy to compete with Victoria's Secret and their supermodels, including Gisele Bündchen. As the business school engagement was ending, Linda fielded a seemingly personal question; "I have to ask...in your role as the CEO, do you get to work with the models?"
Mental Models A mental model is an explanation of someone's thought process about how something works in the real world. It is a representation of the surrounding world, the relationships between its various parts and a person's intuitive perception about his or her own acts and their consequences. Mental models can help shape behavior and set an approach to solving problems (akin to a personal algorithm) and doing tasks.
Source: http://en.wikipedia.org/wiki/Mental_model
Issue 122 Fall/Winter 2013 PCMI Journal Page 57 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Mental Models
Essentially, all models are wrong, but some are useful.
Professor George Box
Resource Management Model
A c Proactive t i v i Reactive t y “Mine” “Ours” Ownership
Issue 122 Fall/Winter 2013 PCMI Journal Page 58 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Resource Management
Proactive – applying effort while “good,” “OK,” “well,” or “correct” is happening
Resource Management
Proactive – applying effort while “good,” “OK,” “well,” or “correct” is happening Reactive – applying effort after “bad,” “not OK,” “sick,” or “incorrect” happens
Issue 122 Fall/Winter 2013 PCMI Journal Page 59 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Resource Management “An ounce of prevention is worth a pound of cure”
Resource Management “An ounce of prevention is worth a pound of cure”
“A stitch in time saves nine”
Issue 122 Fall/Winter 2013 PCMI Journal Page 60 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Resource Management “An ounce of prevention is worth a pound of cure”
“A stitch in time saves nine”
“Every dollar we invest in high-quality early education can save more than $7 later on”
Perception & Thinking
“What we see depends on what we thought before we looked.”
Myron Tribus
Issue 122 Fall/Winter 2013 PCMI Journal Page 61 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Quiz
Horse Trading “The secret to selling a horse is…
Mark Twain
Issue 122 Fall/Winter 2013 PCMI Journal Page 62 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Horse Trading “The secret to selling a horse is… to sell it before it dies.”
Mark Twain
Time Management How much time is spent discussing parts, tasks, activities, program milestones, etc. which are good and completed on time?
Issue 122 Fall/Winter 2013 PCMI Journal Page 63 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Time Management
Buying Watermelons and Briquettes
Issue 122 Fall/Winter 2013 PCMI Journal Page 64 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Grades What letter grade is required for all purchased parts and services, as well as tasks completed internally?
Task Flow P
D E F
I H G
Issue 122 Fall/Winter 2013 PCMI Journal Page 65 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Task Flow P Handoff Requirements?
D E F
I H G
Task Grades
Issue 122 Fall/Winter 2013 PCMI Journal Page 66 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Task Grades
Task Grades
Issue 122 Fall/Winter 2013 PCMI Journal Page 67 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Task Management
Macro System Model
Issue 122 Fall/Winter 2013 PCMI Journal Page 68 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Macro System Model Task Completion
Macro System Model Task Completion Step 1 Step 2 Step N
Issue 122 Fall/Winter 2013 PCMI Journal Page 69 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Macro System Model Task Completion Assembly Step 1 GOOD Step 2 Task A Step N FIT Sub- Step 1 GOOD Assembly 1 Step 2 Task B Step N
Step 1 GOOD Step 2 Task O FIT Step N Sub- Step 1 GOOD Assembly 2 Step 2 Task P Step N
Macro System Model Task Completion Assembly Final Assembly Step 1 GOOD Step 2 Task A Step N FIT Sub- Step 1 GOOD Assembly 1 Step 2 Task B Step N
Step 1 GOOD Step 2 Task O FIT Step N Sub- Step 1 GOOD Assembly 2 Step 2 Task P Step N
Issue 122 Fall/Winter 2013 PCMI Journal Page 70 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Macro System Model Task Completion Assembly Final Assembly Step 1 GOOD Step 2 Task A Step N FIT Sub- Step 1 GOOD Assembly 1 Step 2 Task B Step N FIT Product Step 1 GOOD Assembly Step 2 Task O FIT Step N Sub- Step 1 GOOD Assembly 2 Step 2 Task P Step N
Macro System Model Task Completion Assembly Final Assembly Step 1 GOOD Step 2 Task A Step N FIT Sub- Step 1 GOOD Assembly 1 Step 2 Task B Step N FIT Product Step 1 GOOD Assembly Step 2 Task O FIT Step N Sub- Step 1 GOOD Assembly 2 Step 2 Task P Step N WORKS
Issue 122 Fall/Winter 2013 PCMI Journal Page 71 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Task Grades
0 10 20 30 40 50 60 70 80 90 100
Task Grades
0 10 20 30 40 50 60 70 80 90 100
Issue 122 Fall/Winter 2013 PCMI Journal Page 72 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Cutting Wood Given a piece of wood that will be cut into 2 pieces, how many lines will be drawn across the top face before the cut is made?
Cutting Wood 1 line
Issue 122 Fall/Winter 2013 PCMI Journal Page 73 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Cutting Wood 1 line (target)
Cutting Wood
2 lines
Issue 122 Fall/Winter 2013 PCMI Journal Page 74 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Cutting Wood
2 lines
target
Examples of Task Management HOLE DIAMETER PAGE COUNT
MIN MAX 20 25 OUTER DIAMETER DISTANCE FROM THE DOOR
MIN MAX 0 FT 100 FT
Issue 122 Fall/Winter 2013 PCMI Journal Page 75 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Examples of Task Management HOLE DIAMETER PAGE COUNT
MIN MAX 20 25 OUTER DIAMETER DISTANCE FROM THE DOOR
MIN MAX 0 FT 100 FT
Macro System Task Management HOLE DIAMETER PAGE COUNT
MIN MAX 20 25 OUTER DIAMETER DISTANCE FROM THE DOOR
MIN MAX 0 FT 100 FT
Issue 122 Fall/Winter 2013 PCMI Journal Page 76 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Macro System Task Management HOLE DIAMETER PAGE COUNT
= =
MIN MAX 20 25 OUTER DIAMETER DISTANCE FROM THE DOOR
= =
MIN MAX 0 FT 100 FT
Micro System Task Management HOLE DIAMETER PAGE COUNT
= =
MIN MAX 20 25 OUTER DIAMETER DISTANCE FROM THE DOOR
= =
MIN MAX 0 FT 100 FT
Issue 122 Fall/Winter 2013 PCMI Journal Page 77 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Resource Management Contrast HOLE DIAMETER HOLE DIAMETER
MIN MAX MIN MAX OUTER DIAMETER OUTER DIAMETER
MIN MAX MIN MAX
Resource Management Contrast HOLE DIAMETER HOLE DIAMETER
MINMIND THE TASKMAX MIN MAX OUTER DIAMETER OUTER DIAMETER
MIN MAX MIN MAX
Issue 122 Fall/Winter 2013 PCMI Journal Page 78 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Resource Management Contrast HOLE DIAMETER HOLE DIAMETER
MINMIND THE TASKMAX MINMIND THE GAP MAX OUTER DIAMETER OUTER DIAMETER
MIN MAX MIN MAX
Micro System Model Task Completion Assembly Final Assembly Step 1 Step 2 Task A Step N Degrees of FIT Degrees of Sub- Step 1 GOOD Assembly 1 Step 2 Task B Step N Degrees of FIT Product Step 1 Assembly Step 2 Task O Degrees of FIT Step N Sub- Step 1 Assembly 2 Step 2 Task P Step N Degrees of WORKS
Issue 122 Fall/Winter 2013 PCMI Journal Page 79 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Modes of Thinking
Modes of Thinking
Categories Absolutes Discrete / Digital How many students at CSUN? How many faculty?
