PPHHOOTTOO--CCHHEEMMIICCAALL MMAACCHHIINNIINNGG

DDaavviidd SSmmaarrtt UUKK SSaalleess MMaannaaggeerr WWHHYY PPHHOOTTOOCCHHEEMMIICCAALL MMIILLLLIINNGG ?? ((CChheemmiiccaall MMiilllliinngg))

Only method of producing a component without changing the structure of the substrate

Cheap method of manufacture

Flexible tooling WWhhaatt iiss PPhhoottoocchheemmiiccaall MMaacchhiinniinngg// CChheemmiiccaall MMiilllliinngg??

The selective etching of metal substrates to produce a required component

TTYYPPEESS OOFF EETTCCHHAANNTT

Ferric Chloride Used to etch Ferrous metals, Brass, Copper, Nickel, Aluminium

Ferric Nitrate Used to etch Silver and silver alloys and Molybdenum The Photo-Chemical Milling Industry has never had a dedicated chemical supplier The Photo-Chemical Milling Industry forced to use processes designed for the lesser requirements of the PCB Industry Requirements for the Chemical Milling Industry more difficult to meet than those of the PCB Industry MacDermid has the technology to pass the Chemical Milling Industries most stringent requirements Differences in Copper Substrates 1.PCB Industry Formed by electroplating pure copper/100µm thick. 2.Chemical Milling Hot rolled from ingots impure copper/200-400µ thick very severe soiling problems. Types of metals that are Chemically-milled •Copper •Alloy 42 Kovar •Mild Steel •Stainless Steel •Brass •Aluminium Pre-Cleaning Philosophy The use of a properly formulated alkaline cleaner is the most cost effective way to prepare metals for photo-resist application Production processes involved in Manufacture PPrroodduuccttiioonn PPrroocceessss --SSttaaggee 11 Material Storage and Cutting PPrroodduuccttiioonn PPrroocceessss --SSttaaggee 22 Panel Cleaning and Drying Can be either vertical or horizontal PPrroodduuccttiioonn PPrroocceessss --SSttaaggee 33

Laminating, Exposure and Developing PPrroodduuccttiioonn PPrroocceessss --SSttaaggee 44 Laminating, Exposure and Developing

Typical photo-tool Spray Developing of image PPrroodduuccttiioonn PPrroocceessss --SSttaaggee 55 Etching of Image with Ferric Chloride PPrroodduuccttiioonn PPrroocceessss --SSttaaggee 66 Strip Dry-film Etch Resist PPaanneel lA Appppeeaarraannccee A Afftteerr E Eaacchh S Sttaaggee

Cut panel Cleaned Laminated Imaged

Developed Etched Stripped PPrroocceesssseess ffoorr CChheemmiiccaall MMiilllliinngg Aquamer MI 200 Aquamer PR 200 Aquamer MP 500

Alkaline Rinse Acid Clean/ Rinse Rinse Dry Photo-resist Clean Nano-etch Application and Imaging Circamac 104 Circamac 115 NE Copper Cleaner or Circamac 117 KE Cleaner

Develop Rinse Etch Rinse Resist Strip Rinse Rinse Dry

Circamac 290 Circamac 280 HWT Circamac 202 Etchant CM Developer Circamac 256 Circamac 295 Aquamer Anti-foam 2 Oxidant FFiinnaall FFiinniisshhiinngg SSttaaggee Copper and brass can be required to be finished with either electro plated nickel or nickel and tin or nickel and gold Sterling Silver Etched parts are often formed e.g. to make boxes or screens for printed circuit boards - RF screening cans EEttcchhiinngg FFaaccttoorrss SSoollddeerr PPaassttee SStteenncciill PPrroodduuccttiioonn A stencil is ………..