Issue 122 Fall/Winter 2013 PCMI Journal Page 80 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Modes of Thinking
Categories Continuum Absolutes Relative Discrete / Digital Wholeness / Analog How many students Better/Faster/Cheaper/ at CSUN? How Smarter/etc. many faculty? Students are different, faculty are different
Purposeful Resource Management
Issue 122 Fall/Winter 2013 PCMI Journal Page 81 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Resource Management
A c Proactive t i v i Reactive t y “Mine” “Ours” Ownership
Resource Management
A c Proactive t i v i Reactive t y “Mine” “Ours” Ownership
Issue 122 Fall/Winter 2013 PCMI Journal Page 82 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Resource Management
A c Proactive t i v i Reactive t y “Mine” “Ours” Ownership
Resource Management
A P c U Proactive R t P i O S v E Reactive REFLEXIVE F i U t L y “Mine” “Ours” Ownership
Issue 122 Fall/Winter 2013 PCMI Journal Page 83 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Opportunities to Act
Opportunities to Act (differences that make a difference)
Category Thinking vs. Continuum Thinking
Issue 122 Fall/Winter 2013 PCMI Journal Page 84 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Opportunities to Act (differences that make a difference)
Category Thinking vs. Continuum Thinking Macro Systems vs. Micro Systems
Opportunities to Act (differences that make a difference)
Category Thinking vs. Continuum Thinking Macro Systems vs. Micro Systems Attention to “Good” elements
Issue 122 Fall/Winter 2013 PCMI Journal Page 85 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Issue 122 Fall/Winter 2013 PCMI Journal Page 86 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Issue 122 Fall/Winter 2013 PCMI Journal Page 87 Insights From Mixed Model Management William Bellows |InThinking Network | Aerojet Rocketdyne | US photo chemical machining institute
Issue 122 Fall/Winter 2013 PCMI Journal Page 88 Laser Cutting Jeff Klein | Tacoma Steel | US
photo chemical machining institute
Jeff Klein Tacoma Steel | US
Presentation: Laser Cutting
Jeff’s primary background is in manufacturing, coatings and automated/integrated systems. He is currently working in the metals industry, where he is involved in combining multiple facets of metal working to achieve a final product.
Some of these combined trades include cutting (laser, flame, plasma and saw), forming, welding (manually and robotic) and etching (laser and chemical). These processes will be used with any one of most alloys of steel and aluminum as well as many other types of metals.
Please click here for the electronic version of Laser Cutting.
Laser Cu)ng and Etching
Issue 122 Fall/Winter 2013 PCMI Journal Page 89 Laser Cutting Jeff Klein | Tacoma Steel | US photo chemical machining institute
CO2 High and Low Power • Resonator • Shu:er Column • Bend Mirrors • Cu@ng Head
Issue 122 Fall/Winter 2013 PCMI Journal Page 90 Laser Cutting Jeff Klein | Tacoma Steel | US photo chemical machining institute
Resonator Electrode
M M S i i h r Electricity r u r r t o o t r r e s s r
Gasses
Electrode
Shu9er Column
• Par0al Reflec0ve Mirror • Shu:er • Primary Focus Lens
Issue 122 Fall/Winter 2013 PCMI Journal Page 91 Laser Cutting Jeff Klein | Tacoma Steel | US photo chemical machining institute
Cu)ng Head
• Final Focus Lens • Capaci0ve Height Sensor • Assist Gas
Issue 122 Fall/Winter 2013 PCMI Journal Page 92 Laser Cutting Jeff Klein | Tacoma Steel | US photo chemical machining institute
Laser CapabiliBes
• Types of materials to cut • Material thicknesses • Types of materials to etch • Types of etching • High Power • Low Power
Laser Quality
• Kerf • Tolerance • Cu@ng edge • Lead-‐In
Issue 122 Fall/Winter 2013 PCMI Journal Page 93 Laser Cutting Jeff Klein | Tacoma Steel | US photo chemical machining institute
Laser OperaBon • AutoCAD design • ProNest • Parameter se@ngs • Beam power • Speed • Assist gas • Assist gas pressure • CNC programmed
Issue 122 Fall/Winter 2013 PCMI Journal Page 94 Laser Cutting Jeff Klein | Tacoma Steel | US photo chemical machining institute
How can PCM and Laser cu)ng/etching compliment one another?
• Shape cu@ng thicker material • Color contrast in etching • Broadening the market
Proven Methods
• Photo chemical machine first • Damage to rollers • Risk: Damage to material on cu@ng slats • Add alignment targets
Issue 122 Fall/Winter 2013 PCMI Journal Page 95 Laser Cutting Jeff Klein | Tacoma Steel | US photo chemical machining institute
Other trades to Combine • Welding • Forming • Roll forming • Coa0ngs/Finishes • Explosion bonding • Sales
Issue 122 Fall/Winter 2013 PCMI Journal Page 96 Laser Cutting Jeff Klein | Tacoma Steel | US photo chemical machining institute
Issue 122 Fall/Winter 2013 PCMI Journal Page 97 Titanium Etching, Chapter II Randy Markle | Chemcut | US
photo chemical machining institute
Randy Markle Chemcut | US
Presentation: Titanium Etching, Chapter II | An overview of the effects of the nitric acid on the etching rate and surface finish of titanium etched in HF-Nitric mixtures.
Randy has been with Chemcut for over thirty years. Most of that time Randy has been in the process engineering department. His main focus has been on etching and regeneration with an emphasis on chemical machining. He has authored and presented several papers at various PCMI technical sessions.
Randy has a degree from Penn State University.
Please click here for the electronic version of Titanium Etching, Chapter II.
Titanium Etching
An evaluation of titanium etching using HF and nitric acid etching solutions. Chapter 2
Randy Markle Chemcut
Issue 122 Fall/Winter 2013 PCMI Journal Page 98
1 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
Review
PCMI Conference Fall 2012 Santa Monica, CA
Etching Reaction
* Ti + 3HF → TiF3 + 3/2 H2↑
With the addition of nitric acid
* Ti + 6HF + 4HNO3 → H2TiF6 + 4NO2↑ + 4H2O
* Allen D M, 1986, The Principles and Practice of Photochemical Machining and Photoetching, pg. 97.
Issue 122 Fall/Winter 2013 PCMI Journal Page 99 1 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
Purpose
The purpose of these tests were to document the effects, on the etch rate and the surface finish of titanium, when etching with different hydrofluoric acid and nitric acid etching solutions.
Issue 122 Fall/Winter 2013 PCMI Journal Page 100 2 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
Material
Titanium – Grade 2, commercially pure, mill finish Titanium – 98.9% min Carbon – 0.08% max Oxygen – 0.25% max Nitrogen – 0.03% max Iron – 0.3% max Hydrogen – 0.015% max Density – 0.163 lb/in3 Hardness – Rockwell B68 to B80 Yield Strength – 40,000 psi min
Etching Solutions
The etching solutions were a mixture of hydrofluoric acid (49%, s.g.- 1.18), nitric acid (68%, s.g.- 1.41), and water, by weight. Chemical additions were made during the testing to adjust and maintain acid concentrations resulting from increased solution volume.
Issue 122 Fall/Winter 2013 PCMI Journal Page 101 3 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
Etching Parameters
Temperature – 43.3° C (110° F) Oscillation Rate – 30 sweeps per minute Spray Pressure (Top) – 2.07bar (30psi) Conveyor Speed – variable Etch Time - variable
Concentrations Evaluated
HF HNO3 3% 0%, 3%, 6%, 10%, 15% 4.21% 20% 5% 0%, 3%, 6%, 10%, 15%, 20% 10% 0%, 3%, 6%, 10%, 15%, 20%
Issue 122 Fall/Winter 2013 PCMI Journal Page 102 4 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
Etch Rate – 3% HF
Etch Rate – 5% HF
Issue 122 Fall/Winter 2013 PCMI Journal Page 103 5 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
Etch Rate – 10% HF
Etch Rate Comparison
Issue 122 Fall/Winter 2013 PCMI Journal Page 104 6 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
Mill Finish
3% HF Comparison
Issue 122 Fall/Winter 2013 PCMI Journal Page 105 7 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
5% HF Comparison
10% HF Comparison
Issue 122 Fall/Winter 2013 PCMI Journal Page 106 8 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
Surface Roughness
Mill 5% HF& 5% HF& Finish 5% HF 10% HNO3 20% HNO3 Ra (microinches) 13.63 112.3 34.7 56.85
Mill 10% HF& 10% HF& Finish 10% HF 10% HNO3 20% HNO3 Ra (microinches) 13.63 120.82 35 39.54
Chapter 1 Summary
HF only etching is slow Hydrogen gas is produced Results in a rough surface finish Nitric acid addition increases the etch rate Eliminates the hydrogen gas Produces a smoother finish Etch rate levels off above 10% nitric acid
Issue 122 Fall/Winter 2013 PCMI Journal Page 107 9 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
Chapter 1 Summary
High acid levels cause erratic etching High acid levels produce titanium oxide
Recommendation
3-5% HF +
5-10% HNO3
Issue 122 Fall/Winter 2013 PCMI Journal Page 108 10 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
Chapter Two
Etch rate and undercut of imaged titanium
panels using HF and HNO3 at various nitric concentrations and selected spray pressures
Etching Solutions
The etching solutions used were 5%HF with Nitric additions of 5%, 10%, and 15%
Issue 122 Fall/Winter 2013 PCMI Journal Page 109 11 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
Test Pattern
Model 2315
Issue 122 Fall/Winter 2013 PCMI Journal Page 110 12 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
Etching Parameters
Temperature – 110° F (43.3° C) Oscillation Rate – 30 sweeps per minute Spray Pressure (Top) – 15, 20, 25, & 30 psi Conveyor Speed – 7.3ipm Etch Time – 3 minutes
Etch Rate and Undercut Calculations
Issue 122 Fall/Winter 2013 PCMI Journal Page 111 13 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
Etch rate @ 15 psi (1.03 bar) 40
35 15% Nitric
30
10% Nitric 25
5% Nitric
Etch Rtae (microns/min) Etch Rtae (microns/min) 20
15
10 10 (254u) 12.5 (317.5u) 15 (381u) 17.5 (444.5u) 20 (508u) Opening Size (mils)
Etch rate @ 20 psi (1.38 bar)
40
35
15% Nitric 30
10% Nitric 25
5% Nitric
Etch Rate (microns/min) (microns/min) Etch Rate 20
15
10 10 (254u) 12.5 (317.5u) 15 (381u) 17.5 (444.5u) 20 (508u) Opening Size (mils)
Issue 122 Fall/Winter 2013 PCMI Journal Page 112 14 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
Etch rate @ 25 psi (1.72 bar)
40
15% Nitric 35
30 10% Nitric
25
5% Nitric
Etch Rate (microns/min) (microns/min) Etch Rate 20
15
10 10 (254u) 12.5 (317.5u) 15 (381u) 17.5 (444.5u) 20 (508u) Opening Size (mils)
Etch rate @ 30 psi (2.07 bar)
40
35
15% Nitric
30 10% Nitric
25
5% Nitric 20 Etch Rate (microns/min) Etch Rate (microns/min)
15
10 10 (254u) 12.5 (317.5u) 15 (381u) 17.5 (444.5u) 20 (508u) Opening Size (mils)
Issue 122 Fall/Winter 2013 PCMI Journal Page 113 15 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
Spray Pressure/Etch Rate Comparison (microns/minute)
Spray Pressure (psi)
Solution 15 (1.03Bar) 20 (1.38Bar) 25 (1.72Bar) 30 (2.07Bar)
5%HF+5%HNO3 20.58 21.28 21.36 21.12
5%HF+10%HNO3 29.36 29.26 29.00 29.84
5%HF+15%HNO3 32.82 33.60 34.06 34.10
Undercut
The amount of lateral etch as compared to the amount of vertical etch, expressed as a ratio or a percentage.