A sheet of metal with holes in it - used to deposit solder paste

OR

An Essential tool, the design and optimisation of which is critical to achieving consistent printed results and product quality SStteenncciill MMaannuuffaaccttuurriinngg TTeecchhnnoollooggyy

°Precision Etching(Photo Chemical Machining) °Accurate,Cost effective stencil solutions °Used for component pitches down to 0.635mm °Laser Cutting °Improved dimensional accuracy for finer pitch requirements °Used for component pitches down to 0.4mm

°Electroforming °Provides the best paste release of all the technologies °Can be used for all components and packages °Laser-formed Stencil material is electroformed and the apertures are lasered Processes for Chemical Milling of Stainless Steel Solder Paste Screens Aquamer

Alkaline Rinse Acid Clean/ Rinse Rinse Dry Photoresist Clean Nanoetch Application and Imaging Circamac 104 Circamac 117 KE

Develop Rinse Etch Rinse Rinse Resist Strip Rinse Dry

Circamac 290 Circamac 202 Circamac 280 HWT Etchant CM Circamac 256 Developer Circamac 295 Aquamer Anti-foam 2 Oxidant 11SSTTSSuubbttrraaccttiivvee pprroocceessss...PPrreecciissiioonn e ettcchhiinngg ((PPCCMM)) Final etched/required size

Exposed aperture Etchant

Photo resist Stencil Blank Latest Manufacturing Technology EElleeccttrrooffoorrmmiinngg PPrroocceessss

Conductive Mandrel Anode Basket Nickel pellets Photo-Resist

Metal deposit

A TTyyppiiccaall EElleeccttrrooffoorrmmeedd aappeerrttuurree pprrooffiillee Trapezoidal Aperture formation

Flexible metal blade Trapezoidal Apertures

Consistent height Uniform Deposits OOppttiimmiisseedd PPaassttee RReelleeaassee ffoorr FFiinneerr PPiittcchh PPrriinnttiinngg

Would you choose the bucket or the drainpipe? Multi-level stencils MMuullttii--lleevveell sstteenncciillss

Able to achieve the paste volumes required by all components

Extra height for SM connectors, power devices and PLCC’s

Standard thickness

Reduced deposits for fine pitch applications NNeeww TTeecchhnnoollooggyy --MMiiccrroossttrruuccttuurreess

Manufacturing of high density circuits - Manufactured by electroforming Typical track and gap of 15 - 25 microns PRODUCTS FOR CHEMICAL MILLING • 26104 Circamac 104 Copper Cleaner - Alkali spray cleaner to remove tenacious soils used with Circamac 115 before Photo-mech

• 26016 Circamac 115 Copper Cleaner NE - Low foaming cleaner / nanoetch also promotes resist adhesion

• 26017 Circamac 117 Chemcleaner KE - Low foaming cleaner formulated for steel and iron alloys prior to photo resist lamination

• 19257 MacuPrep G4 - Stabilised micro-etch for copper and brass, provides ultra fine surface

• 24712 Canclean SPA 2 Aluminium Cleaner - Spray cleaner for aluminium prior to photo resist lamination

• 26502 Circamac 202 Resist Stripper - Effectively removes full aqueous dry film resist leaving a residue free surface

• 26015 Circamac 256 Resist Stripper - Removes dry film resist effectively and efficiently from fine line/spacing, for spray applications

• 26280 Circamac 280 HWT Developer - A concentrated liquid alkaline solution to develop dry film resist with water softening agents

• 19798 Aquamer Anti-foam 2 - A solvent free, easily dispersed, non silicone defoamer for use in acid and alkaline aqueous solutions

• 26290 Circamac 290 Etchant CM - Ferric Chloride etch for the rapid etching of all grades of copper, brass, steel, and aluminium

• 46346 Circamac 295 Re-Gen Sodium Chlorate Solution (40%) - Used to regenerate ferric chloride solutions.

• Aquamer MP 500 Series Superior dry-film for acid etching resist available in a variety of thicknesses

• Aquamer PR 200 Series Superior dry-film for acid etching resist available in a variety of thicknesses