Issue 122 Fall/Winter 2013 PCMI Journal Page 114 16 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
20-mil (508µ) Imaged Line
Solution – 5%HF+5%HNO3 @ 15psi (1.03bar) Average Depth – 58.3 microns Average Width – 698.4 microns Undercut Percentage – 163.9%
Issue 122 Fall/Winter 2013 PCMI Journal Page 115 17 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
10-mil (254µ) Imaged Line
Solution – 5%HF+15%HNO3 @ 15psi(1.03bar) Average Depth – 98.9 microns Average Width – 417.2 microns Undercut Percentage – 82.6%
5%HF+HNO3 @ 15psi (1.03bar) 180.0
160.0
5% Nitric 140.0
120.0 10% Nitric 100.0 Undercut Percentage Percentage Undercut 80.0 15% Nitric
60.0
40.0 10 (254u) 12.5 (317.5u) 15 (381u) 17.5 (444.5u) 20 (508u) Opening Size (mils)
Issue 122 Fall/Winter 2013 PCMI Journal Page 116 18 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
5%HF+HNO3 @ 20psi(1.38bar) 180.0
160.0
5% Nitric 140.0
120.0 10% Nitric
100.0 15% Nitric Undercut Percentage Percentage Undercut 80.0
60.0
40.0 10 (254u) 12.5 (317.5u) 15 (381u) 17.5 (444.5u) 20 (508u) Opening Size (mils)
5%HF+HNO3 @ 25psi(1.72bar) 180.0 160.0
5% Nitric 140.0
120.0
10% Nitric 100.0
Undercut Percentage Percentage Undercut 15% Nitric 80.0
60.0
40.0 10 (254u) 12.5 (317.5u) 15 (381u) 17.5 (444.5u) 20 (508u) Opening Size (mils)
Issue 122 Fall/Winter 2013 PCMI Journal Page 117 19 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
5%HF+HNO3 @ 30psi(2.07bar) 180.0
160.0
5% Nitric 140.0
120.0 10% Nitric
100.0 15% Nitric Undercut Percentage
80.0
60.0
40.0 10 (254u) 12.5 (317.5u) 15 (381u) 17.5 (444.5u) 20 (508u) Opening Size (mils)
Spray Pressure/Undercut Comparison (percentage)
Spray Pressure (psi)
Solution 15 (1.03Bar) 20 (1.38Bar) 25 (1.72Bar) 30 (2.07Bar)
5%HF+5%HNO3 145.6% 145.9% 147.8% 154.9%
5%HF+10%HNO3 115.6% 106.7% 97.2% 105.4%
5%HF+15%HNO3 90.2% 98.9% 95.5% 101.4%
Issue 122 Fall/Winter 2013 PCMI Journal Page 118 20 Titanium Etching, Chapter II Randy Markle | Chemcut | US photo chemical machining institute
Summary
The etch rate is slightly affected by the spray pressure. Spray impingement is not a major contributor to etch rate. Dwell (contact) time and acid concentration are more influential. Undercut of 100% (1:1) is to be expected.
Questions?
Issue 122 Fall/Winter 2013 PCMI Journal Page 119 21 New Product and Services Showcase Heather McCrabb | Faraday Technology, Inc. | US
photo chemical machining institute
Heather McCrabb Faraday Technology | US
Presentation: New Product and Services Showcase
Heather McCrabb is a chemist and has been employed at Faraday since 2002. Ms. McCrabb received her B.S. and M.S. in Chemistry from Wright State University (Dayton, OH) in 1999 and 2001, respectively.
Ms. McCrabb has published/presented widely on the patented FARADAYIC Process for a variety of industrial applications including FARADAYIC Through-Mask Electo- Etching.
Please click here for the electronic version of the New Product and Services Showcase.
Faraday Technology, Inc.
Heather McCrabb Faraday Technology, Inc., Clayton, OH 45315, USA
PCMI Fall Conference
October 7, 2013
Issue 122 Fall/Winter 2013 PCMI Journal Page 120 New Product and Services Showcase Heather McCrabb | Faraday Technology, Inc. | US photo chemical machining institute
Overview
Faraday Technology, Inc.
Facilities
Products/Services
For More Information...
Faraday Technology, Inc.
Faraday Technology specializes in electrochemical engineering • ~26 Issued Patents and ~25 Pending Patents in this area • www.faradaytechnology.com Faraday is a wholly-owned subsidiary• of Physical Sciences, PSI • Inc. (Boston, MA) Locations www.psicorp.com Collectively, the company • staffs ~190 employees • ~ 100 patents company wide in numerous fields PSI Employees • by Education
Issue 122 Fall/Winter 2013 PCMI Journal Page 121 New Product and Services Showcase Heather McCrabb | Faraday Technology, Inc. | US photo chemical machining institute
Vision - Technology Platform . “…to be known as the company that changed the focus of electrochemical engineering from the art of complex chemistries to the science of pulse/pulse reverse electric fields...”
Electrochemical Machining, Polishing, Electrodeposition/Plating Deburring, Through-Mask Etching
Open Innovation
. Augments larger company R&D needs . Strong IP portfolio provides protection for strategic partners → competitive advantage . Leverages government R&D dollars → solve current industrial problems
Investment Discovery Innovation Market Knowledge Dollars Research Dollars
Issue 122 Fall/Winter 2013 PCMI Journal Page 122 New Product and Services Showcase Heather McCrabb | Faraday Technology, Inc. | US photo chemical machining institute
Faraday Technology, Inc. Faraday’s Technology Development Concept Development, Proof of Concept, Prototype, Commercial Conceptual Reduction to Alpha/Beta- Implementation Reduction to Practice Scale Validation Practice
Bench-Top Feasibility
Production-Scale Validation
Pilot-Scale Validation
Faraday Technology, Inc.
Platform Technology: Core Competency: Pulse/Pulse Reverse Design and Engineer of Processing Novel Electrochemical Hardware
Electronics Uniform processing Edge and Surface Finishing Enhanced reliability • Engineered Coatings • Improved manufacturing→ • Battery and Fuel Cell Power Additive or subtractive • Environmental Systems electrochemical processes • Corrosion and Monitoring • Enables HDI • Services • Independently as improvement• to current industrial practice or combined as a total manufacturing solution
Issue 122 Fall/Winter 2013 PCMI Journal Page 123 New Product and Services Showcase Heather McCrabb | Faraday Technology, Inc. | US photo chemical machining institute
Facilities
Facilities Lab Facility Machine Shop
Pilot-Scale Facility
Issue 122 Fall/Winter 2013 PCMI Journal Page 124 New Product and Services Showcase Heather McCrabb | Faraday Technology, Inc. | US photo chemical machining institute
Products and Services
Products/Services Electro(kinetic)deposition Electrochemical Surface Finishing Tri-Chrome (Common and Exotic Metals and Alloys) Electropolishing Before
Before
After
After
Copper Photo-Electrochemical Machining
Electro-deburring Co-Mn Alloy Ceramics
Issue 122 Fall/Winter 2013 PCMI Journal Page 125 New Product and Services Showcase Heather McCrabb | Faraday Technology, Inc. | US photo chemical machining institute
Products/Services Electrochemical Processing Equipment Other Electrochemical Services Corrosion Monitoring
Electro-separation Soil Remediation
For More Information…
Contact Information – Faraday Technology • 315 Huls, Clayton, OH 45315 Ph: (937)836-7749 – CTO and IP Council Dr. E. Jennings Taylor [email protected] – Principal Scientist Heather McCrabb [email protected] • •
Issue 122 Fall/Winter 2013 PCMI Journal Page 126 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US
photo chemical machining institute
Don Risko PEM Technologies LLC | US
Presentation: Precision Electrolytic Machining
Don Risko received his BS and MS degrees in Electrical Engineering from the University of Pittsburgh. He is a consultant in the field of electrochemical machining (DGR Consulting), and he has worked for Rockwell International, Extrude Hone Corporation, and the Ex One Company.
The majority of Mr. Risko’s work has been in electrochemical metal removal and surface finish assessment. He concentrated on Electrochemical Machining (ECM) technology at both Extrude Hone and Ex One where he lead R&D and machine design for their ECM product lines including introduction of the first production microECM machining systems. He has been working with PEM (Precision Electrolytic Machining) for the past three years.
Please click here for the electronic version of Precision Electrolytic Machining.
Precision Electrolytic Machining Precision Electrolytic Machining
Issue 122 Fall/Winter 2013 PCMI Journal Page 127 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Precision Electrolytic Machining
PEM Technologies is pleased to provide you with this Power Point presentation. If you have any questions about the content, please contact us, and we will provide you with assistance.
NOTICE This Power Point is provided for sole use by our customers. Any other use of these slides requires the written approval of PEM Technologies, LLC and is subject to Non Disclosure Agreement
PEM Technologies, LLC
Issue 122 Fall/Winter 2013 PCMI Journal Page 128 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Faraday ‘s Law for Metal Removal
The PEM process is based on the Faraday principle of the dissolution of metal by a DC (direct current) in the presence of a salt based electrolyte solution.
I * t Material Removed = Mx * nx * F The amount of metal electrolytically removed is proportional to the product of Current (I) and time (t).
Issue 122 Fall/Winter 2013 PCMI Journal Page 129 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Faraday Principle When two metal objects are exposed to an electrolyte solution and a DC power supply is connected to them, then the metal connected to + looses atoms from the surface (i.e., dissociates) under influence of the metal connected to −.
+ Metal D - Ions
DC Voltage
Faraday Principle When a specific electrolyte solution like sodium nitrate salt and water is used, the metal connected to + looses atoms from the surface (i.e., dissociates) under influence of the metal connected to − and precipitates as a metal hydroxide (MOH).
Metal + Ions D -
MOH
DC Voltage
Issue 122 Fall/Winter 2013 PCMI Journal Page 130 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Electrolytic Machining
Electrolyte (Salt Solution)
Fe OH- Electrons H+ H+ OH- Fe++ Electrons
H2 ++ - + - Fe(OH)2 Fe Fe + 2e 2H + 2e H2 Fe++ + 2OH- Fe(OH) Gas 2 Precipitate + Cathode- Anode Flow
(Electrode) Precipitate Gas (Workpiece) Dissolved Metal / Metal Dissolved
PEM Precision Electrolytic Machining
Cathode Tool (-)
forward feed Cathode shape and
resulting current flow controlled electrolyte flow determine material 50 Hz vibration removal t Electrode distance 10 – 400 µm Oscillation - Cathode - Cathode
Electrolyte Electrolyte - Cathode- Electrolyte + + A node + Anode + AnodeWorkpiece (+)
Combined Pulse 20 ms & Oscillation 50 Hz
2 ms
Issue 122 Fall/Winter 2013 PCMI Journal Page 131 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
PEM Precision Electrolytic Machining
1-5ms Constant Current t Pulse
forward feed
controlled electrolyte flow 50 Hz vibration t Electrode distance 10 – 400 µm Oscillation - Cathode - Cathode
Electrolyte Electrolyte - Cathode- Electrolyte + + A node + Anode + Anode
Combined Pulse 20 ms & Oscillation 50 Hz
2 ms
PEM Process Components
1-5ms Constant Current t Pulse
forward feed
controlled electrolyte flow 50 Hz vibration t Electrode distance 10 – 400 µm Oscillation - Cathode - Cathode
Electrolyte Electrolyte - Cathode- Electrolyte + + A node + Anode + Anode Timed voltage pulse
Combined Pulse 20 ms & Oscillation 50 Hz
2 ms
Issue 122 Fall/Winter 2013 PCMI Journal Page 132 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
PEM Precision Electrolytic Machining
forward feed
controlled electrolyte flow
50 Hz vibration
distance 10 – 400 µm - +
20 ms
50 Hz
2 ms
Machine Control PEM Machining Center
Pulse Filter Power Supply PEM MACHINE
Filter Press
Sludge
Temperature Sensor Electrolyte pH Process Tank Chiller Sensor Conductivity Sensor
Issue 122 Fall/Winter 2013 PCMI Journal Page 133 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
PEM Machine
Rigid portal construction
Black Natural Granite and Stainless Steel
T-slot table, anodically switched
Z-axis with oscillation, cathodically switched
PEM Technologies
PEM Control
17“ Touch Screen
PC with Windows Based
Graphics structured
Machining Control System
Real-Time Computer
Online Process Analysis and Assessment
PEM Technologies
Issue 122 Fall/Winter 2013 PCMI Journal Page 134 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
PEM Power
2000 Ampere modules (4 shown)
1- 15 VDC
Unipolar pulse current up to 8,000 A
Short circuit detection and safety shut-off
Power 30 kW
PEM Technologies
PEM Aqua
PEM Technologies
Issue 122 Fall/Winter 2013 PCMI Journal Page 135 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
PEM Aqua
Multi chamber electrolyte tank
Membrane Filtration 0,2 µm particle size, automatic backflush
Continuous control and regulation of pH-value, conductivity, temperature
Flow rate variable, max. 40 l/min at 1-10 bar
Secondary containment
PEM Technologies
Filterpress used to remove metal hydroxides from electrolyte
Issue 122 Fall/Winter 2013 PCMI Journal Page 136 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Tooling •Cathode – active and insulated areas •Part clamping •Anode connection •Electrolyte flow path z - Axis Oscillator
Patented z1 oscillating feed i Electrolyte Electrolyte IN OUT
PEM Tooling
Tray of workpieces
Cathode
T
Typical multiple part tooling configuration
Issue 122 Fall/Winter 2013 PCMI Journal Page 137 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
PEM Tooling
Complete tooling
Simultaneously machine 60 cavities in 14 workpieces
Tray of workpieces
Cathode Design
Side gap No side
A B C machining gap
Frontal gap
Issue 122 Fall/Winter 2013 PCMI Journal Page 138 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Parameters & Typical Values
Current 650 A/sq in (1 A/sq mm) 40 A to 8000 A, depending on power supply output
Voltage 1 – 15 V
Oscillation 0 – 50 Hz
Time seconds to minutes
Electrolyte pressure Normally 15 – 120 psi (1 - 8 bar), depending on application
Electrolyte temperature 65 °F to 85 °F (20 °C to 30 °C)
pH value pH 6.5 to pH 7.5 (in exceptional cases up to pH 8.5)
Conductivity Salt concentration normally 6-8% NaNO3 corresponding to a range between 80 mS and 150 mS
Electrolyte flow .03 - .25 gpm (0.1 -1.0 l/min), depending on application
Some Characteristics of the PEM Process
Excellent Surface Finish
Tolerance in the range of 10 micron
No burrs or stresses
Machines most metals
Examples
Issue 122 Fall/Winter 2013 PCMI Journal Page 139 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Excellent Surface Finish
Surface finish is a function of material (typical Ra = 1 – 10 μin)
Pill Die
Accurate volume with excellent surface finish
Issue 122 Fall/Winter 2013 PCMI Journal Page 140 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Molds
Cathode
100 cavity mold
Mold Inserts
Issue 122 Fall/Winter 2013 PCMI Journal Page 141 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
1 IPR Driver
Punches
Issue 122 Fall/Winter 2013 PCMI Journal Page 142 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Complex Forms
Heat Sink
0.4 in
Heat Sink with flow passages
Issue 122 Fall/Winter 2013 PCMI Journal Page 143 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Mold Inserts
Cathode
Multiple part machining using quick change cathodes
Precision Punches
Taper 0.0002 inch
Issue 122 Fall/Winter 2013 PCMI Journal Page 144 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Precision Punches
Precision Punches
Issue 122 Fall/Winter 2013 PCMI Journal Page 145 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Punch die example
1.0 inch
Medical≈Fuel Systems ≈Fluid Power ≈Automotive ≈Die & Mold ≈Aerospace ≈Consumer Products ≈Defense ≈Energy ≈General Engineering
Die Machining
Larger Components
PEM Technologies
Issue 122 Fall/Winter 2013 PCMI Journal Page 146 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Diesel Pump Housing
Oval transverse drilling Intersects feed bore Burr free 450,000 parts / year 48-part fixture
Internal Machining
Motion Power Control Supply
ON ON
OFF OFF + - Insulation
+
_ Electrolyte Cathode
+ Anode / Workpiece
Issue 122 Fall/Winter 2013 PCMI Journal Page 147 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
.017 inch diameter 㼼.0002
.625 in long
Complex Geometry
0.010 in thick webs
Issue 122 Fall/Winter 2013 PCMI Journal Page 148 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Knurling Tool
Part Name: Knurling tool insert for gasket dies. Part Function: Sample structure for car cylinder – head gaskets. Material: 1.4112 StructuredPart dimensions: surface geometry Diameter 30 mm. height 10 mm. Machined feature dimensions: structure 0.610 mm. Machining time: 9 min. No. of parts machined per cycle: 1 part (Larger area possible up to 4 and 6 cylinder gaskets.) Current : 800 Amp. Feed rate: 0.07 mm/min. Surface finish: Ra=0.1µm.
PEM Capabilities
Microstructure Diameter 60-70 μm Center-center distance 200 μm Height 250 μm Process time: 12 min
Issue 122 Fall/Winter 2013 PCMI Journal Page 149 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Rotary Shaver Head
Edge radius
Slot and Polish of stainless steel blanks
Sharp edge 40 seconds for 96 slots
Dies
Cold heading dies and marking dies
Issue 122 Fall/Winter 2013 PCMI Journal Page 150 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Rectangular Hole Minimum Radius 1- 2- 3- Minimum Sidewall Taper 0.020 … 0.2 mm. (.0008-.008 in) 1 Cavities
2 0.020 … 0.2 mm. (.0008-.008 in)
Minimum Sidewall Taper
0.020 … 0.2 mm. (.0008-.008 in) 3
Minimum Sidewall Taper depends on the shape of the electrode.
Large electrode: Taper 1 ... 3 degrees.
Sidewall electrode insolated: 0 degrees
Results depend on material and process parameter settings
Die Punch Posts Minimum Radius 1- 2-
Minimum Sidewall Taper
1 0.05 … 0.3 mm. (.002-.012 in) Minimum Sidewall taper 0 degrees with foil electrode, but foot radius slightlyMinimu increased.m Sidewall T Smallaper diameter change (+/- 0.1 … 0.3 mm. .004-.012 in Undercut possible on the fly depending on process settings
2 0.05 … 0.3 mm. (.002-.012 in)
Issue 122 Fall/Winter 2013 PCMI Journal Page 151 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Channels & Grooves
Slot or Channel Minimum Slot width
Depth limitation at minimum slot width
Minimum Channel width depends on depth. Shallow channels can be below 0.2 mm. (.008 in) Minimum Channel Width
Minimum width increases as the depth increases. Minimum width of a one inch deep channel would be in the range of .040 –.080 in
Pins
Pin
Minimum diameter
0,12mm+/- 0,005 (.005+/-.0002 in)
Issue 122 Fall/Winter 2013 PCMI Journal Page 152 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
Blind Hole
Blind hole
Minimum diameter
0,2mm (conical taper ~5°)(.008 in)
Applications for PEM Technology
Fluid Dynamic motors & actuators High precision gears Medical implants Diesel fuel system components Die and mold inserts and punches Surgical instruments Dynamic seals Compacting dies Jet engine fuel system components Aircraft hydraulic actuators Heat transfer surfaces
Issue 122 Fall/Winter 2013 PCMI Journal Page 153 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
General Process Capability
Feed Rate: .004-.016in/mi n (.1-.4 mm/min)
MRR max: .08 cu in/min (1.3cc/min)
Current Density: 650 A/sq in ( 1 A/sq mm)
Max area: 12 sq in ~ 3 in dia (77 sq cm)
Tolerance capability: .0004-.0008 in 10 -20 micron
Features and Benefits
Can produce features that are difficult or impossible to produce by other means
Tool life is extremely long
No burrs or material deformation
No stress imparted to the workpiece
Can machine hardened metals
Excellent surface finish
Simultaneous multi part machining
Issue 122 Fall/Winter 2013 PCMI Journal Page 154 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
PEM Process Development
Application Review
Part Drawing CAD Model
Concept Design
Proposal
PEM Process Development
Design & Quotation Manufacture Tooling
Part Drawing CAD Model Final Design
Concept Design
Proposal
Issue 122 Fall/Winter 2013 PCMI Journal Page 155 Precision Electrolytic Machining Don Risko | PEM Technologies LLC | US photo chemical machining institute
PEM Process Development
Design & Process Quotation Manufacture Tooling Development
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Issue 122 Fall/Winter 2013 PCMI Journal Page 156 Human Resources Interactive Ideas Exchange | How to Motivate, Train and Educate the PCM Workforce Mat Simpkins | United Western Enterprises | US photo chemical machining institute
Mat Simpkins United Western Enterprises, Inc. | US
Presentation: Human Resources Interactive Ideas Exchange | How to Motivate, Train and Educate the PCM Workforce
Mat Simpkins holds a Master’s degree in Microsystems and Nanotechnology from Cranfield University, UK. His thesis was entitled ‘Photochemical Machining of Magnesium for Micro-engineering.’
Mat also has a background in chemistry with a Bachelor’s degree from Loughborough University, UK. Since 2011 Mat has been working for United Western Enterprises Inc,. as a Photo Chemical Machining Specialist.
Please click here for the electronic version the Human Resources Interactive Ideas Exchange.
Human Resources Interac/ve Ideas Exchange
Mat Simpkins
United Western Enterprises, Inc.
Issue 122 Fall/Winter 2013 PCMI Journal Page 157 Human Resources Interactive Ideas Exchange | How to Motivate, Train and Educate the PCM Workforce Mat Simpkins | United Western Enterprises | US photo chemical machining institute
Introduc/on
Discuss HR, related to the manufacturing environment (specifically PCM).
Hopefully we will find out from this interac/ve exchange….
• What HR measures do you take? • What HR tools do you use? • Share successful examples
My Background
Current posi/on Chemist and Compliance Officer, United Western Enterprises, Inc.
Previous experience "Photochemical Machining of Magnesium for Microengineering Applica/ons, MSc thesis, Cranfield University, Bedford, UK (2009).
D.M. Allen et al., "A Novel Photochemical Machining Process for Magnesium Aerospace and Biomedical Microengineering Applica/ons,” J. Micromechanics and Microengineering, 20, 105010 (2010).
Issue 122 Fall/Winter 2013 PCMI Journal Page 158 Human Resources Interactive Ideas Exchange | How to Motivate, Train and Educate the PCM Workforce Mat Simpkins | United Western Enterprises | US photo chemical machining institute
‘A chain is only as strong as its weakest link’
Human Resource Development
Prac/cing HR in a manufacturing plant is dras/cally different than in an office environment
• Unique communica/on challenges • Get out on the floor • Gain plant experience • Build effec/ve employee rela/ons
‘The person who gets their hands around the manufacturing processes will ul/mately be an effec/ve HR person’ Jackie Brova Vice President of HR at Church & Dwight
Issue 122 Fall/Winter 2013 PCMI Journal Page 159 Human Resources Interactive Ideas Exchange | How to Motivate, Train and Educate the PCM Workforce Mat Simpkins | United Western Enterprises | US photo chemical machining institute
Interac/on
• Split up into 4 groups • 4 Team captains • 4 Different topics • 10 – 15 minutes • Team captains report back to everyone with 4 points each • Open for discussion from everyone
Group 1 Group 2 Find Train
Group 3 Group 4 Mo/vate Control
Issue 122 Fall/Winter 2013 PCMI Journal Page 160 Human Resources Interactive Ideas Exchange | How to Motivate, Train and Educate the PCM Workforce Mat Simpkins | United Western Enterprises | US photo chemical machining institute
‘Nothing changes if nothing changes’
‘Teamwork Makes The Dream Work’
Thank you
Issue 122 Fall/Winter 2013 PCMI Journal Page 161 Workforce Safety Kris Stanford | NW Etch
photo chemical machining institute
Kris Stanford Northwest Etch | US
Presentation: Workforce Safety & Workforce Safety Interactive Ideas Exchange
Kris Stanford started with NW Etch in 2011. She received an AA in Environmental Science from Clover Park Technical School in 2010. Prior to school Kris worked as the Plant Safety Coordinator for Simpson Timber located in Tacoma, WA.
Kris has also worked as an industrial waste technician at an intel semiconductor facility in Chandler, AZ and as a chemical technician at a Motorola facility in Chandler, AZ.
Please click here for the electronic version Workforce Safety & Workforce Safety.
Workforce Safety
PCMI Fall Conference 10/7/13 Kris Stanford Environmental/Safety Manager
Issue 122 Fall/Winter 2013 PCMI Journal Page 162 Workforce Safety Kris Stanford | NW Etch photo chemical machining institute
Zero Accidents is a choice not our goal
PPE and Ergonomics
Proper PPE for the job
Engineering controls
Ergonomic training
Issue 122 Fall/Winter 2013 PCMI Journal Page 163 Workforce Safety Kris Stanford | NW Etch photo chemical machining institute
New hire orientation
Facility tour
Safety orientation
Assigned mentor
Checks and balances
Employee feedback
Employee performed audits
Outside resources
Issue 122 Fall/Winter 2013 PCMI Journal Page 164 Workforce Safety Kris Stanford | NW Etch photo chemical machining institute
Conclusion Implement changes deliberately and not reactively.
Involvement of employees
Monitoring progress
Measuring results
Follow through with future plans
Issue 122 Fall/Winter 2013 PCMI Journal Page 165 How to Optimize Dry Film Adhesion to Various Metal Surfaces Bill Wilson | DuPont Electronic Technologies | US
photo chemical machining institute
Bill Wilson Dupont Printed Circuit Materials | US
Presentation: How to Optimize Dry Film Adhesion to Various Metal Surfaces – A discussion of mechanical and chemical surface modification techniques and the lamination conditions that assure dry film adhesion, including dry vs. wet-lamination
Bill Wilson is a mechanical engineer with 40 years of experience supporting DuPont’s dry film and flexible laminate products, specializing in on-site customer technical support and new process and product development. He has been happily associated with PCMI and the chem-milling industry throughout his entire career.
Please click here for the electronic version the How to Optimize Dry Film Adhesion to Various Metal Surfaces.
HOW TO OPTIMIZE DRY FILM ADHESION TO VARIOUS METAL SURFACES
PCMI INTERNATIONAL CONFERENCE OCTOBER 8, 2013 BILL WILSON
Issue 122 Fall/Winter 2013 PCMI Journal Page 166 How to Optimize Dry Film Adhesion to Various Metal Surfaces Bill Wilson | DuPont Electronic Technologies | US photo chemical machining institute
2
OPTIMIZING DRY FILM ADHESION 1. Surface Pre-cleaning 2. Dry Film Lamination 3. Dry Film Development 4. Post-Development Curing
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3
SURFACE PRE-CLEANING
• The single most important process step; without good dry film adhesion, nothing else matters. • Dry film adhesion comes from two sources: chemical and mechanical.
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Issue 122 Fall/Winter 2013 PCMI Journal Page 167 How to Optimize Dry Film Adhesion to Various Metal Surfaces Bill Wilson | DuPont Electronic Technologies | US photo chemical machining institute
4
CHEMICAL ADHESION
• Dry films are formulated to complex (chelate) with copper and copper alloys only. • There is no significant chemical bonding to non-copper metals.
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5 MECHANICAL ADHESION Need a Uniform Microscopically Roughened Surface: 1. Abrasive Brush Scrubbing 2. Pumice Brush Scrubbing 3. Chemical Passivation 4. Chemical Microetching
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Issue 122 Fall/Winter 2013 PCMI Journal Page 168 How to Optimize Dry Film Adhesion to Various Metal Surfaces Bill Wilson | DuPont Electronic Technologies | US photo chemical machining institute
6 CHEMICAL PRECLEANING First, all metals must be properly degreased: 1. Strong alkaline detergent cleaners at high temperature (55-60C) are most effective. 2. Follow with acid neutralization or other acidic process step.
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7
COPPER & CU ALLOYS
1. Abrasive Brush Scrub or 2. Pumice Brush Scrub or 3. Degrease, Microetch and Mild Antitarnish
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Issue 122 Fall/Winter 2013 PCMI Journal Page 169 How to Optimize Dry Film Adhesion to Various Metal Surfaces Bill Wilson | DuPont Electronic Technologies | US photo chemical machining institute
8 ALUMINUM 1. Proprietary Conversion Coating or 2. Microetch: 3-6% Sodium Hydroxide Result: Light Satinized Surface Finish De-smut = Nitric Acid or a Commercial Deoxidizer
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9
STAINLESS STEEL
1. Pumice Brush Scrub or 2. Nitric Acid Passivation = 20% at 60-70C (140-160F) for 10-20 min. Result: Slightly Matte Finish
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Issue 122 Fall/Winter 2013 PCMI Journal Page 170 How to Optimize Dry Film Adhesion to Various Metal Surfaces Bill Wilson | DuPont Electronic Technologies | US photo chemical machining institute
10 STEEL AND NICKEL-IRON ALLOYS 1. Pumice Scrub and/or 2. Phosphoric Acid = 25% at 70-80C (160-175F) for up to 5 minutes Result: Lightly Phosphatized = Dull, Slightly Matte Finish
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11
NICKEL
• Nitric Acid = 2-3% at 70-80C for 2-4 minutes • Result: Slightly Matte Finish
10/5/13
Issue 122 Fall/Winter 2013 PCMI Journal Page 171 How to Optimize Dry Film Adhesion to Various Metal Surfaces Bill Wilson | DuPont Electronic Technologies | US photo chemical machining institute
12
TITANIUM
• 10% Nitric Acid and 2% Phosphoric Acid Conversion Coating • Adjust Temp and Time to Achieve Uniform Satinized Finish
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13 SURFACE CHARACTERIZATION DuPont Analytical Service: • Veeco Wyko Optical Scanner • Ra = Average Peak Height Across Sample Area (3” x 3”) • 3-Dimensional Mapping
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Issue 122 Fall/Winter 2013 PCMI Journal Page 172 How to Optimize Dry Film Adhesion to Various Metal Surfaces Bill Wilson | DuPont Electronic Technologies | US photo chemical machining institute
14 3D SURFACE MAPS
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15
DRY FILM LAMINATION
Maximize Chemical and/or Mechanical Bonds to Surface: • Optimize Laminator Conditions • Use Wet-Lamination
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Issue 122 Fall/Winter 2013 PCMI Journal Page 173 How to Optimize Dry Film Adhesion to Various Metal Surfaces Bill Wilson | DuPont Electronic Technologies | US photo chemical machining institute
16
DRY FILM LAMINATION
• Preheat Thick Metal = 120C (250F) for 15-30 minutes • Laminate Hot and Slow = 120C at 0.6-0.8 mpm • Exit Temp = 60-80C (140-175F)
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17 WET LAMINATION • The dry film used must be specifically formulated to be hydrophilic (absorbs water). • Water absorption softens the resist and permits it to flow fully into all surface features (i.e. dents, scratches and micro-topography).
10/5/13
Issue 122 Fall/Winter 2013 PCMI Journal Page 174 How to Optimize Dry Film Adhesion to Various Metal Surfaces Bill Wilson | DuPont Electronic Technologies | US photo chemical machining institute
18 WET-LAM BENEFITS • Higher yields = reduced mfg costs. • Improved image adhesion for long and/or multi-pass etch cycles. • Resistance to mechanical handling damage. • Improved etch factors and edge quality.
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19 WET-LAM CONFORMATION
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Issue 122 Fall/Winter 2013 PCMI Journal Page 175 How to Optimize Dry Film Adhesion to Various Metal Surfaces Bill Wilson | DuPont Electronic Technologies | US photo chemical machining institute
20 ETCHED EDGES WITH WET-LAM
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21 ETCHED EDGES WITH WET-LAM
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Issue 122 Fall/Winter 2013 PCMI Journal Page 176 How to Optimize Dry Film Adhesion to Various Metal Surfaces Bill Wilson | DuPont Electronic Technologies | US photo chemical machining institute
22
DUPONT HRL YIELDMASTER
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23 HRL WET-LAM CONTROLS
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Issue 122 Fall/Winter 2013 PCMI Journal Page 177 How to Optimize Dry Film Adhesion to Various Metal Surfaces Bill Wilson | DuPont Electronic Technologies | US photo chemical machining institute
24 HAKUTO CSL WET-LAM
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25 WET BARS AND WIPERS
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Issue 122 Fall/Winter 2013 PCMI Journal Page 178 How to Optimize Dry Film Adhesion to Various Metal Surfaces Bill Wilson | DuPont Electronic Technologies | US photo chemical machining institute
26 DRY FILM DEVELOPMENT Optimize for “Mild” Conditions: • Concentration = 0.8-0.9% • Temperature = 80-85F • Breakpoint = 60-65% • Rinse Water = Hard (120-300 ppm)
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27
POST-DEVELOP CURING
• UV-Bump – Not Recommended Dry Film Image Embrittlement • Oven Baking – 120C (250F) for 10 to 30 minutes
10/5/13
Issue 122 Fall/Winter 2013 PCMI Journal Page 179 How to Optimize Dry Film Adhesion to Various Metal Surfaces Bill Wilson | DuPont Electronic Technologies | US photo chemical machining institute
28 DRY FILM IMAGING SUMMARY
1. Pre-cleaning – Optimize for Adhesion 2. Lamination – Optimize for Adhesion 3. Development – Minimize Image Attack 4. Post-Dev Baking – Strengthen Image
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29
HAPPY METAL FINISHING
10/5/13
Issue 122 Fall/Winter 2013 PCMI Journal Page 180 photo chemical machining institute
The industries widest range of system sizes and feature choices.
Booth 303 www.chemcut.net 1-800-Chemcut [email protected] 500-1 Science Park Rd State College, PA 16803
Issue 122 Fall/Winter 2013 PCMI Journal Page 181 2014 Advertising Opportunities
photo chemical machining institute
PCMI is pleased to invite you to advertise in the 2014 Journal and Membership Directory. The PCMI Journal is published in electronic format twice each year in the spring and again in the fall. The Membership Directory is published in July. Take advantage of these opportunities to reach the leaders in the industry. Place your advertisement insertion order today. The closing date for all issues is the first of the month prior to publication. There is no extra charge for color. Ads and net costs (in U.S.$) are as follows:
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Issue 122 Fall/Winter 2013 PCMI Journal Page 182 photo chemicalSUPERIORSUPERIOR machining institute EtchantsEtchants
PVS Technologies. Ferric Chloride. And so much more.
PVS Technologies. Providing exceptional Ferric Chloride for your Photochemical Machining process. Delivering outstanding service for your operation.
PVS Technologies. Offering multiple Ferric Chloride grades and concentrations to suit all etching applications.
PVS Technologies. Answering your demand for the best etchant.
Ferric Chloride Etchants
Spent FeCl Etchant Recycling Service 3 Mini-Bulk Delivery of Acids, � Caustic Materials Environmental Management Services SUPERIORSUPERIOR ServiceService
Ferric Chloride. And so much more.
10900 Harper Avenue / Detroit, MI 48213 / 800-337-7428 // www.www.pvstechnologies.compvstechnologies.com
Issue 122 Fall/Winter 2013 PCMI Journal Page 183 photo chemical machining institute
Vertical Spray Processing Equipment
Etch Factor over 6
34.592 µm
34.592 µm
. Processing of all substrate types . Compact, operator friendly and down to 25 micron cleanroom capable design . Available for all wet process spray . Exceptional uniformity results over applications namely Developer, Etcher, the panel and especially same results Quick etch, Resist stripper and DES line on both sides of the panel . Complete touch free system with . Competitive pricing and easy integrated blow off system maintenance
www.schmid-group.com
Issue 122 Fall/Winter 2013 PCMI Journal Page 184